CN104294200A - Copper wire tinning equipment - Google Patents
Copper wire tinning equipment Download PDFInfo
- Publication number
- CN104294200A CN104294200A CN201410501201.XA CN201410501201A CN104294200A CN 104294200 A CN104294200 A CN 104294200A CN 201410501201 A CN201410501201 A CN 201410501201A CN 104294200 A CN104294200 A CN 104294200A
- Authority
- CN
- China
- Prior art keywords
- annealing furnace
- zinc
- frame
- wire
- pond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
Abstract
The invention discloses copper wire tinning equipment. The copper wire tinning equipment comprises a wire releasing frame, an annealing furnace, a soldering aid device, a tinning tank and a tapping device, wherein a wire coil is arranged on the wire releasing frame, the annealing furnace is arranged at the right side of the wire releasing frame, the right side of the annealing furnace is connected with the soldering aid device, the tinning tank is arranged at the right side of the soldering aid device, the tapping device is arranged on the wire releasing frame, the annealing furnace, the soldering device and the tinning tank and is used for tapping a copper wire. A copper wire is firstly released from the wire coil, enters into the annealing furnace by virtue of a guiding ring and a wire guiding pipe to be softened in the annealing furnace, then enters into a hydrochloric acid tank by virtue of a wire guiding pipe to be subjected to acid pickling and deoiling, is tapped into a heating plate by virtue of a guiding rod and a tapping frame to be heated by the heating plate, then is tapped into the tinning tank by virtue of a guiding column and a guiding frame to be tinned and finally is lead out by the guiding frame. The copper wire tinning equipment is simple in structure, good in tinning effect and relatively low in invested cost.
Description
Technical field
The present invention relates to copper wire tin-plating field, particularly relate to a kind of copper wire tin plating equipment.
Background technology
The copper cash that China's technique is used, as-annealed condition is necessary for before zinc-plated, so first copper cash must be carried out sofening treatment on special annealing furnace, and zinc-plated before also to carry out pickling to copper line surface, help weldering, to remove the oxide film of copper line surface, improve the performances such as resistance to corrosion, at present, process for plating copper wire with tin also has problems, stable not during copper wire tin-plating, affect the performance of copper cash, and copper cash surface when through overpickling can be attached with hydrochloric acid solution, or be to produce copper sludge at high-speed motion, be easy to like this affect zinc-plated effect, and draw that tension control when getting copper cash is bad also affects its zinc-plated effect, therefore, the problem solving this class seems particularly important.
Summary of the invention
The object of this invention is to provide a kind of copper wire tin plating equipment, by being provided with pay off rack, annealing furnace, soldering device, drawing and get device and zinc-plated pond, to solve the problem of prior art zinc-plated effect instability, zinc-plated weak effect.
In order to solve the problem, the invention provides a kind of copper wire tin plating equipment, include pay off rack, annealing furnace, soldering device, zinc-plated pond and draw and get device, described pay off rack is provided with drum, the right side of described pay off rack is provided with annealing furnace, the right side of described annealing furnace is connected with soldering device, and the right side of described soldering device is provided with zinc-plated pond, described in draw and get device and be arranged on pay off rack, annealing furnace, soldering device and zinc-plated pond be used for drawing and get copper cash.
Further improvement is: the right-hand member of described pay off rack is provided with guide ring, and the left end of annealing furnace is provided with wire conduit, and the copper cash on drum is entered in annealing furnace by guide ring, wire conduit and softens.
Further improvement is: described soldering device includes hydrochloric acid pond, the right-hand member of described annealing furnace is provided with wire conduit, one end of described wire conduit is connected in hydrochloric acid pond, described hydrochloric acid pond is provided with tail rod, the right side of tail rod is provided with small-sized rag plate, the right side of described small-sized rag plate is provided with to draw gets frame, described in draw the right-hand member getting frame and be provided with lifting mechanism.
Further improvement is: described in draw the right side of getting frame and be provided with hot-plate, described hot-plate is provided with two openable lid doors.
Further improvement is: the right side of described hot-plate is provided with zinc-plated pond, the middle part in described zinc-plated pond is provided with guidepost, guidepost is fixed on zinc-plated pond by fixed block, the left end in described zinc-plated pond is provided with storage rack, storage rack is provided with large-scale rag, the left side of described storage rack is provided with guide frame, and the right side in described zinc-plated pond is provided with guide frame.
Further improvement is: described guide ring, wire conduit, tail rod, draw get frame, guidepost, guide frame be to draw and get device.
