CN104311401A - Benzocyclobutene-perfluorocyclobutane unit-containing thermosetting monomer and its preparation method and use - Google Patents

Benzocyclobutene-perfluorocyclobutane unit-containing thermosetting monomer and its preparation method and use Download PDF

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CN104311401A
CN104311401A CN201410466607.9A CN201410466607A CN104311401A CN 104311401 A CN104311401 A CN 104311401A CN 201410466607 A CN201410466607 A CN 201410466607A CN 104311401 A CN104311401 A CN 104311401A
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CN104311401B (en
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房强
周俊峰
罗乙杰
王佳佳
金凯凯
王元强
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Shanghai Institute of Organic Chemistry of CAS
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C43/00—Ethers; Compounds having groups, groups or groups
    • C07C43/02—Ethers
    • C07C43/257—Ethers having an ether-oxygen atom bound to carbon atoms both belonging to six-membered aromatic rings
    • C07C43/29—Ethers having an ether-oxygen atom bound to carbon atoms both belonging to six-membered aromatic rings containing halogen
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C41/00—Preparation of ethers; Preparation of compounds having groups, groups or groups
    • C07C41/01—Preparation of ethers
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C41/00—Preparation of ethers; Preparation of compounds having groups, groups or groups
    • C07C41/01—Preparation of ethers
    • C07C41/18—Preparation of ethers by reactions not forming ether-oxygen bonds
    • C07C41/26—Preparation of ethers by reactions not forming ether-oxygen bonds by introduction of hydroxy or O-metal groups
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C41/00—Preparation of ethers; Preparation of compounds having groups, groups or groups
    • C07C41/01—Preparation of ethers
    • C07C41/18—Preparation of ethers by reactions not forming ether-oxygen bonds
    • C07C41/30—Preparation of ethers by reactions not forming ether-oxygen bonds by increasing the number of carbon atoms, e.g. by oligomerisation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2602/00—Systems containing two condensed rings
    • C07C2602/02—Systems containing two condensed rings the rings having only two atoms in common
    • C07C2602/04—One of the condensed rings being a six-membered aromatic ring
    • C07C2602/06—One of the condensed rings being a six-membered aromatic ring the other ring being four-membered

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  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

The invention provides a benzocyclobutene-perfluorocyclobutane unit-containing thermosetting monomer and its preparation method and use. The benzocyclobutene-perfluorocyclobutane unit-containing thermosetting monomer is a compound shown in the formula I. The compound shown in the formula I can be heated and cured to form a cured product. The cured product has good heat resistance and electrical properties and can be used as a high temperature-resistant binder or an electronic component packaging material.

Description

Containing the thermosetting monomer of benzocyclobutene and perfluorocyclobutane unit, preparation method and application thereof
Technical field
The invention belongs to high-performance polymer and manufacture field, be specifically related to a kind of simple thermosetting resin, the preparation method and application that contain benzocyclobutene and trans-1,1,2,2,3,4-Hexafluorocyclobutane structural unit.
Background technology
Organic materials containing hexafluoro cyclobutyl arylene ether unit has excellent optical property because of it, is subject to people's attention in the past 30 years.These materials have higher light transmissioning efficiency and minimum light loss, are expected as organic light-guide material (see Macromolecules 2004,37,5724 and Macromolecules 2005,38,8278).On the other hand, because C-F key has less polarizable rate, trifluoro vinyl ether structure is contained for performed polymer with two or three-functionality-degree, the thermosetting resin of hexafluoro cyclobutyl arylene ether functional group is contained by hot setting acquisition main chain, be developed and be used as advanced low-k materials (see Mat.Res.Soc.Symp.Proc.1997,443,177).This kind of material not only advantage of lower cost, and there is excellent mechanical property and low rate of moisture absorption (see WO9015043).But by manufacturing hexafluoro cyclobutyl arylene ether polymer containing the performed polymer of trifluoro vinyl ether, often because the reaction of trifluoro vinyl ether is incomplete, residual trifluoro vinyl ether can affect the performance of material.Unreacted trifluoro vinyl is subject to nucleophilic reagent attack, simultaneously neither acidproof, also not alkaline-resisting, can affect the resistance to medium (Macromolecules2008,41,7490-7496) of material.
In sum, this area still lack a kind of not containing or substantially containing residual trifluoro vinyl ether containing hexafluoro cyclobutyl arylene ether unit organic materials.
