CN104393393A - Processing technique for orthogonal mode power combiner - Google Patents
Processing technique for orthogonal mode power combiner Download PDFInfo
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- CN104393393A CN104393393A CN201410679695.0A CN201410679695A CN104393393A CN 104393393 A CN104393393 A CN 104393393A CN 201410679695 A CN201410679695 A CN 201410679695A CN 104393393 A CN104393393 A CN 104393393A
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- mode power
- power combiner
- orthogonal mode
- upper cavity
- processing
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- 238000012545 processing Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title abstract description 23
- 238000005219 brazing Methods 0.000 claims abstract description 27
- 238000005516 engineering process Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 238000013461 design Methods 0.000 claims abstract description 13
- 238000005554 pickling Methods 0.000 claims abstract description 8
- 239000012535 impurity Substances 0.000 claims abstract description 7
- 238000011282 treatment Methods 0.000 claims abstract description 7
- 238000003754 machining Methods 0.000 claims abstract description 5
- 238000003801 milling Methods 0.000 claims description 31
- 239000002994 raw material Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000000137 annealing Methods 0.000 claims description 6
- 238000011010 flushing procedure Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 239000000945 filler Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 7
- 210000000080 chela (arthropods) Anatomy 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- Drying Of Semiconductors (AREA)
Abstract
The invention discloses a processing technique for an orthogonal mode power combiner. The processing technique for the orthogonal mode power combiner includes steps that S1, finishing processing an upper cavity body (1) and a lower cavity body (2) according to design; S2, trying to install the upper cavity body (1) and lower cavity body (2); S3, acid pickling to remove impurities; S4, manufacturing brazing filler material, and assembling the upper cavity body (1), lower cavity body (2) and brazing filler material; S5, setting a vacuum brazing curve, heating, and preserving the heat to finish vacuum brazing; S6, further carrying out numerical control machining on the shape of the orthogonal mode power combiner and a flange disc (3); S7, machining drill holes and reaming the flange disc (3); S8, performing electrochemical treatment. The novel design and technique technology of the processing technique for the orthogonal mode power combiner are suitable for the mass production of multiple types of power combiners of microwave apparatus of the electronic industry, and the processing technique for the orthogonal mode power combiner meets the product quality requirements and has advantages of less processing procedure, short production period, high cavity size precision, rare welding deformation, no weld joint corrosion and the like.
Description
Technical field
The present invention relates to a kind of processing technology of orthogonal mode power combiner.
Background technology
What microwave device manufacturing firm now made that the process of orthogonal mode power combiner adopts usually is divided into multiple part by orthogonal mode power combiner, and assembly welding is shaping several times to adopt traditional-handwork flame brazing method.As shown in Figure 1, certain orthogonal mode power combiner is by plate, waveguide, 3 ring flange Combination Welding, and adopt Manual flame soldering, its technological process is as follows:
1, part process flow process in classical production process:
1.1, plate technological process: → heat treatment → Linear cut → milling → pincers of getting the raw materials ready;
1.2, waveguide 1 technological process: → heat treatment → milling → heat treatment → number milling → Linear cut → pincers of getting the raw materials ready → forge;
1.3, waveguide 2 technological process: → milling of getting the raw materials ready;
1.4, circular flange: get the raw materials ready → car → number milling → insert;
1.5, square flange dish: milling of getting the raw materials ready → count → insert → pincers;
2, parts technological process in classical production process:
Orthogonal mode power combiner: form wave conductor (see figure 2) by plate and the first welding of waveguide 1, then by waveguide 2 and ring flange welding forming, its technological process: equipped plate and waveguide, ring flange etc. → pickling → gas brazing → cleaning → pincers → milling → pincers.
