CN104327363B - A kind of wire-insulating compound that can be used for hygrothermal environment - Google Patents
A kind of wire-insulating compound that can be used for hygrothermal environment Download PDFInfo
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- CN104327363B CN104327363B CN201410696414.2A CN201410696414A CN104327363B CN 104327363 B CN104327363 B CN 104327363B CN 201410696414 A CN201410696414 A CN 201410696414A CN 104327363 B CN104327363 B CN 104327363B
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- powder
- bisphenol
- epoxy resin
- type epoxy
- kaolin
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 39
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 27
- -1 polyethylene Polymers 0.000 claims abstract description 27
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000005995 Aluminium silicate Substances 0.000 claims abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 13
- 235000012211 aluminium silicate Nutrition 0.000 claims abstract description 13
- 229960000892 attapulgite Drugs 0.000 claims abstract description 13
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 13
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052625 palygorskite Inorganic materials 0.000 claims abstract description 13
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 13
- 235000010413 sodium alginate Nutrition 0.000 claims abstract description 13
- 239000000661 sodium alginate Substances 0.000 claims abstract description 13
- 229940005550 sodium alginate Drugs 0.000 claims abstract description 13
- 239000004575 stone Substances 0.000 claims abstract description 13
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims abstract description 9
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 9
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 239000004698 Polyethylene Substances 0.000 claims abstract description 9
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 9
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 9
- 239000000194 fatty acid Substances 0.000 claims abstract description 9
- 229930195729 fatty acid Natural products 0.000 claims abstract description 9
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 9
- 239000012774 insulation material Substances 0.000 claims abstract description 9
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 9
- 229920000573 polyethylene Polymers 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- 239000012467 final product Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 10
- AHJKRLASYNVKDZ-UHFFFAOYSA-N DDD Chemical compound C=1C=C(Cl)C=CC=1C(C(Cl)Cl)C1=CC=C(Cl)C=C1 AHJKRLASYNVKDZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000000845 anti-microbial effect Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010017533 Fungal infection Diseases 0.000 description 1
- 208000031888 Mycoses Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000000843 anti-fungal effect Effects 0.000 description 1
- 229940121375 antifungal agent Drugs 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000003115 biocidal effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Insulated Conductors (AREA)
Abstract
The invention belongs to electric power Material Field, disclose a kind of wire-insulating compound that can be used for hygrothermal environment, it is prepared from by following raw material, polyethylene, polrvinyl chloride, bisphenol A type epoxy resin, bisphenol f type epoxy resin, γ aminopropyl triethoxysilane, octyl ester of epoxy fatty acid, attapulgite, polydimethylsiloxane, dicyclopentadiene, TDE, graphite powder, aluminum nitride powder, carborundum powder, Kaolin, sodium alginate and Muscovitum stone powder.Insulation Material of the present invention can use under hygrothermal environment for a long time, and keeps preferable hot strength, elongation at break and insulating properties.
Description
Technical field
The invention belongs to electric power Material Field, be specifically related to a kind of wire-insulating compound that can be used for hygrothermal environment.
Background technology
Electric wire is typically to be formed by several or several groups of wires (often organizing at least two) are stranded around center, is shaped like rope, simultaneously outer layer cover height insulating barrier.Electric wire has power cord, controls electric wire, compensating wire, shielding wire, high temperature electric wire, computer electric wire, signal wires, coaxial cord, fire-resistant wires, wire for ship, mining electric wire, aluminum alloy wire etc..They are all made up of sub-thread or stranded conductor and insulating barrier, are used for connecting circuit, electrical equipment etc..
Wire insulation outer layer, mainly for the protection of inner conductor, uses PVC electric wire material the most mostly, and it is based on polyvinyl chloride resin, adds many component mixing materials of various compounding ingredient.Owing to its mechanical performance is superior, against weather is good, there are excellent electrical insulation properties, handling ease and the advantage such as with low cost, are therefore widely used in insulation and the jacket material of electric wire.But electric wire materials in the market yet suffers from defect, and some moisture effects are poor, it is susceptible to electric leakage, some antimildew and antibacterial effects are bad, it is impossible to be applied in hygrothermal environment for a long time, and people are when using electric wire, it is very easy to fungal infection, affects the health of people.
