CN104328372A - Device and processing method for directly plating micro-fine wire surface with metal layer - Google Patents

Device and processing method for directly plating micro-fine wire surface with metal layer Download PDF

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Publication number
CN104328372A
CN104328372A CN201410530224.3A CN201410530224A CN104328372A CN 104328372 A CN104328372 A CN 104328372A CN 201410530224 A CN201410530224 A CN 201410530224A CN 104328372 A CN104328372 A CN 104328372A
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micro
casing
metal layer
fine wire
annealing
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CN201410530224.3A
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CN104328372B (en
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曹军
范俊玲
吕长春
李科
朱利霞
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HENAN YOUK ELECTRONIC MATERIALS CO Ltd
Henan University of Technology
Jiaozuo university
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HENAN YOUK ELECTRONIC MATERIALS CO Ltd
Henan University of Technology
Jiaozuo university
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36Elongated material
    • C23C2/38Wires; Tubes
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/26After-treatment
    • C23C2/28Thermal after-treatment, e.g. treatment in oil bath

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Thermal Sciences (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention discloses a device and a method for directly plating a micro-fine wire surface with a metal layer. The device comprises a wire spooling and releasing device, a heating device, a plating device, a tension control device and a waste gas collecting device; the wire spooling and releasing device comprises a wire spooling system, a wire releasing system and guide wheels; the heating device comprises quartz glass pipes, heating pipes, annealing box bodies and a drying box body, and the quartz glass pipes are respectively placed in the annealing box bodies and the drying box body, and are supported by supporting seats; the plating device comprises a mold base, a mold, guiding pipes and micro-amount pumps; the tension control device comprises an angular displacement sensors and guide wheels; the waste gas collecting device comprises a collecting hood and axial flow fans. The device and the method avoid electroplating or chemical plating from causing harm to the environment and operators, can directly plate the micro-fine wire surface with the metal layer, can precisely control the thickness of the metal layer, improves the processing efficiency of a micro-fine wire, and allows the wire after being plated to be not required further wiredrawing processing, so as to ensure the uniformity of the plating layer.