Summary of the invention
The object of this invention is to provide a kind of not containing or substantially containing residual trifluoro vinyl ether containing hexafluoro cyclobutyl arylene ether unit organic materials.
A first aspect of the present invention, provides a kind of as shown in the formula the compound shown in I:
A second aspect of the present invention, provide a kind of preparation method of formula I as described in the first aspect of the invention, described method comprises step:
In inert solvent, react with formula II compound and formula III compound, obtain formula I;
Preferably, described reaction is carried out under one or more reagent being selected from lower group: cuprous salt, imidazole ligands, mineral alkali, or its combination.
In another preference, the cuprous salt used is cuprous chloride, cuprous bromide or cuprous iodide, preferably uses cuprous chloride.
In another preference, the imidazole ligands used is 1-Methylimidazole, 1,2 dimethylimidazole, N-butyl imidazole or N-isopropylimdazole.
In another preference, the mineral alkali used is basic metal; Preferably, described mineral alkali is selected from lower group: oxyhydroxide, carbonate, or its combination; More preferably, described mineral alkali is salt of wormwood.
In another preference, in described reaction, described inert solvent is selected from lower group: toluene, dioxane, DMF, N, dinethylformamide, dimethyl sulfoxide (DMSO), N-Methyl pyrrolidone, hexamethylphosphoramide, tetramethylene sulfone, or its combination.
In another preference, in described reaction, described 4-bromine benzocyclobutene (formula III compound) and 4, the mol ratio of 4 '-dihydroxyl-phenylbenzene trans-1,1,2,2,3,4-Hexafluorocyclobutane ether is 2 ~ 5:1.
In another preference, described 4-bromine benzocyclobutene (formula III compound) is 1 ~ 5:0.1 ~ 1:0.1 ~ 1:1 ~ 5 with the mol ratio of cuprous salt, imidazole ligands and mineral alkali.
In another preference, described reaction is carried out at 80-160 DEG C.
In another preference, the described reaction times is 5-30 hour.
In another preference, described formula II compound is prepared by the following method:
In inert solvent, react with formula IIa compound, obtain formula II compound;
In another preference, described reaction is carried out under the reagent being selected from lower group exists: boron tribromide, pyridine hydrochloride, or aluminium triiodide.
In another preference, described inert solvent is selected from lower group: methylene dichloride, trichloromethane, ethylene dichloride, toluene.
In another preference, described reaction is carried out at 10 DEG C ~ 40 DEG C, preferably at room temperature carries out.
In another preference, the described reaction times is 10 ~ 20h.
In another preference, described formula IIa compound is prepared by the following method:
In inert solvent, carry out polyreaction with formula IIb compound, obtain formula IIa compound:
In another preference, described solvent is selected from lower group: phenyl ether, trimethylbenzene, tetramethylene sulfone, or its combination.
In another preference, described reaction is carried out at 120 DEG C ~ 180 DEG C.
In another preference, the described reaction times is 12 ~ 36h.
A third aspect of the present invention, provides the purposes of a kind of compound as described in the first aspect of the invention for the preparation of cured product.
A fourth aspect of the present invention, provides a kind of cured product, and described cured product is cured by formula I as described in the first aspect of the invention thus prepares.
In another preference, described cured product is with solidifying separately such as formula the compound shown in I thus preparing.
In another preference, described cured product formula I and other benzocyclobutene monomers or unsaturated double-bond resin alloy solidify to be prepared; Preferably, described cured product solidify with the monomer blend being selected from lower group by formula I to prepare: bismaleimides, tolane, toluylene, or it combines.
In another preference, the resin alloy weight ratio of described simple thermosetting resin and other benzocyclobutene monomers or unsaturated double-bond is 1:0.05 ~ 8.
In another preference, described cured product has following schematic structure:
Wherein, m, n are integer.
In another preference, boundary's electric constant (1-30MHz) of described cured product is 2.3 ~ 2.7.
In another preference, in the nitrogen of described cured product, 5% thermogravimetric weight loss temperature is 450 ~ 490 DEG C.
In another preference, in the air of described cured product, 5% thermogravimetric weight loss temperature is 380 ~ 410 DEG C.
In another preference, in the nitrogen of described cured product, 1000 DEG C of carbon residual rates are >=45%, are preferably >=50%.
In another preference, described being cured as is heating and curing.
In another preference, the described temperature that is heating and curing is 200-300 DEG C.
