CN104393327A - Heat-conducting rubber sheet fixing structure and end socket - Google Patents
Heat-conducting rubber sheet fixing structure and end socket Download PDFInfo
- Publication number
- CN104393327A CN104393327A CN201410641090.2A CN201410641090A CN104393327A CN 104393327 A CN104393327 A CN 104393327A CN 201410641090 A CN201410641090 A CN 201410641090A CN 104393327 A CN104393327 A CN 104393327A
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- CN
- China
- Prior art keywords
- heat
- screw
- bottom head
- heat conduction
- offset plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/058—Construction or manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
- H01M50/183—Sealing members
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Secondary Cells (AREA)
- Connection Of Plates (AREA)
Abstract
The invention discloses a heat-conducting rubber sheet fixing structure, which is used for detachably fixing a conducting rubber sheet on the top of a lower end socket. The heat-conducting rubber sheet fixing structure comprises a locating component and a screw; the lower end socket is correspondingly provided with an accommodating hole and a screw hole; the accommodating hole is formed the top of the lower end socket and extends downwards; the screw hole is formed in side surface of the lower end socket, extends inwards and then is communicated with the accommodating hole; the locating component comprises a fixing part and a hooking part, the fixing part is inserted in the accommodating hole and is provided with a slant facing to the screw hole, one end of the hooking part is fixed at the upper end of the fixing part, the hooking part extends to the heat-conducting rubber sheet, and the other end of the hooking part is bent downwards, is protruded and extends, and then is propped against the heat-conducting rubber sheet; a screw thread is connected with the interior of a screw hole and is propped against the slant. According to the heat-conducting rubber sheet fixing structure, the heat-conducting rubber sheet is in closely contact with the lower end socket, and the heat conductivity is good; the screw is transversely arranged and does not burn an electrode lug, and the heat-conducting rubber sheet is conveniently and quickly replaced. Correspondingly, the invention further discloses an end socket having the heat-conducting rubber sheet.
Description
Technical field
The present invention relates to lithium battery encapsulation apparatus field, particularly relate to a kind of heat-conducting glue board fixing structure and there is the end socket of this fixed structure.
Background technology
Along with extensive use and the fast development of various portable electric appts and electric automobile, constantly increase the demand of its dynamical system-chemical power source lithium ion battery, it is current state-of-the-art commercialization secondary cell.Lithium ion battery enjoys favor with the performance that its high power capacity, high voltage, high cyclical stability, high-energy-density, non-environmental-pollution etc. are excellent, is called as the green energy resource of 21 century and leading power supply.Wherein, flexible packing lithium ion battery has that energy density is high, lightweight, metamorphosis is many, can make the advantages such as thin battery, and therefore electronic mobile product adopts flexible packing lithium ion battery as the energy substantially at present.
Aluminum-plastic composite membrane in flexible packing material generally comprises five-layer structure, inside and outside each two layers of polyethylene layer (PE) and polypropylene layer (PP), middle one deck aluminium foil layer.The closedtop packaging machine used during encapsulation comprises the end socket be made up of upper cover and bottom head, usually core is loaded in type composite membrane, under certain temperature, time, pressure effect, use closedtop packaging machine the tab and aluminium film inner layer PP or PE that lug are similar to packaging aluminium film PP material are gripped and make its melted by heat, be bonded together after cooling, reach the effect of sealing.
Current closedtop encapsulation uses soft envelope and hard envelope two kinds of modes, wherein soft envelope mode is fixed with one block of silica gel plate (or other heat conduction offset plates) on the bottom head surface of closedtop packaging machine end socket, fixed form generally adopts screw to be from top to bottom screwed into silica gel plate and bottom head is fixed, its shortcoming is as follows: one, in encapsulation process, the tab cap nut that is very easily fixed scalded, and affects product quality; Two, this fixed form cannot ensure silica gel plate and bottom head surface contact intact, affect thermal conductivity, closedtop encapsulation colloidal sol bad risk is higher; Three, silica gel plate breakage is changed comparatively loaded down with trivial details, and because upper and lower end socket spacing is limited when changing, needs to take out silica gel plate by turning on screw after end socket integral demounting again, affects production efficiency to a certain extent.