Description

A kind of micro-fine wire surface directly coated metal layer equipment and working method
Technical field
The invention belongs to wire surface processing technology field, relate to a kind of wire surface direct coated metal layer Apparatus and method for, particularly relate to a kind of micro-fine wire surface directly coated metal layer equipment and working method.
Background technology
Along with silver-plated, plating palladium, the micro-fine wire such as zinc-plated are at aerospace cable, research laboratory's material, notebook computer, mobile phone Ultrathin coaxial cable, high-tension enameled wire, widespread use in the fields such as loud speaker outlet line, require that metal plating wire rod has uniform coating, controlled thickness of coating and thinner diameter (diameter is less than 0.02mm), this just proposes requirements at the higher level to wire surface metal plating.The uneven metallic surface resistance that causes of wire surface metal plating increases, have a strong impact on the laser propagation effect of high-frequency signal in wire rod, zinc coat thickness control out of true can improve tooling cost, there is the drawbacks such as fracture of wire frequency is high, metal plating comes off in metallic coating wire pulling process, the problems referred to above have had a strong impact on the application of metal plating wire rod in the fields such as electronics, automobile and data transmission.Improving wire surface coated metal quality, optimizing metal plating wire rod processing process is problem demanding prompt solution in the processing of metal plating micro-fine wire.
Existing Coating metal superfine wire rod processing adopts and adopts electrochemical plating and electroless plating method coating thick metal layers when wire rod major diameter, then through drawing the fine metal coating wire rod obtaining required diameter, there is shortcomings in this working method: 1. electrochemical plating and electroless plating method all exist prussiate, heavy metal contamination, there is considerable influence to environment, the course of processing is neglected a little and will be damaged bringing on a disaster property of environment; 2. electrochemical plating and electroless plating method are all easy works the mischief to operator, has a strong impact on workman's physical and mental health; 3. plating or product of electroless plating contain heavy metal and heavy metal complex, can not meet environment RoHs and specify; 4. easy in metal plating drawing crack in pair major diameter Coating metal wire drawing process, make metal plating effectively can not be attached to wire surface; 5., owing to being two-phase metal, during the method processing micro-fine wire, wire rod outage is higher, is difficult to wire rod to be machined to below 0.020mm.Therefore above-mentioned working method exists problems, have a strong impact on fine metal coating wire quality, made troubles to the processing of wire rod and use.
Therefore, at present in the urgent need to changing existing working method, to solve Problems existing in the processing of current fine metal coating wire production.
Summary of the invention
The present invention is intended to solve that environmental pollution in the current fine metal coating wire rod course of processing, uneven coating are even, coating can not accurately control and fine metal coating wire rod such as can not to process at the problem.
For this reason, the invention provides a kind of micro-fine wire surface directly coated metal layer equipment and working method, equipment comprises take-up and pay-off device, heating unit, coater, tenslator and waste gas collection device, wherein, described take-up and pay-off device comprises winding system, paying off system and some guide wheels, and winding system and paying off system are arranged on heating unit bottom.Described heating unit comprises quartz glass tube, heating tube, two annealing casings, oven dry casings, described annealing casing and oven dry casing are all vertically placed, and two annealing casings lay respectively at oven dry casing both sides, be symmetric, quartz glass tube is placed on annealing casing and dries in the annealing pipe at casing center, and supported by base for supporting, described quartz glass tube freely can take out from top, annealing casing, oven dry casing can be tilted during taking-up, avoid silica tube to touch article above equipment.Described coater is fixed on heating unit bottom, and coater can regulate in orientation, all around four, guarantee to dry silica tube center superposition in casing in mold center and heating unit in coater, described coater comprises mold base, mould, thrust-augmenting nozzle and micro pump, micro pump is connected with mould by thrust-augmenting nozzle, coater can regulate in orientation, all around four, guarantees to dry silica tube center superposition in casing in mold center and heating unit in coater.Described tenslator comprises angular displacement sensor, and tenslator is positioned at above annealing casing.Described waste gas collection device comprises collecting hood and axial fan, and waste gas collection device is positioned at heating unit top, realizes gas sampling.
Further, the winding system in described take-up and pay-off device, paying off system are active winding system and active release wire system, adopt servomotor as driving, and paying off system are positioned at below winding system.
Further, described annealing casing, dry casing and can manually tilt, after tilting with the angle of vertical direction higher than 30 °, annealing casing, the heating tube of drying in casing adopt three sections of type of heating to heat, and every section of heating power can independently control.
Again further, in described coater, mold base is provided with thermostat, ensures that mold base temperature is at 20 DEG C-25 DEG C, and preferentially selects semiconductor chilling plate to control die temperature, be fixed on mold base by semiconductor chilling plate by tackiness agent.
Again further, in described coater, mould is made up of mold, inlet region, die hole, infusion hole, outlet area and core rod, and the preferred rough diamond of core material, Die orifice diameter is greater than processing gauge or diameter of wire 4-5 micron, and is fixed in mold base by reed.
