CN104320957A - Cooling system for electronic equipment - Google Patents
Cooling system for electronic equipment Download PDFInfo
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- CN104320957A CN104320957A CN201410594101.6A CN201410594101A CN104320957A CN 104320957 A CN104320957 A CN 104320957A CN 201410594101 A CN201410594101 A CN 201410594101A CN 104320957 A CN104320957 A CN 104320957A
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- electronic equipment
- surface cooler
- dissipating heat
- heat system
- heat exchanger
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Abstract
The invention provides a cooling system for electronic equipment. According to the embodiment of the cooling system for the electronic equipment, a surface air cooler is arranged on a supporting frame, a secondary side is further arranged to be connected with the surface air cooler, a primary side is arranged to be connected with a heat exchanger of a water source device; in this way, the surface air cooler can absorb heat generated by the electronic equipment through refrigerant materials in the surface air cooler, the refrigerant materials can be converted into the gas state, and then the heat exchanger utilizes water provided by the water source device to carry out refrigeration on the refrigerant materials of the gas state in the surface air cooler. Thus, heat exchange can be carried out on heat generated by the electronic equipment through the surface air cooler, and the purpose of cooling is achieved; due to the fact that an extra driving device is not needed, and energy consumption is lowered.
Description
[technical field]
The present invention relates to heat dissipation technology, particularly relate to a kind of electronic equipment dissipating heat system.
[background technology]
At electronic equipment such as, in the use procedure of the computer equipments such as main frame, peripheral hardware, server, switch, optical transmitter and receiver and motivational guarantee equipment, the chip that electronic equipment internal is arranged operationally can produce a large amount of heats, cause the temperature of its operational environment to rise, be unfavorable for the normal work of electronic equipment.In order to address this problem, the heat to electronic equipment produces is needed to carry out cooling processing.In prior art, can adopt in the machine room at electronic equipment place, precision air conditioner is installed, to produce cold wind and the air inlet being transported to electronic equipment cools.
But this cooling system of precision air conditioner, energy ezpenditure is comparatively large, cannot meet the requirement of environmental protection.
[summary of the invention]
Many aspects of the present invention provide a kind of electronic equipment dissipating heat system, in order to reduce the energy ezpenditure of cooling system.
An aspect of of the present present invention, provides a kind of electronic equipment dissipating heat system, comprising:
Support frame;
Surface cooler, is arranged on described support frame, for utilizing cooling substance wherein, absorbing the heat that electronic equipment produces, changing into gaseous state to make described cooling substance;
Heat exchanger, its secondary side connects described surface cooler, and its primary side connects water source device, and the water provided for utilizing described water source device carries out refrigeration process to the cooling substance of gaseous state in described surface cooler.
Aspect as above and arbitrary possible implementation, provide a kind of implementation further, and described cooling substance comprises solid-state cooling substance or liquid refrigeration material.
Aspect as above and arbitrary possible implementation, provide a kind of implementation further, the windward side of described surface cooler arranges fan.
Aspect as above and arbitrary possible implementation, provide a kind of implementation further, the lee face of described surface cooler arranges fan.
Aspect as above and arbitrary possible implementation, provide a kind of implementation further, described surface cooler is positioned at the enclosure top of electronic equipment.
Aspect as above and arbitrary possible implementation, provide a kind of implementation further, described surface cooler is positioned at bottom the rack of electronic equipment.
Aspect as above and arbitrary possible implementation, provide a kind of implementation further, and described electronic equipment dissipating heat system comprises one or more described surface cooler.
Aspect as above and arbitrary possible implementation, provide a kind of implementation further, and each surface cooler connects a heat exchanger.
Aspect as above and arbitrary possible implementation, provide a kind of implementation further, and at least two surface coolers connect a heat exchanger.
Aspect as above and arbitrary possible implementation, provide a kind of implementation further, and the difference of the height of described heat exchanger and the height of described surface cooler is more than or equal to the height threshold pre-set.
As shown from the above technical solution, the embodiment of the present invention is by arranging surface cooler on the support frame, and then secondary side is set connects described surface cooler, primary side connects the heat exchanger of water source device, make surface cooler can utilize cooling substance wherein, absorb the heat that electronic equipment produces, gaseous state is changed into make described cooling substance, and then the water utilizing described water source device to provide by heat exchanger carries out refrigeration process to the cooling substance of gaseous state in described surface cooler, like this, the heat that electronic equipment produces carries out heat exchange through surface cooler, to realize the object cooled, due to without the need to extra drive unit, thus reduce energy ezpenditure.
