CN104395085B - For the material deposition system that material is deposited on substrate and method - Google Patents
For the material deposition system that material is deposited on substrate and method Download PDFInfo
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- CN104395085B CN104395085B CN201380031437.5A CN201380031437A CN104395085B CN 104395085 B CN104395085 B CN 104395085B CN 201380031437 A CN201380031437 A CN 201380031437A CN 104395085 B CN104395085 B CN 104395085B
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- 239000000758 substrate Substances 0.000 title claims abstract description 42
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- 238000009826 distribution Methods 0.000 claims description 17
- 238000004140 cleaning Methods 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 11
- 239000007921 spray Substances 0.000 claims description 6
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- 238000002347 injection Methods 0.000 description 12
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Abstract
For the material deposition system (10,30) material being deposited on electric substrate (12), including: framework (20,32)；Support member (22), it is attached to described framework and is configured to during deposition operation support electric substrate (12)；Gantry (24,38), it is attached to described framework (20,33)；And deposition head, it is attached to described gantry (24,38).Described deposition head (14,36) can be mobile in described support member (22) top by the movement of gantry (24,38).Described deposition head (14,36) including: room (1110), and it is configured to store material；Actuator (1130), it is configured to the material of certain volume is released described room (1110)；Pin (120), it extends from described room (1110) and terminates at pinhole aperture (130)；And at least two air nozzle (140,150), they are positioned at the relative both sides of described pinhole aperture (130).In response to described actuator (1130), the material of intended volume is formed at described pinhole aperture (130) place, and described at least two air nozzle (140,150) each generation time control air pulse in, to produce microdroplet from described intended volume and described microdroplet accelerated to two-forty.
Description
Related application
The application relates to and requires to be filed on June 29th, 2011, entitled " Pulsed Air-Actuated
Micro-Droplet on Demand Ink Jet (pulse of air actuating type microdroplet drop on demand ink jet machine) ", the U.S. Shen transferred the possession of
Please serial number No.13, the priority of the U.S. Patent application of 135,215, and be filed on August 25th, 2010, entitled
" Pulsed Air-Actuated Micro-Droplet on Demand Ink Jet (the on-demand spray of pulse of air actuating type microdroplet
Ink machine) ", the Application U.S. Serial No No.61/376 that transfers the possession of, the priority of the U.S. Provisional Patent Application of 942, the two is beautiful
State's patent application is thus incorporated herein by reference for all purposes.
Technical field
The present invention generally relates to the system and method being deposited on by material on substrate (such as printed circuit board (PCB)), especially
It relates to the apparatus and method being deposited on electric substrate by following material, described material be such as soldering paste, epoxy resin,
Underfill, encapsulant and other assembly materials.
Background technology
If there is the prior art distribution system of dry type, being used for distributing the liquid that can count or slurry and answering for various
With.A kind of this application is IC chip and other electronic units to be assembled in circuit board substrate (they are sometimes referred to
For electric substrate) on.In this application, automatic partition match system be used for by micro-Breakup of Liquid Ring epoxide resin or soldering paste or some
Other associated materials distribute on circuit boards.Automatic partition match system is additionally operable to underfill and encapsulant distribution
Line, parts are mechanically secured to circuit board by these materials.Underfill and encapsulant are in order to improve assembly
Machinery and environmental characteristics.
Another Application is for distributing the least or micro-material to circuit board.Can distribute micro-material one it is
In system, dispenser unit utilizes the rotating screw machine with spiral groove to force material to leave nozzle and enter on circuit board.
A kind of such system is disclosed in Speedingline Technologies company (this in Franklin city, Massachusetts
The subsidiary of bright assignee) entitled " the LIQUID DISPENSING SYSTEM WITH SEALING that has
AUGERING SCREW AND METHOD FOR DISPENSING (has fluid dispensing system and the use of sealing screw screw mandrel
In distribution method " United States Patent (USP) No.5,819,983.
In the operation using spiral type allotter, before micro-material or wire material are distributed to circuit board,
Dispenser unit is reduced towards the surface of circuit board, and after distribution micro-material or wire material, promotes allotter list
Unit.Use the allotter of the type, little accurate material can be placed with the biggest precision.At forward in the direction of circuit board
Needed for time needed for upper reduction and lifting dispenser unit (being commonly called z-axis to move) can aid in execution batch operation
Time.Specifically, utilize the allotter of spiral type, before distribution micro-material or wire material, reduce dispenser unit,
Make material or " humidifying " circuit board.Humidifying processes the extra time contributing to performing batch operation.
In automatic partition orchestration field it is known that towards circuit board launch or injection microviscosity material.In this spray
In the system of emitter type, minimum and discrete sticky stuff penetrates from nozzle with enough inertia so that material is at contact electricity
Can separate with nozzle before the plate of road.As it has been described above, use the application of spiral type or other existing traditional distribution systems,
Needed with micro-material humidifying circuit board before nozzle release micro-material.When injection, micro-material can be deposited on substrate
Humidifying is not the pattern of discrete micro-material, or alternatively, micro-material can be positioned to sufficiently close to each other so that they close
And become continuous pattern more or less.A kind of such injection type system is disclosed in that to be positioned at Illinois Glenn dimension outstanding
Entitled " the METHOD AND APPARATUS FOR that Illinois Tool Works company (assignee of the present invention) has
DISPENSING A VISCOUS MATERIAL ON A SUBSTRATE is (for the method being assigned on substrate by sticky stuff
And device) " United States Patent (USP) No.7,980,197 in.