Again further, the angular displacement sensor in described tenslator controls tension force precision and is not less than 0.1g.
The working method of the direct coated metal layer equipment in micro-fine wire surface of the present invention is as follows:
A () connects the infusion hole of micro pump and mould by thrust-augmenting nozzle;
(b) wire rod to be processed by paying off system through guide wheel perpendicular through the inlet region of mould, die hole and outlet area, at the silica tube by drying in casing, then the angular displacement sensor in tenslator and guide wheel enter annealing casing, eventually pass guide wheel rolling on winding system;
C () opens micro pump, 0.1-0.5ml liquid nano metal is injected mould by thrust-augmenting nozzle, and liquid nano metal flow is 0.01-0.1ml/ minute;
Tension value in (d) adjustment tenslator, after liquid nano metal has injected, opening device.
Further, drying casing heating tube temperature scope in described working method is 250 DEG C-550 DEG C, and annealing casing heating tube temperature scope is 300 DEG C-600 DEG C.
Further, in described working method, the tension range of tenslator is 0.1-20g.
Again further, in described working method, wire rod process velocity is not less than 20m/ minute.
The working method of the direct coated metal layer equipment in micro-fine wire of the present invention surface eliminates the harm to environment and operator of heavy metal and prussiate in electrochemical plating and electroless plating method, solve that wire surface uneven coating is even, thickness of coating can not accurately control and fine metal coating wire rod due to problems such as bimetal cannot draw, for fine metal coating wire stock processing equipment and method propose new thought.
Compared with existing instrument and supplies, micro-fine wire surface of the present invention directly coated metal layer Apparatus and method for has the following advantages:
1. employing liquid nano metal, avoids plating or electroless plating causes harm to environment and operator;
2. adopt wire drawing finished wire rod surface directly coated metal, solve traditional method after major diameter plating or electroless plating thick metal layers, the difficult problem that two-phase metal wire-drawing outage is high; And can to ultra tiny wire rod (wire diameter is less than 0.016mm) surface directly coated metal layer;
3. coated metal layer thickness according to die adjustment, accurately can control metal layer thickness;
4. coated metal layer and wire annealing carry out simultaneously, improve micro-fine wire working (machining) efficiency;
5. no longer pass through further Wire Drawing after wire rod coating, ensure that coating uniformity.
Accompanying drawing explanation
Fig. 1 is the structural representation of the direct coated metal layer equipment in micro-fine wire of the present invention surface.
Fig. 2 is the vertical view of the mould of the direct coated metal layer equipment in micro-fine wire of the present invention surface.
Fig. 3 is the sectional view of the mould of the direct coated metal layer equipment in micro-fine wire of the present invention surface.
Wherein, 1, guide wheel; 2, quartz glass tube; 3, heating tube; 4, annealing casing; 5, winding system; 6, paying off system; 7, micro pump; 8, thrust-augmenting nozzle; 9, mold base; 10, mould; 11, casing is dried; 12, angular displacement sensor; 13, collecting hood; 14, axial fan; 15, supporting seat; 16, core rod; 17, mold; 18, inlet region; 19, die hole; 20, infusion hole; 21, outlet area.
Embodiment
Describe the specific embodiment of the present invention in detail below in conjunction with accompanying drawing, the content of embodiment is not as the restriction to protection content of the present invention.
The present invention relates to a kind of micro-fine wire surface directly coated metal layer equipment and working method, by described Apparatus and method for, can directly to micro-fine wire Coating metal level, eliminate electrochemical plating and the pollution of electroless plating method to environment and the harm to operator, fine and that overlay coating thickness is controlled fine surface metal plating layer wire rod can be obtained.
As shown in Figures 1 to 3, micro-fine wire surface of the present invention directly coated metal layer equipment comprises take-up and pay-off device, heating unit, coater, tenslator and waste gas collection device, wherein, take-up and pay-off device comprises winding system 5, paying off system 6 and some guide wheels 1, winding system 5 and paying off system 6 are arranged on heating unit bottom, winding system 5, paying off system 6 are initiatively winding system and active release wire system, and paying off system 6 to be positioned at below winding system 5 and to adopt servomotor as driving.Described heating unit comprises quartz glass tube 2, heating tube 3, two annealing casings 4 and an oven dry casing 11, described annealing casing 4, oven dry casing 11 vertical direction are placed, and two annealing casings 4 lay respectively at oven dry casing 11 both sides, be symmetric, quartz glass tube 2 is placed on annealing casing 4 and dries in the heating tube 3 at casing 11 center, and supported by supporting seat 15, described quartz glass tube 2 freely can take out from top, annealing casing 4, oven dry casing 11 can be tilted during taking-up, avoid silica tube to touch article above equipment.Annealing casing 4 and the heating tube 3 of drying in casing 11 adopt three sections of type of heating heating, and every section of heating power can independently control.Described coater comprises mold base 9, mould 10, thrust-augmenting nozzle 8 and micro pump 7, micro pump 7 is connected with mould 10 by thrust-augmenting nozzle 8, the aperture diameter of mould 10 is greater than processing gauge or diameter of wire 4-5 micron, and be fixed in mold base 9 by reed, coater is fixed on heating unit bottom, as preferably, coater can before and after, orientation, left and right four regulates, guarantee to dry silica tube 2 center superposition in casing 11 heating tube 3 in mould 10 center and heating unit in coater, and semiconductor chilling plate is bonded in mold base 9 by bonding mode, make mold base temperature between 20 DEG C-25 DEG C.Described tenslator comprises angular displacement sensor 13 and guide wheel 1, tenslator is arranged on above annealing casing 4, and guarantee that wire rod is positioned at oven dry casing 11 silica tube, annealing casing 4 silica tube 2 center by adjustment guide wheel 1, it is 0.1g that the angular displacement sensor in tenslator controls tension force precision.Described waste gas collection device comprises collecting hood 13 and axial fan 14, and waste gas collection device is positioned at heating unit top, to realize gas sampling.