In addition, adopt technical scheme provided by the invention, structure is simple, and flexible arrangement, thus improves installation effectiveness.
In addition, adopt technical scheme provided by the invention, owing to adopting cooling substance in surface cooler, and there is not water, make cooling system provided by the present invention can not bring water logging risk, this improves the safety and reliability of cooling system.
In addition, adopt technical scheme provided by the invention, because the difference of the height of heat exchanger and the height of surface cooler is more than or equal to the height threshold pre-set, make the cooling substance in surface cooler that gravity assisted heat pipe principle can be utilized to circulate, without the need to extra drive unit, effectively energy ezpenditure can be reduced.
[accompanying drawing explanation]
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of the electronic equipment dissipating heat system that Fig. 1 provides for one embodiment of the invention;
The structural representation of the electronic equipment dissipating heat system that Fig. 2 provides for another embodiment of the present invention;
The structural representation of the electronic equipment dissipating heat system that Fig. 3 provides for another embodiment of the present invention;
The structural representation of the electronic equipment dissipating heat system that Fig. 4 provides for another embodiment of the present invention;
The structural representation of the electronic equipment dissipating heat system that Fig. 5 provides for another embodiment of the present invention;
The structural representation of the electronic equipment dissipating heat system that Fig. 6 provides for another embodiment of the present invention.
[embodiment]
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments whole obtained under creative work prerequisite, belong to the scope of protection of the invention.
In addition, term "and/or" herein, being only a kind of incidence relation describing affiliated partner, can there are three kinds of relations in expression, and such as, A and/or B, can represent: individualism A, exists A and B simultaneously, these three kinds of situations of individualism B.In addition, character "/" herein, general expression forward-backward correlation is to the relation liking a kind of "or".
The rack at electronic equipment place, is arranged in machine room, generally faces that electronic equipment heat generation density is high, the problem such as the insufficient space of rack and machine room.All the time, in order to meet the heat radiation or cooling requirement that machine room constantly rises, update and change its cooling system, but still there is local heat island problem in machine room inside, namely cold air directly mixes with hot-air.In order to address this problem, rationally form the air delivery path closed, can the heat-sinking capability of winding houses greatly, fully effectively use the space of rack and machine room.In prior art, can adopt two kinds of channel enclosed schemes, one is passage of heat closure solutions, and another kind is cold channel enclosed scheme.Particularly, the detailed description of passage of heat closure solutions and cold channel enclosed scheme see associated description of the prior art, can repeat no more herein.Technical scheme provided by the present invention, all applicable for two kinds of channel enclosed schemes, for passage of heat closure solutions, technical scheme provided by the present invention will be described in detail below.
The electronic equipment dissipating heat system that the present embodiment provides can comprise support frame 10, surface cooler 20 and heat exchanger 30.Wherein, in the machine room at electronic equipment 40 place, support frame 10 according to the size of the rack of electronic equipment and arrangement, can be arranged flexibly.
Such as, can be arranged on floor 50, as shown in Figure 1, in this mode, described surface cooler 20 can be positioned at the enclosure top of electronic equipment, or can also be arranged in the built on stilts region under floor 50, as shown in Figure 2, in this mode, described surface cooler 20 can be positioned at bottom the rack of electronic equipment.
It should be noted that, in the electronic equipment dissipating heat system shown in Fig. 2, in order to several air-vents being offered on maked somebody a mere figurehead floor 50, the hot-air produced with electronic device, by floor, being full of the whole closed passage of heat.
As depicted in figs. 1 and 2, described surface cooler 20, can be arranged on described support frame 10, for utilizing cooling substance wherein, absorbing the heat that electronic equipment produces, changing into gaseous state to make described cooling substance.Wherein, described cooling substance can solid-state cooling substance, or can also liquid refrigeration material, and such as, the cold-producing mediums such as R22, R134a, R410a or R407c, the present embodiment is not particularly limited this.
As depicted in figs. 1 and 2, heat exchanger 30, its secondary side 31 connects described surface cooler 20, and its primary side 32 connects water source device, and the water provided for utilizing described water source device 70 carries out refrigeration process to the cooling substance of gaseous state in described surface cooler 20.
Described heat exchanger 30, can be plate heat exchanger, or can also be double pipe heat exchanger, not be particularly limited in the present embodiment to this.To it should be noted that, the whole accompanying drawings provided in the present invention, be and be described for plate heat exchanger, but the concrete form of heat exchanger is not limited to plate heat exchanger.