In another preference, described being heating and curing comprises: at 150 ~ 200 DEG C, carry out Procuring, then at 210 ~ 260 DEG C, carries out thermofixation.
In another preference, described pre-cure time is 0.5 ~ 4h.
In another preference, described thermal curing time is 1 ~ 8h.
A fifth aspect of the present invention, provides a kind of goods, and described goods contain compound as described in the first aspect of the invention, or described goods prepare with compound as described in the first aspect of the invention.
In another preference, described goods are high temperature resistant ablation resistant material, or electronic devices and components packaged material.
A sixth aspect of the present invention, provides a kind of goods, and described goods are containing, for example the cured product described in fourth aspect present invention, or described goods prepare with the cured product as described in fourth aspect present invention.
A seventh aspect of the present invention, provide a kind of preparation method of the goods as described in the present invention the 5th or the 6th aspect, described method comprises step:
(1) polymkeric substance is as described in the first aspect of the invention provided;
(2) carry out shaping to polymkeric substance as described in the first aspect of the invention, obtain pre-shaped articles;
(3) pre-shaped articles obtained in described step (2) is cured, obtains the goods as described in the present invention the 5th or the 6th aspect.
In another preference, in described step (2), described shaping be that method by being selected from lower group is carried out: fill with mould, solution spin coating, molten drop-coated.
In another preference, described cured product formula I and other benzocyclobutene monomers or unsaturated double-bond resin alloy solidify to be prepared; Preferably, described cured product solidify with the monomer blend being selected from lower group by formula I to prepare: bismaleimides, tolane, toluylene, or it combines.
In another preference, described being cured as is heating and curing.
In another preference, the described temperature that is heating and curing is 200-300 DEG C.
In another preference, described being heating and curing comprises: at 150 ~ 200 DEG C, carry out Procuring, then at 210 ~ 260 DEG C, carries out thermofixation.
In another preference, described pre-cure time is 0.5 ~ 4h.
In another preference, described thermal curing time is 1 ~ 8h.
In another preference, described solidification also comprises, and after thermofixation completes, heat-treats at 260 ~ 330 DEG C.
In another preference, described heat treatment time is 1 ~ 4h.
In another preference, in described step (2), described is shaped to film forming, and described film forming is the method by being selected from lower group: heating and mould pressing, solution spin coating, molten drop-coated.
In another preference, described solution spin coating or molten drop-coated comprise: with organic solvent dissolution polymkeric substance as described in the first aspect of the invention, on base material, then carry out spin coating or drip being coated with.
In another preference, described organic solvent is selected from lower group: toluene, trimethylbenzene, phenyl ether, trichloromethane, acetone, DMF, N,N-dimethylacetamide, dimethyl sulfoxide (DMSO) or N-Methyl pyrrolidone, or its combination.
Should be understood that within the scope of the present invention, above-mentioned each technical characteristic of the present invention and can combining mutually between specifically described each technical characteristic in below (eg embodiment), thus form new or preferred technical scheme.As space is limited, tiredly no longer one by one to state at this.
Embodiment
The present inventor, through long-term and deep research, has prepared a kind of thermosetting monomer containing benzocyclobutene and trans-1,1,2,2,3,4-Hexafluorocyclobutane structural unit, and cured product.Described thermosetting monomer has good processing characteristics, and the cured product after being heating and curing has good thermotolerance and conductivity.Based on above-mentioned discovery, contriver completes the present invention.
Monomer containing benzocyclobutene and trans-1,1,2,2,3,4-Hexafluorocyclobutane structural unit
The present invention is from molecular design theory, benzocyclobutene unit is introduced in hexafluoro cyclobutyl arylene ether molecular skeleton, obtain thermosetting monomer, can be used as a kind of high-performance coating and packaged material of high heat-resisting, low-k, be applied to the fields such as microelectronics industry, aerospace and national defence.The invention provides the simple thermosetting resin of a kind of benzocyclobutene and trans-1,1,2,2,3,4-Hexafluorocyclobutane structural unit, and preparation method thereof, the benzocyclobutene resin property obtained is excellent, is suitable for being used as high-performance resin matrix or packaged material in the fields such as microelectronics industry, aerospace and national defence.
Particularly, the invention provides a kind of as shown in the formula the compound shown in I:
The preparation method of described formula I comprises step:
In inert solvent, react with formula II compound and formula III compound, obtain formula I;
In another preference, described reaction is carried out under one or more reagent being selected from lower group: cuprous salt, imidazole ligands, mineral alkali, or its combination.
