CN104300766A - Power module and manufacturing method thereof - Google Patents
Power module and manufacturing method thereof Download PDFInfo
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- CN104300766A CN104300766A CN201410453323.6A CN201410453323A CN104300766A CN 104300766 A CN104300766 A CN 104300766A CN 201410453323 A CN201410453323 A CN 201410453323A CN 104300766 A CN104300766 A CN 104300766A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
The invention discloses a power module and a manufacturing method of the power module. The manufacturing method of the power module includes the steps that electronic components at least including integrated circuit chips are electrically connected with a preset circuit of a connection body, coils are arranged, and the connection ends of the coils are electrically connected with the preset circuit of the connection body; a mold cavity is prefabricated, and the connection body provided with the coils and the electronic components is placed in the mold cavity; a magnetic mixture is prepared, and after the mold cavity containing the connection body is filled with the magnetic mixture, a magnetic body is formed in a heating and pressurizing mode; the magnetic body at least wraps the coils, the electronic components and the portion, for arranging the coils and the electronic components, of the connection body, and terminals are exposed out of the magnetic body. The power module forming pressure is greatly lowered, damage to the coils, the electronic components, the connection body and the like in the magnetic body is avoided, and the cooling effect of the manufactured power module is greatly improved.
Description
Technical field
The present invention relates to a kind of power module and manufacture method thereof.
Background technology
At electronics field, in order to provide the voltage and current needed for electronic equipment real work exactly, normally the electronic devices and components such as inductance, resistance, electric capacity, integrated circuit (IC) chip are formed a power supply module (Power Supply in Package), be used for realizing the function of voltage or current conversion.The manufacture method of traditional integrated form power supply module, generally respectively independently electronic devices and components (as IC, R, C), coil etc. are assembled into after on PCB or other substrates by certain loop connected mode to adopt capsulation material encapsulation to form, this technique easily produces crack, and poor radiation, cost is high.In order to overcome the problems referred to above, employing is had to process the magnetic leaving installing space in advance, again magnetic is covered on PCB, the installing space that magnetic leaves is for holding the part such as electronic devices and components, coil, but this method complex process, and the power supply module volume processed is comparatively large, poor radiation; Also have the method encapsulated by magnetic material mixture, this method is commonly used to manufacture inductor, and the pressure adopting cold-press process compacting to need during encapsulation is very large, causes cost higher, and easily destroys inner member.
Summary of the invention
Based on this, the invention reside in the defect overcoming prior art, provide a kind of power module manufacture method, the shaping required pressure of power module is lower, avoid damaging inner each element, and obtained power module thermal diffusivity is good.
Its technical scheme is as follows:
A manufacture method for power module, comprises the steps:
Connector is set, makes this connector possess default circuit connecting mode, and the terminal that can be connected with exposed electrical is set on this connector;
The electronic devices and components at least comprising integrated circuit (IC) chip are configured in the preinstalled circuit connected mode of described connector in the mode be electrically connected, and configure coil, and the link of coil is configured in the preinstalled circuit connected mode of described connector in the mode be electrically connected;
Prefabricated die cavity, and the connector of coil and electronic devices and components is placed in die cavity by aforementioned arrangements;
Configuration magnetic mixture, and the mode by simultaneously temperature-pressure after described magnetic mixture being filled into the die cavity that placed aforementioned connector forms magnetic, described magnetic at least wraps up aforementioned coil and electronic devices and components and described connector for configuring the part of aforementioned coil and electronic devices and components, and described terminal is exposed to the outside of magnetic.
Its further technical scheme is as follows:
Mode by simultaneously temperature-pressure in above-mentioned steps wraps up connector to form magnetic, and its temperature range is 60 degrees Celsius ~ 200 degrees Celsius, and pressure limit is 5 ~ 70 kg/cm.
Temperature-pressure time range under described temperature and pressure scope is 40 ~ 80 minutes.
Described magnetic mixture comprises the Magnaglo of 90 ~ 97 weight portions, the resin of 2.8 ~ 9.0 weight portions.
Described magnetic mixture also comprises the additive of 0.2 ~ 1.0 weight portion.
Described Magnaglo is any one or any two or more mixed-powder between them in alloyed powder, non-crystalline flour, micro-crystal powder, iron powder, ferrite powder.
Described resin is thermosetting resin.
Described magnetic mixture is any one or two or more mixed-powder arbitrarily between them in the iron powder of 95 ~ 97 weight portions, alloyed powder, non-crystalline flour, micro-crystal powder, any one or two or more hybrid resin arbitrarily between them in the epoxy resin of 2.5 ~ 5 weight portions, silicones, phenolic resins, and 0.2 ~ 0.4 additive of weight portion, institute's plus-pressure is 40 ~ 60 kg/cm, heating degree is 120 ~ 150 degrees Celsius, and the temperature-pressure time under described temperature and pressure scope is 1 ~ 2 hour.
