CN104361380B

CN104361380B - An a kind of four mould processing technologys of card for SIM card

Info

Publication number: CN104361380B
Application number: CN201410688710.8A
Authority: CN
Inventors: 曹志新; 张小炜
Original assignee: Hengbao Co Ltd
Current assignee: Hengbao Co Ltd
Priority date: 2014-11-26
Filing date: 2014-11-26
Publication date: 2017-10-17
Anticipated expiration: 2034-11-26
Also published as: CN104361380A

Abstract

A kind of one four mould processing technologys of card of SIM card, comprise the following steps：1）Design the nonstandard four mould bands of position of a card；2）Groove milling；3）Encapsulation；4）It is individualized；5）Lesser calorie is punched.The present invention, realize on the card regions of ID 1 of a standard, process except A1, A2 immobilize for normal place, the four mould SIM cards that B1, B2 can arbitrarily arrange in the card regions of ID 1, so as to produce final 2FF products, this processing technology once the mould of card four only needs to carry out a small amount of to add equipment and can realize even without equipment is added, avoid the overlapping investment of equipment, and disposably four modules on a card can be individualized simultaneously, production efficiency improves 2 times.

Description

An a kind of four mould processing technologys of card for SIM card

Technical field

The present invention relates to communication card technical field, especially with respect to four SIM card module positions point on a kind of one card The processing technology of cloth design.

Background technology

In communication card field, the carrier of SIM card is mainly the materials such as PVC, is environmental protection, reduces cost, part SIM card Product is progressively changed to lesser calorie mode by card (85.6 × 53.97mm) mode of supplly of original standard ID-1 sizes and supplied, card Manufacturer is supplied to the SIM card product of common carrier in 2FF lesser calories (25 × 15mm) mode（What is had also includes 3FF or 4FF Lesser calorie）Mostly it is to carry out a series of processing in the way of the card bimodulus of standard one or standard one block four moulds in the case of delivery.Such as Fruit be with a card bimodal manner produce if, one card on two module positions be by ISO7816 standards place, as long as that with Existing standard device processing（Once or twice complete）But if being produced in the way of four moulds of card of standard Words, because its module position has not all met ISO7816 standards, then have to customize a special card four mould equipment progress again Production, this by be equipment overlapping investment, cause original equipment capacity to waste.

The content of the invention

In order to solve problem above, it is an object of the invention to provide a kind of SIM card one block four mould processing technologys, be On the ID-1 cards of one standard, outside the 2FF lesser calories region of two standards, two 2FF lesser calories are processed in addition, pass through processing Go out four nonstandard mould ID-1 cards, so as to obtain four 2FF lesser calories.And if existing equipment is carried out small range transformation by this, or As long as person adds improved equipment and can met on a small quantity.

The technical scheme is that be accomplished by the following way：An a kind of four mould processing technologys of card for SIM card, including Following steps：1）Design the nonstandard four mould bands of position of a card；2）Groove milling；3）Encapsulation；4）It is individualized；5）Lesser calorie is punched；Its feature It is：

1）, design it is nonstandard one card the four mould bands of position：One 85.6 × 53.97mm standard ID-1 cards, determine two A1, A2 position of individual standard and two nonstandard B1, B2 positions；A1, A2, B1, B2 size are 25 × 15mm；

2）, groove milling：The module groove void of A1, A2 position is milled out on the slotter of standard first, according to device configuration not Together, the groove void of the two positions can be once milled out, one of them can also be first milled out, then rotated card after 180 degree again Secondary be put on the slotter of standard mills out another groove void；Secondly the module slot of the non-cursor position of milling B1 and B2, was transformed with one Slotter, as the operation with milling A1 and A2 module slot, mill out B1 and B2 module groove void, such standard ID-1 cards Piece passes through after groove milling process, just there is the module groove void of four positions；

3）, encapsulation：Because A1 and A2 positions are normal place, the mould of the packaging machine of standard, first packaged A1, A2 position is used Block, equally, according to the difference of device configuration, two modules can be once encapsulated simultaneously, one can also be first sealed, then card are revolved Another is encapsulated again after turnback；Again with a packaging machine transformed, the encapsulation of the two modules of B1, B2 is carried out, thus Complete the module encapsulation of four positions；

4）, it is individualized：, inherently can be to the modules of A1 and A2 normal places with a card bimodulus personalization device of standard Carry out personal data write-in；B1 and B2 positions are non-cursor position, as long as by the rotating disk of a card bimodulus personalization device of standard Station is transformed again, increases raise the price read/write head and the read write line of two non-cursor positions, and individualized production routine upgrades it Afterwards, you can complete the production of the individualized process of this four mould of card；

5）, lesser calorie punching：With standard lesser calorie bicker, complete to be punched the lesser calorie of A1 and A2 positions；And B1 and B2 is non- Cursor position, by the two Position Design die cutting dies of B1 and B2, you can as the lesser calorie of punching A1 with a2 positions, completion pair The lesser calorie punching of B1 and B2 positions, by the production of aforementioned four process, realizes the production of the mould of a card four.

