CN104301462B - Cell phone mainboard structure and mobile phone - Google Patents

Cell phone mainboard structure and mobile phone Download PDF

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Publication number
CN104301462B
CN104301462B CN201410503880.4A CN201410503880A CN104301462B CN 104301462 B CN104301462 B CN 104301462B CN 201410503880 A CN201410503880 A CN 201410503880A CN 104301462 B CN104301462 B CN 104301462B
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CN
China
Prior art keywords
mainboard
mobile phone
cell phone
connector
phone
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Expired - Fee Related
Application number
CN201410503880.4A
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Chinese (zh)
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CN104301462A (en
Inventor
王聪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201410503880.4A priority Critical patent/CN104301462B/en
Publication of CN104301462A publication Critical patent/CN104301462A/en
Application granted granted Critical
Publication of CN104301462B publication Critical patent/CN104301462B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The present invention discloses a kind of cell phone mainboard structure, including the first mainboard for being set gradually along mobile phone width and the second mainboard, communicated to connect between first mainboard and second mainboard, there is gap, the gap between first mainboard and second mainboard is located at the middle part of mobile phone width between first mainboard and second mainboard;The cell phone mainboard structure can prevent mainboard from deforming and deforming with mobile phone, reduce mainboard failure, have more preferable resistance to mechanical impact and compressive property using the mobile phone of the cell phone mainboard structure, product stability is stronger, has longer service life.