The invention has the beneficial effects as follows: get device by being provided with pay off rack and annealing furnace and drawing, can be intact copper cash put into annealing furnace soften, be used for carrying out pickling to copper cash by being provided with soldering device, help weldering, remove the greasy dirt of copper line surface, oxide film, and by being provided with tail rod, small-sized rag plate gets frame with drawing, tail rod and drawing is got frame and is used for drawing and gets copper cash, small-sized rag plate is used for cleaning the hydrochloric acid on copper cash, and being provided with lifting mechanism can regulate copper cash to draw the direction of getting, by being provided with hot-plate, be used for drying to improve the effect of aluminizing to copper cash, by being provided with storage rack and large-scale rag, copper cash passes through rubbing effect before entering zinc-plated pond, by large-scale film rag by the spot of copper line surface, copper sludge cleans out, improve the zinc-plated effect of copper cash, draw and get being provided with to draw and getting copper cash of device, facilitate the zinc-plated of copper cash maximum efficiency.Structure of the present invention is simple, and zinc-plated effect is fine, and input cost is lower.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present invention.
Wherein: 1-pay off rack, 2-annealing furnace, 3-soldering device, the zinc-plated pond of 4-, 5-drum, 6-guide ring, 7-spool, 8-hydrochloric acid pond, 9-tail rod, 10-small-sized rag plate, 11-draws and gets frame, 12-lifting mechanism, 13-hot-plate, 14-lid door, 15-guidepost, 16-fixed block, 17-storage rack, the large-scale rag of 18-, 19-guide frame.
Embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the invention will be further described, and the present embodiment only for explaining the present invention, does not form limiting the scope of the present invention.
As shown in Figure 1, present embodiments provide a kind of copper wire tin plating equipment, include pay off rack 1, annealing furnace 2, soldering device 3, zinc-plated pond 4 and draw and get device, described pay off rack 1 is provided with drum 5, the right side of described pay off rack 1 is provided with annealing furnace 2, the right side of described annealing furnace 2 is connected with soldering device 3, and the right side of described soldering device 3 is provided with zinc-plated pond 4, described in draw and get device and be arranged on pay off rack 1, annealing furnace 2, soldering device 3 and zinc-plated pond 4 be used for drawing and get copper cash.The right-hand member of described pay off rack 1 is provided with guide ring 6, and the left end of annealing furnace 2 is provided with wire conduit 7, and the copper cash on drum 5 is entered in annealing furnace 2 by guide ring 6, wire conduit 7 and softens.Described soldering device 3 includes hydrochloric acid pond 8, the right-hand member of described annealing furnace 2 is provided with wire conduit 7, one end of described wire conduit 7 is connected in hydrochloric acid pond 8, described hydrochloric acid pond 8 is provided with tail rod 9, the right side of tail rod 9 is provided with small-sized rag plate 10, the right side of described small-sized rag plate 10 is provided with to draw gets frame 11, described in draw the right-hand member getting frame 11 and be provided with lifting mechanism 12.The described right side of getting frame 11 of drawing is provided with hot-plate 13, described hot-plate 13 is provided with two openable lid doors 14.The right side of described hot-plate 13 is provided with zinc-plated pond 4, the middle part in described zinc-plated pond 4 is provided with guidepost 15, guidepost 15 is fixed on zinc-plated pond 4 by fixed block 16, the left end in described zinc-plated pond 4 is provided with storage rack 17, storage rack 17 is provided with large-scale rag 18, the left side of described storage rack 17 is provided with guide frame 19, and the right side in described zinc-plated pond 4 is provided with guide frame 19.Described guide ring 6, wire conduit 7, tail rod 9, draw get frame 11, guidepost 15, guide frame 19 be to draw and get device.Copper cash is first released from drum 5, enter annealing furnace 2 by guide ring 6 and wire conduit 7 to soften, then carry out pickling and deoil being entered hydrochloric acid pond 8 by wire conduit 7, and get frame 11 by tail rod 9 and drawing and draw to get in hot-plate 13 and heat, being drawn by copper cash to get finally by guidepost 15 and guide frame 19 carries out zinc-plated in zinc-plated pond 4, finally drawn by guide frame 19.
Device is got by being provided with pay off rack 1 and annealing furnace 2 and drawing, annealing furnace 2 of being put into by copper cash that can be intact softens, be used for carrying out pickling to copper cash by being provided with soldering device 3, help weldering, remove the greasy dirt of copper line surface, oxide film, and by being provided with tail rod 9, small-sized rag plate 10 gets frame 11 with drawing, tail rod 9 and drawing is got frame 11 and is used for drawing and gets copper cash, small-sized rag plate 10 is used for cleaning the hydrochloric acid on copper cash, and being provided with lifting mechanism 12 can regulate copper cash to draw the direction of getting, by being provided with hot-plate 13, be used for drying to improve the effect of aluminizing to copper cash, by being provided with storage rack 17 and large-scale rag 18, copper cash passes through rubbing effect before entering zinc-plated pond, by large-scale film rag 18 by the spot of copper line surface, copper sludge cleans out, improve the zinc-plated effect of copper cash, draw and get being provided with to draw and getting copper cash of device, facilitate the zinc-plated of copper cash maximum efficiency.Structure of the present invention is simple, and zinc-plated effect is fine, and input cost is lower.
