CN104372388A - New copper electroplating liquid - Google Patents
New copper electroplating liquid Download PDFInfo
- Publication number
- CN104372388A CN104372388A CN201310353529.7A CN201310353529A CN104372388A CN 104372388 A CN104372388 A CN 104372388A CN 201310353529 A CN201310353529 A CN 201310353529A CN 104372388 A CN104372388 A CN 104372388A
- Authority
- CN
- China
- Prior art keywords
- parts
- electroplate liquid
- electroplating liquid
- copper
- new copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention relates to the technical field of electroplating liquid, and in particular relates to a new copper electroplating liquid. The copper electroplating liquid comprises the following components in part by weight: 80-150 parts of sodium citrate, 20-80 parts of copper sulfate, 20-80 parts of potassium thiocyanate, 20-50 parts of sodium hypophosphite, 5-10 parts of thiocyanate, 5-8 parts of nickel sulfate, and the balance of water. The aim of the invention is to provide the energy saving and environmentally-friendly copper electroplating liquid with ideal performance.
Description
Technical field
The present invention relates to the technical field of electroplate liquid, specifically a kind of new copper electroplate liquid.
Background technology
Electroplate liquid refers to the cathode current density scope that can expand metal, the outward appearance improving coating, increases the liquid of the features such as the oxidation resistant stability of solution.In electroplating industry cyanide copper plating process, production process must use prussiate cyanide copper plating process, there is the prussiate of hypertoxicity, and its environmental pollution is extremely serious, causes serious threat to workman is healthy; Along with the enhancing of the environmental consciousness of people, the copper-plating technique of an urgent demand development environment-protecting clean, substitutes traditional cyanide copper plating technique.Therefore, develop new environmental protection copper-plating technique, solve the health problem of problem of environmental pollution and direct labor, have positive social effect.Metallic copper, owing to itself having excellent electroconductibility and thermal conduction, is use one of the most general plating at present., there is the covering power of plating solution and the problem of dispersive ability difference in existing copper plating process.
Summary of the invention
The object of this invention is to provide a kind of performance desirable, the new copper electroplate liquid of energy-conserving and environment-protective.
The technical solution used in the present invention is, a kind of new copper electroplate liquid, is made up of by weight following component: Trisodium Citrate 80-150 part, copper sulfate 20-80 part, potassium sulfocyanate 20-80 part, inferior sodium phosphate 20-50 part, thiocyanide 5-10 part, single nickel salt 5-8 part, surplus is water.
Say further, the pH value of described electroplate liquid is 9-11.
Say further, described pH value ammoniacal liquor or sulfuric acid adjustment.
Advantage of the present invention has good covering power and dispersive ability, effectively reduces environmental pollution.
Embodiment
The present invention is further described with the following Examples.
Embodiment 1, a kind of new copper electroplate liquid, is made up of by weight following component: Trisodium Citrate 80 parts, 20 parts, copper sulfate, potassium sulfocyanate 20 parts, inferior sodium phosphate 20 parts, thiocyanide 5 parts, single nickel salt 5 parts, and surplus is water.The pH value of described electroplate liquid is 9-11.Described pH value ammoniacal liquor or sulfuric acid adjustment.
Embodiment 2, a kind of new copper electroplate liquid, is made up of by weight following component: Trisodium Citrate 115 parts, 50 parts, copper sulfate, potassium sulfocyanate 50 parts, inferior sodium phosphate 35 parts, thiocyanide 7.5 parts, single nickel salt 6.5 parts, and surplus is water.The pH value of described electroplate liquid is 9-11.Described pH value ammoniacal liquor or sulfuric acid adjustment.
Embodiment 3, a kind of new copper electroplate liquid, is made up of by weight following component: Trisodium Citrate 150 parts, 80 parts, copper sulfate, potassium sulfocyanate 80 parts, inferior sodium phosphate 50 parts, thiocyanide 10 parts, single nickel salt 8 parts, and surplus is water.The pH value of described electroplate liquid is 9-11.Described pH value ammoniacal liquor or sulfuric acid adjustment.
Should be understood that this embodiment is only not used in for illustration of the present invention to limit the scope of the invention.In addition, should be understood that those skilled in the art can make various changes or modifications the present invention, and these equivalent form of values fall within the protection domain that the application's appended claims limits equally after having read the content that the present invention lectures.
Claims (3)
1. a new copper electroplate liquid, is characterized in that, is made up of by weight following component: Trisodium Citrate 80-150 part, copper sulfate 20-80 part, potassium sulfocyanate 20-80 part, inferior sodium phosphate 20-50 part, thiocyanide 5-10 part, single nickel salt 5-8 part, and surplus is water.
2. a kind of new copper electroplate liquid according to claim 1, is characterized in that, the pH value of described electroplate liquid is 9-11.
3. a kind of new copper electroplate liquid according to claim 1, is characterized in that, described pH value ammoniacal liquor or sulfuric acid adjustment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310353529.7A CN104372388A (en) | 2013-08-14 | 2013-08-14 | New copper electroplating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310353529.7A CN104372388A (en) | 2013-08-14 | 2013-08-14 | New copper electroplating liquid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104372388A true CN104372388A (en) | 2015-02-25 |
Family
ID=52551572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310353529.7A Pending CN104372388A (en) | 2013-08-14 | 2013-08-14 | New copper electroplating liquid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104372388A (en) |
-
2013
- 2013-08-14 CN CN201310353529.7A patent/CN104372388A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| PH12017501577A1 (en) | HOT-DIP Al-Zn-Mg-Si COATED STEEL SHEET AND METHOD OF PRODUCING SAME | |
| CN204918772U (en) | A high corrosion resistance cadmium plating layer for aerospace spare part | |
| CN105239120A (en) | Low-stress spoke nickel plating technology | |
| CN107587173A (en) | A kind of nickel plating solution and its application | |
| CN104532306A (en) | Environment-friendly electroplate liquid | |
| CN104451636A (en) | Chromium-free passivation solution for tin-plated steel plate and preparation method of chromium-free passivation solution | |
| CN104047038B (en) | A kind of nickel chromium triangle copper-cobalt alloy electroplate liquid and compound method thereof | |
| CN104372388A (en) | New copper electroplating liquid | |
| CN103436927B (en) | A kind of method of Alumina gel and metallic nickel ions codeposition | |
| CN103469252B (en) | The aluminium electrolysis cathode rod iron of anti-carburizi ng | |
| CN106191882B (en) | A kind of agent of non-phosphate degreasing and preparation method thereof | |
| CN103924230B (en) | Electrodeposited chromium steel and iron parts passivation treating agent | |
| CN103680669A (en) | Environment-friendly tinned copper clad steel wire | |
| CN103725992A (en) | Washable metal material | |
| CN105886862A (en) | Anti-corrosion aluminum-zinc alloy material | |
| CN106676588A (en) | Manufacturing method of nickel-tungsten plating layer | |
| CN105239062A (en) | Environment-friendly tin plating solution | |
| CN103668348A (en) | Plating method of total-sulfate trivalent chromium plating solution | |
| CN203307455U (en) | Stainless steel workpiece with composite nickel layer | |
| CN103436749A (en) | Anti-rust aluminum alloy | |
| CN103469190A (en) | Composite type low-temperature phosphating solution | |
| CN106917119A (en) | A kind of environmentally friendly chromium nickel coating electroplate liquid | |
| CN104894616A (en) | Novel electroplating liquid | |
| CN104988480A (en) | Black passivating agent | |
| CN103160817A (en) | Chemical copper plating solution |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150225 |
|
| WD01 | Invention patent application deemed withdrawn after publication |