In micro-spray technology field, ink-jet printer uses one or more ink gun accurately to project ink droplet traditionally
To generate word, graph image or other labellings on print media (such as paper).Outside small from every head of ink droplet
Aperture, portion projects print media to form word, graph image or other labellings on the print medium.Suitably control
System makes the generation of ink droplet synchronize.It is essential that ink droplet is substantially uniform size, it is also important that ink droplet is uniformly applied
Make the printing will not distortion on the print medium.Especially when material is deposited on electric substrate, it is also important that ink droplet is smart
Really it is applied on electric substrate.
Existing spraying technique, either heat seeking injection or piezoelectric type injection, be only capable of injection and have low stickiness liquid
The microdroplet of body (usually 2 to 15 centipoise) (such as water-based ink), and it is only used for hand-to-hand fight in tights print distance.Thus, conventional ink-jet system
System can not be specifically adapted to distribute the material of above-mentioned more high viscosity.In this existing ink-jet technology, pressure pulse is with enough
Pressure applies to fluid chamber to overcome surface tension, thus is formed from inkjet nozzle and eject fluid and drip.But, for root
Spray the liquid (more than 100 centipoises) of more high viscosity according to Drop-on-demand requirement for, there is not known injection method.
In the ink gun of a kind of fundamental type, the on-demand generation of ink droplet, e.g., as disclosed in entitled " APPARATUS FOR
APPLYING LIQUID DROPLETS TO A SURFACE BY USING A HIGH SPEED LAMINAR AIR FLOW
TO ACCELERATE THE SAME is (for by using high-speed layer pressure type air stream to apply to surface drop to accelerate drop
Device) " United States Patent (USP) No.4, as 106,032, its entire disclosure is incorporated herein by.At this on-demand
In fixed pattern ink gun, the pressure wave generated in response to the electric pulse from applying to piezoquartz, in the ink chamber in ink gun
Ink flow by the ink channel in ink locular wall, and drip in the inside of the outer surface being positioned at ink chamber's wall and formed out
Ink droplet is formed at oral pore.Ink droplet forms outlet opening through air chamber towards the outside major bore of ink gun from dripping, thus guides
To print media.The continuous air being under pressure is transported to air chamber, and promotes ink droplet to pass through air chamber arrival printing
Medium.
But, the Drop-on-demand ink gun of this prior art has many inferior positions, defect and/or restriction, such as at title
For " AIR ASSISTED INK JET HEAD WITH PROJECTING INTERNAL INK DROP-FORMING
ORIFICE OUTLET (there is the internal ink droplet of projection and form the air-assisted ink gun of outlet opening) " United States Patent (USP) No.4,
613,875 and entitled " AIR ASSISTED INK JET HEAD WITH SINGLE COMPARTMENT INK
CHAMBER (there is the air-assisted ink gun of Dan Cang ink chamber) " United States Patent (USP) No.4, discussed in 728,969, this
The entire disclosure of a little patents is incorporated herein by.In order to attempt improving the Drop-on-demand ink gun of this prior art, ink
Hydroecium has ink droplet and forms outlet opening, and in response to the pressure wave caused by piezoquartz, ink droplet generates from this outlet opening.Inside this
Outlet opening is placed in the middle in the projective structure extended towards outer aperture.Projective structure is the shape of frustum-like shape or mesa shaped.
As described herein, the air at the top (outlet opening) flowing through projection prevent ink humidifying in addition to the top of projection other
Place, thus cause extremely uniform ink droplet to be formed, the most single uniform micro-material produces in response to each pressure wave and is printing
On medium.
Existing micro-injection technology, regardless of whether be piezoelectric type injection, SF or time pressure are to droplet size and use
Fluid viscosity scope in applicable jet fluid has the restriction of inherence, is the most successfully combined in allotter and for inciting somebody to action
This sticky stuff puts in the system on electric substrate.
Summary of the invention
One scheme of the present invention is for the material deposition system for being deposited on electric substrate by material.A reality
Executing in example, described material deposition system includes: framework；Support member, this support member is attached to described framework and is configured to heavy
Electric substrate is supported during long-pending operation；Gantry, this gantry is attached to described framework；And deposition head, this deposition head is attached to institute
State gantry.Described deposition head can move by the movement of described gantry above described support member.Described deposition head includes:
Room, this room is configured to store material；Actuator, this actuator is configured to the material of certain volume is released described room；Pin, this pin
Extend from described room and terminate at pinhole aperture；And at least two air nozzle, they are positioned at the relative of described pinhole aperture
Both sides.The material response of described intended volume is formed at described pinhole aperture in described actuator, and described at least two
Each air nozzle in air nozzle all produces time control air pulse, to produce microdroplet and by described from described intended volume
Microdroplet accelerates to two-forty.