Description

Cell phone mainboard structure and mobile phone
Technical field
The present invention relates to mobile communication equipment technical field, more particularly to a kind of cell phone mainboard structure and application mobile phone master The mobile phone of harden structure.
Background technology
Today, we are lived among the society of a high speed information development, and our work, amusement, life is all different Degree framework on network, medium, the conventional mobile phone of the relative basic function such as be only used for making a phone call, send short messages being capable of band To our abundant informations, help we handle every affairs and can also let us enjoy the smart mobile phone of amusement in one's spare time An exactly product for meeting current social and personal development demand, smart mobile phone will gradually substitute conventional mobile phone be one must So occur, irreversible trend.
With the increase of cell-phone function, green grass or young crops of the giant-screen mobile phone with its preferable Consumer's Experience by more and more users Look at, therefore the mobile phone of current large touch screen is more and more.Mobile phone screen becomes the length dimension and width that ambassador obtains mobile phone Degree size increases, and the possibility that mobile phone deforms in the case can increase considerably.Especially in the width of phone housing Spend it is in uneven thickness on direction in the case of, mobile phone is pressurized or most thick position contacts with bearing surface first when falling, both sides compared with Thin position continues to move, and handset shell can be made to deform when contacting bearing surface, and this deformation is typically what can be recovered, therefore Irremediable damage will not be caused to handset shell.But it is provided in the mainboard inside handset shell while can deforms, Although the deformation can equally recover, mainboard deforming degree can excessively cause mainboard to fail.
The electronic components such as chip are provided with mainboard, some components can together become with mainboard when mainboard deforms Shape, so as to cause component failure.Some components are rigidly larger, will not together be deformed with mainboard, but it is deformed in mainboard In the case of certain change in location can be produced between mainboard, although the change in location mainboard position recover in the case of can To restore, but the electrical connection of itself and mainboard will be affected, and loose contact may be caused to influence the use of mobile phone.
The content of the invention
It is an object of the present invention to:A kind of cell phone mainboard structure is provided, prevents mainboard deformation from causing mainboard to fail, with And influence the annexation of mainboard and component.
It is another object of the present invention to:A kind of mobile phone is provided, can effectively prevent that mainboard together becomes when mobile phone from deforming Shape causes mobile phone to fail.
To use following technical scheme up to this purpose, the present invention:
A kind of cell phone mainboard structure, including the first mainboard and the second mainboard set gradually along mobile phone width, it is described Communicated to connect between first mainboard and second mainboard, there is gap between first mainboard and second mainboard, Gap between first mainboard and second mainboard is located at the middle part of mobile phone width.
In the case where existing mobile phone is increasing, mobile phone width increase causes when it is acted on by external force along width side Easily deform upwards, the deformation of handset shell inevitably influences whether internal structure of mobile phone, and what is stood in the breach is exactly Occupy the mainboard of very large area inside it, often deformation will cause it easily to lose to mainboard as the most important element of interior of mobile phone Effect, while be arranged on the components such as the chip on mainboard and be fixedly connected with mainboard, deform and also result in the deformation of mainboard Component failure.Mobile phone deforms the maximum position of its deflection as its middle part, corresponding mainboard in the direction of the width The maximum position of deflection is similarly the position in the middle part of mobile phone.
Cell phone mainboard is divided into two parts of communication connection in the direction of the width, forms gap between the two sections, together When gap is in mobile phone medium position, so when mobile phone deforms, the deflection of two parts mainboard will be greatly reduced, Even in the case where mobile phone overall deformation amount is little, it can keep indeformable state.
As a kind of preferable technical scheme of cell phone mainboard structure, first mainboard passes through company with second mainboard Connect device to be attached, the connector includes connector female seat and is engaged the company that can be mutually inserted with the connector female seat Device male seat is connect, the connector female seat and the connector socket are two, and two connector female seats are separately positioned on On first mainboard and second mainboard, two connector sockets are connected as one by connecting winding displacement, and with it is right The connector female seat answered carries out grafting.
Connect removable winding displacement, bending, reverse without damaging wire, two connectors are connected by connecting winding displacement Male seat, and then communicate to connect first mainboard and second mainboard, in mobile phone in the case of by outer force deformation, the change of mainboard Shape from the mainboard (PCB) of conventional bulk mainboard be changed into connect winding displacement deformation, therefore reduce first mainboard with it is described The possibility of second mainboard deformation.
