CN104360822A - Chip and control method for working frequency of chip - Google Patents
Chip and control method for working frequency of chip Download PDFInfo
- Publication number
- CN104360822A CN104360822A CN201410568084.9A CN201410568084A CN104360822A CN 104360822 A CN104360822 A CN 104360822A CN 201410568084 A CN201410568084 A CN 201410568084A CN 104360822 A CN104360822 A CN 104360822A
- Authority
- CN
- China
- Prior art keywords
- chip
- frequency
- internal temperature
- preset value
- described chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0602—Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
- G06F3/061—Improving I/O performance
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/06—Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
- G06F3/0601—Interfaces specially adapted for storage systems
- G06F3/0602—Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
- G06F3/061—Improving I/O performance
- G06F3/0611—Improving I/O performance in relation to response time
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Dc-Dc Converters (AREA)
Abstract
The invention discloses a chip and a control method for the working frequency of the chip. The method comprises the following steps: obtaining the internal temperature of the chip; when the internal temperature of the chip is greater than a first preset value, turning down the current working frequency of the chip by adopting a frequency switching technology until the internal temperature of the chip is not greater than the first preset value; when the internal temperature of the chip is less than a second reset value, turning up the current working frequency of the chip by adopting the frequency switching technology until the internal temperature of the chip is not less than the second preset value. The second preset value is not greater than the first preset value. Both the heating value of the chip and the read-write speed of the chip are realized, and the optimal frequency point for meeting the heating value need of the chip is found.
Description
Technical field
The present invention relates to electronic information technical field, more particularly, relate to the control method of a kind of chip and working frequency of chip.
Background technology
Along with user requires more and more higher to the read or write speed of chip, chip designer generally can adopt the mode of the frequency of operation improving chip to improve read or write speed.But too high frequency of operation can cause chip thermal value excessive, thus have influence on the stability of system, reliability and Consumer's Experience, and too low frequency of operation can limit read or write speed.Therefore, how to take into account chip thermal value and chip read or write speed, find the optimum frequency point meeting chip thermal value demand, become those skilled in the art's problem demanding prompt solution.
Summary of the invention
In view of this, the invention provides the control method of a kind of chip and working frequency of chip, to take into account chip thermal value and chip read or write speed, find the optimum frequency point meeting chip thermal value demand.
A control method for working frequency of chip, comprising:
Obtain chip internal temperature;
When described chip internal temperature is higher than the first preset value, frequency error factor technology is adopted to turn down the current frequency of operation of described chip, until described chip internal temperature is not higher than described first preset value;
When described chip internal temperature is lower than the second preset value, frequency error factor technology is adopted to heighten the current frequency of operation of described chip, until described chip internal temperature is not less than described second preset value, wherein said second preset value is not more than described first preset value.
Wherein, described employing frequency error factor technology turns down the current frequency of operation of described chip, comprising:
Calculate the difference between described chip internal temperature and described first preset value;
Search corresponding target frequency point unique with described difference;
Frequency error factor technology is adopted frequency of operation current for described chip to be turned down to described target frequency point.
Wherein, described employing frequency error factor technology heightens the current frequency of operation of described chip, comprising:
Calculate the difference between described chip internal temperature and described second preset value;
Search corresponding target frequency point unique with described difference;
Frequency error factor technology is adopted frequency of operation current for described chip to be heightened to described target frequency point.
Wherein, described employing frequency error factor technology turns down the current frequency of operation of described chip, comprising:
Calculate the rate of change of described chip internal temperature;
Search corresponding target frequency point unique with described rate of change;
Frequency error factor technology is adopted frequency of operation current for described chip to be turned down to described target frequency point.
Wherein, described employing frequency error factor technology heightens the current frequency of operation of described chip, comprising:
Calculate the rate of change of described chip internal temperature;
Search corresponding target frequency point unique with described rate of change;
Frequency error factor technology is adopted frequency of operation current for described chip to be heightened to described target frequency point.
