CN104282409A - Laminated electronic component - Google Patents
Laminated electronic component Download PDFInfo
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- CN104282409A CN104282409A CN201410303008.5A CN201410303008A CN104282409A CN 104282409 A CN104282409 A CN 104282409A CN 201410303008 A CN201410303008 A CN 201410303008A CN 104282409 A CN104282409 A CN 104282409A
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- connecting portion
- pattern
- electronic component
- laminated
- type electronic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Abstract
The present invention provides a laminated electronic component which can suppress occurrence of a structural defect such as a crack and includes a coil having a small direct-current resistance value. A laminated electronic component 100 is configured such that insulator layers 100L0-100L27 and conductor patterns 100a are laminated and a coil is formed in a laminate by connecting the conductor patterns 100a among the insulator layers. The laminated electronic component 100 is characterized in that the coil includes conductor pattern pairs each composed of two conductor patterns (for example, conductor pattern 100L12a and conductor pattern 100L15a) arranged so as to sandwich each insulator layer, and includes a first connecting portion 100bc connecting both end portions of the two conductor patterns so as to connect the two connecting patterns in parallel and a second connecting portion 100d connecting a plurality of the conductor pattern pairs in series, wherein the first connecting portion 100bc and the second connecting portion 100d are arranged so as to be displaced from each other in a direction of a line length of a coil pattern.
Description
Technical field
The present invention relates to a kind ofly has the layered product of insulator layer and conductive pattern inside to be formed with the laminated-type electronic component of circuit at lamination.
Background technology
Along with miniaturization, the high performance of mobile device, as the inductor for power circuit with DCDC exchanger function, what use at present has small-sized laminated-type power inductor.Owing to being more prone to big current in recent years, therefore need the inductor specification with lower D.C. resistance characteristic.
As the method reducing D.C. resistance, such as, there is the area of section increasing inner conductor, and shorten the method for line length.But if widen conductor width, then the method increasing area of section causes reducing magnetic flux through area and reduction inductance value.In addition, if increase conductor thickness, then inner conductor when being easily subject to sintering shrinkage and the shrinkage of Ferrite Material, and the impact of the stress of the difference expanded by difference and the line of contraction process etc., cause the fault of construction as crackle etc.
As solution to the problems described above, such as, disclose in the middle of patent documentation 1 by bonding conductor pattern arranged side by side without the need to reducing the method for D.C. resistance with increasing conductor thickness.But, in the method for patent documentation 1, owing to connecting the conductor of upper and lower four layers in conductor coupling portion, cause segment conductor thickening, therefore cause the problem of the fault of construction occurred as crackle etc.
In addition, Patent Document 2 discloses the method being undertaken being connected side by side by being combined to form conductive pattern on 3/4t ~ 1t and the conductive pattern be formed on 1t.But, in patent documentation 2, have the part (not being part arranged side by side) that conductive pattern is 1 layer, and have the problem that D.C. resistance on the portion obviously increases.
Look-ahead technique document
Patent documentation
Patent documentation 1: Unexamined Patent 8-130115 publication
Patent documentation 2: specially permit No. 4973996 publication
Summary of the invention
The object of the present invention is to provide a kind of generation that can control the fault of construction of crackle etc., and comprise the laminated-type electronic component of the little coil of D.C. resistance.
The present invention solves above-mentioned problem by following solution.But, for the ease of understanding, by being described embodiments of the present invention label symbol, but be not limited thereto.
The invention of claim 1 is a kind of laminated-type electronic component, its lamination has insulator layer (100L0 to 100L27, 200L0 to 200L27, 300L0 to 300L27) and conductive pattern (100a, 200a, 300a), and described conductive pattern is connected between described insulator layer, to form coil in layered product, described laminated-type electronic component (100, 200, 300) feature is, described coil has pair of conductors pattern, described pair of conductors pattern is formed by clipping stacked two conductive patterns of described insulator layer, first connecting portion (100bc, 200bc, 300bc), connected by described first connecting portion between the both ends of described two conductive patterns, to connect described two conductive patterns side by side, second connecting portion (100d, 200d, 300d), the described pair of conductors pattern of many groups is connected in series by described second connecting portion, described first connecting portion and described second connecting portion is configured by the mutual comparatively long transmission line direction staggered positions to coil pattern.