The embodiment of described material deposition system can include control system further, and described control system is for will be from
The time control air pulse of described at least two air nozzle with at described pinhole aperture, form intended volume by described actuator
Material synchronize.At described pinhole aperture formed intended volume material before, described control system enable described at least
Two air nozzles.After producing described microdroplet, described control system disables described at least two air nozzle.Described material
Low sticky stuff and high viscosity material can be included.Described microdroplet can equal to or less than described pinhole aperture.
Another program of the present invention is for the method for being deposited on electric substrate by material.In one embodiment,
Described method includes: electric substrate is positioned at the lower section of the deposition head that can move by gantry；By material supply to described
The room of deposition head；Extend the pin of described deposition head from described room, described pin terminates at pinhole aperture；Actuating with described deposition head
The material of certain volume is released described room to form the material of intended volume at described pinhole aperture by device；By at least two air
Nozzle is positioned at the relative both sides of described pinhole aperture；And produce time control air pulse, to create micro-from described intended volume
Drip and described microdroplet accelerated to two-forty to deposit described microdroplet.
The embodiment of described method can include by control system further by from described at least two air nozzle
Time control air pulse carries out synchronize with the material forming intended volume by described actuator at described pinhole aperture.Described method
Can be included in further at described pinhole aperture formed intended volume material before, enable described at least two air nozzle.
Described method can be included in the step disabling described at least two air nozzle after producing described microdroplet further.Described material
Material can include low sticky stuff and high viscosity material.Described microdroplet can equal to or less than described pinhole aperture.
The further scheme of the present invention is for the material deposition system for being deposited on electric substrate by material.At one
In embodiment, described material deposition system includes: framework；Support member, it is attached to described framework and is configured to deposition behaviour
Electric substrate is supported during work；Gantry, it is attached to described framework；And deposition head, it is attached to described gantry.Described deposition
Head can move by the movement of described gantry above described support member.Described deposition head includes: room, and it is configured to store material
Material；Actuator, the material of certain volume is released described room by its structure；Pin, it extends from described room and terminates at pin hole
Mouthful；And it being positioned at the device of the relative both sides of described pinhole aperture, it is used for producing time control air pulse, with from described expectation body
Long-pending material produces microdroplet and described microdroplet is accelerated to two-forty.
The embodiment of described material deposition system can include control system further, and described control system is for by time control
Air pulse carries out synchronize with the material forming intended volume by described actuator at described pinhole aperture.In described pinhole aperture
Before place forms the material of intended volume, described control system enables at least two air nozzle.After producing described microdroplet,
Described control system disables described at least two air nozzle.Described material can include low sticky stuff and high viscosity material.
Described microdroplet can equal to or less than described pinhole aperture.
Accompanying drawing explanation
Accompanying drawing is not intended to scale relative to.In the accompanying drawings, each identical or essentially identical parts phase in each figure
Same reference represents.For purposes of clarity, all parts are not the most marked.In the accompanying drawings:
Fig. 1 is material deposition or the schematic side view of application system；
Fig. 2 is the axonometric chart of the exemplary materials depositing system of the embodiment of the present invention, and it comprises gantry system and material sinks
Long-pending head；
Fig. 3 A, 3B, 3C and 3D are the schematic diagrams being formed microdroplet by the method and system of the present invention；
Fig. 4 is the demonstration of the pin stretched out from ink chamber and the actuator exposing desired ink at the outlet opening of pin
The schematic diagram of embodiment；
Fig. 5 A is the axonometric chart of the pin illustrating embodiments of the invention；
Fig. 5 B is the top view of above-mentioned pin；
Fig. 5 C is the side view of above-mentioned pin；
Fig. 5 D is the sectional view of the line 5D-5D intercepting along Fig. 5 B；And
Fig. 5 E is the sectional view of the line 5E-5E intercepting along Fig. 5 B.
Detailed description of the invention
Only for illustrative purpose rather than restriction generality, describe the present invention in detail referring now to accompanying drawing.The present invention is also
Do not applied structure and the details of layout being limited to diagram in that description below is illustrated or accompanying drawing.The present invention is illustrated
Principle can be used in other embodiments, and can try out or implement in every way.And, word used herein
And term is for illustrative purposes, it is not construed as limiting.Use " including ", " including ", " having ", " comprising ", " relate to
And " and modification mean to include items listed thereafter and its equivalent structure and extra items.
Various embodiments of the present invention for material deposition or application system, include the equipment of this material deposition system
And the method for deposition material.Specifically, embodiments of the invention are for being used for material (such as half stickiness and stickiness material
Material) it is allocated in the allotter on electric substrate (such as printed circuit board (PCB)).This material includes but not limited to soldering paste, epoxy radicals tree
Fat, underfill and encapsulant, they all use in the manufacture process of printed circuit board (PCB).Can also be used it
The material of his relatively low stickiness, such as conductive ink.