Described magnetic mixture is any one or two or more mixed-powder arbitrarily between them in the iron powder of 92.5 weight portions, alloyed powder, non-crystalline flour, micro-crystal powder, any one or two or more hybrid resin arbitrarily between them in the epoxy resin of 7.0 weight portions, silicones, phenolic resins, and 0.5 additive of weight portion, institute's plus-pressure is 40 kg/cm, heating degree is 150 degrees Celsius, and the temperature-pressure time under described temperature and pressure scope is 1 hour.
Described connector is processed by PCB substrate.
Described connector is become to be formed by injection mo(u)lding aft-loaded airfoil by default wire frame.
After described electronic devices and components and coil are connected to connector, be also included in the step of described connector and electronic devices and components, the junction of coil and the top coating insulating material of described integrated circuit (IC) chip.
When configuring coil in above-mentioned steps, be connected in the preinstalled circuit connected mode of connector after described coil is wrapped in magnetic core in advance.
The manufacture method of described power module also comprises the step that the connector of the power module after to demoulding and/or described magnetic edge are revised.
Present invention also offers a kind of power module, its technical scheme is as follows:
A kind of power module, comprising:
Coil, comprises coil main body and link;
Electronic devices and components, these electronic devices and components at least comprise integrated circuit (IC) chip;
Connector, this connector and described coil and electronic devices and components are electrically connected, and this connector have the terminal that can be connected with exposed electrical;
Magnetic, described coil, electronic devices and components closely wrap up by this magnetic, and described coil, not interspace between electronic devices and components and magnetic, this magnetic at least covers described coil and electronic devices and components and described connector for configuring the part of aforementioned coil and electronic devices and components, and terminal on described connector is outside exposed.
Its further technical scheme is as follows:
Described magnetic and coil, electronic devices and components and connector are combined closely, and magnetic and not interspacing between coil, electronic devices and components and connector.
Described magnetic is formed by the mode adding gentle pressurization simultaneously by the mixture of Magnaglo and resin.
Described Magnaglo comprises the Magnaglo of 95 ~ 97 weight portions, the resin of 2.5 ~ 5 weight portions.
This power module also comprises magnetic core, is fixed on described connector on after being electrically connected after this magnetic core is wound around by described coil main body by the link of described coil and described connector.
Described magnetic core is any one or a few combination of rivet-like magnetic core, column magnetic core, I-type magnetic core, sheet magnetic core.
The magnetic permeability of described magnetic core is higher than the magnetic permeability of described magnetic.
Described coil is one, and described coil is positioned at the top of described electronic devices and components.
Described coil is one, and described coil is positioned at the side of described electronic devices and components.
Described coil is multiple, and described coil is positioned at side and/or the top of described electronic devices and components.
Described connector is printed circuit board (PCB).
Described connector comprises connecting circuit and plastic cement insulating body, and described connecting circuit wraps up by described plastic cement insulating body.
Described integrated circuit (IC) chip is multiple.
Described electronic devices and components are integrated circuit (IC) chip, and this integrated circuit (IC) chip is integrated with resistance, electric capacity, MOSFET, and the unit module that drive circuit, pulse width modulator and controller are integrated.
Described electronic devices and components also comprise resistance and/or electric capacity.
Described integrated circuit (IC) chip is integrated with MOSFET, the unit module that drive circuit, pulse width modulator and controller are integrated.
Described electronic devices and components also comprise MOSFET.
Described integrated circuit (IC) chip is integrated with the unit module that resistance, electric capacity, drive circuit, pulse width modulator and controller be integrated.
The edge of described magnetic does not exceed the edge of described connector.
Described connector is polygon, and described magnetic is also for corresponding polygon and its edge at least does not exceed the edge of described connector.
Below the advantage of preceding solution or principle are described:
The manufacture method of above-mentioned power module, magnetic mixture is made to wrap up connector to form magnetic by adopting the mode of temperature-pressure simultaneously, magnetic is one-body molded with the connector being configured with coil and electronic devices and components, because forming temperature increases, the shaping required pressure of such power module reduces greatly, avoid the coil damaging magnetic inside, electronic devices and components and connector etc., manufacturing cost reduces, and by power module that hot pressing obtains, the coil of its inside, electronic devices and components and connector are closely wrapped up by magnetic, and even can realize without any space between magnetic, not only can obtain the power module of small volume, meet the needs of miniaturization, and the coil of inside, electronic devices and components and connector directly contact with magnetic, can farthest uniform heat in the distribution of whole power module, its radiating effect further increases, by the inner each element of magnetic available protecting, reduce electromagnetic interference, the electrical characteristic of power module is promoted further.Meanwhile, the mechanical strength of obtained power module also improves greatly, thus enables power module bear larger vibration environment.Compare with conventional method, owing to not needing well in advance magnetic, just there is no the restriction of magnetic sidewall, so the coil that can have more how selectable space matching electronic devices and components or select volume larger, and, because electronic devices and components do not need to be limited in headspace, therefore electronic devices and components can be distributed rationally as required on connector, the performance of power module entirety can be improved better, the power module manufactured by this method can obtain more closely packaging effect reliably, greatly improve the moisture resistance properties of product, and the connection of the magnetic of described power module and connector is very firm, there is significant anti-seismic performance, in addition, because coil (inductor) does not need additional designs and manufacture, but be just formed simultaneously while manufacture power module, therefore the time of production can greatly be shortened, reduce manufacturing cost.
