CN104337548A - Portable B-ultrasonic wave transmitting and receiving system connected with convex array probe and method - Google Patents
Portable B-ultrasonic wave transmitting and receiving system connected with convex array probe and method Download PDFInfo
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- CN104337548A CN104337548A CN201410604081.6A CN201410604081A CN104337548A CN 104337548 A CN104337548 A CN 104337548A CN 201410604081 A CN201410604081 A CN 201410604081A CN 104337548 A CN104337548 A CN 104337548A
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4433—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device involving a docking unit
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
- A61B8/4472—Wireless probes
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/52—Devices using data or image processing specially adapted for diagnosis using ultrasonic, sonic or infrasonic waves
Abstract
The invention discloses a portable B-ultrasonic wave transmitting and receiving system connected with a convex array probe and a method, and belongs to the field of medical equipment. The system comprises an FPGA (field programmable gate array), a high-voltage pulse generating circuit, a high-voltage receiving/transmitting disconnecting switch circuit, a high-voltage multiplexing switch circuit, an echo processing circuit and the convex array probe; after high-voltage pulse excitation signals produced by the FPGA pass through the high-voltage pulse generating circuit, high-voltage pulse signals are produced; the high-voltage pulse signals are transmitted to the high-voltage multiplexing switch circuit through a high-voltage sending channel of the high-voltage receiving/transmitting disconnecting switch circuit; the high-voltage multiplexing switch circuit multiplexes the signals to the convex array probe, so as to stimulate all groups of sub-arrays of a convex array probe element to transmit sound beams; the sound beams can produce echo after encountering an object to be tested; echo signals are transmitted to the echo processing circuit through the high-voltage multiplexing switch circuit and a low-voltage receiving channel of the high-voltage receiving/transmitting disconnecting switch circuit. The system provides possibility for the portability of a B-ultrasonic wave diagnostic apparatus, and is greatly superior to a discrete scheme in terms of the signal to noise ratio and echo signal quality.
Description
Technical field
The invention belongs to medical instruments field, be specifically related to a kind of the portable type b ultrasonic emitting-receiving system and the method that connect convex array probe.
Background technology
In domestic medicine, outdoor emergency treatment, even under the special diagnosis and treatment environment such as military first aid, usually need to diagnose the state of an illness rapidly by ultrasonic instrument, to reduce the mortality rate of patient and the wounded.Traditional ultrasonic device because volume is large, carrying the reasons such as inconvenience often can not practical requirement, therefore, just needs the portable ultrasound diagnostic equipment that volume is little, easy to carry.
It is exactly that its launch and accept part adopts the scheme of discrete component to realize that traditional B surpasses the bulky reason of instrument, and the B ultrasonic emitting-receiving system that discrete device realizes has that signal to noise ratio is low, power consumption is large, take long-pending large, the performance of PCB surface a series of shortcoming such as larger affected by environment.
Summary of the invention
For the deficiency that prior art exists, the invention provides a kind of the portable type b ultrasonic emitting-receiving system and the method that connect convex array probe.