In another preference, the cuprous salt used is cuprous chloride, cuprous bromide or cuprous iodide, preferably uses cuprous chloride.
In another preference, the imidazole ligands used is 1-Methylimidazole, 1,2 dimethylimidazole, N-butyl imidazole or N-isopropylimdazole.
In another preference, the mineral alkali used is basic metal; Preferably, described mineral alkali is selected from lower group: oxyhydroxide, carbonate, or its combination; More preferably, described mineral alkali is salt of wormwood.
In another preference, in described reaction, described inert solvent is selected from lower group: toluene, dioxane, DMF, N, dinethylformamide, dimethyl sulfoxide (DMSO), N-Methyl pyrrolidone, hexamethylphosphoramide, tetramethylene sulfone, or its combination.
In another preference, in described reaction, described 4-bromine benzocyclobutene and 4, the mol ratio of 4 '-dihydroxyl-phenylbenzene trans-1,1,2,2,3,4-Hexafluorocyclobutane ether is 2 ~ 5:1.
In another preference, described 4-bromine benzocyclobutene (formula III compound) is 1 ~ 5:0.1 ~ 1:0.1 ~ 1:1 ~ 5 with the mol ratio of cuprous salt, imidazole ligands and mineral alkali.
In another preference, described reaction is carried out at 80-160 DEG C.
In another preference, the described reaction times is 5-30 hour.
In described reaction formula, each raw material can be obtained by conventional route, and such as, in one preferred embodiment of the invention, described formula II compound is prepared by the following method:
In inert solvent, react with formula IIa compound, obtain formula II compound;
In another preference, described reaction is carried out under the reagent being selected from lower group exists: boron tribromide, pyridine hydrochloride, or aluminium triiodide.
In another preference, described inert solvent is selected from lower group: methylene dichloride, trichloromethane, ethylene dichloride, toluene, or its combination.
In another preference, described reaction is carried out at 10 DEG C ~ 40 DEG C, preferably at room temperature carries out.
In another preference, the described reaction times is 10 ~ 20h.
In another preference, described formula IIa compound is prepared by the following method:
In inert solvent, carry out polyreaction with formula IIb compound, obtain formula IIa compound:
In another preference, described solvent is selected from lower group: phenyl ether, trimethylbenzene, tetramethylene sulfone, or its combination.
In another preference, described reaction is carried out at 120 DEG C ~ 180 DEG C.
In another preference, the described reaction times is 12 ~ 36h.
Described formula I may be used for preparing cured product, e.g., by being heating and curing, obtains cured product.Preferably, be heating and curing under an inert atmosphere, thus obtain cured product.
Cured product containing benzocyclobutene and trans-1,1,2,2,3,4-Hexafluorocyclobutane structural unit
Present invention also offers a kind of cured product, described cured product is cured by formula I as described in the first aspect of the invention thus prepares.
Described cured product can be that described formula I thermosetting monomer is cured separately thus prepares, or to be cured with other benzocyclobutene monomers or unsaturated double-bond resin alloy thus to prepare.In one preferred embodiment of the invention, the resin alloy weight ratio of described simple thermosetting resin and other benzocyclobutene monomers or unsaturated double-bond is 1:0.05 ~ 8.
Described curing mode has no particular limits, preferably for being heating and curing.Preferably, the described temperature that is heating and curing is 200-300 DEG C.
In another preference, described being heating and curing comprises: at 150 ~ 200 DEG C, carry out Procuring, then at 210 ~ 260 DEG C, carries out thermofixation.Wherein, described pre-cure time is 0.5 ~ 4h, and described thermal curing time is 1 ~ 8h.
In another preference, described solidification also comprises, and after thermofixation completes, heat-treats at 260 ~ 330 DEG C.
In another preference, described heat treatment time is 1 ~ 4h.
In another preference, described being heating and curing comprises: at 130 ~ 170 DEG C, process 0.5 ~ 2 hour, 0.5 ~ 2 hour is processed at 180 ~ 220 DEG C, 0.5 ~ 2 hour is processed at 220 ~ 260 DEG C, 0.5 ~ 2 hour is processed at 240 ~ 280 DEG C, process 4 ~ 6 hours at 260 ~ 300 DEG C, at 280 ~ 320 DEG C, process 4 ~ 6 hours.