Above-mentioned power module, by arranging magnetic by coil, electronic devices and components closely wrap up, make coil, do not interspace between electronic devices and components and magnetic, make coil, electronic devices and components and connector directly contact with magnetic, can farthest uniform heat in the distribution of whole power module, the radiating effect of further raising power module, magnetic at least covers described coil and electronic devices and components and described connector for configuring the part of aforementioned coil and electronic devices and components, and terminal on connector is outside exposed, such magnetic can the inner each element of available protecting, reduce electromagnetic interference, the electrical characteristic of power module is promoted further.
Accompanying drawing explanation
Fig. 1 is the schematic diagram being configured with the connector of coil and electronic devices and components described in the embodiment of the present invention;
Fig. 2 is for being placed on the schematic diagram of die for molding by the connector in Fig. 1 described in the embodiment of the present invention;
The schematic diagram that Fig. 3 revises at the edge to the power module after demoulding;
Fig. 4 a is the front schematic view of power module finished goods;
Fig. 4 b is the schematic bottom view of power module finished goods;
Fig. 4 c is the perspective diagram of power module finished goods;
Fig. 5 is the schematic diagram that the edge of the magnetic of power module does not exceed the edge of connector;
Fig. 6 is the both sides of the edge of the magnetic of power module schematic diagrames concordant with the edge of connector;
Fig. 7 is the flow chart of the manufacture method of the power module described in the embodiment of the present invention.
Description of reference numerals:
10, mould, 101, die cavity, 20, power module, 100, connector, 110, terminal, 200, coil, 210, coil main body, 220, link, 300, integrated circuit (IC) chip, 400, resistance, 500, electric capacity, 600, magnetic core, 700, magnetic, 800, magnetic mixture, 900, binding agent.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail:
Embodiment one
Referring to figs. 1 through Fig. 7, a kind of manufacture method of power module, comprises the steps:
Connector 100 is set, makes this connector 100 possess default circuit connecting mode, and the terminal 110 that can be connected with exposed electrical is set on this connector 100;
The electronic devices and components at least comprising integrated circuit (IC) chip 300 are configured in the preinstalled circuit connected mode of described connector 100 in the mode be electrically connected, and configure coil 200, and the link of coil is configured in the preinstalled circuit connected mode of described connector 100 in the mode be electrically connected;
Prefabricated die cavity 101, and the connector 100 of coil 200 and electronic devices and components is placed in die cavity 101 by aforementioned arrangements;
Configuration magnetic mixture 800, and described magnetic mixture 800 is filled into placed aforementioned connector 100 die cavity 101 after by while temperature-pressure mode form magnetic 700, described magnetic 700 at least wraps up aforementioned coil 200 and electronic devices and components and described connector 100 for configuring the part of aforementioned coil 200 and electronic devices and components, and described terminal 110 is exposed to the outside of magnetic 700.
With reference to Fig. 1, the periphery being configured with the connector 100 of coil 200 and electronic devices and components is coated with binding agent 900, for improving formed precision and the intensity of magnetic 700.
The manufacture method of power module described in the present embodiment, magnetic mixture 800 is made to wrap up connector 100 to form magnetic 700 by adopting the mode of temperature-pressure simultaneously, magnetic 700 is one-body molded with the connector 100 being configured with coil 200 and electronic devices and components, because forming temperature increases, the shaping required pressure of such power module reduces greatly, avoid the coil 200 damaging magnetic 700 inside, electronic devices and components and connector 100 etc., manufacturing cost reduces, and by power module 20 that hot pressing obtains, the coil 200 of its inside, electronic devices and components and connector 100 are closely wrapped up by magnetic 700, and even can without any space between magnetic 700, not only can obtain the power module 20 of small volume, meet the needs of miniaturization, and the coil 200 of inside, electronic devices and components and connector 100 directly contact with magnetic 700, can farthest uniform heat in the distribution of whole power module 20, its radiating effect further increases, by the inner each element of magnetic 700 available protecting, reduce electromagnetic interference, the electrical characteristic of power module 20 is promoted further.Meanwhile, the mechanical strength of obtained power module 20 also improves greatly, thus makes power module 20 can bear larger vibration environment.Compare with conventional method, owing to not needing well in advance magnetic 700, just there is no the restriction of magnetic 700 sidewall, so the coil 200 that can have more how selectable space matching electronic devices and components or select volume larger, and, because electronic devices and components do not need to be limited in headspace, therefore electronic devices and components can be distributed rationally as required on connector 100, the performance of power module 20 entirety can be improved better, the power module 20 manufactured by this method can obtain more closely packaging effect reliably, greatly improve the moisture resistance properties of product, and the magnetic 700 of described power module 20 and the connection of connector 100 very firm, there is significant anti-seismic performance, in addition, because coil 200 (inductor) does not need additional designs and manufacture, but be just formed simultaneously while manufacture power module 20, therefore the time of production can greatly be shortened, reduce manufacturing cost.