Claims (6)
1. a copper wire tin plating equipment, it is characterized in that: include pay off rack (1), annealing furnace (2), soldering device (3), zinc-plated pond (4) and draw and get device, described pay off rack (1) is provided with drum (5), the right side of described pay off rack (1) is provided with annealing furnace (2), the right side of described annealing furnace (2) is connected with soldering device (3), the right side of described soldering device (3) is provided with zinc-plated pond (4), described in draw and get device and be arranged on pay off rack (1), annealing furnace (2), soldering device (3) and zinc-plated pond (4) are used for drawing and get copper cash.
2. a kind of copper wire tin plating equipment as claimed in claim 1, it is characterized in that: the right-hand member of described pay off rack (1) is provided with guide ring (6), the left end of annealing furnace (2) is provided with wire conduit (7), and the copper cash on drum (5) is entered in annealing furnace (2) softened by guide ring (6), wire conduit (7).
3. a kind of copper wire tin plating equipment as claimed in claim 1, it is characterized in that: described soldering device (3) includes hydrochloric acid pond (8), the right-hand member of described annealing furnace (2) is provided with wire conduit (7), one end of described wire conduit (7) is connected in hydrochloric acid pond (8), described hydrochloric acid pond (8) is provided with tail rod (9), the right side of tail rod (9) is provided with small-sized rag plate (10), the right side of described small-sized rag plate (10) is provided with to draw gets frame (11), described in draw the right-hand member getting frame (11) and be provided with lifting mechanism (12).
4. a kind of copper wire tin plating equipment as claimed in claim 3, is characterized in that: described in draw the right side of getting frame (11) and be provided with hot-plate (13), described hot-plate (13) is provided with two openable lid doors (14).
5. a kind of copper wire tin plating equipment as claimed in claim 1, it is characterized in that: the right side of described hot-plate (13) is provided with zinc-plated pond (4), the middle part of described zinc-plated pond (4) is provided with guidepost (15), guidepost (15) is fixed on zinc-plated pond (4) by fixed block (16), the left end of described zinc-plated pond (4) is provided with storage rack (17), storage rack (17) is provided with large-scale rag (18), the left side of described storage rack (17) is provided with guide frame (19), and the right side of described zinc-plated pond (4) is provided with guide frame (19).
6. a kind of copper wire tin plating equipment as claimed in claim 1, is characterized in that: described guide ring (6), wire conduit (7), tail rod (9), draw get frame (11), guidepost (15), guide frame (19) be to draw and get device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410501201.XA CN104294200A (en) | 2014-09-26 | 2014-09-26 | Copper wire tinning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410501201.XA CN104294200A (en) | 2014-09-26 | 2014-09-26 | Copper wire tinning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104294200A true CN104294200A (en) | 2015-01-21 |
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ID=52314146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410501201.XA Pending CN104294200A (en) | 2014-09-26 | 2014-09-26 | Copper wire tinning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104294200A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106399890A (en) * | 2015-08-11 | 2017-02-15 | 天津德祥鹏金属制品有限公司 | Tinning device of copper wires |
| CN110904401A (en) * | 2019-12-30 | 2020-03-24 | 江苏山峰铜业科技有限公司 | Bare copper tinning process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201770763U (en) * | 2010-01-19 | 2011-03-23 | 东莞市精锋电工机械有限公司 | Automatic soldering machine |
| CN102115862A (en) * | 2010-12-31 | 2011-07-06 | 周开勇 | Circulating tin plating process and device |
| CN102994933A (en) * | 2012-11-26 | 2013-03-27 | 江阴亿欣新材料科技有限公司 | Soldering strip production line |
| CN103014255A (en) * | 2011-09-27 | 2013-04-03 | 吴江市中信科技有限公司 | Annealing wire rewinding machine for copper clad aluminum wire |
| CN204224685U (en) * | 2014-09-26 | 2015-03-25 | 安徽蛟龙科技股份有限公司 | A kind of copper wire tin plating equipment |
-
2014
- 2014-09-26 CN CN201410501201.XA patent/CN104294200A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201770763U (en) * | 2010-01-19 | 2011-03-23 | 东莞市精锋电工机械有限公司 | Automatic soldering machine |
| CN102115862A (en) * | 2010-12-31 | 2011-07-06 | 周开勇 | Circulating tin plating process and device |
| CN103014255A (en) * | 2011-09-27 | 2013-04-03 | 吴江市中信科技有限公司 | Annealing wire rewinding machine for copper clad aluminum wire |
| CN102994933A (en) * | 2012-11-26 | 2013-03-27 | 江阴亿欣新材料科技有限公司 | Soldering strip production line |
| CN204224685U (en) * | 2014-09-26 | 2015-03-25 | 安徽蛟龙科技股份有限公司 | A kind of copper wire tin plating equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106399890A (en) * | 2015-08-11 | 2017-02-15 | 天津德祥鹏金属制品有限公司 | Tinning device of copper wires |
| CN110904401A (en) * | 2019-12-30 | 2020-03-24 | 江苏山峰铜业科技有限公司 | Bare copper tinning process |
| CN110904401B (en) * | 2019-12-30 | 2021-11-30 | 江苏山峰铜业科技有限公司 | Bare copper tinning process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150121 |