Summary of the invention
Present invention aim to address the deficiency that prior art exists, it is provided that a kind of wire-insulating compound that can be used for hygrothermal environment；Electric wire materials prepared by the present invention not only possesses preferable insulating properties and mechanical performance, is also equipped with certain mildew resistant moistureproof anti-microbial property, it is possible to be applied to for a long time in hygrothermal environment.
In order to realize foregoing invention purpose, the present invention is realized by case by following technical side:
A kind of wire-insulating compound that can be used for hygrothermal environment, it is prepared from by the raw material of following weight parts:
Polyethylene 80-90 part, polrvinyl chloride 30-40 part, bisphenol A type epoxy resin 13-15 part, bisphenol f type epoxy resin 13-15 part, gamma-aminopropyl-triethoxy-silane 10-12 part, octyl ester of epoxy fatty acid 8-10 part, attapulgite 6-7 part, polydimethylsiloxane 5-6 part, dicyclopentadiene 5-6 part, TDE 4-5 part, graphite powder 3-4 part, aluminum nitride powder 2-3 part, carborundum powder 1-2 part, Kaolin 1-2 part, sodium alginate 1-2 part, Muscovitum stone powder 1-2 part；
Described attapulgite, graphite powder, aluminum nitride powder, carborundum powder, Kaolin, sodium alginate, and the size controlling of Muscovitum stone powder is more than 200 mesh；
The invention also discloses the preparation method of above-mentioned Insulation Material, comprise the steps:
Step 1): weigh above-mentioned each raw material for standby according to weight portion；
Step 2): by attapulgite, graphite powder, aluminum nitride powder, carborundum powder, Kaolin, sodium alginate, and Muscovitum stone powder are put in blender, stir, then putting in retort, the temperature of retort controls at about 80 DEG C, and insulation reaction 10min obtains modifying agent；
Step 3) is by step 2) modifying agent that obtains, polyethylene, polrvinyl chloride, bisphenol A type epoxy resin, bisphenol f type epoxy resin, gamma-aminopropyl-triethoxy-silane, octyl ester of epoxy fatty acid, polydimethylsiloxane, dicyclopentadiene and TDE are put in centrifuge successively, 1000 turns/min centrifugal mixer 5 minutes, after mix homogeneously, enter double screw extruder and be squeezed into molten condition, be expressed in injection machine after batch mixing is completely melted, injection mo(u)lding and get final product at 300 DEG C.
The wire of the present invention can select the wire of routine, such as copper conductor or aluminum conductor etc. as required.
The beneficial effect that the present invention obtains specifically includes that
Insulation Material of the present invention possesses preferable insulating properties and mechanical performance, is also equipped with certain mildew resistant moistureproof anti-microbial property, it is possible to be applied to for a long time in hygrothermal environment, do not interfere with the health of people, hot strength and elongation at break change are little, and service life is long, possesses preferable security performance；The present invention, by adding multiple auxiliary material auxiliary agent, improves the defect of some materials itself, improves moisture-proof, antibiotic performance and mechanical performance；Preparation technology of the present invention is simple, and material combination is reasonable, with low cost, is suitable for large-scale industrial production.
Detailed description of the invention
For the technical scheme making those skilled in the art be more fully understood that in the application, below in conjunction with the application specific embodiment, the present invention is more clearly and completely described, it is clear that, described embodiment is only some embodiments of the present application rather than whole embodiments.Based on the embodiment in the application, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, all should belong to the scope of protection of the invention.
Embodiment 1
A kind of wire-insulating compound that can be used for hygrothermal environment, it is prepared from by the raw material of following weight parts:
Polyethylene 80 parts, polrvinyl chloride 30 parts, bisphenol A type epoxy resin 13 parts, bisphenol f type epoxy resin 13 parts, gamma-aminopropyl-triethoxy-silane 10 parts, octyl ester of epoxy fatty acid 8 parts, attapulgite 6 parts, polydimethylsiloxane 5 parts, dicyclopentadiene 5 parts, TDE 4 parts, graphite powder 3 parts, aluminum nitride powder 2 parts, carborundum powder 1 part, Kaolin 1 part, sodium alginate 1 part, Muscovitum stone powder 1 part；
Described attapulgite, graphite powder, aluminum nitride powder, carborundum powder, Kaolin, sodium alginate, and the size controlling of Muscovitum stone powder is at 200 mesh；
The preparation method of above-mentioned Insulation Material comprises the steps:
Step 1): weigh above-mentioned each raw material for standby according to weight portion；
Step 2): by attapulgite, graphite powder, aluminum nitride powder, carborundum powder, Kaolin, sodium alginate, and Muscovitum stone powder are put in blender, stir, then putting in retort, the temperature of retort controls at 80 DEG C, and insulation reaction 10min obtains modifying agent；
Step 3) is by step 2) modifying agent that obtains, polyethylene, polrvinyl chloride, bisphenol A type epoxy resin, bisphenol f type epoxy resin, gamma-aminopropyl-triethoxy-silane, octyl ester of epoxy fatty acid, polydimethylsiloxane, dicyclopentadiene and TDE are put in centrifuge successively, 1000 turns/min centrifugal mixer 5 minutes, after mix homogeneously, enter double screw extruder and be squeezed into molten condition, be expressed in injection machine after batch mixing is completely melted, injection mo(u)lding and get final product at 300 DEG C.