The present invention, is realized on the ID-1 cards region of a standard, is processed except A1, A2 are that normal place is fixed not Become, the four mould SIM cards that B1, B2 can arbitrarily arrange in ID-1 cards region, so that final 2FF products have been produced, it is this The processing technology of one four moulds of card only needs to carry out a small amount of to add equipment and set it is achieved that avoiding even without adding equipment Standby overlapping investment, and disposably four modules on a card can be individualized simultaneously, production efficiency improves 2 Times.In addition, the personalization device that the groove milling, encapsulation, punch machine that do not carry out transforming of original standard were even transformed is also Can production standard in the same old way SIM card product.

Brief description of the drawings

Fig. 1 is the position view of two nonstandard modules of embodiment 1.

Fig. 2 is the position view of two nonstandard modules of embodiment 2.

Fig. 3 is the position view of two nonstandard modules of embodiment 3.

Fig. 4 is the position view of two nonstandard modules of embodiment 4.

Fig. 5 is the position view of four nonstandard modules of embodiment 5.

Fig. 6 is a four mould position views of card of standard.

Embodiment

Embodiment 1

As shown in figure 1, being B1 and B2 position distribution schematic diagrames.B1 is in A1 lower section, and B2 is in A2 top.

Specific implementation step is as follows：

1st, the nonstandard four mould bands of position of a card are designed：One 85.6 × 53.97mm standard ID-1 cards, determine two A1, A2 position of standard and two nonstandard B1, B2 positions；A1, A2, B1, B2 size are 25 × 15mm；

2nd, groove milling：The module groove void of A1, A2 position is milled out on the slotter of standard first（cavity）, matched somebody with somebody according to equipment The difference put, can once mill out the groove void of the two positions, can also first mill out one of them, and card then is rotated into 180 Another groove void is milled out on the slotter that standard is placed again into after degree；The module slot of next non-cursor position of milling B1 and B2, with one As the slotter transformed, the operation with milling A1 and A2 module slot, B1 and B2 module groove void, such standard are milled out ID-1 cards pass through after groove milling process, just there is the module groove void of four positions；

3rd, encapsulate：Because A1 and A2 positions are normal place, the mould of the packaging machine of standard, first packaged A1, A2 position is used Block, equally, according to the difference of device configuration, two modules can be once encapsulated simultaneously, one can also be first sealed, then card are revolved Another is encapsulated again after turnback；Again with a packaging machine transformed, the encapsulation of the two modules of B1, B2 is carried out, thus Complete the module encapsulation of four positions；

4th, individualize：, inherently can be to the modules of A1 and A2 normal places with a card bimodulus personalization device of standard Carry out personal data write-in；B1 and B2 positions are non-cursor position, as long as by the rotating disk of a card bimodulus personalization device of standard Station is transformed again, increases raise the price read/write head and the read write line of two non-cursor positions, and individualized production routine upgrades it Afterwards, you can complete the production of the individualized process of this four mould of card.

5th, lesser calorie is punched：With standard lesser calorie bicker, complete to be punched the lesser calorie of A1 and A2 positions；And B1 and B2 is nonstandard Position, by the two Position Design die cutting dies of B1 and B2, you can as the lesser calorie of punching A1 with a2 positions, is completed to B1 It is punched with the lesser calorie of B2 positions.

So, by the production of aforementioned four process, it is possible to realize four moulds of card of the first distribution map shown in Fig. 1 Production.

Embodiment 2：

As shown in Fig. 2 being B1 and B2 position distribution schematic diagrames.B1 is in A1 top, and B2 is in A2 lower section, as long as will be existing Equipment somewhat transform down i.e. can be achieved, method be the same as Example 1.

Embodiment 3：

As shown in figure 3, being B1 and B2 position distribution schematic diagrames.B1 is in A1 top, and B2 is in A2 top, as long as will be existing Equipment somewhat transform down i.e. can be achieved, method be the same as Example 1.

Embodiment 4：

As shown in figure 4, being B1 and B2 position distribution schematic diagrames.B1 is in A1 lower section, and B2 is in A2 lower section, as long as will be existing Equipment somewhat transform down i.e. can be achieved, method be the same as Example 1.