Therefore, being badly in need of one, that silica gel plate can be made to locate is firm, keeps thermal conductive resin, and change fast fixed structure to overcome above-mentioned defect.
Summary of the invention
The object of the present invention is to provide one that silica gel plate can be made to locate firm, keep thermal conductive resin, and change fast fixed structure to overcome above-mentioned defect.
Another object of the present invention is to provide a kind of end socket with this fixed structure.
To achieve these goals, the invention provides a kind of heat-conducting glue board fixing structure, in order to heat conduction offset plate to be detachably fixed on the end face of bottom head, described heat-conducting glue board fixing structure comprises at least one keeper and at least one screw, described bottom head offers at least one containing hole and at least one screw accordingly, described containing hole to be offered and to downward-extension in the end face of described bottom head, described screw is offered in the side of described bottom head and is extended inwardly to and is communicated with described containing hole, described keeper comprises fixed part and hook part, described fixed part inserts in described containing hole downwards, and described fixed part has towards the inclined-plane of described screw, described inclined-plane from top to bottom extends in the inclination laterally of offering described screw near described bottom head, the upper end of described fixed part is fixed in one end of described hook part, described hook part extends to described heat conduction offset plate, and the other end of described hook part bends downwards and protrudes out and compress described heat conduction offset plate, described screw thread to be connected in described screw and to be resisted against described inclined-plane.
Compared with prior art, because the present invention has offered described containing hole and screw on described bottom head, and described keeper is inserted in described containing hole, screw is connected with at described screw internal thread, and described keeper comprises described fixed part and described hook part, after described bottom head loaded onto by described heat conduction offset plate, by the described screw tightening in described screw, described screw declines by ordering about described keeper to described the supporting of inclined-plane of described fixed part in described containing hole, described hook part is followed and is declined and be pressed on described bottom head by described heat conduction offset plate, described screw is twisted tighter, the contact of described heat conduction offset plate and bottom head is tightr, firmly, therefore heat conductivility is better, be conducive to packaging process to complete.Meanwhile, described screw is offered in the side of described bottom head, and namely described screw is also horizontally set at described bottom head and can not be exposed on heat conduction offset plate, therefore can not scald cell polar ear in encapsulation process.In addition, during for changing described heat conduction offset plate, only from the side of described bottom head, described screw need be unscrewed, supporting described fixed part inclined-plane removed by described screw, thus described keeper is loosened and removes compressing described heat conduction offset plate, described heat conduction offset plate is no longer subject to compressing of described hook part, can extract out between upper cover and bottom head easily, change fast, do not affect production efficiency.
Preferably, the end face of described heat conduction offset plate is recessed to form groove, and described hook part bends the bottom surface that the part protruded out presses on described groove downwards.
Particularly, the end face of described bottom head comprises the second plane of the first plane and relatively described first planar projections, and be connected with vertical plane between described first plane and the second plane, described heat conduction offset plate is carried on described first plane.
More specifically, described heat conduction offset plate has the locating flange of the bottom surface projection being positioned at described groove side relatively described groove, and described hook part bends the part protruded out downwards and supports described locating flange and make described heat conduction offset plate near described vertical plane.Described hook part compresses described heat conduction offset plate downwards and makes described heat conduction offset plate near described vertical plane to supporting described locating flange simultaneously, then can position described heat conduction offset plate from both direction, make it more firm.
Preferably, the quantity of described keeper and screw is three, and described bottom head correspondence offers three described containing holes and three described screws.
Particularly, three described containing holes are spaced setting along the length direction of described bottom head, and three described screws are also correspondingly spaced setting along the length direction of described bottom head.
Preferably, described heat conduction offset plate is silica gel plate.