In another preferred embodiment of the present invention, described cured product is the crosslinking structure that the cyclobutene structural unit open loop of formula I is connected to form, such as following schematic structure:
Wherein, m, n are integer.
Described cyclobutene structural unit can carry out open loop dimerization with other cyclobutene structural units, also can form chain or netted superpolymer with the common open loop of other cyclobutene structural units.
Described cured product has excellent electric property and resistance toheat, and in another preference, the specific inductivity (1-30MHz) of described cured product is 2.3 ~ 2.7.
In another preference, in the nitrogen of described cured product, 5% thermogravimetric weight loss temperature is 450 ~ 490 DEG C.
In another preference, in the air of described cured product, 5% thermogravimetric weight loss temperature is 380 ~ 410 DEG C.
In another preference, in the nitrogen of described cured product, 1000 DEG C of carbon residual rates are >=45%, are preferably >=50%.
Polymer product containing benzocyclobutene and trans-1,1,2,2,3,4-Hexafluorocyclobutane structural unit
Present invention also offers a kind of goods, described goods contain such as formula the polymkeric substance described in I, or described goods prepare with such as formula the polymkeric substance described in I.
In another preference, described goods are cured containing useful the cured product obtained such as formula the compound described in I, or described goods prepare with being cured such as formula the compound described in I the cured product obtained.
In another preference, described goods are high temperature resistant ablation resistant material, or electronic devices and components packaged material.
In a preference of the present invention, the preparation method of described goods comprises step:
(1) monomer described in formula I is provided;
(2) carry out shaping to the monomer described in formula I, obtain pre-shaped articles;
(3) pre-shaped articles obtained in described step (2) is cured, obtains described goods.
In another preference, described being cured as is heating and curing.
In another preference, the described temperature that is heating and curing is 200-300 DEG C.
In another preference, described being heating and curing comprises: at 150 ~ 200 DEG C, carry out Procuring, then at 210 ~ 260 DEG C, carries out thermofixation.
In another preference, described pre-cure time is 0.5 ~ 4h.
In another preference, described thermal curing time is 1 ~ 8h.
In another preference, described solidification also comprises, and after thermofixation completes, heat-treats at 260 ~ 330 DEG C.
In another preference, described heat treatment time is 1 ~ 4h.
Described forming method has no particular limits, and normal temperature compacted under method known in the art can be selected to carry out shaping, as by fill with mould or by wiring solution-forming spin coating or drip be coated with a film forming carry out shaping.In a preference of the present invention, in described step (2), described is shaped to film forming, and described film forming is the method by being selected from lower group: heating and mould pressing, solution spin coating, molten drop-coated.
In another preference, described solution spin coating or molten drop-coated comprise: with organic solvent dissolution such as formula the polymkeric substance described in I, on base material, then carry out spin coating or drip being coated with.
In another preference, described organic solvent is selected from lower group: toluene, trimethylbenzene, phenyl ether, trichloromethane, acetone, DMF, N,N-dimethylacetamide, dimethyl sulfoxide (DMSO) or N-Methyl pyrrolidone, or its combination.
Compared with prior art, major advantage of the present invention comprises:
(1) the invention provides a kind of thermosetting resin prepared containing benzocyclobutene and trans-1,1,2,2,3,4-Hexafluorocyclobutane structural unit, described resin has good processing characteristics, may be used for being heating and curing preparing thermosetting resin.
(2) the invention provides a kind of resin-cured product containing benzocyclobutene and trans-1,1,2,2,3,4-Hexafluorocyclobutane structural unit, compared with prior art, in cured product of the present invention, rarer unreacted trifluoro vinyl ether end group, therefore has better electric property and thermostability.
Below in conjunction with specific embodiment, set forth the present invention further.Should be understood that these embodiments are only not used in for illustration of the present invention to limit the scope of the invention.The experimental technique of unreceipted actual conditions in the following example, usually conveniently condition, or according to the condition that manufacturer advises.Unless otherwise indicated, otherwise per-cent and number calculate by weight.