The laminated-type electronic component (100) that claim 2 is invented, it is characterized in that, in the middle of laminated-type electronic component according to claim 1, the projection of shape of observing from laminating direction is made not configure described first connecting portion (100bc) and described second connecting portion (100d) overlappingly.
The laminated-type electronic component (300) that claim 3 is invented, it is characterized in that, in the middle of laminated-type electronic component according to claim 1, the projection of shape local observed from laminating direction is made to configure described first connecting portion (200bc overlappingly, 300bc) with described second connecting portion (200d, 300d).
The laminated-type electronic component (100 that claim 4 is invented, 200,300), it is characterized in that, in the laminated-type electronic component according to any one of claims 1 to 3, be parallel on the cross section compared with long transmission line direction perpendicular to laminate surface, by be positioned at be connected in series described pair of conductors pattern wherein side on described first connecting portion; Be arranged at least one of two conductive patterns on the wherein side being connected in series described pair of conductors pattern; Described second connecting portion; Be arranged at least one of two conductive patterns on the opposite side being connected in series described pair of conductors pattern, and, be positioned at be connected in series described pair of conductors pattern opposite side on described first connecting portion, the current path of described coil is made to configure described first connecting portion (100bc as the crow flies, 200bc, 300bc) with described second connecting portion (100d, 200d, 300d)
The invention of claim 5 is a kind of laminated-type electronic component, its lamination has insulator layer (100L0 to 100L27, 200L0 to 200L27, 300L0 to 300L27) and conductive pattern (100a, 200a, 300a), and described conductive pattern is connected between described insulator layer, to form coil in layered product, described laminated-type electronic component (100, 200, 300) feature is, described coil has pair of conductors pattern, described pair of conductors pattern is formed by clipping stacked two conductive patterns of described insulator layer, first connecting portion (100bc, 200bc, 300bc), connected by described first connecting portion between the both ends of described two conductive patterns, to connect described two conductive patterns side by side, second connecting portion (100d, 200d, 300d), the described pair of conductors pattern of many groups is connected in series by described second connecting portion, configure described first connecting portion and described second connecting portion to the mutual comparatively long transmission line direction staggered positions to coil pattern, be positioned on same diagonal to make the diagonal of the diagonal of described first connecting portion and described second connecting portion.
The effect of invention
According to the present invention, can provide and not have blocked up conductor coupling portion to divide, and the laminated-type electronic component of the low DC resistance of the generation of the fault of construction of crackle etc. can be controlled.
Accompanying drawing explanation
Fig. 1 is the stereogram of the Rotating fields of the first execution mode illustrated according to laminated-type electronic component 100 of the present invention.
Fig. 2 is the vertical view that arrangement illustrates each layer of the laminated-type electronic component 100 of the first execution mode.
Fig. 3 is the state of each layer that the laminated-type electronic component 100 cutting off lamination the first execution mode is shown, and omits the sectional view of insulator layer.
Fig. 4 is the vertical view that arrangement illustrates each layer of existing laminated-type electronic component 500.
Fig. 5 is the state that each layer cutting off lamination existing laminated-type electronic component 500 is shown identically with Fig. 3, and omits the sectional view of insulator layer.
Fig. 6 is the vertical view that arrangement illustrates each layer of the laminated-type electronic component 200 of the second execution mode.
Fig. 7 is the state of each layer that the laminated-type electronic component 200 cutting off lamination the second execution mode is shown, and omits the sectional view of insulator layer.
Fig. 8 is the vertical view that arrangement illustrates each layer of the laminated-type electronic component 300 of mode of texturing.