The first working method of the direct coated metal layer equipment in micro-fine wire surface of the present invention is as follows:
A () connects the infusion hole 20 of micro pump 7 and mould 10 by thrust-augmenting nozzle 8;
(b) by the copper cash to be processed of diameter 0.02mm by paying off system 6 through guide wheel 1 perpendicular through the inlet region 18 of mould 10, die hole 19 and outlet area 21, mould 10 aperture is 0.024mm, copper cash is by drying the silica tube 2 in casing 11 heating tube 3, the temperature of heating tube is 250 DEG C, then the angular displacement sensor 13 in tenslator and guide wheel 1 enter the silica tube 2 in annealing casing 4 heating tube 3, the temperature of heating tube is 300 DEG C, eventually passes guide wheel 1 rolling on winding system 5;
C () opens micro pump 7,0.1ml liquid nano silver is injected mould 10 by thrust-augmenting nozzle 8, and mold base 9 temperature is 20 DEG C, after liquid nano silver has injected, and opening device, liquid nano silver flow is 0.01ml/ minute;
D the tension range of () setting tenslator is 0.5g, wire rod process velocity is 50m/ minute.
The second working method of the direct coated metal layer equipment in micro-fine wire surface of the present invention is as follows:
A () connects the infusion hole 20 of micro pump 7 and mould 10 by thrust-augmenting nozzle 8;
(b) by the copper cash to be processed of diameter 0.025mm by paying off system 6 through guide wheel 1 perpendicular through the inlet region 18 of mould 10, die hole 19 and outlet area 21, mould 10 aperture is 0.030mm, copper cash is by drying the silica tube 2 in casing 11 heating tube 3, the temperature of heating tube is 450 DEG C, then the angular displacement sensor 12 in tenslator and guide wheel 1 enter the silica tube 2 in annealing casing 4 heating tube 3, the temperature of heating tube is 500 DEG C, eventually passes guide wheel 1 rolling on winding system 5;
C () opens micro pump 7,0.3ml liquid nano gold is injected mould 10 by thrust-augmenting nozzle 8, and mold base 9 temperature is 22 DEG C, after liquid nano gold has injected, and opening device, liquid nano silver flow is 0.02ml/ minute;
D the tension range of () setting tenslator is 2.5g, wire rod process velocity is 100m/ minute.
The third working method of the direct coated metal layer equipment in micro-fine wire surface of the present invention is as follows:
A () connects the infusion hole 20 of micro pump 7 and mould 10 by thrust-augmenting nozzle 8;
(b) by the copper cash to be processed of diameter 0.030mm by paying off system 6 through guide wheel 1 perpendicular through the inlet region 18 of mould 10, die hole 19 and outlet area 21, mould 10 aperture is 0.035mm, copper cash is by drying the silica tube 2 in casing 11 heating tube 3, the temperature of heating tube is 550 DEG C, then the angular displacement sensor 13 in tenslator and guide wheel 1 enter the silica tube 2 in annealing casing 4 heating tube 3, the temperature of heating tube is 600 DEG C, eventually passes guide wheel 1 rolling on winding system 5;
C () opens micro pump 7,0.5ml liquid nano palladium is injected mould 10 by thrust-augmenting nozzle 8, and mold base 9 temperature is 25 DEG C, after liquid nano palladium has injected, and opening device, liquid nano palladium flow is 0.05ml/ minute;
D the tension range of () setting tenslator is 5g, wire rod process velocity is 120m/ minute.
4th kind of working method of the direct coated metal layer equipment in micro-fine wire surface of the present invention is as follows:
A () connects the infusion hole 20 of micro pump 7 and mould 10 by thrust-augmenting nozzle 8;
(b) by the to be processed silver-colored line of diameter 0.015mm by paying off system 6 through guide wheel 1 perpendicular through the inlet region 18 of mould 10, die hole 19 and outlet area 21, mould 10 aperture is 0.019mm, copper cash is by drying the silica tube 2 in casing 11 heating tube 3, the temperature of heating tube is 250 DEG C, then the angular displacement sensor 12 in tenslator and guide wheel 1 enter the silica tube 2 in annealing casing 4 heating tube 3, the temperature of heating tube is 350 DEG C, eventually passes guide wheel 1 rolling on winding system 5;
C () opens micro pump 7,0.1ml liquid nano gold is injected mould 10 by thrust-augmenting nozzle 8, and mold base 9 temperature is 20 DEG C, after liquid nano gold has injected, and opening device, liquid nano gold flux is 0.01ml/ minute;
D the tension range of () setting tenslator is 0.5g, wire rod process velocity is 50m/ minute.
Micro-fine wire of the present invention surface directly coated metal layer equipment and working method can avoid traditional electroplating industry and electroless plating industry to problem in the pollution of environment, production safety and wire production process, the problem includes: the problem such as easily to break, ensure that wire surface metal plating is even, achieve wire surface thickness of coating controlled, and can realize at the upper direct coating of superfine wire rod (wire diameter < 0.016mm), solve the difficult problem that traditional technology can not produce superfine coating wire rod, for the processing of micro-fine wire and use provide equipment guarantee.
The content of embodiment is understood for the ease of those skilled in the art and uses the present invention and describe, and does not form restriction the present invention being protected to content.Those skilled in the art, after having read content of the present invention, can carry out suitable amendment to the present invention.Protection content of the present invention is as the criterion with the content of claim.When not departing from flesh and blood and the protection domain of claim, the various amendments carried out the present invention, change and replacement etc. are all within protection scope of the present invention.