Fig. 1 schematically illustrates material deposition system according to an embodiment of the invention, such as allotter, total body surface
It is shown as 10.Material deposition system 10 is used for sticky stuff (such as, more than the material of 100 centipoises) is deposited on electric substrate 12
On (such as printed circuit board (PCB) or semiconductor wafer).Electric substrate 12 can include other substrates, such as solar energy further
Battery.Material deposition system 10 can be also used for depositing the material (half sticky stuff) of other relatively low stickiness of such as conductive ink
On electric substrate 12.Material deposition system 10 can alternatively be used for other application, is such as used for applying automobile gasket material
Or apply for specific medical.It should be understood that as used herein, to relatively low stickiness, half stickiness or stickiness material
Quoting of material is exemplary, and is intended to unless otherwise prescribed not limit.
Material deposition system 10 includes: sedimentation unit or deposition head, is sometimes referred to as allocation unit, and it is generally designated as
14；And controller 18, this controller is for controlling the operation of material deposition system.Though it is shown that single deposition head, but should
It should be appreciated that, two or more deposition head can be set.Material deposition system 10 also includes: framework 20, and this framework 20 has
For supporting the pedestal 22 of substrate 12；And gantry system 24, this gantry system 24 is movably coupled to framework 20 for propping up
Support and mobile deposition head 14.Deposition head 14 and gantry system 24 are attached to controller 18, and operate under the direction of the controller.
Transmitter system (not shown) or other transmission mechanisms (such as, step rate) can use in material deposition system 10 with control
Circuit board is loaded onto material deposition system and from material deposition system unloading circuit plate by system.Use under controller 18 controls
Motor, gantry system 24 can move sedimentation unit 14 is positioned predetermined position on circuit boards.
Material deposition system 10 can include display unit 26 alternatively, display unit 26 be connected to controller 18 for
User shows various information.In another embodiment, can exist optionally with in the second controller controlling sedimentation unit.Material
Material depositing system 10 farther includes the collection cups 28 when cleaning pin, it will be described in more detail below.As shown, receive
Collection cup 28 is placed on mobile saddle 30, and saddle 30 can move relative to framework 20.
With reference to Fig. 2, exemplary materials depositing system is generally designated as 30, and it can be by Franklin city, Massachusetts
Speedline Technologies company providesAllotter platform is constituted.Material deposition system 30 is wrapped
Including: framework 32, the parts of this framework 32 backing material depositing system, these parts include but not limited to be positioned at material deposition system
Cabin 34 in controller (such as controller 18)；And be generally designated as 36 deposition head or dispensing head, deposition head or
Dispensing head is used for depositing low sticky stuff (such as, less than 50 centipoises), half sticky stuff (such as, 50-100 centipoise), stickiness material
Material (such as, 100-1000 centipoise) and/or high viscosity material (such as, more than 1000 centipoises).Deposition head 36 can be at controller
Under the control of 18, the quadrature-axis along gantry system (being generally designated as 38) moves to allow by Distribution of materials on circuit boards,
Circuit board is such as above-mentioned substrate 12, can be sometimes referred to as electric substrate or circuit board.Lid 40 is illustrated at beating
Open position is with the internal part of display material depositing system 30, and internal part includes deposition head 36 and gantry system 38.
Supply is generally of pad pattern or other patterns, this figure to the circuit board (such as substrate 12) of material deposition system 30
Case is generally for the conductive surface area of material deposition.Material deposition system 30 also includes transmitter system (not shown), this transmission
Device system can be entered by the opening 42 arranged along every side of material deposition system, with along the x-axis direction by board transmission
Deposition position to material deposition system.In some embodiments, material deposition system 30 has and is generally designated as 44
All stations assembly, when circuit board is in the deposition position below deposition head 36, assembly of standing in week is positioned adjacent to circuit board.When by material
When the controller of material depositing system 30 guides, transmitter system is by below circuit board supply to deposition head 36 and adjacent to week station assembly
The position of 44.Once arriving the position below deposition head 36, circuit board is at for manufacturing operation (such as, deposition operation)
Appropriate location.
Material deposition system 30 farther includes vision inspection system, and vision inspection system is indicated generally at 46 and structure
Make as alignment circuit plate and check deposition material on circuit boards.In order to material is successfully deposited on circuit board, warp
By controller 18, circuit board and deposition head 36 are directed at.Alignment is heavy by moving based on the reading from vision inspection system 46
Long-pending 36 and/or circuit board and realize.When deposition head 36 and circuit board are properly aligned with, handle deposition head to perform deposition
Operation.After deposition operation, the optional inspection relying on vision inspection system 46 to carry out circuit board can be performed, to guarantee
Deposited suitable material and at suitable position that material has been deposited on circuit board.Vision inspection system 46 can use
Benchmark, chip, plate hole, chip edge or other discernible patterns on circuit board are to determine suitable alignment.Checking
After circuit board, controller uses transmitter system control circuit plate to move to next position, can perform plate at this position
Next during assembling processes operates, and next operates e.g.: can be placed on circuit boards by electricity parts, or can will deposit
Material solidification onboard.
In certain embodiments, material deposition system 30 can operate as follows.Transmitter system can be used circuit board
It is loaded into the deposition position in material deposition system 30.By using vision inspection system 46 that circuit board is directed at deposition head 36.