Fig. 9 is the state that each layer cutting off the existing laminated-type electronic component 300 of lamination is shown, and omits the sectional view of insulator layer.
Figure 10 shows existing example more above-mentioned respectively, the first execution mode, the second execution mode, the form of the analog result of the DC resistance of mode of texturing etc.
Figure 11 is the vertical view of each layer of the laminated-type electronic component that other modes of texturing are shown side by side.
Figure 12 is the state that each layer of laminated-type electronic component cutting off other modes of texturing of lamination is shown, and omits the sectional view of insulator layer.
Reference numeral
100,200,300,400,500 laminated-type electronic components
100L0 to 100L27,200L0 to 200L27,300L0 to 300L27,400L0 to 400L27,500L0 to 500L27 insulator layer
100a, 200a, 300a, 400a, 500a conductive pattern
100bc, 200bc, 300bc, 400bc, 500bc first connecting portion
100d, 200d, 300d, 400d, 500d second connecting portion
P1, P2, P3, P4, P5 current path
Embodiment
With reference to the accompanying drawings the mode for implementing the best of the present invention is described.
(the first execution mode)
Fig. 1 is the stereogram of the Rotating fields of the first execution mode illustrated according to laminated-type electronic component 100 of the present invention.
Fig. 2 is the vertical view that arrangement illustrates each layer of the laminated-type electronic component 100 of the first execution mode.
Fig. 3 is the state of each layer that the laminated-type electronic component 100 cutting off lamination the first execution mode is shown, and omits the sectional view of insulator layer.Although this Fig. 3 generally show in fig. 2 with the cross section of the position shown in arrow A-A, but, shown in it is not cross section accurately, and shows the structure being positioned at paper inboard being more deeper than off-position, and the state of this structure as fragmentary perspective is illustrated.The first connecting portion 100L1b is had, 100L2b, 100L13c, 100L14c, 100L19b, 100L20b and the second connecting portion 100L4d, 100L5d by the structure shown in this perspective.
In addition, comprising each figure that below Fig. 1 to Fig. 3 illustrates is the figure shown in medelling, for the ease of understanding the size, the shape that suitably enlargedly show each several part.
Further, in the following description, although record concrete numerical value, shape and material etc., can suitably change.
The laminated-type electronic component 100 of the first execution mode has insulator layer 100L0 to insulator layer 100L27 for lamination; Conductive pattern 100L0a, 100L3a, 100L6a, 100L9a, 100L12a, 100L15a, 100L18a, 100L21a, 100L24a, 100L27a; First connecting portion 100L1b, 100L2b, 100L7b, 100L7c; 100L8b, 100L8c, 100L13b, 100L13c; 100L14b, 100L14c, 100L19b, 100L19c; 100L20b, 100L20c, 100L25b, 100L26b and the second connecting portion 100L4d; 100L5d, 100L10d, 100L11d, 100L16d; 100L17d, 100L22d, 100L23d, and the inductor by forming at the insulator layer of the superiors' lamination protection.
By adopting magnetic material, nonmagnetic substance, the insulator of dielectric etc. forms the insulator layer of insulator layer 100L0 to insulator layer 100L27 and protection.
By adopting silver, silver system, gold, gold system, the metal material of platinum etc. is formed as the conducting resinl of pasty state to form conductive pattern 100L0a, 100L3a, 100L6a, 100L9a, 100L12a, 100L15a, 100L18a, 100L21a, 100L24a, 100L27a (being collectively referred to as conductive pattern 100a below).Conductive pattern 100a is formed as the roughly ring-type with partial notch.In addition, conductive pattern 100L0a and conductive pattern 100L3a, conductive pattern 100L6a and conductive pattern 100L9a, conductive pattern 100L12a and conductive pattern 100L15a, conductive pattern 100L18a and conductive pattern 100L21a, conductive pattern 100L24a is formed as identical shape respectively with conductive pattern 100L27a, and after clipping insulator layer overlay configuration, forms the pair of conductors pattern of a group.