In sum, there is the following problem and defect in traditional-handwork flame brazing method: 1, manufacturing procedure is many, the production cycle is long; 2, operating personnel's workload is large, and level of skill requires higher (when plate and waveguide 1 welding, by operator by plate bending and forming); 3, traditional-handwork gas brazing is localized heating, poor temperature uniformity during welding, and after welding, the deflection of die cavity is comparatively large, and cavity dimension precision is difficult to ensure; 4, the consistency of the orthogonal mode power combiner that traditional-handwork gas brazing is shaping is poor, large to telecommunication parameter influence, increases debugging difficulty; 5, for making solder wetting, capillary flow in mother metal gap, brazing flux must be used during soldering joint filling, and brazing flux is large to the corrosiveness of mother metal itself, thoroughly cannot remove residual brazing flux after soldering, cause the antiseptic property of power combiner significantly to reduce, useful life significantly shortens.Therefore, conventional fabrication processes method is difficult to meet the quality requirement of product and the demand of batch production.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of processing technology of orthogonal mode power combiner is provided, solves traditional orthogonal mode power combiner and solve because repeatedly Manual flame welds the problem that the welding deformation, the poor use that is large to telecommunication parameter influence and solder of dimensional accuracy that bring cause Corrosion Protection greatly to reduce.
A processing technology for orthogonal mode power combiner, it comprises the following steps:
S1: according to the processing of the processing and lower chamber that have designed upper cavity;
S2: trial assembly upper cavity and lower chamber, makes assembling laminating between upper cavity and lower chamber tight;
S3: pickling, removes impurity;
S4: make solder, and upper cavity, lower chamber and solder are assembled;
S5: vacuum brazing curve is set, heating and thermal insulation, completes vacuum brazing;
S6: further digital control processing is carried out to orthogonal mode power combiner profile and ring flange;
S7: machining is holed and reamed to ring flange;
S8: electrochemical treatments.
The processing of the upper cavity described in step S1 comprises following sub-step:
Raw material are cut into upper cavity profile according to design by S111: get the raw materials ready, reserved allowance 3 ~ 5mm, thickness surplus 3 ~ 5mm;
S112: programme to CNC milling machine, completes upper cavity rough milling, monolateral pre-made allowance 2 ~ 3mm;
S113: heat-treatment of annealing, temperature controls at 250-280 DEG C;
S114: again programme to CNC milling machine, completes the finish-milling processing of upper cavity.
The processing of the lower chamber described in step S1 comprises following sub-step:
Raw material are cut into lower chamber profile according to design by S121: get the raw materials ready, reserved allowance 3 ~ 5mm, thickness surplus 3 ~ 5mm;
S122: programme to CNC milling machine, completes lower chamber rough milling, monolateral pre-made allowance 2 ~ 3mm;
S123: heat-treatment of annealing, temperature controls at 250-280 DEG C;
S124: again programme to CNC milling machine, completes the finish-milling processing of lower chamber.
Impurity described in step S3 comprises greasy dirt and oxide-film.
Vacuum brazing described in step S5 is carried out at the temperature of 615 DEG C.
Electrochemical treatments described in step S8 comprises: oil removing, etch, first time flushing, bright pickling, second time flushing, electric conductive oxidation, third time rinse and drying.
The present invention needs the orthogonal mode power combiner processed, it comprises upper cavity and lower chamber, described upper cavity comprises the first half of the first half of multiple ring flange, the first half of multiple waveguide and multiple plate, described lower chamber comprises the latter half of the latter half of multiple ring flange, the latter half of multiple waveguide and multiple plate, upper cavity and lower chamber are provided with boss, groove and the seam of locating, upper cavity and lower chamber are all formed in one, and upper cavity passes through together with vacuum brazing with lower chamber.
Described boss, groove and seam are also provided with the gap of 0.02-0.04mm.
The invention has the beneficial effects as follows: (1) has broken the traditional design of orthogonal mode power combiner, process, 1 vacuum brazing is changed into shaping by original repeatedly Manual flame soldering, utilize existing Computerized Numerical Control processing technology and Vacuum Soldering Technology advantage, orthogonal mode power combiner is divided into upper and lower cavity, designed by said structure, the shaping orthogonal mode power combiner cavity dimension precision of vacuum brazing is high and consistency good, die cavity inner wall surface roughness high (can reach Ra1.6 or more high accuracy).The invention solves because repeatedly Manual flame welds the welding deformation brought, improve orthogonal mode power combiner dimensional accuracy and product quality.