May then pass through controller start deposition head 36 to perform deposition operation, in this deposition operation, material is deposited on circuit
Precise location on plate.Once deposition head 36 has performed deposition operation, then from material deposition can be by transmitter system
Unite 30 transmission circuit plates so that second circuit board subsequently can be loaded in material deposition system.
Illustrating deposition head with reference to Fig. 3 A to 3D, Fig. 3 A, this deposition head is embodied as the ink-jet of the ink-jet system 110 of the present invention
Head.Although be used herein as " ink " and " ink-jet " ink-jet system 110 is described it should be understood that, " ink " and
" ink-jet " should not limit system and the material deposited by system.As shown in Figure 3A, at the outlet opening of pin and from sky
When the time control air pulse of gas jets starts, what deposition head had an intended volume of material is initially formed thing.Fig. 3 B illustrates logical
Cross the pulse of air from air nozzle and be initially formed microdroplet.Fig. 3 C illustrates the microdroplet supply source from ink and the outlet opening of pin
Depart from, and microdroplet is towards the acceleration of print media.Fig. 3 D illustrates the microdroplet completed in the outer aperture leaving ink gun, and
The end of time control air pulse.
Therefore, Fig. 3 A to 3D schematically illustrates the ink droplet forming portion of exemplary ink jet head of system 110 of the present invention
Sectional view.As can be seen, the end of pin 120 terminates at outlet opening 130.First air nozzle 140 and the second air nozzle
The 150 relative both sides being positioned at outlet opening 30, for being guided out the time control air pulse at oral pore 130.Exemplary ink jet head
Outer aperture 160 be positioned at below the outlet opening 130 of pin 120.Outer aperture 160 axially aligns pin 120 and its outlet opening 130.
Turning now to Fig. 3 A, by suitable actuator, at the outlet opening 130 of pin 120, form the expectation body of ink 180
Long-pending 170 be initially formed thing, all piezoquartzes in this way of actuator, piston or any other suitably can be by ink from ink
Room pulse enters into and through in pin 120 and by the actuator of this pin 120.Actuator force need not be enough to from pin outlet completely
Drop ejection.Intended volume 170 is illustrated as the substantially hemispherical projections of the ink that the outlet opening 130 from pin 120 extends.Formed
Before or while intended volume 170, the first air nozzle 140 and the second air nozzle 150 are enabled simultaneously for expectation body
Long-pending 170 conveying time control air pulses.
As a result, from the power extruding intended volume 170 of the pulse of air of air nozzle 140 and 150, as shown in Figure 3 B,
Until the intended volume 170 excess ink 180 from pin 120 departs from, as shown in Figure 3 C, thus create microdroplet 170a.As
Shown in Fig. 3 C, the power from the pulse of air of air nozzle 140 and 150 continues to accelerate microdroplet 170a and leaves outer aperture 160 also
And towards print media.
Once define microdroplet 170a and be pushed out outer aperture 160, then disabling air nozzle 140 and 150, such as Fig. 3 D
Shown.Utilize time control air pulse to produce in aforementioned manners and accelerate microdroplet 170a by making, it is possible to generating less than outlet
The microdroplet of the diameter in hole 130 and accelerate to print distance spray for suitably injection and with longer by microdroplet with sufficiently high speed
Penetrate.This is also applicable even for high viscosity liquid.Time shown in fig. 3d terminates time control air pulse and ensure that micro-
Drip 170a and will maintain its integrity when it advances to print media with two-forty.Continuous high speed rate air stream will shear ink droplet,
Produce the long ink " tail " of towing ink droplet, or otherwise negatively affect the integrity of ink droplet and cause inappropriate
Ground or apply the most defectively to print media.
With reference now to Fig. 4, it is illustrated that the exemplary embodiment of disclosed method and system.Piston shell 1100 is shown as
Having ink chamber 1110, ink chamber 1110 terminates at a diameter of DoPiston shell aperture 1120.Pin 120 is suitably attached to live
Plug housing aperture 1120.Pin 120 and piston shell aperture DoThere is identical or roughly the same diameter.Pin 120 also defines
Length or liquid length So.Piston 1130 be operatively positioned in piston shell 1100 inside and can piston movable within
Stroke distances Sp.Piston 1130 has piston diameter Dp.It should be understood that piston 1130 is via suitable piston control system
Mobile, this piston control system activates piston 1130 as required, and wherein, piston 1130 travels piston stroke distance SpTo push away
The ink of dynamic intended volume leaves ink chamber 1110, into and through pin 120 and leaves pin outlet opening 130, as shown in Figure 3A.
Although the actuator in Fig. 4 be shown as piston 1130 it should be understood that, any suitable actuator all may be used
To be used for promoting the ink of intended volume to leave pin 120, as shown in Figure 3A.It is, for example possible to use piezoquartz replaces piston.