Technical scheme of the present invention:
Connect a portable type b ultrasonic emitting-receiving system for convex array probe, this system comprises: isolating switch circuit and high-pressure multi-path multiplexing switch circuit are received/sent out to FPGA, high-voltage pulse generating circuit, high pressure, echo processing circuit, convex array probe;
The control of described FPGA is connected with the signal input part of high-voltage pulse generator with outfan, and meanwhile, the control end of FPGA also connects high pressure and receives/send out isolating switch circuit and high-pressure multi-path multiplexing switch circuit; Described high-voltage pulse generating circuit is received/is sent out isolating switch circuit and is connected with high pressure, described high pressure is received/sent out isolating switch circuit and is connected with echo processing circuit with high-pressure multi-path multiplexing switch circuit simultaneously; Described high-pressure multi-path multiplexing switch circuit connects convex array probe;
Described high-voltage pulse generating circuit, for receive from FPGA certain way action of low-voltage pulse pumping signal, this signal converted to can encourage convex array probe launch the corresponding way of sound wave high-voltage pulse signal, this high-voltage pulse signal is reached high pressure receive/send out isolating switch circuit;
Isolating switch circuit is received/sent out to described high pressure, comprise multiple high pressure to receive/send out isolating switch, for the high-voltage pulse signal of reception is reached high-pressure multi-path multiplexing switch circuit from high pressure sendaisle, the echo-signal of reception is reached echo processing circuit from low pressure receive path; The high pressure sendaisle that isolating switch circulates used for the low pressure receive path of isolating low-voltage signal and circulating used and high-voltage signal is received/sent out to described high pressure;
Described high-pressure multi-path multiplexing switch circuit, comprise multiple high-voltage switch gear, for the on off operating mode by switching each high-voltage switch gear, successively the high-voltage pulse signal of the certain way received is acted in each group of submatrix of convex array probe array element, encourage the beam of sound needed for each group of submatrix transmitting of convex array probe array element successively; Described each group of submatrix is combination that the is adjacent and array element of the way same number of this high-voltage pulse signal in the array element of convex array probe; The echo-signal corresponding to beam of sound reaches high pressure by corresponding high-voltage switch gear successively and receives/send out isolating switch circuit;
Described FPGA, comprising: pulse excitation signal emission control module, high pressure receive/send out isolating switch initial configuration module and high-pressure multi-path multiplex switch switches control module;
Described pulse excitation signal emission control module, for generation of required action of low-voltage pulse pumping signal, and reaches high-voltage pulse generating circuit by this signal;
Isolating switch initial configuration module is received/sent out to described high pressure, receives/send out the on off operating mode of isolating switch, clamp current for configuring high pressure;
Described high-pressure multi-path multiplex switch switches control module, for controlling the on off operating mode of multiple high-voltage switch gear in high-pressure multi-path multiplexing switch circuit;
The portable type b ultrasonic emitting-receiving system of the connection convex array probe described in employing launches sound wave and the method receiving echo, comprises the steps:
Step 1: initialize high pressure and receive/send out isolating switch circuit;
Each high pressure in isolating switch circuit is received/sent out to high pressure and receives/send out the on off operating mode of isolating switch and clamp current carries out initial configuration;
Step 2: first time configuration high-pressure multi-path multiplexing switch circuit;
By in high-pressure multi-path multiplexing switch circuit, required high-voltage switch gear is all configured to conducting state;
Step 3:FPGA sends n road action of low-voltage pulse pumping signal and reaches high-voltage pulse generating circuit;
Step 4: according to the action of low-voltage pulse pumping signal received, high-voltage pulse generating circuit produces n road high-voltage pulse signal;
Step 5: the n road high-voltage pulse signal that step 4 produces receives/send out by high pressure the 1st group of submatrix that isolating switch circuit and high-pressure multi-path multiplexing switch circuit act on convex array probe array element;
Convex array probe has m array element, forms one group of submatrix with an adjacent n array element, then total m-n+1 group submatrix;
Step 6: send a branch of sound wave after the 1st group of submatrix of convex array probe array element is encouraged;
Step 7: the beam of sound that step 6 is launched produces echo through the reflection of testee;
Step 8: convex array probe converts the echo of reception to the signal of telecommunication, i.e. echo-signal;
Step 9: isolating switch circuit is received/sent out to echo-signal through high-pressure multi-path multiplexing switch circuit and high pressure, reaches echo processing circuit;
Step 10: according to step 2 to the method for step 9, repeated execution of steps 2 to step 9 successively, completes the 2nd group of convex array probe array element, the 3rd group successively until the acoustic emission of m-n+1 group submatrix and echo reception.
Operation principle of the present invention is: described FPGA produces the action of low-voltage pulse pumping signal of certain way, and the action of low-voltage pulse pumping signal of this certain way is sent to high-voltage pulse generating circuit, high-voltage pulse generating circuit produces the high-voltage pulse signal of corresponding way, the high pressure sendaisle that isolating switch circuit was received/sent out to this certain high-voltage pulse signal by high pressure reaches high-pressure multi-path multiplexing switch circuit, the high-voltage pulse signal of this certain way is multiplexed on the convex array probe of array number higher than the way of this high-voltage pulse signal by high-pressure multi-path multiplexing switch circuit, namely form successively according to array element adjacent in convex array probe and organize submatrix more, successively the high-voltage pulse signal of this certain way is acted in each group of submatrix, encourage the beam of sound needed for each group of submatrix transmitting of convex array probe array element successively, described each group of submatrix is combination that the is adjacent and array element of the way same number of high-voltage pulse signal in convex array probe, echo can be produced after beam of sound runs into testee, convex array probe receives echo and converts this echo to the signal of telecommunication and obtains echo-signal, echo-signal reaches high pressure by high-pressure multi-path multiplexing switch circuit and receives/send out isolating switch circuit, then reaches echo processing circuit by the low pressure receive path that isolating switch circuit was received/sent out to high pressure and process.
