CN104406070B - Three-dimensional luminous LED (Light Emitting Diode) bulb lamp and preparation method thereof - Google Patents

Three-dimensional luminous LED (Light Emitting Diode) bulb lamp and preparation method thereof Download PDF

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Publication number
CN104406070B
CN104406070B CN201410665831.0A CN201410665831A CN104406070B CN 104406070 B CN104406070 B CN 104406070B CN 201410665831 A CN201410665831 A CN 201410665831A CN 104406070 B CN104406070 B CN 104406070B
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CN
China
Prior art keywords
radiator
led luminescent
lamp
luminescent wafer
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410665831.0A
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Chinese (zh)
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CN104406070A (en
Inventor
伍活民
陈文锡
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GUANGZHOU WIN NEWS TECHNOLOGY CO., LTD.
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GUANGZHOU WIN NEWS TECHNOLOGY Co Ltd
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Priority to CN201410665831.0A priority Critical patent/CN104406070B/en
Publication of CN104406070A publication Critical patent/CN104406070A/en
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Publication of CN104406070B publication Critical patent/CN104406070B/en
Expired - Fee Related legal-status Critical Current
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The invention discloses a three-dimensional luminous LED (Light Emitting Diode) bulb lamp and a preparation method thereof. The three-dimensional luminous LED bulb lamp comprises a lamp holder, a lamp cover, a radiating body and an LED luminous wafer; the radiating body which is arranged on the lamp holder is arranged inside the lamp cover; the lamp cover is fixed on the lamp holder; the external surface of the heating body is in spatial multi-surface distribution; the LED luminous wafer which is directly fixed on the radiating body is in spatial multi-surface distribution to achieve a three-dimensional luminous effect; meanwhile the LED luminous chip is directly fixed on the radiating body, a radiating path is shortened maximally, and accordingly the three-dimensional luminous LED bulb lamp has the character of efficient heat dissipation.