Many factors affects the size (that is, dripping diameter) of ink droplet and ink droplet is ejected into print media.These factors include
Acceleration time Δt, orifice area Ao, piston area Ap, piston acceleration ap, orifice diameter Do, piston diameter Dp, power on piston
Fp, piston matter Mp, liquid column length So, piston stroke Sp, Mean fluid speed Uo, final speed U of liquid at apertureO, f, at aperture
Liquid initial speed UO, i, average piston speed Up, final speed U of pistonP, f, piston initial rate UP, i, fluid density ρ with
And surface tension σ.According to presently disclosed method and system, it has been determined that, the size of ink droplet or more specifically drip
Diameter DdBelow equation can be used to calculate:
Dd=(6σ M p D o 3 )1/3=(6σ M p S p D o )1/3
ρ Fp Dp 2 ρ Fp So
Thus it is seen that, drop volume is directly proportional to the ratio of surface tension and fluid density.Drop volume becomes anti-with acceleration
Ratio.The cubic root of drop volume and orifice diameter or Do3 with the square root of piston diameter or DpThe ratio of 2 is directly proportional.Also as can be seen,
Higher acceleration produces less drop volume.In order to obtain higher acceleration, it usually needs longer haul distance, otherwise
Big energy must be supplied.But, longer stroke can generate bigger drop volume.In order to obtain little drop volume, it is necessary to use
Short stroke, but so generally cannot obtain high acceleration.But, this method and system can use short stroke to produce
Little drop volume, realizes a high speed simultaneously.
In presently disclosed method and system, the only ink of micro volume needs to be present at pin outlet opening, and comes
It is used for extracting this micro volume from the time control air pulse of air nozzle.Time control air pulse from air nozzle can will drip
Accelerate to up to 340m/s (velocity of sound).Therefore, the time control air pulse from air nozzle supplies micro-from high viscosity liquid extraction
Drip and accelerate them the energy needed for two-forty.Time control air pulse also keeps orifices clean, keeps dropping in it and marches to
It is straight during print media, and increases extra desorption power.
As an example, the embodiment shown in Fig. 4 is for spraying the microdroplet of the motor oil of 30W.In this example embodiment, orifice diameter
DoIt is 152 μm, piston diameter DpIt is 850 μm.In piston stroke S usedpWhen being 100 μm, from the time control air of air nozzle
Pulses generation microdroplet and with two-forty accelerate microdroplet, the diameter D that microdroplet hasdLess than orifice diameter Do.Although it is described above
Size be the operation of demonstration methods and system signal it should be understood that, these sizes can be carried out with herein
Instruct different various amendments.
Although discussed above proposing in an exemplary fashion causes about the disclosed on-demand pulse of air for high viscosity liquid
The teaching of the method and system of dynamic high-velocity droplets, but it will be clear to the person skilled in the art that this teaching can
To be applied to any kind of generation and to apply drop to the equipment of substrate (such as, spraying, soldering, printing etc.).Additionally, to the greatest extent
Manage and aforementioned have been described with optimal mode and/or other examples, it should be understood that it can be carried out various amendment, this
The disclosed theme in place may be embodied as various forms and example, and this teaching can apply to several application, only describes herein
Some of which is applied.
In one example, with reference to Fig. 5 A to 5E, nozzle or pin are generally designated as 2000.As shown, it is being illustrated in
In one embodiment of Fig. 5 A and 5B, pin 2000 includes three parts, when these three part matches together formed circumferentially around
Multiple air flues that fluid distribution pinhole aperture is left.This path forces air parallel to flow equably in the fluid stream ejected
Dynamic.Along with air flows through wherein, the aperture area of this path reduces equably, thus dramatically increases its speed.This high velocity stream is drawn
Rise and be attached to any liquid desorption pin outside outside pinhole aperture by surface tension and taken away by air stream.
Fig. 5 C shows three parts of pin, and includes: fluid distribution pin 2010；Base 2020, it pumps with fluid
Equipment is equipped with mutually and is formed for liquid and the housing of air assist passage, thus keeps flow separation and by air auxiliary flow
Direction is shaped to and fluid levelling row and concentric flowing；And nozzle 2030, it forces flowing to be concentric with distributed liquid
Stream, is also formed for path that is stable and that comprise air auxiliary flow.
Fig. 5 D illustrates air auxiliary entrance port 2040, and airflow distribution is circumferentially around air auxiliary flow side by it
Flow with homogenization to port.Air auxiliary flow is concentric with distribution pin 2010 ground and leaves, and the serrated face 2050 of pin is used as further
Setting air stream and guide any liquid that splashes down to leave pin discharge tip.
Fig. 5 E illustrates fluid inlet port 2080, distribution pin outlet port 2090 and air auxiliary flow direction port
In one 2070.
This layout makes air auxiliary air generation " the literary composition mound flow through direction controlling path and leave around distribution pin outlet
In effect ", this is in the most advanced generation negative pressure of distribution pin and extracts out and may stay any residual fluid at this tip.This fluid
Taken away by air auxiliary flow, and can be collected in waste canister cup for processing.
Further disclose the pin for cleaning material depositing system (such as allotter) or the method for nozzle.The method
Performing deposition operation including by material deposition system (such as system 10 or 30), material deposition system is configured to: by electronics base
Plate is positioned through below the moveable deposition head of gantry；Room by material supply to deposition head；By the piston of deposition head from this
Room is extended；And promote the material of certain volume to leave room by the actuator of deposition head to be deposited on to be formed at pinhole aperture
The material of the intended volume on electric substrate.The air that the method farther includes with being directed to pinhole aperture cleans pinhole aperture.