Beneficial effect: portable type b ultrasonic emitting-receiving system and the method for connection convex array probe of the present invention compared with prior art have following advantage: adopt fully integratedization scheme, for " portable " of B ultrasonic diagnostic apparatus provides possibility, reduce system power dissipation simultaneously, and be significantly superior to discrete scheme in noise when echo-signal quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of the portable type b ultrasonic emitting-receiving system of the connection convex array probe of the specific embodiment of the invention;
Fig. 2 is the FPGA of the specific embodiment of the invention and the annexation schematic diagram of high-voltage pulse generating circuit;
Fig. 3 is the annexation schematic diagram that isolating switch circuit was received/sent out to the FPGA of the specific embodiment of the invention and high pressure;
Fig. 4 is the FPGA of the specific embodiment of the invention and the annexation schematic diagram of high-pressure multi-path multiplexing switch circuit;
Fig. 5 is the annexation schematic diagram that isolating switch circuit was received/sent out to the high-voltage pulse generating circuit of the specific embodiment of the invention and high pressure;
Fig. 6 is the annexation schematic diagram that isolating switch circuit and high-pressure multi-path multiplexing switch circuit were received/sent out to the high pressure of the specific embodiment of the invention;
Fig. 7 is the high-pressure multi-path multiplexing switch circuit of the specific embodiment of the invention and the annexation schematic diagram of convex array probe;
Fig. 8 is that the employing of the specific embodiment of the invention connects the B ultrasonic emitting-receiving system transmitting sound wave of convex array probe and the method flow diagram receiving echo;
Fig. 9 is that isolating switch initialization result analogous diagram is received/sent out to the high pressure of the specific embodiment of the invention;
Figure 10 is high pressure multiplexing switch circuit configuration signal and the pulse excitation signal analogous diagram of the specific embodiment of the invention;
Figure 11 is the waveform figure of the high pressure multiplexing switch circuit configuration signal of the specific embodiment of the invention;
Figure 12 is the waveform figure of a certain road high-voltage pulse signal of the specific embodiment of the invention.
Figure 13 is the echo-signal figure of the specific embodiment of the invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
A kind of portable type b ultrasonic emitting-receiving system connecting convex array probe of present embodiment, as shown in Figure 1, this system comprises: isolating switch circuit and high-pressure multi-path multiplexing switch circuit, echo processing circuit are received/sent out to FPGA, high-voltage pulse generating circuit, high pressure, convex array probe;
The model of what the FPGA of present embodiment selected is altera corp is the FPGA of EP2C5Q208C8N.The high-voltage pulse generating circuit of present embodiment is formed primarily of the high-voltage pulse generator that 4 models are MAX4940.The high pressure of present embodiment is received/is sent out isolating switch circuit and receives/send out isolating switch formation primarily of the high pressure that 2 models are MAX4936.The high-pressure multi-path multiplexing switch circuit of present embodiment is formed primarily of the high-pressure multi-path multiplex switch that 5 models are MAX4968.
The evaluation circuit board of the echo processing circuit of present embodiment mainly contains model to be AFE5805EVM and model be TSW1250 is formed.The convex array probe of the present embodiment is the mid frequency produced by Hai Ying company is the convex array probe of 3.5MHz.