With reference to Fig. 3, further, the manufacture method of described power module, also comprise the step that the connector 100 of the power module 20 after to demoulding and/or described magnetic 700 edge are revised, revise its edge by the mode of the machineries such as cutting, more excellent outward appearance and the precision controlling of Geng Gao can be obtained.
Described in the present embodiment, connector 100 is processed by PCB substrate, and described connector 100 also be can be and becomes to be formed by injection mo(u)lding aft-loaded airfoil by default wire frame.Further, when configuring coil 200 in above-mentioned steps, be connected in the preinstalled circuit connected mode of connector 100 after described coil 200 is wrapped in magnetic core 600 in advance, arranging like this to increase inductance value, improves the electric property of whole power module 20.As shown in Figure 1, described integrated circuit (IC) chip 300, resistance 400, electric capacity 500, magnetic core 600 are configured in the preinstalled circuit connected mode of PCB substrate in the mode be electrically connected.
Further, after described electronic devices and components and coil 200 are connected to connector 100, be also included in the step of described connector 100 and electronic devices and components, the junction of coil 200 and the top coating insulating material of described integrated circuit (IC) chip 300.Generally can use magnetic conductive material to obtain lower impedance, insulating material can prevent short circuit and can reduce the pressure that in manufacture and use procedure, magnetic 700 pairs of electronic devices and components cause further.
Mode by simultaneously temperature-pressure in above-mentioned steps wraps up connector 100 to form magnetic 700, its temperature range is 60 degrees Celsius ~ 200 degrees Celsius, pressure limit is 5 ~ 70 kg/cm, and the temperature-pressure time range under described temperature and pressure scope is 40 ~ 80 minutes.Traditional mode of colding pressing, required pressure is generally 2000-3000 kg/cm, powder just can be made to be shaped to desired shape and size, pressure too conference makes the electronic devices and components of power module 20 inside damage, the insulating barrier of coil 200 also there will be the risk of damage simultaneously, thus cause coil 200 short circuit or " high frequency short circuit ", and coil 200 and connector 100, also the situation of opening a way can be there is because of brute force extruding in the tie point of such as PCB substrate or metal connection frame (HOOP or Lead frame), the field of some particular design or application in addition, inner high density high fragility magnetic core or other components and parts, parts, cracking can be there is due to excessive pressure, affect performance even cannot work.And the method described in the present embodiment, by forming temperature being controlled at 60 degrees Celsius ~ 200 degrees Celsius, Stress control is in 5 ~ 70 kg/cm, and the temperature-pressure time range under described temperature and pressure scope is 40 ~ 80 minutes, can realize shaping, and shaping after power module 20 there is good mechanical strength and electric property.
Described magnetic mixture 800 comprises the Magnaglo of 90 ~ 97 weight portions, described Magnaglo be alloyed powder (as iron silicon/iron sial/iron nickel/iron nickel molybdenum), non-crystalline flour (as Fe-based amorphous/cobalt base amorphous), micro-crystal powder (as iron-based crystallite and cobalt-based crystallite), iron powder, ferrite powder (as nickel zinc/magnesium zinc/MnZn) any one or they arbitrarily between mixture; The resin of 2.8 ~ 9.0 weight portions, described resin is thermosetting resin, as epoxy resin, phenolic resins, based resin, silicones or its two or more hybrid resin, its form has normal temperature solid-state or normal temperature liquid state, and the forming temperature in the present embodiment is determined according to the solidification point of resin; The temperature-pressure time is considered with its particle size distribution according to the shape of the content of resin and Magnaglo; Briquetting pressure is benchmark according to the minimum pressure lower limit that Magnaglo internal part can bear; Concrete property according to Magnaglo defines, and resin needs the collocation of one or several different viscosities to use.Magnaglo needs to reach stronger insulation effect by the insulation processing of itself or the parcel of resin, wherein said magnetic mixture 800, as alloyed powder, non-crystalline flour, micro-crystal powder, ferrite powder can not do insulation processing, iron powder mainly uses insulating material NaOH (NaOH), ammonia (NH3), soluble phosphate, additional nitrogen protection, through stirring, heat treatment, classification is sieved, carry out insulation processing, the content of its insulating material is 0.3-1 weight portion, by carrying out insulation processing to Magnaglo, make the magnetic 700 suppressed to the circuit chip 300 of its inside, resistance 400, electric capacity 500 etc. has reliable insulating effect, reduce electromagnetic interference, promote the electrical characteristic of power module 20.