A kind of chip, comprising:
Temperature sensing circuit, for detection chip internal temperature;
Frequency switching circuit, for switching the frequency of operation of chip;
And the logic control circuit to be connected with described frequency switching circuit with described temperature sensing circuit, for when described chip internal temperature is higher than the first preset value, control described frequency switching circuit to turn down the current frequency of operation of described chip, until described chip internal temperature is not higher than described first preset value; When described chip internal temperature is lower than the second preset value, control described frequency switching circuit to heighten the current frequency of operation of described chip, until described chip internal temperature is not less than described second preset value, wherein said second preset value is not more than described first preset value.
Wherein, described logic control circuit is when described chip internal temperature is higher than the first preset value, calculate the difference between described chip internal temperature and described first preset value, search corresponding target frequency point unique with described difference and control described frequency switching circuit and frequency of operation current for described chip is turned down to described target frequency point, until described chip internal temperature is not higher than the circuit of described first preset value.
Wherein, described logic control circuit is when described chip internal temperature is lower than the second preset value, calculate the difference between described chip internal temperature and described second preset value, search corresponding target frequency point unique with described difference and control described frequency switching circuit and frequency of operation current for described chip is heightened to described target frequency point, until described chip internal temperature is not less than the circuit of described second preset value.
Wherein, described logic control circuit is when described chip internal temperature is higher than the first preset value, calculate the rate of change of described chip internal temperature, search corresponding target frequency point unique with described rate of change and control described frequency switching circuit and frequency of operation current for described chip is turned down to described target frequency point, until described chip internal temperature is not higher than the circuit of described first preset value.
Wherein, described logic control circuit is when described chip internal temperature is lower than the second preset value, calculate the rate of change of described chip internal temperature, search corresponding target frequency point unique with described rate of change and control described frequency switching circuit and frequency of operation current for described chip is heightened to described target frequency point, until described chip internal temperature is not less than the circuit of described second preset value.
As can be seen from above-mentioned technical scheme, the present invention is by designing at chip internal integrated temperature sensitive design and frequency error factor, the frequency of operation of chip is turned down when chip temperature is higher, the frequency of operation of chip is heightened when chip temperature is lower, thus achieve chip thermal value within the specific limits stable, this design automatically adjusting working frequency of chip according to chip internal temperature, the optimum frequency point meeting chip thermal value demand can be automatically found, achieve taking into account chip thermal value and chip read or write speed.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the accompanying drawing provided.
The control method process flow diagram of Fig. 1 a kind of working frequency of chip disclosed in the embodiment of the present invention;
Fig. 2 a disclosed in the embodiment of the present invention a kind of frequency error factor technology that adopts to turn down the method flow diagram of working frequency of chip;
Fig. 2 b disclosed in the embodiment of the present invention a kind of frequency error factor technology that adopts to heighten the method flow diagram of working frequency of chip;
Fig. 3 a is that the embodiment of the present invention another employing frequency error factor technology disclosed is to turn down the method flow diagram of working frequency of chip;
Fig. 3 b is that the embodiment of the present invention another employing frequency error factor technology disclosed is to heighten the method flow diagram of working frequency of chip;
Fig. 4 is a kind of chip structure schematic diagram disclosed in the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
See Fig. 1, the embodiment of the invention discloses a kind of control method of working frequency of chip, to realize taking into account chip thermal value and chip read or write speed, find the optimum frequency point meeting chip thermal value demand, comprising:
Step 100: obtain chip internal temperature;
Step 200: judge that whether described chip internal temperature is higher than the first preset value, if described chip internal temperature is higher than described first preset value, enters step 400, otherwise enters step 300;
Step 300: judge that whether described chip internal temperature is lower than the second preset value, if described chip internal temperature is lower than described second preset value, enter step 500, otherwise this control procedure terminates, wherein said second preset value is not more than described first preset value;
Step 400: adopt frequency error factor technology to turn down the current frequency of operation of described chip.
Step 500: adopt frequency error factor technology to heighten the current frequency of operation of described chip.