The annexation of EP2C5Q208C8N type FPGA and 4 high-voltage pulse generating circuit that MAX4940 chip is formed of present embodiment as shown in Figure 2, pin I/O0 ~ the I/O3 of FPGA is connected successively with pin PULSER_CP0 ~ PULSER_CP3 pin of a MAX4940 chip respectively, pin I/O4 ~ the I/O7 of FPGA is connected successively with pin PULSER_CN0 ~ PULSER_CN3 pin of a MAX4940 chip respectively, pin I/O8 ~ the I/O11 of FPGA is connected successively with pin PULSER_CP4 ~ PULSER_CP7 pin of the 2nd MAX4940 chip respectively, pin I/O12 ~ the I/O15 of FPGA is connected successively with pin PULSER_CN4 ~ PULSER_CN7 pin of the 2nd MAX4940 chip respectively, pin I/O16 ~ the I/O19 of FPGA is connected successively with PULSER_CP8 ~ PULSER_CP11 pin of the 3rd MAX4940 chip respectively, pin I/O20 ~ the I/O23 of FPGA is connected successively with PULSER_CN8 ~ PULSER_CN11 pin of the 3rd MAX4940 chip respectively, pin I/O24 ~ the I/O27 of FPGA is connected successively with PULSER_CP12 ~ PULSER_CP15 pin of the 4th MAX4940 chip respectively, pin I/O28 ~ the I/O31 of FPGA is connected successively with PULSER_CN12 ~ PULSER_CN15 pin of the 4th MAX4940 chip respectively,
EP2C5Q208C8N type FPGA and 2 high pressure that MAX4936 chip is formed of present embodiment is received/is sent out the high pressure that the annexation of isolating switch circuit and 2 MAX4936 chips form and receive/send out isolating switch inside circuit annexation as shown in Figure 3, the pin I/O32 of FPGA is connected with the TR_SW_LE pin of the 2nd MAX4936 chip jointly with the TR_SW_LE pin of a MAX4936 chip, pin I/O33 is connected with the TR_SW_CLR pin of the 2nd MAX4936 chip jointly with the TR_SW_CLR pin of a MAX4936 chip, pin I/O34 is connected with the TR_SW_CLK pin of the 2nd MAX4936 chip jointly with the TR_SW_CLK pin of a MAX4936 chip, pin I/O35 is connected with the TR_SW_DIN of a MAX4936 chip, the TR_SW_DOUT pin of the one MAX4936 chip is connected with the TR_SW_DIN pin of the 2nd MAX4936 chip,
The inner annexation of high-pressure multi-path multiplexing switch circuit that the annexation of the high-pressure multi-path multiplexing switch circuit that EP2C5Q208C8N type FPGA and 5 MAX4968 chip of present embodiment is formed and 5 MAX4968 chips are formed as shown in Figure 4, the pin I/O36 and first of FPGA, second, 3rd, 4th, the MUX_LE pin of the 5th MAX4968 chip is connected jointly, pin I/O37 and first, second, 3rd, 4th, the MUX_CLR pin of the 5th MAX4968 chip is connected jointly, pin I/O38 and first, second, 3rd, 4th, the MUX_CLK pin of the 5th MAX4968 chip is connected jointly, pin I/O39 is connected with the MUX_DIN pin of a MAX4968 chip, the MUX_DOUT pin of the one MAX4968 chip is connected with the MUX_DIN pin of the 2nd MAX4968 chip, the MUX_DOUT pin of the 2nd MAX4968 chip is connected with the MUX_DIN pin of the 3rd MAX4968 chip, the MUX_DOUT pin of the 3rd MAX4968 chip is connected with the MUX_DIN pin of the 4th MAX4968 chip, the MUX_DOUT pin of the 4th MAX4968 chip is connected with the MUX_DIN pin of the 5th MAX4968 chip,
The annexation of isolating switch circuit is received/sent out to the high-voltage pulse generating circuit be made up of 4 MAX4940 chips of present embodiment and the high pressure be made up of 2 MAX4936 chips as shown in Figure 5, and the pin HV_PULSE_0 ~ HV_PULSE_3 of the MAX4940 chip in high-voltage pulse generating circuit received/sent out the MAX4968 chip in isolating switch circuit successively pin HV1 ~ HV4 with high pressure is connected; Pin HV_PULSE_4 ~ the HV_PULSE_7 of the 2nd MAX4940 chip received/sent out the MAX4968 chip in isolating switch circuit successively pin HV5 ~ HV8 with high pressure is connected; Pin HV_PULSE_8 ~ the HV_PULSE_11 of the 3rd MAX4940 chip received/sent out the 2nd MAX4968 chip in isolating switch circuit successively pin HV1 ~ HV4 with high pressure is connected; Pin HV_PULSE_12 ~ the HV_PULSE_15 of the 4th MAX4940 chip received/sent out the 2nd MAX4968 chip in isolating switch circuit successively pin HV5 ~ HV8 with high pressure is connected;