The secondary side 31 of described heat exchanger 30, for the medium providing temperature high, as treated the cooling substance etc. of the gaseous state of heat exchange; The primary side 32 of described heat exchanger 30, for the medium providing temperature low, as water source device the water etc. that provides.
Particularly, described surface cooler 20 specifically can be connected to the secondary side 31 of heat exchanger 30 by pipeline.Be understandable that, pipeline can also arrange one or more valve, in order to control the circulation of cold-producing medium.Correspondingly, described water source device is specifically as follows a pipeline, can lead to chilled water in it.Be understandable that, chilled water pipeline can also arrange one or more valve, in order to control the open and close of chilled water.
Like this, the hot-air that electronic equipment produces, is discharged into the inside of the passage of heat via its rack, forms malleation to make the inside of the passage of heat.Under the effect of malleation, hot-air then can by the external leakage of surface cooler to the passage of heat.Hot-air carries out a heat exchange process in surface cooler, i.e. surface cooler cooling substance wherein, and the heat in the hot-air that absorption electronic equipment produces, changes into gaseous state to make described cooling substance.Like this, hot-air will be cooled to uniform temperature by surface cooler and become cold air, thus enters the cold passage of passage of heat outside.Electronic equipment from cold passage, will suck cold air again, to realize the object cooled, and then can control within normal range (NR) by the temperature of the operational environment of electronic equipment, to ensure the normal work of electronic equipment.
For surface cooler, the cooling substance of gaseous state enters heat exchanger from the secondary side of heat exchanger, by the water that the water source device that the primary side from heat exchanger enters provides, particularly chilled water, is condensed into liquid cooling substance.Liquid cooling substance then can utilize its flowable characteristic, flow back in refrigerator, so circulates.Due to without the need to extra drive unit, thus reduce energy ezpenditure.
Alternatively, in one of the present embodiment possible implementation, further fan can also be set in the windward side of described surface cooler 20 or lee face, as shown in Figure 3, like this, the flowing velocity of air can be accelerated, and then improve the heat exchange efficiency of surface cooler, thus improve the efficiency of cooling.
Further, the quantity of fan also can according to demand, be arranged flexibly.
Described surface cooler 20 specifically can vertically be arranged on described support frame 10, as shown in Figure 1, Figure 2 and Figure 3, or predetermined angle can also be become to be inclined on described support frame 10 with ground, as shown in Figure 4, or can also be set in parallel on described support frame 10, as shown in Figure 6, the present embodiment is not particularly limited this.
Alternatively, in one of the present embodiment possible implementation, described electronic equipment dissipating heat system can comprise one or more described surface cooler 20.Its concrete quantity according to demand, can carry out flexible configuration.Such as, 6 public surface coolers of rack, as shown in Figure 5.
Particularly, each surface cooler 20 can connect a heat exchanger 30, or jointly can also connect a heat exchanger 30 by least two surface coolers 20, and the present embodiment is not particularly limited this.
Alternatively, in one of the present embodiment possible implementation, the difference of the height of described heat exchanger 30 and the height of described surface cooler 20 can be more than or equal to the height threshold pre-set.Like this, can make the cooling substance in surface cooler that gravity assisted heat pipe principle can be utilized to circulate, without the need to extra drive unit, effectively can reduce energy ezpenditure.Particularly, the detailed description of gravity assisted heat pipe principle see related content of the prior art, can repeat no more herein.
Be understandable that, in cold channel enclosed scheme, the principle in the principle of technical scheme provided by the present invention and passage of heat closure solutions, specifically the principle in reference thermal channel enclosed scheme can understand, repeats no more herein.
In the present embodiment, by arranging surface cooler on the support frame, and then secondary side is set connects described surface cooler, primary side connects the heat exchanger of water source device, make surface cooler can utilize cooling substance wherein, absorb the heat that electronic equipment produces, gaseous state is changed into make described cooling substance, and then the water utilizing described water source device to provide by heat exchanger carries out refrigeration process to the cooling substance of gaseous state in described surface cooler, like this, the heat that electronic equipment produces carries out heat exchange through surface cooler, to realize the object cooled, due to without the need to extra drive unit, thus reduce energy ezpenditure.
In addition, adopt technical scheme provided by the invention, structure is simple, and flexible arrangement, thus improves installation effectiveness.