Correspondingly, present invention also offers a kind of end socket, comprise upper cover, bottom head, the heat conduction offset plate being arranged at the end face of described bottom head and described heat-conducting glue board fixing structure.Described upper cover and bottom head are in being oppositely arranged up and down, and the lower end of described upper cover is formed with the upper encapsulation flange protruded out downwards, and described heat conduction offset plate is raised up to and is formed with the lower encapsulation flange relative with described upper encapsulation flange.
Compared with prior art, end socket of the present invention has and makes described heat conduction offset plate locate firm and thermal conductivity is good, screw can not scald cell polar ear, advantage fast when changing described heat conduction offset plate.
Accompanying drawing explanation
Fig. 1 is the stereogram of end socket of the present invention.
Fig. 2 is the exploded view of end socket of the present invention.
Fig. 3 is the three-dimensional cutaway view after the present invention hides upper cover.
Embodiment
Below in conjunction with the Figure of description provided, description is made to preferred embodiment of the present invention.
As shown in Figure 1 to Figure 3, the invention discloses a kind of end socket, comprise upper cover 1, bottom head 2, heat conduction offset plate 3 and described heat conduction offset plate 3 is detachably fixed on the heat-conducting glue board fixing structure of described bottom head 2 end face.Described heat-conducting glue board fixing structure comprises three keepers 4 and three screw (not shown).
Described upper cover 1 and bottom head 2 are in being oppositely arranged up and down, and the lower end of described upper cover 1 is formed with the upper encapsulation flange 11 protruded out downwards.
The end face of described bottom head 2 comprises the second plane 22 of the first plane 21 and relatively described first plane 21 projection, be connected with vertical plane 23 between described first plane 21 and the second plane 22, the end face of visible described bottom head 2 is step-like in what be made up of described first plane 21, vertical plane 23 and the second plane 22.Described bottom head 2 offers three containing holes 24 to downward-extension in described second plane 22, described bottom head 2 also offers three screws 25 extending inwardly to containing hole 24 described with three and be communicated with respectively on a side of adjacent described first plane 21, three described containing holes 24 are spaced setting along the length direction of described bottom head 2, and three described screws 25 are also correspondingly spaced setting along the length direction of described bottom head 2.
Described heat conduction offset plate 3 is carried on described first plane 21, the end face of described heat conduction offset plate 3 is recessed to form groove 30, described heat conduction offset plate 3 has the both sides the locating flange 31 of the bottom surface projection of relatively described groove 30 and lower encapsulation flange 32 that lay respectively at described groove 30, described locating flange 31 contacts with described vertical plane 23, described lower encapsulation flange 32 is relative with described upper encapsulation flange 11, after described upper cover 1 with 2-in-1 of bottom head, described upper encapsulation flange 11 grips with lower encapsulation flange 32 aluminum-plastic composite membrane packing battery core jointly.The face that described upper encapsulation flange 11 is relative with lower encapsulation flange 32 can be plane, also can be intermeshing male and fomale(M&F) or the flank of tooth.What described heat conduction offset plate 3 was concrete can adopt silica gel plate.
The entirety of described keeper 4 is roughly in inverted L shape, described keeper 4 comprises fixed part 41 and hook part 42, described fixed part 41 inserts downwards in described containing hole 24, and described fixed part 41 has towards the inclined-plane 411 of described screw 25, described inclined-plane 411 from top to bottom extends in the inclination laterally of offering described screw 25 near described bottom head 2, and namely the upper end of described fixed part 41 is comparatively thin and lower end is thicker gradually.The another side that described fixed part 41 and described inclined-plane 411 deviate from mutually is plane and can be close to the inwall of described containing hole 24.The upper end of described fixed part 41 is fixed in one end of described hook part 42, described hook part 42 is parallel to described second plane 22 ground and extends to described heat conduction offset plate 3, and the other end of described hook part 42 bends downwards and protrudes in described groove 30 and press on the bottom surface of described groove 30, meanwhile, described hook part 42 bends the part protruded out downwards and also can contact with the medial surface of described locating flange 31.