Traditional cold compaction process, also needs heat treatment after shaping, and the method described in the present embodiment gets up shaping and combined with heat treatment, and technique is simplified and shortens.And cold moudling needs to ensure to obtain required formed body and size by Magnaglo such as " adhesion " of iron powder body and the glue of proper viscosity, and in order to ensure that power module does not ftracture after cold moudling and heat treatment, minimum thickness requirement is formed to iron powder and internal part has dimensional requirement, this limitation limits size and the structure of power module internal part, is unfavorable for the optimization process of internal part.And the method described in the present embodiment, magnetic 700 after shaping by the solidification bonding force that resin is powerful, iron powder is fixed, the molding thickness of iron powder requires greatly to reduce, the intensity of power module and the part design of flexibility magnetic 700 inside can be ensured, by adjusting the optimization of magnetic 700 internal part structure or increasing suitable parts (as bar magnet, magnetic cap) make up even strengthen power module electric property (as larger inductance, better saturation characteristic, less resistance etc.).
Described magnetic mixture 800 also comprises the additive of 0.2 ~ 1.0 weight portion, described additive mainly contains following a few class: 1) zinc stearate (or dolomol, or barium stearate), for increasing the mobility of Magnaglo, improve the even transmission of pressure; 2) phosphoric acid hydrogen ammonia, strengthens the insulation characterisitic of iron powder; 3) low melting point (80-100 degree) plasticiser; 4) calcium carbonate: increase macromolecule resin in conjunction with mechanical strength; 5) ethylene propylene diene rubber: the tensile elastic intensity increasing resin; Needed for embody rule, add wherein one or more.
Embodiment two
The manufacture method of the power module described in the present embodiment, described magnetic mixture 800 is the iron powder of 95 ~ 97 weight portions, alloyed powder, non-crystalline flour, any one or any two or more mixed-powder between them in micro-crystal powder, the epoxy resin of 2.5 ~ 5 weight portions, silicones, any one or any two or more hybrid resin between them in phenolic resins, and 0.2 ~ 0.4 additive of weight portion, institute's plus-pressure is 40 ~ 60 kg/cm, heating degree is 120 ~ 150 degrees Celsius, and the temperature-pressure time under described temperature and pressure scope is 1 ~ 2 hour.Method described in the present embodiment, shaping best effects is ensured by configuring suitable magnetic mixture 800, by increasing forming temperature, the prolongation temperature-pressure time reduces briquetting pressure, ensure that magnetic 700 internal part is not impaired, the power module 20 that compacting is drawn has good mechanical strength and electric property.
Embodiment three
The manufacture method of the power module described in the present embodiment, described magnetic mixture 800 is the iron powder of 92.5 weight portions, alloyed powder, non-crystalline flour, any one or any two or more mixed-powder between them in micro-crystal powder, the epoxy resin of 7.0 weight portions, silicones, any one or any two or more hybrid resin between them in phenolic resins, and 0.5 additive of weight portion, institute's plus-pressure is 40 kg/cm, heating degree is 150 degrees Celsius, and the temperature-pressure time under described temperature and pressure scope is 1 hour.With reference to Fig. 2, integrated circuit (IC) chip 300 is configured with in Fig. 1 shown in figure, resistance 400, electric capacity 500, the PCB substrate of magnetic core 600 is arranged in mould 10, magnetic mixture 800 is wrapped in PCB substrate periphery by simultaneously temperature-pressure and forms magnetic 700, method described in the present embodiment, shaping best effects is ensured by configuring suitable magnetic mixture 800, by increasing forming temperature, the prolongation temperature-pressure time reduces briquetting pressure, ensure that magnetic 700 internal part is not impaired, the power module 20 that compacting is drawn has good mechanical strength and electric property.
Embodiment four
The manufacture method of the power module described in the present embodiment, the iron powder of the magnetic mixture 92.5kg of the present embodiment configuration, the epoxy resin of 7.0kg, and the additive of 0.5kg, described additive comprise in zinc stearate, phosphoric acid hydrogen ammonia, low melting point (80-100 degree) plasticiser, calcium carbonate, ethylene propylene diene rubber one or more, institute's plus-pressure is 40 kg/cm, and heating degree is 150 degrees Celsius, and the temperature-pressure time under described temperature and pressure scope is 1 hour.Method described in the present embodiment, shaping best effects is ensured by configuring suitable magnetic mixture 800, by increasing forming temperature, the prolongation temperature-pressure time reduces briquetting pressure, ensure that magnetic 700 inner member is not impaired, the power module 20 that compacting is drawn has good mechanical strength and electric property.