Embodiment 2
A kind of wire-insulating compound that can be used for hygrothermal environment, it is prepared from by the raw material of following weight parts:
Polyethylene 90 parts, polrvinyl chloride 40 parts, bisphenol A type epoxy resin 15 parts, bisphenol f type epoxy resin 15 parts, gamma-aminopropyl-triethoxy-silane 12 parts, octyl ester of epoxy fatty acid 10 parts, attapulgite 7 parts, polydimethylsiloxane 6 parts, dicyclopentadiene 6 parts, TDE 5 parts, graphite powder 4 parts, aluminum nitride powder 3 parts, carborundum powder 2 parts, Kaolin 2 parts, sodium alginate 2 parts, Muscovitum stone powder 2 parts；
Described attapulgite, graphite powder, aluminum nitride powder, carborundum powder, Kaolin, sodium alginate, and the size controlling of Muscovitum stone powder is at 300 mesh；
The preparation method of above-mentioned Insulation Material comprises the steps:
Step 1): weigh above-mentioned each raw material for standby according to weight portion；
Step 2): by attapulgite, graphite powder, aluminum nitride powder, carborundum powder, Kaolin, sodium alginate, and Muscovitum stone powder are put in blender, stir, then putting in retort, the temperature of retort controls at 80 DEG C, and insulation reaction 10min obtains modifying agent；
Step 3) is by step 2) modifying agent that obtains, polyethylene, polrvinyl chloride, bisphenol A type epoxy resin, bisphenol f type epoxy resin, gamma-aminopropyl-triethoxy-silane, octyl ester of epoxy fatty acid, polydimethylsiloxane, dicyclopentadiene and TDE are put in centrifuge successively, 1000 turns/min centrifugal mixer 5 minutes, after mix homogeneously, enter double screw extruder and be squeezed into molten condition, be expressed in injection machine after batch mixing is completely melted, injection mo(u)lding and get final product at 300 DEG C.
Embodiment 3
The performance test of wire-insulating compound prepared by the present invention:
The various aspects of performance of the cable insulating material of embodiment 1 and embodiment 2 preparation is preferable, and concrete testing result can be shown in Table 1, and wherein Insulation Material layer thickness is 2mm:
Table 1
| Performance indications | Testing standard | Desired value | Embodiment 1 | Embodiment 2 |
| Hot strength Mpa | GB/T1040.3-2006 | 12.5 | 18.9 | 19.3 |
| Elongation at break % | GB/T1040.3-2006 | 400 | 589 | 583 |
| Resisting environmental stress and cracking F0 (h) | GB/T2951.41-2008 | 500 | 571 | 577 |
| Oxygen index (OI) | GB/T2406-1993 | 26 | 29 | 30 |
| Antifungal is tested | GB/T2403-1999 | 0 grade | 0 grade | 0 grade |
| Specific insulation × 10-15(Ω cm) | GB/T 3048.2-2007 | 2.0 | 2.51 | 2.49 |
The present invention also have detected at 100 DEG C, 240h baking oven hydrothermal aging test (with reference to GB/T2951.12-2008), and the hot strength of the cable insulating material of embodiment 1 and embodiment 2 preparation reduces 3.5% and 4.0% respectively；Elongation at break reduces 10.2% and 10.5% respectively；Insulating properties and oxygen index (OI) do not have significant change；Comply fully with standard.
After testing, each parameter all meets index to wire-insulating compound prepared by Example 1 and Example 2 of the present invention, it is possible to uses for a long time under hygrothermal environment, and keeps preferable hot strength, elongation at break and insulating properties；Insulation Material of the present invention can suppress mycete to breed effectively, it is to avoid people contact mycete and unhealthful in use.