Description

A kind of three-dimensional light LED Bulb lamp And preparation method thereof
Technical field
The present invention relates to a kind of LED, especially relate to LEDbulb lamp of a kind of three-dimensional light and preparation method thereof.
Background technology
Conventional incandescent power consumption height; life-span is short; under the overall situation that global resources are nervous; the most gradually forbidden producing by national governments; substitute products are electronic energy-saving lamps therewith; although electronic energy-saving lamp improves energy-saving effect, but owing to employing the heavy metal element of many pollution environment, runs counter to again the main trend of environmental conservation.Along with the high speed development of LED technology, LED illumination is increasingly becoming the main selection of novel green illumination.One important application of LED illumination is LEDbulb lamp, and in known LED lamp bulb structure, LED luminescent wafer is arranged in lamp bead, and is connected on aluminium base by lamp bead pin.Restriction yet with current technique, lamp bead substrate can only make plane, the bulb lamp causing lamp bead substrate form to make is extremely difficult to the effect of the three-dimensional light of traditional energy-saving lamp, simultaneously because LED luminescent wafer is arranged in lamp bead, its heat passes to aluminium base via narrow lamp bead pin and rejects heat in air again, heat dissipation path is narrow and small, and radiating effect is poor.
Summary of the invention
In order to overcome the deficiencies in the prior art, it is an object of the invention to provide one and be capable of three-dimensional light, simultaneously LEDbulb lamp of high efficiency and heat radiation and preparation method thereof.
The technical solution adopted in the present invention is:
A kind of LEDbulb lamp of three-dimensional light, including lamp socket, lampshade, radiator and LED luminescent wafer, described radiator is arranged on lamp socket and is arranged in lampshade, lampshade is fixed on lamp socket, radiator outer surface is the many EDS maps in space, LED luminescent wafer is directly anchored on radiator also many EDS maps in space, and LED luminescent wafer is connected with lamp socket the two poles of the earth by lead-in wire.
As the improvement of technique scheme, described radiator is the polyhedron of a kind of band tapered configuration.
Further, described LED luminescent wafer is pasted on radiator by crystal-bonding adhesive, and LED luminescent wafer is 180 degree and goes out light.Owing to LED luminescent wafer is to be affixed directly in the plane of radiator, so LED luminescent wafer goes out light and is 180 degree and goes out light, with lamp bead form less than compared with 150 degree of rising angles, rising angle is wider.
Further, above described LED luminescent wafer, embedding has the hemisphere fluorescent glue for changing glow color.
The preparation method of the LEDbulb lamp of a kind of three-dimensional light, comprises the following steps:
A) prepare polylith strip and the metal fin of triangle, or the substrate of more than three can be bent into;
B) the metal fin of polylith strip by being welded to connect as prism, prism top is welded with the metal fin of polylith triangle by inclined-plane, the metal fin composition pyramidal shape of triangle, prism and pyramid constitute polyhedron metallic heat dissipating part, it is also possible to by substrate bending obtains the substrate radiator on band inclined-plane;
C) by polyhedron metallic heat dissipating part by modes such as spraying, electrophoresis, stickups, form insulating barrier, thickness be less than 0.5mm, if radiator is substrate radiator, wherein aluminium base in manufacturing process with insulating barrier, need not separately do, other metal basal boards are also by modes such as spraying, electrophoresis, stickups, forming insulating barrier, thickness is less than 0.5mm;
D) on each face of radiator, LED luminescent wafer is pasted by crystal-bonding adhesive, and by fastening LED luminescent wafer after baking;
E) use ultrasonic friction weldering metal wire that two electrodes of multiple LED luminescent wafers are carried out welding processing, thus LED luminescent wafer is coupled together in parallel or series;
F) fluorescent glue is covered on LED luminescent wafer, and fluorescent glue is cured as hemispherical by baking;
G) radiator being mounted with LED luminescent wafer being fixed on lamp socket, the lead-in wire of LED luminescent wafer is connected with lamp socket the two poles of the earth;
H) lampshade is installed on lamp socket, radiator is covered, completes the installation of bulb.
The invention has the beneficial effects as follows: the LEDbulb lamp of the present invention is owing to using the polyhedral radiator of band tapered configuration, and LED luminescent wafer is directly anchored on radiator, also many EDS maps in space, realize the effect of three-dimensional light, simultaneously because LED luminescent wafer is directly anchored on radiator, shorten heat dissipation path to greatest extent, realize high efficiency and heat radiation, lamp life than lamp bead formula is long, the light decay within 3 years 15% can be realized, simultaneously lower than current lamp bead formula LED on cost, and the bulb lamp of big wattage can be done.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention;
Fig. 2 is the radiator structure schematic diagram of the present invention;
Fig. 3 is the sectional view of Fig. 2.
Detailed description of the invention
The present invention is further detailed explanation with detailed description of the invention below in conjunction with the accompanying drawings.
Referring to figs. 1 through Fig. 3, the LEDbulb lamp of a kind of three-dimensional light of the present invention, including lamp socket 1, lampshade 2, radiator 3 and LED luminescent wafer 4.Radiator 3 is fixed on lamp socket 1 and is arranged in lampshade 2, it is preferable that described radiator 3 is that a kind of welding by inclined-plane is formed, and top is pyramidal structure, and bottom is the polyhedron of prism structure;LED luminescent wafer 4 is directly anchored on radiator 3 surface and is connected with lamp socket 1 the two poles of the earth by lead-in wire 5, many EDS maps in space, realize three-dimensional light effect, preferably, crystal-bonding adhesive is used to be pasted on by LED luminescent wafer 4 on radiator 3 surface, firm pasting is difficult to displacement or comes off, after stickup, LED luminescent wafer 4 has 180 degree of rising angles, above LED luminescent wafer 4, embedding has the fluorescent glue 6 for changing glow color simultaneously, to adapt to the glow color requirement of light, further, fluorescent glue 6 is preferably hemisphere;Lampshade 2 is fixed on lamp socket 1, it is preferable that described lampshade 2 uses Transparent lamp shade, its internal radiator 3 and LED luminescent wafer 4 both can have been protected from collision, the most do not affected the outgoing of bulb lamp light.
Additionally, the invention also discloses the preparation method of above-mentioned bulb lamp, comprise the following steps: a) prepare polylith strip and the metal fin of triangle, or the substrate of more than three can be bent into;B) the metal fin of polylith strip by being welded to connect as prism, prism top is welded with the metal fin of polylith triangle by inclined-plane, the metal fin composition pyramidal shape of triangle, prism and pyramid constitute polyhedron metallic heat dissipating part, it is also possible to by substrate bending obtains the substrate radiator on band inclined-plane;C) by polyhedron metallic heat dissipating part by modes such as spraying, electrophoresis, stickups, form insulating barrier 7, thickness be less than 0.5mm, if radiator 3 is substrate radiator, wherein aluminium base in manufacturing process with insulating barrier 7, need not separately do, other metal basal boards are also by modes such as spraying, electrophoresis, stickups, forming insulating barrier 7, thickness is less than 0.5mm;D) on each face of radiator 3, LED luminescent wafer 4 is pasted by crystal-bonding adhesive, and by fastening LED luminescent wafer 4 after baking;E) use ultrasonic friction weldering lead-in wire 5 that two electrodes of multiple LED luminescent wafers 4 are carried out welding processing, thus LED luminescent wafer 4 is coupled together in parallel or series;F) fluorescent glue 6 is covered on LED luminescent wafer 4, and by baking, fluorescent glue 6 is cured as hemispherical;G) radiator 3 being mounted with LED luminescent wafer 4 being fixed on lamp socket 1, the lead-in wire 5 of LED luminescent wafer 4 is connected with lamp socket 1 the two poles of the earth;H) lampshade 2 is installed on lamp socket 1, radiator 3 is covered, completes the installation of bulb.
The LEDbulb lamp of the three-dimensional light of the present invention, be there is the radiator 3 of space multiaspect distributed architecture by employing, make LED luminescent wafer 4 fixed thereon also many EDS maps in space, realize the effect of LEDbulb lamp three-dimensional light, LED luminescent wafer 4 is directly anchored on radiator 3 simultaneously, shorten heat dissipation path to greatest extent, it is achieved the high efficiency and heat radiation of LEDbulb lamp.
The foregoing is only the preferred embodiments of the present invention, as long as realizing within the technical scheme of the object of the invention broadly falls into protection scope of the present invention with essentially identical means.