The present embodiment is by designing at chip internal integrated temperature sensitive design and frequency error factor, the frequency of operation of chip is turned down when chip temperature is higher, the frequency of operation of chip is heightened when chip temperature is lower, thus achieve chip thermal value within the specific limits stable, this design automatically adjusting working frequency of chip according to chip internal temperature, the optimum frequency point meeting chip thermal value demand can be automatically found, achieve taking into account chip thermal value and chip read or write speed.
Wherein it should be noted that, the process of the size of comparable chip internal temperature and the first preset value, the second preset value, and the restriction in out-of-order, that is, step 200 is not limited to the execution sequence of step 300.
Wherein, regulate the process of working frequency of chip, fixed step size can be adopted to regulate, variable step size also can be adopted to regulate, but consider and adopt variable step size can solve contradiction between optimal speed and precision, therefore using the latter as preferably.Concrete, the intensity of variation (i.e. the size of described variable step size) of the frequency of operation of chip, can determine (as Fig. 2 a-2b) relative to the extent of deviation of the first preset value, the second preset value according to chip internal temperature, also can determine (as Fig. 3 a-3b) according to the rate of change of chip internal temperature, certainly, also jointly can be determined by both.
See Fig. 2 a, described step 400 comprises:
Step 401: calculate the difference between described chip internal temperature and described first preset value;
Step 402: search corresponding target frequency point unique with described difference; Different differences is to there being different target frequency points, and difference is larger, and corresponding target frequency point is lower;
Step 403: adopt frequency error factor technology frequency of operation current for described chip to be turned down to described target frequency point.
See Fig. 2 b, described step 500 comprises:
Step 501: calculate the difference between described chip internal temperature and described second preset value;
Step 502: search corresponding target frequency point unique with described difference; Different differences is to there being different target frequency points, and difference is larger, and corresponding target frequency point is higher;
Step 503: adopt frequency error factor technology frequency of operation current for described chip to be heightened to described target frequency point.
See Fig. 3 a, described step 400 comprises:
Step 411: the rate of change calculating described chip internal temperature;
Step 412: search corresponding target frequency point unique with described rate of change; Different rate of change is to there being different target frequency points, and rate of change is larger, and corresponding target frequency point is lower;
Step 413: adopt frequency error factor technology frequency of operation current for described chip to be turned down to described target frequency point.
See Fig. 2 b, described step 500 comprises:
Step 511: the rate of change calculating described chip internal temperature;
Step 512: search corresponding target frequency point unique with described rate of change; Different rate of change is to there being different target frequency points, and rate of change is larger, and corresponding target frequency point is higher;
Step 513: adopt frequency error factor technology frequency of operation current for described chip to be heightened to described target frequency point.
In addition, see Fig. 4, the embodiment of the invention also discloses a kind of chip, comprising:
Temperature sensing circuit 401, for detection chip internal temperature;
Frequency switching circuit 402, for switching the frequency of operation of chip;
And the logic control circuit 403 to be connected with frequency switching circuit 402 with temperature sensing circuit 401, for when described chip internal temperature is higher than the first preset value, controlled frequency commutation circuit 402 turns down the current frequency of operation of described chip, until described chip internal temperature is not higher than described first preset value; When described chip internal temperature is lower than the second preset value, controlled frequency commutation circuit 402 heightens the current frequency of operation of described chip, until described chip internal temperature is not less than described second preset value, wherein said second preset value is not more than described first preset value.
Wherein, described chip includes but not limited to mobile storage class chip.
Wherein, logic control circuit 403 is when described chip internal temperature is higher than the first preset value, calculate the difference between described chip internal temperature and described first preset value, search corresponding target frequency point unique with described difference and frequency of operation current for described chip is turned down to described target frequency point, until described chip internal temperature is not higher than the circuit of described first preset value by controlled frequency commutation circuit 402.
Wherein, logic control circuit 403 is when described chip internal temperature is lower than the second preset value, calculate the difference between described chip internal temperature and described second preset value, search corresponding target frequency point unique with described difference and frequency of operation current for described chip is heightened to described target frequency point, until described chip internal temperature is not less than the circuit of described second preset value by controlled frequency commutation circuit 402.