(2) when structural design, in order to ensure precision and the welding requirements of orthogonal mode power combiner combination assembling, be designed to upper cavity coordinate with lower chamber, fit system adopts the control program of 6 degree of location (upper and lower, front, rear, left and right), appropriate design boss, groove and seam are located, to ensure assembly precision.
(3) down considering weld tabs at the location fit position of upper cavity, lower chamber enters thickness and fit clearance, ensure that the mobility of solder joint filling during welding.
(4) by the contrast of traditional scheme and the present invention program, manufacturing procedure of the present invention significantly reduces, and reduces labour intensity, shortens the production cycle, improves task performance.
(5) because Vacuum Soldering Technology does not need brazing flux in brazing process, also can connect highly active Al-alloy metal well, can obtain the soldered fitting of fine and close light, this joint possesses excellent mechanical performance and corrosion resistance simultaneously.
(6) electrical property design index is met completely through this novel orthogonal mode power combiner of electric performance test.
(7) use Computerized Numerical Control processing technology and Vacuum Soldering Technology, the consistency of part, cavity dimension precision and surface roughness can be ensured; And then ensure that telecommunication parameter consistency.
Accompanying drawing explanation
Fig. 1 is conventional orthogonal mould power combiner explosive view;
Fig. 2 is the wave conductor schematic diagram formed by traditional approach welding;
Fig. 3 is the explosive view that the present invention needs the orthogonal mode power combiner processed;
Fig. 4 is the schematic perspective view that the present invention needs the orthogonal mode power combiner processed;
Fig. 5 is the upper cavity schematic perspective view that the present invention needs the orthogonal mode power combiner processed;
Fig. 6 is the lower chamber schematic perspective view that the present invention needs the orthogonal mode power combiner processed;
Fig. 7 is the inventive method flow chart;
In figure, 1-upper cavity, 2-lower chamber, 3-ring flange, 4-waveguide 1,5-waveguide 2,6-plate.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail: as shown in Figure 7, a kind of processing technology of orthogonal mode power combiner, it comprises the following steps:
S1: according to the processing of the processing and lower chamber 2 that have designed upper cavity 1;
S2: trial assembly upper cavity 1 and lower chamber 2, makes to assemble between upper cavity 1 and lower chamber 2 and fits closely;
S3: pickling, removes impurity;
S4: make solder, and upper cavity 1, lower chamber 2 and solder are assembled;
S5: vacuum brazing curve is set, heating and thermal insulation, completes vacuum brazing;
S6: further digital control processing is carried out to orthogonal mode power combiner profile and ring flange 3;
S7: machining is holed and reamed to ring flange 3;
S8: electrochemical treatments.
The processing of the upper cavity 1 described in step S1 comprises following sub-step:
Raw material are cut into upper cavity 1 profile according to design by S111: get the raw materials ready, reserved allowance 3 ~ 5mm, thickness surplus 3 ~ 5mm;
S112: programme to CNC milling machine, completes upper cavity 1 rough milling, monolateral pre-made allowance 2 ~ 3mm;
S113: heat-treatment of annealing, temperature controls at 250-280 DEG C;
S114: again programme to CNC milling machine, completes the finish-milling processing of upper cavity 1.
The processing of the lower chamber 2 described in step S1 comprises following sub-step:
Raw material are cut into lower chamber 2 profile according to design by S121: get the raw materials ready, reserved allowance 3 ~ 5mm, thickness surplus 3 ~ 5mm;
S122: programme to CNC milling machine, completes lower chamber 2 rough milling, monolateral pre-made allowance 2 ~ 3mm;
S123: heat-treatment of annealing, temperature controls at 250-280 DEG C;
S124: again programme to CNC milling machine, completes the finish-milling processing of lower chamber 2.
Impurity described in step S3 comprises greasy dirt and oxide-film.
Vacuum brazing described in step S5 is carried out at the temperature of 615 DEG C.