Described first plane 21 is terminated in and after three described keepers 4 are inserted three described containing holes 24 respectively by anti-for described heat conduction offset plate 3, three described screws are inserted respectively in three described screws 25, described screw inwardly supports described inclined-plane 411 by the threaded engagement with described screw 25, described screw orders about the decline of described fixed part 41 (keeper 4) to supporting of described inclined-plane 411, described in the process declined, hook part 42 compresses described groove 30 bottom surface, is pressed in described first plane 21 by described heat conduction offset plate 3.Simultaneously, described hook part 42 bends the part protruded out downwards and also can support described locating flange 31 and make described heat conduction offset plate 3 near described vertical plane 23, described hook part 42 is not necessary to supporting of described locating flange 31, only by described heat conduction offset plate 3 downward support the location that can realize described heat conduction offset plate 3, and described hook part 42 is that width by rationally arranging the lower male portion of described hook part 42 bending realizes to supporting of described locating flange 31.
During for changing described heat conduction offset plate 3, only from the side of described bottom head 2, described screw need be unscrewed, supporting described fixed part 41 inclined-plane 411 removed by described screw, thus make described keeper 4 loosen and remove compressing described heat conduction offset plate 3, described heat conduction offset plate 3 is no longer subject to compressing of described hook part 42, can extract out between upper cover 1 and bottom head 2 easily.
Certainly, the quantity of described keeper 4, screw, containing hole 24 and screw 25 is not limited to three, and its quantity can be selected according to needs of production.The screw adopted in the present embodiment can with other screwed connectors as the replacement such as stud, screw, and certainly, it is better that effect is supported on the described inclined-plane 411 of connector to described fixed part 41 with tack.Because screw is standard component, therefore do not draw in the drawings.
The present invention compared with prior art, due to the compact siro spinning technology that the heat conduction offset plate 3 in end socket of the present invention is realized on described bottom head 2 by heat-conducting glue board fixing structure, heat conductivility is good, described screw is arranged at the side of described bottom head 2 simultaneously, instead of be exposed to the end face of described heat conduction offset plate 3, therefore can not scald cell polar ear in encapsulation process.Again due to the improvement on heat-conducting glue board fixing structure, make the replacing of heat conduction offset plate 3 quick, do not affect production efficiency.
Above disclosedly be only preferred embodiments of the present invention, its effect facilitates those skilled in the art to understand and implements according to this, certainly the interest field of the present invention can not be limited with this, therefore according to the equivalent variations that the present patent application the scope of the claims is done, the scope that the present invention is contained still is belonged to.
Claims (8)
1. a heat-conducting glue board fixing structure, in order to heat conduction offset plate to be detachably fixed on the end face of bottom head, it is characterized in that: described heat-conducting glue board fixing structure comprises at least one keeper and at least one screw, described bottom head offers at least one containing hole and at least one screw accordingly, described containing hole to be offered and to downward-extension in the end face of described bottom head, described screw is offered in the side of described bottom head and is extended inwardly to and is communicated with described containing hole, described keeper comprises fixed part and hook part, described fixed part inserts in described containing hole downwards, and described fixed part has towards the inclined-plane of described screw, described inclined-plane from top to bottom extends in the inclination laterally of offering described screw near described bottom head, the upper end of described fixed part is fixed in one end of described hook part, described hook part extends to described heat conduction offset plate, and the other end of described hook part bends downwards and protrudes out and compress described heat conduction offset plate, described screw thread to be connected in described screw and to be resisted against described inclined-plane.
2. heat-conducting glue board fixing structure as claimed in claim 1, it is characterized in that: the end face of described heat conduction offset plate is recessed to form groove, described hook part bends the bottom surface that the part protruded out presses on described groove downwards.
3. heat-conducting glue board fixing structure as claimed in claim 2, it is characterized in that: the end face of described bottom head comprises the second plane of the first plane and relatively described first planar projections, be connected with vertical plane between described first plane and the second plane, described heat conduction offset plate is carried on described first plane.