Or, logic control circuit 403 is when described chip internal temperature is higher than the first preset value, calculate the rate of change of described chip internal temperature, search corresponding target frequency point unique with described rate of change and frequency of operation current for described chip is turned down to described target frequency point, until described chip internal temperature is not higher than the circuit of described first preset value by controlled frequency commutation circuit 402.
Wherein, logic control circuit 403 is when described chip internal temperature is lower than the second preset value, calculate the rate of change of described chip internal temperature, search corresponding target frequency point unique with described rate of change and frequency of operation current for described chip is heightened to described target frequency point, until described chip internal temperature is not less than the circuit of described second preset value by controlled frequency commutation circuit 402.
In sum, the present invention is by designing at chip internal integrated temperature sensitive design and frequency error factor, the frequency of operation of chip is turned down when chip temperature is higher, the frequency of operation of chip is heightened when chip temperature is lower, thus achieve chip thermal value within the specific limits stable, this design automatically adjusting working frequency of chip according to chip internal temperature, the optimum frequency point meeting chip thermal value demand can be automatically found, achieve taking into account chip thermal value and chip read or write speed.
In this instructions, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar portion mutually see.For chip disclosed in embodiment, because it is uniquely corresponding with method disclosed in embodiment, so description is fairly simple, relevant part illustrates see method part.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. a control method for working frequency of chip, is characterized in that, comprising:
Obtain chip internal temperature;
When described chip internal temperature is higher than the first preset value, frequency error factor technology is adopted to turn down the current frequency of operation of described chip, until described chip internal temperature is not higher than described first preset value;
When described chip internal temperature is lower than the second preset value, frequency error factor technology is adopted to heighten the current frequency of operation of described chip, until described chip internal temperature is not less than described second preset value, wherein said second preset value is not more than described first preset value.
2. method according to claim 1, is characterized in that, described employing frequency error factor technology turns down the current frequency of operation of described chip, comprising:
Calculate the difference between described chip internal temperature and described first preset value;
Search corresponding target frequency point unique with described difference;
Frequency error factor technology is adopted frequency of operation current for described chip to be turned down to described target frequency point.
3. method according to claim 1, is characterized in that, described employing frequency error factor technology heightens the current frequency of operation of described chip, comprising:
Calculate the difference between described chip internal temperature and described second preset value;
Search corresponding target frequency point unique with described difference;
Frequency error factor technology is adopted frequency of operation current for described chip to be heightened to described target frequency point.
4. method according to claim 1, is characterized in that, described employing frequency error factor technology turns down the current frequency of operation of described chip, comprising:
Calculate the rate of change of described chip internal temperature;
Search corresponding target frequency point unique with described rate of change;
Frequency error factor technology is adopted frequency of operation current for described chip to be turned down to described target frequency point.
5. method according to claim 1, is characterized in that, described employing frequency error factor technology heightens the current frequency of operation of described chip, comprising:
Calculate the rate of change of described chip internal temperature;
Search corresponding target frequency point unique with described rate of change;
Frequency error factor technology is adopted frequency of operation current for described chip to be heightened to described target frequency point.
6. a chip, is characterized in that, comprising:
Temperature sensing circuit, for detection chip internal temperature;
Frequency switching circuit, for switching the frequency of operation of chip;
And the logic control circuit to be connected with described frequency switching circuit with described temperature sensing circuit, for when described chip internal temperature is higher than the first preset value, control described frequency switching circuit to turn down the current frequency of operation of described chip, until described chip internal temperature is not higher than described first preset value; When described chip internal temperature is lower than the second preset value, control described frequency switching circuit to heighten the current frequency of operation of described chip, until described chip internal temperature is not less than described second preset value, wherein said second preset value is not more than described first preset value.
7. chip according to claim 1, it is characterized in that, described logic control circuit is when described chip internal temperature is higher than the first preset value, calculate the difference between described chip internal temperature and described first preset value, search corresponding target frequency point unique with described difference and control described frequency switching circuit and frequency of operation current for described chip is turned down to described target frequency point, until described chip internal temperature is not higher than the circuit of described first preset value.