In addition, adopt technical scheme provided by the invention, owing to adopting cooling substance in surface cooler, and there is not water, make cooling system provided by the present invention can not bring water logging risk, this improves the safety and reliability of cooling system.
In addition, adopt technical scheme provided by the invention, because the difference of the height of heat exchanger and the height of surface cooler is more than or equal to the height threshold pre-set, make the cooling substance in surface cooler that gravity assisted heat pipe principle can be utilized to circulate, without the need to extra drive unit, effectively energy ezpenditure can be reduced.
In addition, adopt technical scheme provided by the invention, what time following the advantage brought mainly also have:
1), more near thermal source, the efficiency of cooling is higher;
2), to the size of the rack of electronic equipment do not have extra demand, collocation flexibly;
3), low to machine room civil engineering conditional request, the civil engineering condition of the technical scheme of traditional precision air conditioner can this scheme compatible;
4), can install before the rack of electronic equipment marches into the arena prerequisite, support to pay fast;
5), structure is simple, and low price, main parts size supplier is more.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiments.
The described unit illustrated as separating component or can may not be and physically separates, and the parts as unit display can be or may not be physical location, namely can be positioned at a place, or also can be distributed in multiple network element.Some or all of unit wherein can be selected according to the actual needs to realize the object of the present embodiment scheme.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, also can be that the independent physics of unit exists, also can two or more unit in a unit integrated.Above-mentioned integrated unit both can adopt the form of hardware to realize, and the form that hardware also can be adopted to add SFU software functional unit realizes.
Last it is noted that above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. an electronic equipment dissipating heat system, is characterized in that, comprising:
Support frame;
Surface cooler, is arranged on described support frame, for utilizing cooling substance wherein, absorbing the heat that electronic equipment produces, changing into gaseous state to make described cooling substance;
Heat exchanger, its secondary side connects described surface cooler, and its primary side connects water source device, and the water provided for utilizing described water source device carries out refrigeration process to the cooling substance of gaseous state in described surface cooler.
2. electronic equipment dissipating heat system according to claim 1, is characterized in that, described cooling substance comprises solid-state cooling substance or liquid refrigeration material.
3. electronic equipment dissipating heat system according to claim 1, is characterized in that, the windward side of described surface cooler arranges fan.
4. electronic equipment dissipating heat system according to claim 1, is characterized in that, the lee face of described surface cooler arranges fan.
5. electronic equipment dissipating heat system according to claim 1, is characterized in that, described surface cooler is positioned at the enclosure top of electronic equipment.
6. electronic equipment dissipating heat system according to claim 1, is characterized in that, described surface cooler is positioned at bottom the rack of electronic equipment.
7. electronic equipment dissipating heat system according to claim 1, is characterized in that, described electronic equipment dissipating heat system comprises one or more described surface cooler.
8. electronic equipment dissipating heat system according to claim 7, is characterized in that, each surface cooler connects a heat exchanger.
9. electronic equipment dissipating heat system according to claim 7, is characterized in that, at least two surface coolers connect a heat exchanger.
10. the electronic equipment dissipating heat system according to the arbitrary claim of claim 1 ~ 9, is characterized in that, the difference of the height of described heat exchanger and the height of described surface cooler is more than or equal to the height threshold pre-set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410594101.6A CN104320957A (en) | 2014-10-29 | 2014-10-29 | Cooling system for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410594101.6A CN104320957A (en) | 2014-10-29 | 2014-10-29 | Cooling system for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104320957A true CN104320957A (en) | 2015-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410594101.6A Pending CN104320957A (en) | 2014-10-29 | 2014-10-29 | Cooling system for electronic equipment |
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| CN (1) | CN104320957A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255387A (en) * | 2016-08-31 | 2016-12-21 | 深圳绿色云图科技有限公司 | Cooling system and data center |
| CN106793684A (en) * | 2016-12-06 | 2017-05-31 | 郑州云海信息技术有限公司 | A kind of refrigerant phase-change refrigerating plant |
-
2014
- 2014-10-29 CN CN201410594101.6A patent/CN104320957A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106255387A (en) * | 2016-08-31 | 2016-12-21 | 深圳绿色云图科技有限公司 | Cooling system and data center |
| CN106255387B (en) * | 2016-08-31 | 2019-05-03 | 深圳绿色云图科技有限公司 | Cooling system and data center |
| CN106793684A (en) * | 2016-12-06 | 2017-05-31 | 郑州云海信息技术有限公司 | A kind of refrigerant phase-change refrigerating plant |
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Application publication date: 20150128 |