As a kind of preferable technical scheme of cell phone mainboard structure, two connector female seats pass through surface mount process Be respectively welded on first mainboard and second mainboard, the both ends of the connection winding displacement respectively with the connector socket It is welded to connect.
As a kind of preferable technical scheme of cell phone mainboard structure, the mainboard is a Rigid Flex, including described First mainboard, the second mainboard, and the FPC of connection first mainboard and second mainboard.
FPC is arranged between the first mainboard and the second mainboard, and the middle position on mobile phone width Put, the assembling process of the first mainboard and the second mainboard is reduced using Rigid Flex, it is possible to increase the production efficiency of mobile phone, together When can avoid setup error.
As a kind of preferable technical scheme of cell phone mainboard structure, lead between first mainboard and second mainboard Cross wireless transmission method communication connection.
Preferably, signal projector and signal receiver are provided with first mainboard and second mainboard, The signal projector and the signal receiver are arranged at the first mainboard and the second mainboard marginal position close to each other.
By signal projector and signal receiver setting close to each other, the decay of signal can be reduced, ensures signal transmission Quality.
Preferably, in the signal projector of first mainboard and second mainboard and the signal receiver Outside is provided with radome.
Set radome to coat signal projector and signal receiver, avoid outside during transmission of wireless signals Interference of the signal to it, while avoid interference of its signal to external signal.
As a kind of preferable technical scheme of cell phone mainboard structure, power management chip, base are provided with the mainboard Microarray strip, radio frequency chip, the power management chip and the baseband chip are arranged on first mainboard or described the simultaneously On two mainboards, the radio frequency chip is arranged on different mainboards from the baseband chip.
Baseband chip is responsible for handling substantial amounts of data, and power consumption is big, and power management chip and its are arranged in same mainboard Electric energy supply is carried out to it;Radio frequency chip is provided separately with baseband chip, reduces mutual signal interference.
As a kind of preferable technical scheme of cell phone mainboard structure, first mainboard and/or second mainboard are L Type mainboard.
A kind of mobile phone, using cell phone mainboard structure as described above.
As a kind of preferable technical scheme of mobile phone, first mainboard is fixedly mounted on institute with second mainboard State between the upper lid of mobile phone and the lower cover of the mobile phone.
As a kind of preferable technical scheme of mobile phone, the mobile phone is in the thin arcuate structure in middle part thickness both sides, the hand The maximum position of machine thickness is located at the middle part of the mobile phone width.
Large scale mobile phone, especially in the mobile phone of the thin arcuate structure in middle part thickness both sides, falling due in uneven thickness Or thicker portion contacts as stress surface with bearing surface first when being squeezed, movement under force is continued in relatively thin position, causes mobile phone Deformation, make mainboard that mainboard to be divided into the two parts for mutually moving and being independent of each other in the maximum position of mobile phone thickness, avoid mobile phone Deformation drives mainboard deformation to cause to fail.
Beneficial effects of the present invention are:The cell phone mainboard structure can prevent mainboard from deforming and deforming with mobile phone, reduce master Plate fails, and has more preferable resistance to mechanical impact and compressive property using the mobile phone of the cell phone mainboard structure, product stability is more By force, there is longer service life.
Brief description of the drawings
The present invention is described in further detail below according to drawings and examples.
Fig. 1 is cell phone mainboard dimensional structure diagram described in the embodiment of the present invention one.
Fig. 2 is another view stereo structural representation of cell phone mainboard described in the embodiment of the present invention one.
Fig. 3 is connector construction schematic diagram described in the embodiment of the present invention one.
Fig. 4 is cell phone mainboard decomposition texture schematic diagram described in the embodiment of the present invention one.
Fig. 5 is cell phone mainboard dimensional structure diagram described in the embodiment of the present invention two.
Fig. 6 is mobile phone decomposing state schematic diagram described in the embodiment of the present invention three.
Fig. 7 is enlarged drawing at I in Fig. 6.
In Fig. 1 to 4:
10th, the first mainboard;11st, the second mainboard;12nd, connector female seat;13rd, connector socket;14th, winding displacement is connected;15th, it is electric Source control chip;16th, baseband chip;17th, radio frequency chip;18th, memory chip;
In Fig. 5:
20th, the first mainboard;21st, the second mainboard;22nd, the first wireless communication module;23rd, the second wireless communication module;
In Fig. 6,7:
31st, upper plastic cover;32nd, metal top cover;33rd, mainboard assembly;331st, the first mainboard;332nd, the second mainboard;333rd, it is soft Property wiring board;34th, lower plastic cover;35th, battery cover;36th, locating dowel;37 positioning holes.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Embodiment one:
As shown in figures 1-4, in the present embodiment, a kind of cell phone mainboard structure of the present invention, including along mobile phone width The first mainboard 10 and the second mainboard 11 that direction is arranged side by side successively, are communicated to connect between the first mainboard 10 and the second mainboard 11, And there is certain interval therebetween, the first mainboard 10 with the second mainboard 11 there is identical width the gap is located at The medium position of mobile phone width.The first mainboard 10 and the second mainboard 11 carry out communication link by connector in the present embodiment Connect.