Electrochemical treatments described in step S8 comprises: oil removing, etch, first time flushing, bright pickling, second time flushing, electric conductive oxidation, third time rinse and drying.
As Fig. 3, Fig. 4, shown in Fig. 5 and Fig. 6, the orthogonal mode power combiner of processing of the present invention, it comprises upper cavity 1 and lower chamber 2, described upper cavity 1 comprises the first half of multiple ring flange 3, the first half of multiple waveguide and the first half of multiple plate 6, described lower chamber 2 comprises the latter half of multiple ring flange 3, the latter half of multiple waveguide and the latter half of multiple plate 6, upper cavity 1 and lower chamber 2 are provided with the boss of locating, groove and seam, upper cavity 1 and lower chamber 2 are all formed in one, upper cavity 1 passes through together with vacuum brazing with lower chamber 2.
Described boss, groove and seam are also provided with the gap of 0.02-0.04mm.
Claims (6)
1. a processing technology for orthogonal mode power combiner, is characterized in that: it comprises the following steps:
S1: complete the processing of upper cavity (1) and the processing of lower chamber (2) according to design;
S2: trial assembly upper cavity (1) and lower chamber (2), makes to assemble between upper cavity (1) and lower chamber (2) and fits closely;
S3: pickling, removes impurity;
S4: make solder, and upper cavity (1), lower chamber (2) and solder are assembled;
S5: vacuum brazing curve is set, heating and thermal insulation, completes vacuum brazing;
S6: further digital control processing is carried out to orthogonal mode power combiner profile and ring flange (3);
S7: machining is holed and reamed to ring flange (3);
S8: electrochemical treatments.
2. the processing technology of a kind of orthogonal mode power combiner according to claim 1, is characterized in that: the processing of the upper cavity (1) described in step S1 comprises following sub-step:
Raw material are cut into upper cavity (1) profile according to design by S111: get the raw materials ready, reserved allowance 3 ~ 5mm, thickness surplus 3 ~ 5mm;
S112: programme to CNC milling machine, completes upper cavity (1) rough milling, monolateral pre-made allowance 2 ~ 3mm;
S113: heat-treatment of annealing, temperature controls at 250-280 DEG C;
S114: again programme to CNC milling machine, completes the finish-milling processing of upper cavity (1).
3. the processing technology of a kind of orthogonal mode power combiner according to claim 1, is characterized in that: the processing of the lower chamber (2) described in step S1 comprises following sub-step:
Raw material are cut into lower chamber (2) profile according to design by S121: get the raw materials ready, reserved allowance 3 ~ 5mm, thickness surplus 3 ~ 5mm;
S122: programme to CNC milling machine, completes lower chamber (2) rough milling, monolateral pre-made allowance 2 ~ 3mm;
S123: heat-treatment of annealing, temperature controls at 250-280 DEG C;
S124: again programme to CNC milling machine, completes the finish-milling processing of lower chamber (2).
4. the processing technology of a kind of orthogonal mode power combiner according to claim 1, is characterized in that: the impurity described in step S3 comprises greasy dirt and oxide-film.
5. the processing technology of a kind of orthogonal mode power combiner according to claim 1, is characterized in that: the vacuum brazing described in step S5 is carried out at the temperature of 615 DEG C.
6. the processing technology of a kind of orthogonal mode power combiner according to claim 1, is characterized in that: the electrochemical treatments described in step S8 comprises: oil removing, etch, first time flushing, bright pickling, second time flushing, electric conductive oxidation, third time rinse and drying.
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CN201410679695.0A CN104393393A (en) | 2014-11-24 | 2014-11-24 | Processing technique for orthogonal mode power combiner |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114986085A (en) * | 2022-04-22 | 2022-09-02 | 成都欧拉微波元器件有限公司 | Twisted waveguide processing method |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114986085A (en) * | 2022-04-22 | 2022-09-02 | 成都欧拉微波元器件有限公司 | Twisted waveguide processing method |
CN114986085B (en) * | 2022-04-22 | 2024-03-01 | 成都欧拉微波元器件有限公司 | Twisted waveguide processing method |
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Application publication date: 20150304 |