Embodiment 5：

As shown in figure 5, being B1, B2 and C1, C2 position distribution schematic diagram, C1, B1 are located at A1 upper and lower respectively, B2, C2 are located at A2 upper and lower respectively, can be achieved as long as existing equipment is somewhat transformed down, method be the same as Example 1.Simply its The processing number of times of each manufacturing procedure may be slightly varied from.In above-mentioned figure, A1, A2 are normal place, are immobilized, B1, B2 are non-cursor position, and its position in this four shadow regions of C, D, E, F can arbitrarily be distributed, actually one standard The mould of a card six can be at most realized on ID-1 cards.

As shown in fig. 6, being a four mould position views of card of standard.Produced in the way of four moulds of card, because of its chip position Put and all do not met ISO7816 standards, then have to customize a special four mould equipment of card again and produced, this will be set Standby overlapping investment, causes original equipment capacity to waste.

The process description of aforementioned four production process, just for the specific descriptions of the specific production equipment of certain class, certainly such as The device configuration of process that fruit has is different, and the production number of times in some processes can be changed, no matter groove milling process, envelope Dress process, individualized process still rush lesser calorie process, and the production number of times of its every procedure is determined by the concrete configuration of equipment 's.Such as, four groove voids on a card can be achieved by 1 to groove milling several times, encapsulate, individualize, Yi Jichong Lesser calorie is also such.The present invention, is realized on the ID-1 cards region of a standard, is processed except A1, A2 are normal place Immobilize, the four mould SIM cards that B1, B2 can arbitrarily arrange in C, D, E, F shadow region as Figure 1-4, so as to produce Final 2FF products, the processing technology of four moulds of a this card only needs to carry out a small amount of to add equipment and set even without adding It is standby it is achieved that avoid the overlapping investment of equipment, and disposably four modules on a card can be carried out simultaneously Peopleization, production efficiency improves 2 times.In addition, the groove milling, encapsulation, punch machine that do not carry out transforming of original standard are even subject to The personalization device transformed can also production standard in the same old way SIM card product.

Obviously, the technical staff of card vendor in the art or equipment supplier can carry out a small range to the present invention Various modifications or modification, without departing from the spirit and scope of the invention, so, if be related to the present invention various modifications or Modification belongs within the scope of the claim and its equivalent technology of the present invention, then the present invention is also intended to comprising these modifications and become Including type.

Claims

1. an a kind of card N mould processing methods of SIM card, comprise the following steps：1) the nonstandard card N moulds band of position is designed；2) milling Groove；3) encapsulate；4) individualize；5) lesser calorie is punched；It is characterized in that：

1) the nonstandard card N moulds band of position, is designed：One 85.6 × 53.97mm standard ID-1 cards, determine two standards A1, A2 position and the nonstandard positions of N-2；The size of all positions is 25 × 15mm；

2), groove milling：The module groove void of A1, A2 position is milled out on the slotter of standard first, can according to the difference of device configuration Once to mill out the groove void of the two positions, one of them can also be first milled out, is placed again into after card then is rotated into 180 degree Another groove void is milled out on the slotter of standard；Secondly the module slot of milling other non-cursor positions, with a slotter transformed, As operation with milling A1 and A2 module slot, the module groove void of other non-cursor positions, such standard ID-1 cards are milled out After groove milling process, just there is the module groove void of N number of position；

3), encapsulate：Because A1 and A2 positions are normal place, using the module of the packaging machine of standard, first packaged A1, A2 position, Equally, according to the difference of device configuration, two modules can be once encapsulated simultaneously, one can also be first sealed, then card are rotated Another is encapsulated again after 180 degree；Again with a packaging machine transformed, the encapsulation of other modules is carried out, this completes N number of The module encapsulation of position；

4), individualize：With a card bimodulus personalization device of standard, the module of A1 and A2 normal places can inherently be carried out Personal data writes；Other positions are non-cursor position, as long as the rotating disk station of a card bimodulus personalization device of standard is entered Row is transformed again, raise the price read/write head and the read write line of N-2 non-cursor positions of increase, after individualized production routine upgrading, i.e., The production of the individualized process of this card N mould can be completed；

5), lesser calorie is punched：With standard lesser calorie bicker, complete to be punched the lesser calorie of A1 and A2 positions；And other positions are nonstandard Position, by nonstandard Position Design die cutting die, you can as the lesser calorie of punching A1 with A2 positions, is completed nonstandard to other The lesser calorie punching of position, by the production of aforementioned four process, realizes the production of a card N moulds；

Slotter therein, packaging machine, personalization device and bicker are all standard devices, and N is four or six.