The step of cleaning pinhole aperture can be to carry out before or after deposition operation.Cleaning includes: by two or more skies
Gas jets is positioned at the relative both sides of pinhole aperture；And generation guides the air pulse to pinhole aperture.In a particular embodiment,
Control system is synchronized to produce time control air pulse to clean pinhole aperture from two air nozzles.In another embodiment, should
Method farther includes to be positioned at above collection cups by deposition head when cleaning pin.Collection cups is placed on mobile saddle with movement
Or Positioning collection cup is below deposition head.
Thus, it should be observed that, the dispensing head of the embodiment of the present invention uses air as actuating can be to help from dividing
Join head release to drip.Skinny device assembles against jet expansion and the concentric table making to drip desorption nozzle with generation shearing force
Face.This equipment be configured to cause air the exit point of fluid or near impulse nozzle, and geometrically balance around nozzle
Drop in avoid any deviation or power, deviation or power to cause and deviate its expected path during marching to distribute surface.Empty
Gas secondary effects can by change pressure applied and change, additionally it is possible to be embodied as pulse mode with interrupt further drip and
Surface tension between nozzle.If being applied for pulse mode, it is highly important that pulse and persistent period the time, to guarantee
Effective desorption and utilization are left the residual air stream of equipment and are aided in towards target carrying droplet.
In a particular embodiment, the time control pulse being perpendicular to drip direction allows to be substantially reduced a size.An embodiment
In, drip be ejected before should not start air auxiliary too early, otherwise produced turbulent flow can interfere the injection of droplet.This
Outward, air auxiliary should not apply too late, and expectation otherwise may not be occurred to discharge and drip will be without departing from nozzle.The pulse of air can
With the shortest so that there will be no residual pressure and interfere the injection dripped subsequently.
The teachings of the present invention can apply to any kind of distribution system and (includes the distribution system with nozzle type dispensing head
System) with by injection of material to electric substrate.
So have been described with some schemes of at least one embodiment of the present invention it should be understood that the technology of this area
Personnel are readily apparent that various change, revise and improve.This change, revise and improve the part being intended to the present invention,
And it is intended to fall under in the spirit and scope of the present invention.Therefore, aforementioned specification and accompanying drawing are only examples.
Claims (26)
1., for the material deposition system being deposited on electric substrate by material, described material deposition system includes:
Framework；
Support member, this support member is attached to described framework, and described support member is configured to during deposition operation support electric substrate；
Gantry, this gantry is attached to described framework；And
Deposition head, this deposition head is attached to described gantry, and by the movement of described gantry, described deposition head can be described
Moving above support member, described deposition head includes:
Room, this room is configured to store material,
Actuator, this actuator is configured to the material of certain volume is released described room,
Pin, this pin extends from described room and terminates at pinhole aperture, and
At least two air nozzle, they are positioned at the relative both sides of described pinhole aperture,
Wherein, in response to described actuator, it is desirable to the material of volume is formed at described pinhole aperture, and wherein, described at least
Each air nozzle in two air nozzles all produce time control air pulse with from the material of described intended volume produce microdroplet,
Described microdroplet is accelerated to two-forty and cleans described aperture.
Material deposition system the most according to claim 1, this material deposition system farther includes control system, this control
System for by from described at least two air nozzle time control air pulse with by described actuator in described pinhole aperture
Place forms the material of described intended volume and synchronizes.
Material deposition system the most according to claim 2, wherein, forms the material of described intended volume at described pinhole aperture
Before material, described control system enables described at least two air nozzle.
Material deposition system the most according to claim 3, wherein, after producing described microdroplet, described control system is stopped
With described at least two air nozzle.
Material deposition system the most according to claim 1, wherein, described material includes low sticky stuff and high viscosity material
Material.
Material deposition system the most according to claim 5, wherein, described microdroplet equals to or less than described pinhole aperture.
Material deposition system the most according to claim 1, wherein, described deposition head also includes multiple air flue, described
Multiple air flues leave circumferentially around fluid distribution pinhole aperture, are used for guiding air auxiliary flow.
8., for the method being deposited on electric substrate by material, described method includes:
Electric substrate is positioned at the lower section of the deposition head that can move by gantry；
Room by material supply to described deposition head；
Being extended from described room by the pin of described deposition head, described pin terminates at pinhole aperture；
With the actuator of described deposition head, the material of certain volume is released described room to form expectation body at described pinhole aperture
Long-pending material；
At least two air nozzle is positioned at the relative both sides of described pinhole aperture；And
Produce time control air pulse, with from the material of described intended volume produce microdroplet, described microdroplet is accelerated to two-forty with
Deposit described microdroplet and clean described aperture.
The most according to Claim 8, the method stated, farther include from described at least two air nozzle by control system
Time control air pulse carries out synchronize with the material being formed described intended volume by described actuator at described pinhole aperture.
Method the most according to claim 9, further includes at the material forming described intended volume at described pinhole aperture
Before, described at least two air nozzle is enabled.