Embodiment five
Present embodiments provide a kind of power module 20 obtained by said method manufacture, its technical scheme is as follows:
Referring to figs. 1 through Fig. 6, a kind of power module 20, comprising:
Coil 200, comprises coil main body 210 and link 220;
Electronic devices and components, these electronic devices and components at least comprise integrated circuit (IC) chip 300;
Connector 100, this connector 100 is electrically connected with described coil 200 and electronic devices and components, and this connector 100 has the terminal 110 that can be connected with exposed electrical;
Magnetic 700, described coil 200, electronic devices and components closely wrap up by this magnetic 700, and described coil 200, not interspace between electronic devices and components and magnetic 700, this magnetic at least covers described coil 200 and electronic devices and components and described connector 100 for configuring the part of aforementioned coil 200 and electronic devices and components, and terminal 110 on described connector 100 is outside exposed.
Power module 20 described in the present embodiment, by arranging magnetic 700 by coil 200, electronic devices and components closely wrap up, make coil 200, do not interspace between electronic devices and components and magnetic 700, make coil 200, electronic devices and components and connector 100 directly contact with magnetic 700, can farthest uniform heat in the distribution of whole power module 20, the radiating effect of further raising power module 20, magnetic 700 at least covers described coil 200 and electronic devices and components and described connector 100 for configuring the part of aforementioned coil 200 and electronic devices and components, and terminal 110 on connector 100 is outside exposed, such magnetic 700 can the inner each element of available protecting, reduce electromagnetic interference, the electrical characteristic of power module 20 is promoted further.
Electronic devices and components described in the present embodiment comprise resistance 400, electric capacity 500, integrated circuit (IC) chip 300, and described integrated circuit (IC) chip 300 is integrated with MOSFET, the unit module that drive circuit, pulse width modulator and controller are integrated.Described electronic devices and components also only can arrange integrated circuit (IC) chip, and this integrated circuit (IC) chip is integrated with resistance, electric capacity, MOSFET, and the unit module that drive circuit, pulse width modulator and controller are integrated.Or described electronic devices and components comprise MOSFET, integrated circuit (IC) chip, described integrated circuit (IC) chip is integrated with the unit module that resistance, electric capacity, drive circuit, pulse width modulator and controller be integrated.According to the actual requirements, described integrated circuit (IC) chip 300 can arrange multiple.Described connector 100 is printed circuit board (PCB), and described connector 100 also can be comprise connecting circuit and plastic cement insulating body, the structure that described connecting circuit wraps up by described plastic cement insulating body.
With reference to Fig. 1, described in the present embodiment, power module 20 also comprises magnetic core 600, is fixed on described connector 100 on after being electrically connected after this magnetic core 600 is wound around by described coil main body 210 by the coil mounting terminal on the link 220 of described coil and described connector 100.In the present embodiment, magnetic core is column magnetic core, and according to the actual requirements, described magnetic core can be any one or a few combination of rivet-like magnetic core, column magnetic core, I-type magnetic core, sheet magnetic core.The magnetic permeability of described magnetic core 600 is higher than the magnetic permeability of described magnetic 700, because magnetic core 600 adopts the technique of high density high sintering temperature to make, higher than low-density magnetic 700 magnetic permeability, such magnetic core 600 can make up the deficiency of the magnetic 700 of low magnetic permeability, plays supplementary function to power module 20 overall performance.
Described in the present embodiment, coil 200 is one, and described coil 200 is positioned at the side of described electronic devices and components.According to power module 20 internal structure demand, described coil 200 also can be arranged on the top of described electronic devices and components.According to the actual requirements, described coil 200 can arrange multiple, and described coil 200 is positioned at side and/or the top of described electronic devices and components.
Described magnetic 700 and coil 200, electronic devices and components and connector 100 are combined closely, and do not interspace between magnetic 700 and coil 200, electronic devices and components and connector 100.Not only can obtain the power module 20 of small volume; meet the needs of miniaturization; and the coil 200 of inside, electronic devices and components and connector 100 directly contact with magnetic; can farthest uniform heat in the distribution of whole power module; its radiating effect further increases, thus can reduce conducting resistance and the conduction loss of MOSFET, simultaneously by the inner each element of magnetic available protecting; reduce electromagnetic interference, the electrical characteristic of power module 20 is promoted further.