The high pressure be made up of 2 MAX4936 chips of present embodiment receive/send out isolating switch circuit and the annexation of high-pressure multi-path multiplexing switch circuit that is made up of 5 MAX4968 chips as shown in Figure 6, the pin HVMUX_IN_0 that the MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW0A ~ SW4A of a MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_1 that the MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW5A ~ SW9A of a MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_2 that the MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW10A ~ SW14A of a MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_3 that the MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW15A ~ SW3A of a MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_4 that the MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW4A ~ SW8A of the 2nd MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_5 that the MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW9A ~ SW13A of the 2nd MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_6 that the MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW14A ~ SW15A of the 2nd MAX4968 chip in high-pressure multi-path multiplexing switch circuit, the pin SW0A ~ W2A of the 3rd MAX4968 chip; The pin HVMUX_IN_7 that the MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW3A ~ SW7A of the 3rd MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_8 that the 2nd MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW8A ~ SW12A of the 3rd MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_9 that the 2nd MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW13A ~ SW15A of the 3rd MAX4968 chip in high-pressure multi-path multiplexing switch circuit, the pin SW0A ~ SW1A of the 4th MAX4968 chip; The pin HVMUX_IN_10 that the 2nd MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW2A ~ SW6A of the 4th MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_11 that the 2nd MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW7A ~ SW11A of the 4th MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_12 that the 2nd MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW12A ~ SW15A of the 4th MAX4968 chip in high-pressure multi-path multiplexing switch circuit, the pin SW0A of the 5th MAX4968 chip; The pin HVMUX_IN_13 that the 2nd MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW1A ~ SW5A of the 5th MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_14 that the 2nd MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW6A ~ SW10A of the 5th MAX4968 chip in high-pressure multi-path multiplexing switch circuit; The pin HVMUX_IN_15 that the 2nd MAX4936 chip in isolating switch circuit was received/sent out to high pressure is connected with the pin SW11A ~ SW15A of the 5th MAX4968 chip in high-pressure multi-path multiplexing switch circuit;
As shown in Figure 7, in high-pressure multi-path multiplexing switch circuit, the pin SW0B ~ SW15B of a MAX4968 chip is connected with pin PROBE_0, PROBE_16, PROBE_32, PROBE_48, PROBE_64, PROBE_1, PROBE_17, PROBE_33, PROBE_49, PROBE_65, PROBE_2, PROBE_18, PROBE_34, PROBE_50, PROBE_66, PROBE_3 of convex array probe successively for the high-pressure multi-path multiplexing switch circuit be made up of 5 MAX4968 chips of present embodiment and the annexation of convex array probe; Pin SW0B ~ the SW15B of the 2nd MAX4968 chip in high-pressure multi-path multiplexing switch circuit is connected with pin PROBE_19, PROBE_35, PROBE_51, PROBE_67, PROBE_4, PROBE_20, PROBE_36, PROBE_52, PROBE_68, PROBE_5, PROBE_21, PROBE_37, PROBE_53, PROBE_69, PROBE_6, PROBE_22 of convex array probe successively; Pin SW0B ~ the SW15B of the 3rd MAX4968 chip in high-pressure multi-path multiplexing switch circuit is connected with pin PROBE_38, PROBE_54, PROBE_70, PROBE_7, PROBE_23, PROBE_39, PROBE_55, PROBE_71, PROBE_8, PROBE_24, PROBE_40, PROBE_56, PROBE_72, PROBE_9, PROBE_25, PROBE_41 of convex array probe successively; Pin SW0B ~ the SW15B of the 4th MAX4968 chip in high-pressure multi-path multiplexing switch circuit is connected with pin PROBE_57, PROBE_73, PROBE_10, PROBE_26, PROBE_42, PROBE_58, PROBE_74, PROBE_11, PROBE_27, PROBE_43, PROBE_59, PROBE_75, PROBE_12, PROBE_28, PROBE_44, PROBE_60 of convex array probe successively; Pin SW0B ~ the SW15B of the 5th MAX4968 chip in high-pressure multi-path multiplexing switch circuit is connected with pin PROBE_76, PROBE_13, PROBE_29, PROBE_45, PROBE_61, PROBE_77, PROBE_14, PROBE_30, PROBE_46, PROBE_62, PROBE_78, PROBE_15, PROBE_31, PROBE_47, PROBE_63, PROBE_79 of convex array probe successively;