Specifically, the edge close to the second mainboard 11 on the first mainboard 10 is provided with a connector female seat 12, second The position corresponding with connector female seat 12 on the first mainboard 10 is again provided with a connector female seat 12 on mainboard 11.Two connections Connector socket 13 is plugged with device female seat 12 respectively, two connector sockets 13 are attached by connecting winding displacement 14, so that will First mainboard 10 is communicatively coupled with the second mainboard 11.
In the present embodiment, the connected mode of the mainboard 10 of connector female seat 12 and first and the second mainboard 11 is using table Face attachment process is welded;Connect and be attached between the both ends of winding displacement 14 and connector socket 13 by way of welding.
Power management chip 15, baseband chip 16, radio frequency chip 17 and memory chip 18 are provided with cell phone mainboard, electricity Source control chip 15 is mainly responsible for identification CPU power supply amplitudes, produces corresponding short square ripple, promotes late-class circuit to carry out power defeated Go out, baseband chip 16 is used to receive for the process of compilation to receiving and sending messages, radio frequency chip 17 or transmission signal, memory chip 18 For storing data.Therefore wherein the power consumption of baseband chip 16 is maximum in the present embodiment sets itself and power management chip 15 simultaneously Put on the first mainboard 10, and on the same face, memory chip 18 is arranged on the another side on the first mainboard 10.Radio frequency chip 17 are arranged on the second mainboard 11 and it is pulled open a certain distance with baseband chip 16, reduce the interference that radiofrequency signal is subject to.
Embodiment two:
As shown in figure 5, in the present embodiment, a kind of cell phone mainboard structure of the present invention, including along mobile phone width side To the first mainboard 20 and the second mainboard 21 being arranged side by side successively, communicated to connect between the first mainboard 20 and the second mainboard 21, and And there is certain interval therebetween, there is identical width to cause the gap to be located at hand for the first mainboard 20 and the second mainboard 21 The medium position of machine width.The first mainboard 20 and the second mainboard 21 are by way of wireless transmission signal in the present embodiment It is communicatively coupled.
Specifically, the first mainboard 20 is provided with the first wireless communication module 22 on a lateral edges of the second mainboard 21, Second mainboard 21 is provided with the second wireless communication module 23, the first mainboard 20 and the second mainboard on the edge of the first mainboard 20 Signal transmission is carried out by the first wireless communication module 22 and the second wireless communication module 23 between 21.In the first radio communication mold The outside of the wireless communication module 23 of block 22 and second is provided with the radome of two wireless communication modules of covering.
First wireless communication module 22 includes the first signal projector and the first signal receiver, the second radio communication mold Block 23 includes secondary signal transmitter and secondary signal receiver,
By 23 setting close to each other of the first wireless communication module 22 and the second wireless communication module, signal can be reduced and passed Decay during defeated, ensure signal transmission quality.Radome is set by the first wireless communication module 22 and the second channel radio Letter module 23 coats, and avoids interference of the external signal to it during transmission of wireless signals, while avoid its signal to outside The interference of signal.
Preferably, radome is made of flexible material.
The shape of mainboard is not limited to the shape described in embodiment, in other embodiments the first mainboard 20 and second Mainboard 21 can also be L-type mainboard or c-type mainboard.
Embodiment three:
As shown in Figure 6,7, in the present embodiment, a kind of mobile phone of the present invention is included by upper plastic cover 31, metal Lid 32, mainboard assembly 33, lower plastic cover 34 and battery cover 35.Its lower plastic cover 34 and battery cover 35 are in middle part thickness both sides Thin arcuate structure, and the maximum position of mobile phone thickness is located at the middle part of mobile phone width.
Mainboard assembly 33 includes two pieces of pcb boards and connects the FPC 333 of two pieces of pcb boards, two pieces of pcb board difference For the first mainboard 331 and the second mainboard 332, the boundary position of the first mainboard 331 and the second mainboard 332 is located at mobile phone width side To medium position.
The locating dowel 36 for fixing the first mainboard 331 and the second mainboard 332 is provided with metal top cover 32, One mainboard 331 is set with being provided with the positioning hole 37 corresponding with the locating dowel 36 on the second mainboard 332 centered on locating dowel 36 Threaded tubular structure, the first mainboard 331 and the second mainboard 332 are fixed by locating dowel 36, positioning hole 37 and screw pacifies Between metal top cover 32 and lower plastic cover 34.
In description herein, term " first ", " second ", it is used only for being distinguish between in description, it is not special Implication.
It is to be understood that above-mentioned embodiment is only that presently preferred embodiments of the present invention and institute's application technology are former Reason, in technical scope disclosed in this invention, change that any one skilled in the art is readily apparent that or Replace, should all cover within the scope of the present invention.