8. chip according to claim 1, it is characterized in that, described logic control circuit is when described chip internal temperature is lower than the second preset value, calculate the difference between described chip internal temperature and described second preset value, search corresponding target frequency point unique with described difference and control described frequency switching circuit and frequency of operation current for described chip is heightened to described target frequency point, until described chip internal temperature is not less than the circuit of described second preset value.
9. chip according to claim 1, it is characterized in that, described logic control circuit is when described chip internal temperature is higher than the first preset value, calculate the rate of change of described chip internal temperature, search corresponding target frequency point unique with described rate of change and control described frequency switching circuit and frequency of operation current for described chip is turned down to described target frequency point, until described chip internal temperature is not higher than the circuit of described first preset value.
10. chip according to claim 1, it is characterized in that, described logic control circuit is when described chip internal temperature is lower than the second preset value, calculate the rate of change of described chip internal temperature, search corresponding target frequency point unique with described rate of change and control described frequency switching circuit and frequency of operation current for described chip is heightened to described target frequency point, until described chip internal temperature is not less than the circuit of described second preset value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410568084.9A CN104360822A (en) | 2014-10-22 | 2014-10-22 | Chip and control method for working frequency of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410568084.9A CN104360822A (en) | 2014-10-22 | 2014-10-22 | Chip and control method for working frequency of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104360822A true CN104360822A (en) | 2015-02-18 |
Family
ID=52528086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410568084.9A Pending CN104360822A (en) | 2014-10-22 | 2014-10-22 | Chip and control method for working frequency of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104360822A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106066813A (en) * | 2016-05-26 | 2016-11-02 | 努比亚技术有限公司 | Resource scheduling device, mobile terminal and resource regulating method |
| CN109002356A (en) * | 2018-06-06 | 2018-12-14 | 北京嘉楠捷思信息技术有限公司 | Chip frequency modulation method and device of computing equipment, computing force board, computing equipment and storage medium |
| CN109086130A (en) * | 2018-06-06 | 2018-12-25 | 北京嘉楠捷思信息技术有限公司 | Chip frequency modulation method and device of computing equipment, computing force board, computing equipment and storage medium |
| CN110082768A (en) * | 2019-04-12 | 2019-08-02 | 惠州市德赛西威汽车电子股份有限公司 | A kind of heat dissipating method and radar of the vehicle-mounted forward direction high-resolution radar of 77Ghz |
| CN110489220A (en) * | 2019-08-16 | 2019-11-22 | 紫光展锐(重庆)科技有限公司 | Arithmetic unit and operation method |
| CN111274069A (en) * | 2018-12-05 | 2020-06-12 | 锐迪科（重庆）微电子科技有限公司 | Data processing method and device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6020820A (en) * | 1997-10-28 | 2000-02-01 | Micro-Star International Co., Ltd. | CPU over-heat protection detection device |
| CN1501463A (en) * | 2002-11-12 | 2004-06-02 | 联想(北京)有限公司 | Chip frequency regulation method |
| CN101030095A (en) * | 2006-03-02 | 2007-09-05 | 联想（新加坡）私人有限公司 | Heat quantity control method and computer |
| CN103376859A (en) * | 2012-04-26 | 2013-10-30 | 华为技术有限公司 | Chip performance control method and device |
-
2014
- 2014-10-22 CN CN201410568084.9A patent/CN104360822A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6020820A (en) * | 1997-10-28 | 2000-02-01 | Micro-Star International Co., Ltd. | CPU over-heat protection detection device |
| CN1501463A (en) * | 2002-11-12 | 2004-06-02 | 联想(北京)有限公司 | Chip frequency regulation method |
| CN101030095A (en) * | 2006-03-02 | 2007-09-05 | 联想（新加坡）私人有限公司 | Heat quantity control method and computer |