Above in association with specific embodiment, invention has been described, it will be appreciated by those skilled in the art that these descriptions are all exemplary, is not limiting the scope of the invention.The present invention can be made various variants and modifications according to spirit and principles of the present invention by those skilled in the art, and these variants and modifications are also within the scope of the invention.
Claims (1)
1. the wire-insulating compound that can be used for hygrothermal environment, it is characterised in that described Insulation Material is prepared from by the raw material of following weight parts:
Polyethylene 80-90 part, polrvinyl chloride 30-40 part, bisphenol A type epoxy resin 13-15 part, bisphenol f type epoxy resin 13-15 part, gamma-aminopropyl-triethoxy-silane 10-12 part, octyl ester of epoxy fatty acid 8-10 part, attapulgite 6-7 part, polydimethylsiloxane 5-6 part, dicyclopentadiene 5-6 part, TDE 4-5 part, graphite powder 3-4 part, aluminum nitride powder 2-3 part, carborundum powder 1-2 part, Kaolin 1-2 part, sodium alginate 1-2 part, Muscovitum stone powder 1-2 part；
Described attapulgite, graphite powder, aluminum nitride powder, carborundum powder, Kaolin, sodium alginate, and the particle diameter of Muscovitum stone powder all control more than 200 mesh；
The preparation method of described Insulation Material comprises the steps:
Step 1): weigh each raw material for standby according to weight portion；
Step 2): by attapulgite, graphite powder, aluminum nitride powder, carborundum powder, Kaolin, sodium alginate, and Muscovitum stone powder are put in blender, stir, then putting in retort, the temperature of retort controls at 80 DEG C, and insulation reaction 10min obtains modifying agent；
Step 3) is by step 2) modifying agent that obtains, polyethylene, polrvinyl chloride, bisphenol A type epoxy resin, bisphenol f type epoxy resin, gamma-aminopropyl-triethoxy-silane, octyl ester of epoxy fatty acid, polydimethylsiloxane, dicyclopentadiene and TDE are put in centrifuge successively, 1000 turns/min centrifugal mixer 5 minutes, after mix homogeneously, enter double screw extruder and be squeezed into molten condition, be then expressed in injection machine, injection mo(u)lding and get final product at 300 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410696414.2A CN104327363B (en) | 2014-11-27 | 2014-11-27 | A kind of wire-insulating compound that can be used for hygrothermal environment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410696414.2A CN104327363B (en) | 2014-11-27 | 2014-11-27 | A kind of wire-insulating compound that can be used for hygrothermal environment |
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| CN104327363A CN104327363A (en) | 2015-02-04 |
| CN104327363B true CN104327363B (en) | 2016-09-21 |
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| CN105924845A (en) * | 2016-06-13 | 2016-09-07 | 深圳市红岩电控设备有限公司 | Efficient and energy-saving environment-friendly graphene power distribution cabinet |
| CN107936342A (en) * | 2017-11-30 | 2018-04-20 | 钟永松 | It is a kind of that there is the CABLE MATERIALS of antimildew and antibacterial |
| CN109233097A (en) * | 2018-08-21 | 2019-01-18 | 浙江亚格电子科技有限公司 | Track shields door pillar wrapper sheet component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103275415A (en) * | 2013-05-13 | 2013-09-04 | 浙江飞龙管业有限公司 | Special Half-type communication cable protection sleeve for seafloor |
| CN104017333A (en) * | 2014-06-18 | 2014-09-03 | 国家电网公司 | Cold-resistant and high-temperature resistant cable material and preparation method thereof |
| CN104151746A (en) * | 2014-08-12 | 2014-11-19 | 国家电网公司 | environment-friendly fire-retardant insulation material and application thereof in electric cables |
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| JP2898859B2 (en) * | 1993-09-29 | 1999-06-02 | 住友ベークライト株式会社 | Flame retardant resin composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103275415A (en) * | 2013-05-13 | 2013-09-04 | 浙江飞龙管业有限公司 | Special Half-type communication cable protection sleeve for seafloor |
| CN104017333A (en) * | 2014-06-18 | 2014-09-03 | 国家电网公司 | Cold-resistant and high-temperature resistant cable material and preparation method thereof |
| CN104151746A (en) * | 2014-08-12 | 2014-11-19 | 国家电网公司 | environment-friendly fire-retardant insulation material and application thereof in electric cables |
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