Claims (9)

1. a kind of cell phone mainboard structure, it is characterised in that including the first mainboard and second set gradually along mobile phone width Mainboard, communicated to connect between first mainboard and second mainboard, between first mainboard and second mainboard With gap, the gap between first mainboard and second mainboard is located at the middle part of mobile phone width;
First mainboard is attached with second mainboard by connector, the connector include connector female seat and The connector socket that can be mutually inserted is engaged with the connector female seat, the connector female seat and the connector socket are equal For two, two connector female seats are separately positioned on first mainboard and second mainboard, two connections Device male seat is connected as one by connecting winding displacement, and carries out grafting with corresponding connector female seat.
2. cell phone mainboard structure according to claim 1, it is characterised in that two connector female seats pass through surface mount Technique is respectively welded on first mainboard and second mainboard, the both ends of the connection winding displacement respectively with the connector Male seat is welded to connect.
3. cell phone mainboard structure according to claim 1, it is characterised in that the mainboard is a Rigid Flex, including First mainboard, the second mainboard, and the FPC of connection first mainboard and second mainboard.
4. cell phone mainboard structure according to claim 1, it is characterised in that first mainboard and second mainboard it Between communicated to connect by wireless transmission method.
5. cell phone mainboard structure according to any one of claim 1 to 4, it is characterised in that be provided with the mainboard Power management chip, baseband chip, radio frequency chip, the power management chip and the baseband chip are arranged on described the simultaneously On one mainboard or second mainboard, the radio frequency chip is arranged on different mainboards from the baseband chip.
6. cell phone mainboard structure according to claim 5, it is characterised in that first mainboard and/or second master Plate is L-type mainboard.
7. a kind of mobile phone, it is characterised in that the mobile phone is using the cell phone mainboard structure any one of claim 1 to 6.
8. mobile phone according to claim 7, it is characterised in that first mainboard is fixedly mounted with second mainboard Between the upper lid of the mobile phone and the lower cover of the mobile phone.
9. the mobile phone according to claim 7 or 8, it is characterised in that the mobile phone is in the thin arcuate structure in middle part thickness both sides, The maximum position of the mobile phone thickness is located at the middle part of the mobile phone width.
CN201410503880.4A 2014-09-26 2014-09-26 Cell phone mainboard structure and mobile phone Expired - Fee Related CN104301462B (en)

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Application Number Priority Date Filing Date Title
CN201410503880.4A CN104301462B (en) 2014-09-26 2014-09-26 Cell phone mainboard structure and mobile phone

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Application Number Priority Date Filing Date Title
CN201410503880.4A CN104301462B (en) 2014-09-26 2014-09-26 Cell phone mainboard structure and mobile phone

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CN104301462A CN104301462A (en) 2015-01-21
CN104301462B true CN104301462B (en) 2017-11-24

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107708295A (en) * 2017-11-17 2018-02-16 珠海市魅族科技有限公司 Printed circuit board assembly and terminal device
CN107943729A (en) * 2017-11-29 2018-04-20 郑州云海信息技术有限公司 Gigabit Ethernet communication means and system between a kind of dual control mainboard
CN111245461A (en) * 2018-11-13 2020-06-05 Oppo广东移动通信有限公司 Electronic device
CN112307523A (en) * 2020-11-09 2021-02-02 维沃移动通信有限公司 Chip module, information processing method and device and electronic equipment

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111492A (en) * 2007-10-26 2009-05-21 Kyocera Corp Portable electronic equipment
CN202068678U (en) * 2011-04-27 2011-12-07 深圳威迈斯电源有限公司 Mounting structure between printed circuit boards
CN202841225U (en) * 2012-08-14 2013-03-27 广东欧珀移动通信有限公司 Handset mainboard and handset comprising the same
CN203086534U (en) * 2013-01-04 2013-07-24 深圳酷比通信设备有限公司 Smart phone mainboard and smart phone
CN203086533U (en) * 2013-01-04 2013-07-24 深圳酷比通信设备有限公司 Mobile phone mainboard and mobile phone

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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18

Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

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