| CN103376859A (en) * | 2012-04-26 | 2013-10-30 | 华为技术有限公司 | Chip performance control method and device |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106066813A (en) * | 2016-05-26 | 2016-11-02 | 努比亚技术有限公司 | Resource scheduling device, mobile terminal and resource regulating method |
| CN106066813B (en) * | 2016-05-26 | 2020-03-13 | 努比亚技术有限公司 | Resource scheduling device, mobile terminal and resource scheduling method |
| CN109002356A (en) * | 2018-06-06 | 2018-12-14 | 北京嘉楠捷思信息技术有限公司 | Chip frequency modulation method and device of computing equipment, computing force board, computing equipment and storage medium |
| CN109086130A (en) * | 2018-06-06 | 2018-12-25 | 北京嘉楠捷思信息技术有限公司 | Chip frequency modulation method and device of computing equipment, computing force board, computing equipment and storage medium |
| CN109086130B (en) * | 2018-06-06 | 2022-06-10 | 北京嘉楠捷思信息技术有限公司 | Chip frequency modulation method and device of computing equipment, computing force board, computing equipment and storage medium |
| CN109002356B (en) * | 2018-06-06 | 2022-06-10 | 北京嘉楠捷思信息技术有限公司 | Chip frequency modulation method and device of computing equipment, computing force board, computing equipment and storage medium |
| US11502693B2 (en) | 2018-06-06 | 2022-11-15 | Canaan Creative Co., Ltd. | Chip frequency modulation method and apparatus of computing device, hash board, computing device and storage medium |
| CN111274069A (en) * | 2018-12-05 | 2020-06-12 | 锐迪科（重庆）微电子科技有限公司 | Data processing method and device |
| CN111274069B (en) * | 2018-12-05 | 2023-07-07 | 锐迪科（重庆）微电子科技有限公司 | Data processing method and device |
| CN110082768A (en) * | 2019-04-12 | 2019-08-02 | 惠州市德赛西威汽车电子股份有限公司 | A kind of heat dissipating method and radar of the vehicle-mounted forward direction high-resolution radar of 77Ghz |
| CN110489220A (en) * | 2019-08-16 | 2019-11-22 | 紫光展锐(重庆)科技有限公司 | Arithmetic unit and operation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104360822A (en) | Chip and control method for working frequency of chip | |
| WO2017107330A1 (en) | Temperature control method and mobile terminal | |
| KR101770530B1 (en) | Techniques enabling low power states for a communications port | |
| TWI657327B (en) | Switch control circuit, switch control method and converter using the same | |
| WO2020107392A1 (en) | Fan control method and apparatus, and electronic device | |
| CN104244527A (en) | LED over-current protection circuit based on negative temperature coefficient thermistor | |
| WO2014204437A3 (en) | Tracking core-level instruction set capabilities in a chip multiprocessor | |
| CN102830734B (en) | Equipment temperature regulating circuit | |
| CN109582371A (en) | A kind of low-power consumption awakening method and device | |
| JP2016163403A5 (en) | ||
| TWI426182B (en) | System and method for controlling fans | |
| CN204131089U (en) | A kind of overheating protection circuit of electronic system and electronic system | |
| CN105824344A (en) | Current adjusting method and terminal | |
| US20140191794A1 (en) | Method for performing adaptive voltage scaling (avs) and integrated circuit configured to perform avs | |
| WO2014138023A3 (en) | Shipping preferences population systems and related methods | |
| CN203932046U (en) | The crystal circle structure of narrow scribe line | |
| CN105865648A (en) | Low-power-consumption temperature detection method and device | |
| CN105759674A (en) | Calibration method and calibration unit of slow clock, clock circuit and mobile communication terminal | |
| CN104182015A (en) | Information processing method and electronic equipment | |
| WO2016165372A1 (en) | Method and device for controlling hot plug operation of cpu in mobile terminal | |
| ES2862305T3 (en) | Apparatus for determining parameters for estimating the temperature of a switching element in an inverter | |
| CN203338173U (en) | Welding machine protection circuit based on thermistor | |
| CN104076844B (en) | A kind of control method of motor cooling control system | |
| CN104361560A (en) | Geometric matching map sheet joint method based on circular region fitting | |
| CN104362844A (en) | Method and device applied to control of power factor correction |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150218 |