Adopt the B ultrasonic emitting-receiving system of the connection convex array probe of present embodiment to launch sound wave and the method receiving echo, as shown in Figure 8, it comprises the steps:
Step 1: initialize high pressure and receive/send out isolating switch circuit;
EP2C5Q208C8N type FPGA carries out initial configuration by SPI interface to the on off operating mode, clamp current etc. that isolating switch MAX4936 chip was received/sent out to the high pressure that 2 adopt daisy chain type to connect, and simulation result as shown in Figure 9;
Step 2: first time configuration high-pressure multi-path multiplexing switch circuit;
EP2C5Q208C8N type FPGA carries out first time configuration by the on off operating mode of SPI interface to the high-pressure multi-path multiplex switch MAX4968 chip that 5 adopt daisy chain type to connect, make high pressure activation signal can by specific 16 switching channels, act on front No. 16 array elements of convex array probe, simulation result as shown in Figure 10; The configuration signal waveform of oscillograph test as shown in figure 11;
Step 3:EP2C5Q208C8N type FPGA sends 16 road action of low-voltage pulse pumping signals and reaches high-voltage pulse generating circuit;
Inner at FPGA, by using former figure input mode and Verilog Programming with Pascal Language mode, produce one group of 16 road pulse excitation signal, each road pulse excitation signal is made up of the pulse of a P type and a N-type pulse respectively; Pulse excitation signal frequency is 3.5MHz, and the dead band waiting time is about 30ns; Simulation result as shown in Figure 10;
Step 4: according to the action of low-voltage pulse pumping signal received, high-voltage pulse generating circuit produces 16 road high-voltage pulse signals;
After the action of low-voltage pulse pumping signal input high-voltage pulse generating circuit that step 3 produces, produce corresponding high pressure, high-frequency bipolar pulse exports; The road high-voltage pulse signal that oscillograph is measured as shown in figure 12;
Step 5: the 16 road high-voltage pulse signals that step 4 produces receive/send out by high pressure first group of submatrix that isolating switch circuit and high-pressure multi-path multiplexing switch circuit act on convex array probe;
Convex array probe has 80 array elements, forms one group of submatrix, totally 65 groups of submatrixs with adjacent 16 array elements;
Step 6: send a branch of sound wave after 16 array elements in first group of submatrix of convex array probe are encouraged;
Step 7: the sound wave that step 6 is launched produces echo-signal through the reflection of testee;
According to the difference of testee, sound wave can produce multiecho on the surface of testee, such as, echo-signal shown in Figure 13.
Step 8: convex array probe converts the echo of reception to the signal of telecommunication;
Step 9: isolating switch circuit is received/sent out to echo-signal through high-pressure multi-path multiplexing switch circuit and high pressure, and high-voltage signal is isolated, the useful signal of low pressure reaches echo processing circuit;
The echo processing circuit of present embodiment, comprises AFE5805EVM and TSW1250FPGA, and first AFE carries out low noise amplification to the echo-signal received, to improve the signal to noise ratio of echo-signal; After anti-aliasing filter, be quantified as digital signal by high-speed AD acquisition and by high speed LVDS interface digital signal be sent in FPGA and carry out signal preprocessing.
Step 10: according to step 2 to the method for step 9, repeated execution of steps 2 to step 9 successively, completes the 2nd group of convex array probe, the 3rd group successively until the acoustic emission of the 65th group of submatrix.