11. methods according to claim 10, after further including at the described microdroplet of generation, disable described at least two
The step of air nozzle.
12. methods according to claim 8, wherein, described material includes low sticky stuff and high viscosity material.
13. methods according to claim 12, wherein, described microdroplet equals to or less than described pinhole aperture.
14. methods according to claim 8, farther include to spray to be concentric with and distribute the air auxiliary flow that pin leaves.
15. 1 kinds are used for the material deposition system being deposited on electric substrate by material, and described material deposition system includes:
Framework；
Support member, it is attached to described framework, and described support member is configured to during deposition operation support electric substrate；
Gantry, it is attached to described framework；And
Deposition head, it is attached to described gantry, and by the movement of described gantry, described deposition head can be at described support member
Top is mobile, and described deposition head includes:
Room, this room is configured to store material,
Actuator, this actuator is configured to the material of certain volume is released described room,
Pin, this pin extends from described room and terminates at pinhole aperture, wherein, in response to described actuator, it is desirable to the material of volume
Material is formed at described pinhole aperture, and
Being positioned at the device of the relative both sides of described pinhole aperture, this device is used for producing time control air pulse, with from described expectation
The material of volume produces microdroplet, described microdroplet accelerates to two-forty and cleaning pinhole aperture.
16. material deposition system according to claim 15, this material deposition system farther includes control system, described
Control system is for by time control air pulse and the material being formed described intended volume by described actuator at described pinhole aperture
Material synchronizes.
17. material deposition system according to claim 16, wherein, form described intended volume at described pinhole aperture
Before material, described control system enables at least two air nozzle.
18. material deposition system according to claim 17, wherein, after producing described microdroplet, described control system
Disable described at least two air nozzle.
19. material deposition system according to claim 15, wherein, described material includes low sticky stuff and high viscosity material
Material.
20. material deposition system according to claim 19, wherein, described microdroplet equals to or less than described pinhole aperture.
21. 1 kinds of methods for the nozzle of cleaning material depositing system, material deposition system is configured to material is deposited on electricity
On submounts, described method includes:
Performing deposition operation by material deposition system, material deposition system is configured that and electric substrate is positioned through gantry energy
Below the deposition head of enough movements；Room by material supply to deposition head；The piston of deposition head is extended from this room, described deposition
Head has the pin terminating at pinhole aperture；And promote the material of certain volume to leave room with at pin hole by the actuator of deposition head
The material of the intended volume being deposited on electric substrate is formed at Kou；
Pinhole aperture is cleaned with the air being directed to pinhole aperture；
Wherein cleaning pinhole aperture includes the relative both sides that at least two air nozzle is positioned at pinhole aperture and produces guiding
Air pulse to pinhole aperture.
22. methods according to claim 21, farther include to synchronize the time control from described at least two air nozzle
Air pulse is to clean pinhole aperture.
23. methods according to claim 21, wherein, described material includes low sticky stuff and high viscosity material.
24. methods according to claim 23, wherein, the microdroplet distributed by described pinhole aperture equals to or less than described
Pinhole aperture.
25. 1 kinds of methods for the nozzle of cleaning material depositing system, material deposition system is configured to material is deposited on electricity
On submounts, described method includes:
Performing deposition operation by material deposition system, material deposition system is configured that and electric substrate is positioned through gantry energy
Below the deposition head of enough movements；Room by material supply to deposition head；The piston of deposition head is extended from this room, described deposition
Head has the pin terminating at pinhole aperture；And promote the material of certain volume to leave room with at pin hole by the actuator of deposition head
The material of the intended volume being deposited on electric substrate is formed at Kou；
Pinhole aperture is cleaned with the air being directed to pinhole aperture；
During cleaning pin, deposition head is positioned at above collection cups.
26. methods according to claim 25, wherein, described collection cups is placed on the saddle that can move.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/448,724 US9089863B2 (en) | 2012-04-17 | 2012-04-17 | Method for cleaning a nozzle of a material deposition system |
| US13/448,724 | 2012-04-17 | ||
| PCT/US2013/036695 WO2013158588A2 (en) | 2012-04-17 | 2013-04-16 | Material deposition system and method for depositing materials on a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104395085A CN104395085A (en) | 2015-03-04 |
| CN104395085B true CN104395085B (en) | 2016-11-30 |
Family
ID=
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395509A (en) * | 2000-01-14 | 2003-02-05 | 斯皮德莱技术公司 | Variable volume positive displacement dispensing system and method |
| US7294309B1 (en) * | 2003-05-15 | 2007-11-13 | Takeda San Diego, Inc. | Small volume liquid handling apparatus and method |
| JP2010104863A (en) * | 2008-10-28 | 2010-05-13 | Seiko Epson Corp | Droplet discharge device |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395509A (en) * | 2000-01-14 | 2003-02-05 | 斯皮德莱技术公司 | Variable volume positive displacement dispensing system and method |
| US7294309B1 (en) * | 2003-05-15 | 2007-11-13 | Takeda San Diego, Inc. | Small volume liquid handling apparatus and method |
| JP2010104863A (en) * | 2008-10-28 | 2010-05-13 | Seiko Epson Corp | Droplet discharge device |
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