The preparation of embodiment 1 precursor 1 (1-(bromo-1,1,2, the 2-tetrafluoro oxyethyl group of 2-) methyl-phenoxide)
Under argon shield; 49.6 grams of p methoxy phenols are added in reaction flask; 156 gram 1; 2-dibromotetrafluoroethane and 350 milliliters of existing DMSO (dimethyl sulfoxide (DMSO)) steamed; stir 30 minutes under ice-water bath; then 83 grams of Anhydrous potassium carbonates are added; remove ice-water bath, room temperature reaction 6 hours, is poured into water reaction mixture; vigorous stirring 20 minutes; in batches with chloroform by product extraction, extraction liquid saturated sodium-chloride water solution revolve after washing steam removing chloroform, residue column chromatography purification (silicagel column; sherwood oil is eluent), yield 77%. 1H?NMR(300?MHz,CDCl 3)δ(ppm):3.81(s,3H),6.89(d,2H),7.15(d,2H)； 19F?NMR(282?MHz)δ(ppm):-86.63(t,2F),-68.36(t,2F).
The preparation of embodiment 2 precursor 2 (1-(1,2,2-trifluoro-ethylene oxygen base) methyl-phenoxide)
Under argon shield, in reaction flask, add 50 grams of 1-(bromo-1,1,2, the 2-tetrafluoro oxyethyl group of 2-) methyl-phenoxide, 300 milliliters are newly steamed acetonitrile, agitation and dilution, and add 25 grams of zinc powders, temperature rising reflux reacts 24 hours.Reaction solution is poured in 600 ml waters, stir more than 15 minutes, use chloroform extraction in batches, combined chloroform extraction liquid, with saturated sodium-chloride water solution washing, anhydrous sodium sulfate drying more than 12 hours.Revolve and steam removing chloroform, concentrated solution residue column chromatography purification (silicagel column, sherwood oil is eluent) yield 55%. 1H?NMR(300?MHz,CDCl 3):δ(ppm):3.80(s,3H),6.87(d,2H),7.05(d,2H)； 19F?NMR(282?MHz,CDCl 3):δ(ppm)-133.89(dd,1F),-127.84(dd,1F),-120.79(dd,1F).
The preparation of embodiment 3 precursor 3 pairs of (methoxyphenol) hexafluoro cyclobutyl ethers (1,1 '-(1,2,2,3,3,4 ,-trans-1,1,2,2,3,4-Hexafluorocyclobutane-1,2-dioxy base)-two (to anisoles))
Under argon shield, in reaction flask, add 20 grams of 1-(1,2,2-trifluoro-ethylene oxygen base) methyl-phenoxide and 50 milliliters of phenyl ether, be heated to 150 DEG C of reactions 24 hours.Be cooled to rapid column chromatography (petrol ether/ethyl acetate, 10:1) after room temperature, productive rate 95%. 1H?NMR(300?MHz,CDCl 3):δ(ppm)3.80(s,6H),6.84(d,2H),7.04-7.10(m,4H),7.44(d,2H)；
19F?NMR(282?MHz,CDCl 3):δ(ppm)-132.47,-131.90,-131.65,-131.11,-130.85,-130.58,-130.31,-130.07,-129.90,-129.76,-129.54,-129.11,128.97,-128.75,-128.32,-127.41.
The preparation of embodiment 4 precursor 4 (4,4 '-dihydroxyl-phenylbenzene trans-1,1,2,2,3,4-Hexafluorocyclobutane ether)
Under argon shield; presoma 3 pairs of (methoxyphenol) hexafluoro cyclobutyl ether (10 grams) are added in reaction flask; methylene dichloride (100 milliliters); at mixture is chilled to 0 DEG C; slowly drip the diethyl ether solution (20 grams) of boron tribromide, finish, mixture is in room temperature for overnight; reactant shrend separates organic layer after going out.After desolventizing, crude by column chromatography (petrol ether/ethyl acetate, 10:1) is separated, and obtains 4,4 '-dihydroxyl-phenylbenzene trans-1,1,2,2,3,4-Hexafluorocyclobutane ether, productive rate 89%. 1H?NMR(300?MHz,CDCl 3):δ(ppm)6.82(d,2H),7.01-7.08(m,4H),7.41(d,2H). 19F?NMR(282?MHz,CDCl 3):δ(ppm)-132.44,-131.88,-131.50,-131.00,-130.85,-130.52,-130.30,-130.01,-129.85,-129.79,-129.51,-129.01,128.90,-128.71,-128.30,-127.33.