4. heat-conducting glue board fixing structure as claimed in claim 3, it is characterized in that: described heat conduction offset plate has the locating flange of the bottom surface projection being positioned at described groove side relatively described groove, described hook part bends the part protruded out downwards and supports described locating flange and make described heat conduction offset plate near described vertical plane.
5. heat-conducting glue board fixing structure as claimed in claim 1, it is characterized in that: the quantity of described keeper and screw is three, described bottom head correspondence offers three described containing holes and three described screws.
6. heat-conducting glue board fixing structure as claimed in claim 5, is characterized in that: three described containing holes are spaced setting along the length direction of described bottom head, and three described screws are also correspondingly spaced setting along the length direction of described bottom head.
7. heat-conducting glue board fixing structure as claimed in claim 1, is characterized in that: described heat conduction offset plate is silica gel plate.
8. an end socket, comprise upper cover, bottom head and be arranged at the heat conduction offset plate of end face of described bottom head, described upper cover and bottom head are in being oppositely arranged up and down, the lower end of described upper cover is formed with the upper encapsulation flange protruded out downwards, described heat conduction offset plate is raised up to and is formed with the lower encapsulation flange relative with described upper encapsulation flange, it is characterized in that: also comprise the heat-conducting glue board fixing structure as described in any one of claim 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641090.2A CN104393327B (en) | 2014-11-13 | 2014-11-13 | Heat-conducting glue board fixing structure and end socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410641090.2A CN104393327B (en) | 2014-11-13 | 2014-11-13 | Heat-conducting glue board fixing structure and end socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104393327A true CN104393327A (en) | 2015-03-04 |
| CN104393327B CN104393327B (en) | 2016-11-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410641090.2A Active CN104393327B (en) | 2014-11-13 | 2014-11-13 | Heat-conducting glue board fixing structure and end socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104393327B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008055259A2 (en) * | 2006-11-04 | 2008-05-08 | Excellatron Solid State, Llc | Packaged thin film batteries and methods of packaging thin film batteries |
| CN201508882U (en) * | 2009-10-28 | 2010-06-16 | 惠州市赛能电池有限公司 | Flexible package lithium ion battery electrode lug encapsulating device |
| CN202601795U (en) * | 2012-05-25 | 2012-12-12 | 浙江振龙电源股份有限公司 | Polymer soft-packed lithium ion electric core packaging system |
| CN203721836U (en) * | 2013-11-26 | 2014-07-16 | 新余英泰能科技有限公司 | Seal head device |
| CN204216149U (en) * | 2014-11-13 | 2015-03-18 | 东莞市久森新能源有限公司 | Heat-conducting glue board fixing structure and end socket |
-
2014
- 2014-11-13 CN CN201410641090.2A patent/CN104393327B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008055259A2 (en) * | 2006-11-04 | 2008-05-08 | Excellatron Solid State, Llc | Packaged thin film batteries and methods of packaging thin film batteries |
| CN201508882U (en) * | 2009-10-28 | 2010-06-16 | 惠州市赛能电池有限公司 | Flexible package lithium ion battery electrode lug encapsulating device |
| CN202601795U (en) * | 2012-05-25 | 2012-12-12 | 浙江振龙电源股份有限公司 | Polymer soft-packed lithium ion electric core packaging system |
| CN203721836U (en) * | 2013-11-26 | 2014-07-16 | 新余英泰能科技有限公司 | Seal head device |
| CN204216149U (en) * | 2014-11-13 | 2015-03-18 | 东莞市久森新能源有限公司 | Heat-conducting glue board fixing structure and end socket |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104393327B (en) | 2016-11-23 |
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Effective date of registration: 20190605 Address after: 424300 Luxury Vehicle Inspection Company on Industrial Avenue, Wushuizhen County Industrial Park, Linwu County, Hunan Province Patentee after: Hunan Jiusun New Energy Co., Ltd. Address before: 523470 Waterfront Industrial Park, Hengli Town, Dongguan City, Guangdong Province, 21 Patentee before: DONGGUAN JOYSUN NEW ENERGY CO., LTD. |
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| TR01 | Transfer of patent right |