Described magnetic is formed by the mode adding gentle pressurization simultaneously by the mixture of Magnaglo and resin.Described Magnaglo comprises the Magnaglo of 95 ~ 97 weight portions, the resin of 2.5 ~ 5 weight portions.Power module 20 described in the present embodiment, arranges the magnetic formed by the magnetic mixture 800 of suitable configurations, and by increasing forming temperature, the prolongation temperature-pressure time reduces briquetting pressure, makes power module 20 have good mechanical strength and electric property.
With reference to Fig. 4 a, 4b, 4c, Fig. 5, Fig. 6, the edge of described magnetic 700 does not exceed the edge of described connector 100.According to the actual requirements, also can arrange in polygon by described connector 100, described magnetic 700 is also for corresponding polygon and its edge at least does not exceed the edge of described connector 100.
The above embodiment only have expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (34)
1. a manufacture method for power module, is characterized in that, comprises the steps:
Connector is set, makes this connector possess default circuit connecting mode, and the terminal that can be connected with exposed electrical is set on this connector;
The electronic devices and components at least comprising integrated circuit (IC) chip are configured in the preinstalled circuit connected mode of described connector in the mode be electrically connected, and configure coil, and the link of coil is configured in the preinstalled circuit connected mode of described connector in the mode be electrically connected;
Prefabricated die cavity, and the connector of coil and electronic devices and components is placed in die cavity by aforementioned arrangements;
Configuration magnetic mixture, and the mode by simultaneously temperature-pressure after described magnetic mixture being filled into the die cavity that placed aforementioned connector forms magnetic, described magnetic at least wraps up aforementioned coil and electronic devices and components and described connector for configuring the part of aforementioned coil and electronic devices and components, and described terminal is exposed to the outside of magnetic.
2. the manufacture method of power module according to claim 1, it is characterized in that, mode by simultaneously temperature-pressure in above-mentioned steps wraps up connector to form magnetic, and its temperature range is 60 degrees Celsius ~ 200 degrees Celsius, and pressure limit is 5 ~ 70 kg/cm.
3. the manufacture method of power module according to claim 2, is characterized in that, the temperature-pressure time range under described temperature and pressure scope is 40 ~ 80 minutes.
4. the manufacture method of power module according to claim 1, is characterized in that, described magnetic mixture comprises the Magnaglo of 90 ~ 97 weight portions, the resin of 2.8 ~ 9.0 weight portions.
5. the manufacture method of power module according to claim 4, is characterized in that, described magnetic mixture also comprises the additive of 0.2 ~ 1.0 weight portion.
6. the manufacture method of the power module according to any one of claim 4 to 5, it is characterized in that, described Magnaglo is any one or any two or more mixed-powder between them in alloyed powder, non-crystalline flour, micro-crystal powder, iron powder, ferrite powder.
7. the manufacture method of the power module according to any one of claim 4 to 5, is characterized in that, described resin is thermosetting resin.
8. the manufacture method of power module according to claim 1, it is characterized in that, described magnetic mixture is the iron powder of 95 ~ 97 weight portions, alloyed powder, non-crystalline flour, any one or any two or more mixed-powder between them in micro-crystal powder, the epoxy resin of 2.5 ~ 5 weight portions, silicones, any one or any two or more hybrid resin between them in phenolic resins, and 0.2 ~ 0.4 additive of weight portion, institute's plus-pressure is 40 ~ 60 kg/cm, heating degree is 120 ~ 150 degrees Celsius, and the temperature-pressure time under described temperature and pressure scope is 1 ~ 2 hour.
9. the manufacture method of power module according to claim 1, it is characterized in that, described magnetic mixture is the iron powder of 92.5 weight portions, alloyed powder, non-crystalline flour, any one or any two or more mixed-powder between them in micro-crystal powder, the epoxy resin of 7.0 weight portions, silicones, any one or any two or more hybrid resin between them in phenolic resins, and 0.5 additive of weight portion, institute's plus-pressure is 40 kg/cm, heating degree is 150 degrees Celsius, and the temperature-pressure time under described temperature and pressure scope is 1 hour.
10. the manufacture method of the power module according to any one of Claims 1-4, is characterized in that, described connector is processed by PCB substrate.
The manufacture method of 11. power modules according to any one of Claims 1-4, is characterized in that, described connector is become to be formed by injection mo(u)lding aft-loaded airfoil by default wire frame.
The manufacture method of 12. power modules according to any one of Claims 1-4, it is characterized in that, after described electronic devices and components and coil are connected to connector, be also included in the step of described connector and electronic devices and components, the junction of coil and the top coating insulating material of described integrated circuit (IC) chip.
The manufacture method of 13. power modules according to any one of Claims 1-4, is characterized in that, when configuring coil in above-mentioned steps, be connected in the preinstalled circuit connected mode of connector after described coil is wrapped in magnetic core in advance.