Claims (10)

1. a micro-fine wire surface directly coated metal layer equipment, comprise take-up and pay-off device, heating unit, coater, tenslator and waste gas collection device, it is characterized in that: described take-up and pay-off device comprises winding system (5), paying off system (6) and guide wheel (1); Described heating unit comprises quartz glass tube (2), heating tube (3), two annealing casings (4) and dries casing (11), described annealing casing (4) and oven dry casing (11) are all vertically placed, and two annealing casings (4) are symmetricly set on the left and right sides of drying casing (11), quartz glass tube (2) is placed on annealing casing (4) and dries casing (11) center, and is supported by supporting seat (15); Described coater comprises mold base (9), mould (10), thrust-augmenting nozzle (8) and micro pump (7), micro pump (7) is connected with mould (10) by thrust-augmenting nozzle (8), and in coater, the center of mould (10) and heating unit dry the center superposition of casing (11); Described tenslator comprises angular displacement sensor (12), and tenslator is positioned at annealing casing (4) top, and described waste gas collection device comprises collecting hood (13) and axial fan (14), and waste gas collection device is positioned at heating unit top.
2. micro-fine wire surface directly coated metal layer equipment as claimed in claim 1, it is characterized in that: the winding system (5) in described take-up and pay-off device, paying off system (6) are active winding system and active release wire system, adopt servomotor as driving, and paying off system (6) is positioned at winding system (5) below.
3. micro-fine wire surface directly coated metal layer equipment as claimed in claim 1, is characterized in that: the annealing casing (4) in described heating unit, dry casing (11) and adopt three sections of type of heating heating, and every section of heating power all can independently control.
4. micro-fine wire surface directly coated metal layer equipment as claimed in claim 1, is characterized in that: the annealing casing (4) in described heating unit, dry casing (11) and can manually tilt, after tilting and the angle of vertical direction higher than 30 °.
5. micro-fine wire surface directly coated metal layer equipment as claimed in claim 1, it is characterized in that: described coater can regulate in orientation, all around four, and the mold base (9) in coater is provided with thermostat, ensure that mold base temperature is at 20 DEG C-25 DEG C.
6. micro-fine wire surface directly coated metal layer equipment as claimed in claim 1, it is characterized in that: the mould (10) in described coater is made up of mold (17), inlet region (18), die hole (19), infusion hole (20), outlet area (21) and core rod (16), die hole (19) diameter is greater than processing gauge or diameter of wire 4-5 micron, and is fixed in mold base (9) by reed.
7. micro-fine wire surface directly coated metal layer equipment as claimed in claim 1, is characterized in that: the control tension force precision of the angular displacement sensor (13) in described tenslator is not less than 0.1g.
8. micro-fine wire surface directly coated metal layer equipment as claimed in claim 1, is characterized in that: described working method is as follows:
Micro pump (7) and mould (10) is connected by thrust-augmenting nozzle (8);
Wire rod to be processed by paying off system through guide wheel (1) perpendicular through mould (10), again by drying the quartz glass tube (2) in casing (11), then the angular displacement sensor (12) in guide wheel (1) and tenslator enters annealing casing (4), eventually passes guide wheel (1) rolling on winding system (5);
Open micro pump (7), 0.1-0.5ml liquid nano metal is injected mould (10) by thrust-augmenting nozzle (8), and liquid nano metal flow is 0.01-0.1ml/ minute;
Tension value in adjustment tenslator, after liquid nano metal has injected, opening device.
9. the working method of the direct coated metal layer equipment in micro-fine wire surface as claimed in claim 8, is characterized in that: in described oven dry casing (11), heating tube (3) temperature range is 250 DEG C-550 DEG C; In described annealing casing (4), heating tube (3) temperature range is 300 DEG C-600 DEG C.
10. the working method of the direct coated metal layer equipment in micro-fine wire surface as claimed in claim 8, is characterized in that: the tension range of described tenslator is that 0.1-20g and/or described wire rod process velocity are not less than 20m/ minute.
CN201410530224.3A 2014-10-10 2014-10-10 A kind of micro-fine wire surface direct coated metal layer equipment and processing method Active CN104328372B (en)