Embodiment 5 contains the preparation of the thermosetting monomer of benzocyclobutene and perfluorocyclobutane unit
Under argon shield; 4 are added in reaction unit; 4 '-dihydroxyl-phenylbenzene trans-1,1,2,2,3,4-Hexafluorocyclobutane ether (19g; 0.05 mol) 4-bromine benzocyclobutene (36.6g; 0.2 mol); 1.95 grams of cuprous iodides (0.01 mol); 6.15 grams of N-butyl imidazole (0.05 mol); 13.86 grams of salt of wormwood (0.1 mol); 100 milliliters of toluene, are warming up to 140 DEG C of reactions 16 hours, are cooled to room temperature; reaction mixture chloroform dilutes, and neutralizes after the washing of organic layer dilute hydrochloric acid with saturated sodium bicarbonate aqueous solution again.Solid crude product is obtained after revolving steaming removing organic solvent.White solid product can be obtained, productive rate 66% by column chromatography purification (petrol ether/ethyl acetate, 6:1).Proton nmr spectra 1h-NMR result (300 MHz, CDCl 3, ppm) and δ 3.12 (s, 8H), 6.73-7.15 (14H).Mass spectrum (EI/MS) characterizes m/z:584.14 (100.0%).
Embodiment 6 contains the preparation of the thermosetting monomer of benzocyclobutene and perfluorocyclobutane unit
With embodiment 5, but cuprous chloride is adopted to be catalyzer, products collection efficiency 51%.
Embodiment 7 contains the preparation of the thermosetting monomer of benzocyclobutene and perfluorocyclobutane unit
With embodiment 5, but solvent adopts N-Methyl pyrrolidone, productive rate 61%.
The solidification of the thermosetting monomer of embodiment 8 benzocyclobutene and perfluorocyclobutane unit
Get 4 grams of embodiment 5 obtained products, be placed in Glass tubing (diameter 2.5cm that is airtight, that be full of argon gas, height 8.5cm) in, then Glass tubing is placed in oil bath, carries out stage intensification, 150 DEG C × 1 hour, 200 DEG C × 1 hour, 240 DEG C × 1 hour, 260 DEG C × 1 hour, 280 DEG C × 5 hours, 300 DEG C × 5 hours.The resin that light column is crosslinked is obtained after cooling.
The performance of embodiment 9 cured product
By the cross-linked resin that embodiment 8 obtains, become the disk of diameter 2 centimetres, thickness 3 millimeters with sand papering, test its dielectric properties., this disk is pulverized meanwhile, carry out TGA measurement with the powder of gained.Following table is dielectric and the resistance toheat of cured resin.
The all documents mentioned in the present invention are quoted as a reference all in this application, are just quoted separately as a reference as each section of document.In addition should be understood that those skilled in the art can make various changes or modifications the present invention after having read above-mentioned teachings of the present invention, these equivalent form of values fall within the application's appended claims limited range equally.

Claims (10)

1. one kind as shown in the formula the compound shown in I:
2. the preparation method of formula I as claimed in claim 1, is characterized in that, comprise step:
In inert solvent, react with formula II compound and formula III compound, obtain formula I;
Preferably, described reaction is carried out under one or more reagent being selected from lower group: cuprous salt, imidazole ligands, mineral alkali, or its combination.
3. method as claimed in claim 2, it is characterized in that, described formula II compound is prepared by the following method:
In inert solvent, react with formula IIa compound, obtain formula II compound;
4. method as claimed in claim 3, it is characterized in that, described formula IIa compound is prepared by the following method:
In inert solvent, carry out polyreaction with formula IIb compound, obtain formula IIa compound:
5. the purposes of compound as claimed in claim 1, is characterized in that, for the preparation of cured product.
6. a cured product, is characterized in that, described cured product formula I as claimed in claim 1 is cured thus prepares.
7. goods, is characterized in that, described goods are containing, for example compound according to claim 1, or prepared by described goods compound as claimed in claim 1.
8. goods, is characterized in that, described goods are containing, for example cured product according to claim 6, or prepared by described goods cured product as claimed in claim 6.
9. a preparation method for goods as claimed in claim 7 or 8, is characterized in that, comprises step:
(1) polymkeric substance as claimed in claim 1 is provided;
(2) carry out shaping to polymkeric substance as claimed in claim 1, obtain pre-shaped articles;
(3) pre-shaped articles obtained in described step (2) is cured, obtains goods as claimed in claim 7 or 8.
10. method as claimed in claim 9, it is characterized in that, in described step (2), described is shaped to film forming, and described film forming is the method by being selected from lower group: heating and mould pressing, solution spin coating, molten drop-coated.
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