The manufacture method of 14. power modules according to any one of Claims 1-4, is characterized in that, also comprises the step that the connector of the power module after to demoulding and/or described magnetic edge are revised.
15. 1 kinds of power modules, is characterized in that, comprising:
Coil, comprises coil main body and link;
Electronic devices and components, these electronic devices and components at least comprise integrated circuit (IC) chip;
Connector, this connector and described coil and electronic devices and components are electrically connected, and this connector have the terminal that can be connected with exposed electrical;
Magnetic, described coil, electronic devices and components closely wrap up by this magnetic, and described coil, not interspace between electronic devices and components and magnetic, this magnetic at least covers described coil and electronic devices and components and described connector for configuring the part of aforementioned coil and electronic devices and components, and terminal on described connector is outside exposed.
16. power modules according to claim 15, is characterized in that, described magnetic and coil, electronic devices and components and connector are combined closely, and magnetic and not interspacing between coil, electronic devices and components and connector.
17. power modules according to claim 15, is characterized in that, described magnetic is formed by the mode adding gentle pressurization simultaneously by the mixture of Magnaglo and resin.
18. power modules according to claim 17, is characterized in that, described Magnaglo comprises the Magnaglo of 95 ~ 97 weight portions, the resin of 2.5 ~ 5 weight portions.
19. power modules according to claim 15, is characterized in that, this power module also comprises magnetic core, are fixed on described connector on after being electrically connected after this magnetic core is wound around by described coil main body by the link of described coil and described connector.
20. power modules according to claim 19, is characterized in that, described magnetic core is any one or a few combination of rivet-like magnetic core, column magnetic core, I-type magnetic core, sheet magnetic core.
21. power modules according to claim 19, is characterized in that, the magnetic permeability of described magnetic core is higher than the magnetic permeability of described magnetic.
22. power modules according to claim 15, is characterized in that, described coil is one, and described coil is positioned at the top of described electronic devices and components.
23. power modules according to claim 15, is characterized in that, described coil is one, and described coil is positioned at the side of described electronic devices and components.
24. power modules according to claim 15, is characterized in that, described coil is multiple, and described coil is positioned at side and/or the top of described electronic devices and components.
25. power modules according to claim 15, is characterized in that, described connector is printed circuit board (PCB).
26. power modules according to claim 15, is characterized in that, described connector comprises connecting circuit and plastic cement insulating body, and described connecting circuit wraps up by described plastic cement insulating body.
27. power modules according to claim 15, is characterized in that, described integrated circuit (IC) chip is multiple.
28. according to claim 15 to the power module according to any one of 27, it is characterized in that, described electronic devices and components are integrated circuit (IC) chip, and this integrated circuit (IC) chip is integrated with resistance, electric capacity, MOSFET, and the unit module that drive circuit, pulse width modulator and controller are integrated.
29., according to claim 15 to the power module according to any one of 27, is characterized in that, described electronic devices and components also comprise resistance and/or electric capacity.
30. power modules according to claim 29, is characterized in that, described integrated circuit (IC) chip is integrated with MOSFET, the unit module that drive circuit, pulse width modulator and controller are integrated.
31., according to claim 15 to the power module according to any one of 27, is characterized in that, described electronic devices and components also comprise MOSFET.
32. power modules according to claim 31, is characterized in that, described integrated circuit (IC) chip is integrated with the unit module that resistance, electric capacity, drive circuit, pulse width modulator and controller be integrated.
33., according to claim 15 to the power module according to any one of 27, is characterized in that, the edge of described magnetic does not exceed the edge of described connector.
34., according to claim 15 to the power module according to any one of 27, is characterized in that, described connector is polygon, and described magnetic is also for corresponding polygon and its edge at least does not exceed the edge of described connector.
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| CN201410453323.6A CN104300766B (en) | 2014-09-05 | 2014-09-05 | Power module and its manufacture method |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102256443A (en) * | 2010-04-02 | 2011-11-23 | 雅达电子国际有限公司 | Inductors occupying space above circuit board components |
| CN102810392A (en) * | 2011-05-31 | 2012-12-05 | 美桀电子科技(深圳)有限公司 | Thin closed magnetic circuit inductor and manufacturing method thereof |
| CN102857088A (en) * | 2012-08-28 | 2013-01-02 | 胜美达电机（香港）有限公司 | Power supply module |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102256443A (en) * | 2010-04-02 | 2011-11-23 | 雅达电子国际有限公司 | Inductors occupying space above circuit board components |
| CN102810392A (en) * | 2011-05-31 | 2012-12-05 | 美桀电子科技(深圳)有限公司 | Thin closed magnetic circuit inductor and manufacturing method thereof |
| CN102857088A (en) * | 2012-08-28 | 2013-01-02 | 胜美达电机（香港）有限公司 | Power supply module |
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