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CN106622919A (en) * 2016-12-28 2017-05-10 河南理工大学 Metal strip surface roughness increasing equipment and machining method
CN107916325A (en) * 2017-11-29 2018-04-17 苏州金钜松机电有限公司 A kind of annealing furnace of heating for multiple times
CN108520807A (en) * 2018-03-21 2018-09-11 江苏通光电子线缆股份有限公司 A kind of electric wire sheath application system and its painting method
CN114130603A (en) * 2021-12-07 2022-03-04 江苏泰力松新材料有限公司 Single-side coating device and coating method thereof

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DE10331608A1 (en) * 2003-07-12 2005-01-27 Hew-Kabel/Cdt Gmbh & Co. Kg Process for coating and / or partially overmolding flexible elongate material
WO2009119044A1 (en) * 2008-03-24 2009-10-01 株式会社クボタ Pipe provided with corrosion prevention layer on the outside surface, process for production of the same, and process for production of alloy wires to be used for corrosion prevention of outside surface of the pipe
CN102658606A (en) * 2012-05-11 2012-09-12 香港雅诚国际有限公司 Manufacturing method of resin diamond wire
CN203381052U (en) * 2013-06-20 2014-01-08 开封恒锐新金刚石制品有限公司 Resin-diamond wire producing machine
CN103753721A (en) * 2014-01-21 2014-04-30 开封恒锐新金刚石制品有限公司 Method for producing resin diamond wire through metal powder doped with resin sizing agent

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Publication number Priority date Publication date Assignee Title
CN106622919A (en) * 2016-12-28 2017-05-10 河南理工大学 Metal strip surface roughness increasing equipment and machining method
CN106622919B (en) * 2016-12-28 2020-04-28 河南理工大学 Metal strip surface roughness increasing equipment and processing method
CN107916325A (en) * 2017-11-29 2018-04-17 苏州金钜松机电有限公司 A kind of annealing furnace of heating for multiple times
CN108520807A (en) * 2018-03-21 2018-09-11 江苏通光电子线缆股份有限公司 A kind of electric wire sheath application system and its painting method
CN108520807B (en) * 2018-03-21 2023-09-29 江苏通光电子线缆股份有限公司 Wire sheath coating system and coating method thereof
CN114130603A (en) * 2021-12-07 2022-03-04 江苏泰力松新材料有限公司 Single-side coating device and coating method thereof

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