Claims (1)

1. the preparation method of the LEDbulb lamp of a three-dimensional light, it is characterised in that comprise the following steps:
A) preparing radiator (3), radiator (3) can be the polyhedron metallic heat dissipating part of more than three, maybe can be bent into the substrate of more than three, and substrate is metallic plate;
B) the polyhedron metallic heat dissipating part of band top bevel can pass through welding, or cold drawn or casting or metal cutting mode obtain, it is possible to by substrate bending obtains the substrate radiator on band inclined-plane;
C) by polyhedron metallic heat dissipating part by spraying, electrophoresis or bonding method, forming insulating barrier (7), thickness is less than 0.5mm, if radiator (3) is substrate radiator, wherein aluminium base in manufacturing process with insulating barrier (7), it is not necessary to separately do;
D) on each face of radiator (3), LED luminescent wafer is pasted by crystal-bonding adhesive, and by fastening LED luminescent wafer after baking;
E) use ultrasonic friction weldering lead-in wire (5) that two electrodes of multiple LED luminescent wafers (4) are carried out welding processing, thus LED luminescent wafer (4) is coupled together in parallel or series;
F) fluorescent glue (6) is covered on LED luminescent wafer (4), and by baking, fluorescent glue (6) is cured as hemispherical;
G) radiator (3) being mounted with LED luminescent wafer (4) being fixed on lamp socket (1), the lead-in wire (5) of LED luminescent wafer (4) is connected with lamp socket (1) the two poles of the earth;
H) lampshade (2) is installed on lamp socket (1), radiator (3) is covered, completes the installation of bulb.
CN201410665831.0A 2014-11-19 2014-11-19 Three-dimensional luminous LED (Light Emitting Diode) bulb lamp and preparation method thereof Expired - Fee Related CN104406070B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410665831.0A CN104406070B (en) 2014-11-19 2014-11-19 Three-dimensional luminous LED (Light Emitting Diode) bulb lamp and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410665831.0A CN104406070B (en) 2014-11-19 2014-11-19 Three-dimensional luminous LED (Light Emitting Diode) bulb lamp and preparation method thereof

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CN104406070B true CN104406070B (en) 2017-01-11

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124008A (en) * 2006-10-18 2008-05-29 Nobuichi Tsubota Led unit, manufacturing method of led unit, and luminaire for ceiling using led unit
CN102221159A (en) * 2011-07-15 2011-10-19 厦门星际电器有限公司 LED (light-emitting diode) lamp with radiating function
CN102301181A (en) * 2009-02-17 2011-12-28 西尔欧集团 LED light bulbs for space lighting
JP5208713B2 (en) * 2008-12-22 2013-06-12 ミネベア株式会社 Linear light source device and planar illumination device
CN103542298A (en) * 2013-10-28 2014-01-29 江门市亮大照明有限公司 LED (Light Emitting Diode) sunlight packaging structure with high production efficiency
CN203836641U (en) * 2014-03-13 2014-09-17 江阴金扬光电科技有限公司 LED bulb
CN204268141U (en) * 2014-11-19 2015-04-15 汇高(广州)电子有限公司 A kind of LEDbulb lamp of three-dimensional light

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008124008A (en) * 2006-10-18 2008-05-29 Nobuichi Tsubota Led unit, manufacturing method of led unit, and luminaire for ceiling using led unit
JP5208713B2 (en) * 2008-12-22 2013-06-12 ミネベア株式会社 Linear light source device and planar illumination device
CN102301181A (en) * 2009-02-17 2011-12-28 西尔欧集团 LED light bulbs for space lighting
CN102221159A (en) * 2011-07-15 2011-10-19 厦门星际电器有限公司 LED (light-emitting diode) lamp with radiating function
CN103542298A (en) * 2013-10-28 2014-01-29 江门市亮大照明有限公司 LED (Light Emitting Diode) sunlight packaging structure with high production efficiency
CN203836641U (en) * 2014-03-13 2014-09-17 江阴金扬光电科技有限公司 LED bulb
CN204268141U (en) * 2014-11-19 2015-04-15 汇高(广州)电子有限公司 A kind of LEDbulb lamp of three-dimensional light

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Effective date of registration: 20161213

Address after: 510620 Guangdong Province, Guangzhou high tech Industrial Development Zone Ruitailu No. 2 No. 102

Applicant after: GUANGZHOU WIN NEWS TECHNOLOGY CO., LTD.

Address before: Whampoa Kaitai Avenue Ruitailu District of Guangzhou City, Guangdong Province, No. 2 510700

Applicant before: High (Guangzhou) Electronics Co., Ltd.

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170111

Termination date: 20171119