Claims (3)
1. connect a portable type b ultrasonic emitting-receiving system for convex array probe, it is characterized in that: this system comprises: isolating switch circuit and high-pressure multi-path multiplexing switch circuit are received/sent out to FPGA, high-voltage pulse generating circuit, high pressure, echo processing circuit, convex array probe;
Described FPGA receives/sends out isolating switch circuit simultaneously and is connected with high-pressure multi-path multiplexing switch circuit with high-voltage pulse generator, high pressure; Described high-voltage pulse generating circuit is received/is sent out isolating switch circuit and is connected with high pressure, described high pressure is received/sent out isolating switch circuit and is connected with echo processing circuit with high-pressure multi-path multiplexing switch circuit simultaneously; Described high-pressure multi-path multiplexing switch circuit connects convex array probe;
Described high-voltage pulse generating circuit, for receive from FPGA certain way action of low-voltage pulse pumping signal, this signal converted to can encourage convex array probe launch the corresponding way of sound wave high-voltage pulse signal, this high-voltage pulse signal is reached high pressure receive/send out isolating switch circuit;
Isolating switch circuit is received/sent out to described high pressure, comprise multiple high pressure to receive/send out isolating switch, for the high-voltage pulse signal of reception is reached high-pressure multi-path multiplexing switch circuit from high pressure sendaisle, the echo-signal of reception is reached echo processing circuit from low pressure receive path; The high pressure sendaisle that isolating switch circulates used for the low pressure receive path of isolating low-voltage signal and circulating used and high-voltage signal is received/sent out to described high pressure;
Described high-pressure multi-path multiplexing switch circuit, comprise multiple high-voltage switch gear, for the on off operating mode by switching each high-voltage switch gear, successively the high-voltage pulse signal of the certain way received is acted in each group of submatrix of convex array probe array element, encourage the beam of sound needed for each group of submatrix transmitting of convex array probe array element successively; Described each group of submatrix is combination that the is adjacent and array element of the way same number of this high-voltage pulse signal in the array element of convex array probe; The echo-signal corresponding to beam of sound reaches high pressure by corresponding high-voltage switch gear successively and receives/send out isolating switch circuit.
2. the portable type b ultrasonic emitting-receiving system of connection convex array probe according to claim 1, it is characterized in that: described FPGA, comprising: pulse excitation signal emission control module, high pressure receive/send out isolating switch initial configuration module and high-pressure multi-path multiplex switch switches control module;
Described pulse excitation signal emission control module, for generation of required action of low-voltage pulse pumping signal, and reaches high-voltage pulse generating circuit by this signal;
Isolating switch initial configuration module is received/sent out to described high pressure, receives/send out the on off operating mode of isolating switch, clamp current for configuring high pressure;
Described high-pressure multi-path multiplex switch switches control module, for controlling the on off operating mode of multiple high-voltage switch gear in high-pressure multi-path multiplexing switch circuit.
3. adopt the portable type b ultrasonic emitting-receiving system of connection convex array probe according to claim 1 to launch sound wave and the method receiving echo, it is characterized in that: comprise the steps:
Step 1: initialize high pressure and receive/send out isolating switch circuit;
Step 2: configuration high-pressure multi-path multiplexing switch circuit;
By in high-pressure multi-path multiplexing switch circuit, required high-voltage switch gear is all configured to conducting state;
Step 3:FPGA sends n road action of low-voltage pulse pumping signal and reaches high-voltage pulse generating circuit;
Step 4: according to the action of low-voltage pulse pumping signal received, high-voltage pulse generating circuit produces n road high-voltage pulse signal;
Step 5: the n road high-voltage pulse signal that step 4 produces receives/send out isolating switch circuit by high pressure and high-pressure multi-path multiplexing switch circuit acts in one group of submatrix of convex array probe array element;
Convex array probe has m array element, forms one group of submatrix with an adjacent n array element, then total m-n+1 group submatrix;
Step 6: send a branch of sound wave after one group of submatrix of the convex array probe array element described in step 5 is encouraged;
Step 7: the beam of sound that step 6 is launched produces echo through the reflection of testee;
Step 8: convex array probe converts the echo of reception to the signal of telecommunication, i.e. echo-signal;
Step 9: isolating switch circuit is received/sent out to echo-signal through high-pressure multi-path multiplexing switch circuit and high pressure, reaches echo processing circuit;
Step 10: according to step 2 to the method for step 9, repeated execution of steps 2 to step 9 successively, completes the acoustic emission of each group of submatrix of convex array probe array element and corresponding echo reception successively.
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Application publication date: 20150211 |