The first connecting portion 100L1b is formed, 100L2b, 100L7b by the material identical with conductive pattern 100a, 100L7c, 100L8b, 100L8c, 100L13b, 100L13c, 100L14b, 100L14c, 100L19b, 100L19c, 100L20b, 100L20c, 100L25b, 100L26b (below these unifications being referred to as the first connecting portion 100bc).Connected by this first connecting portion 100bc between the both ends of these two conductive pattern 100a, to connect two conductive pattern 100a of configured in parallel side by side.
Such as, connected by the first connecting portion 100L13b and the first connecting portion 100L14b, with bonding conductor pattern 100L12a arranged side by side and conductive pattern 100L15a between the end of the side of conductive pattern 100L12a and conductive pattern 100L15a.In addition, connected by the first connecting portion 100L13c and the first connecting portion 100L14c between the end of the opposite side of conductive pattern 100L12a and conductive pattern 100L15a.
Wherein, due to the pair of conductors pattern be made up of conductive pattern 100L0a and conductive pattern 100L3a, and the end side of the pair of conductors pattern to be made up of conductive pattern 100L24a and conductive pattern 100L27a is the gateway of current path, is therefore only connected with side.
The second connecting portion 100L4d is formed, 100L5d, 100L10d, 100L11d, 100L16d, 100L17d, 100L22d, 100L23d (these unifications being referred to as the second connecting portion below) by the material identical with conductive pattern 100a.The pair of conductors pattern of many groups is connected in series by this second connecting portion 100d.Such as, the pair of conductors pattern be made up of conductive pattern 100L12a and conductive pattern 100L15a and the pair of conductors pattern be made up of conductive pattern 100L18a and conductive pattern 100L21a are connected in series by the second connecting portion 100L16d and the second connecting portion 100L17d.Be connected in series pair of conductors pattern by the second connecting portion 100d, thus current path is formed as roughly spiral-shaped, and the function of coil can be possessed.
In the present embodiment, carry out lamination by printing and form above-mentioned each layer.In the printing process of insulator layer, insulator layer be not formed in fact there is through hole function part on, this part is filled by the material printing each connecting portion, thus realize the connection of conductive pattern 100a and the first connecting portion 100bc, and, the connection of conductive pattern 100a and the second connecting portion 100d.But, these are connected, also can by the connection adopting the methods such as existing through hole and plating to carry out on layer direction, the manufacture method of these each layers can adopt arbitrary method.
In the first embodiment, the first connecting portion 100bc and the second connecting portion 100d is configured by the mutual comparatively long transmission line direction staggered positions to coil pattern.Particularly, the projection of shape of observing from laminating direction (normal direction relative to paper Fig. 2, the top in Fig. 3) is made not configure the first connecting portion 100bc and the second connecting portion 100d overlappingly.Thus avoid making the thickening state in conductor local by overlap multiple first connecting portion 100bc and the second connecting portion 100d.
In addition, even if as above-mentioned configuration first connecting portion 100bc and the second connecting portion 100d, the current path of coil also can be guaranteed with required form.That is, being parallel to compared with in the Fig. 3 on the cross section in long transmission line direction perpendicular to laminate surface, current path is made to configure the first connecting portion 100bc and the second connecting portion 100d as the crow flies.Particularly, by being positioned at the first connecting portion 100bc be connected in series on the wherein side of pair of conductors pattern; Be arranged at least one of two conductive patterns be connected in series on the wherein side of pair of conductors pattern; Second connecting portion 100d; Be arranged in be connected in series pair of conductors pattern opposite side at least one of two conductive patterns, and, be positioned at be connected in series pair of conductors pattern opposite side on the first connecting portion 100bc be in line to make the current path of coil.
Below, part is more specifically illustrated further.Illustrate current path P1 here, described current path P1 is formed in the part of the second connecting portion 100L16a and the second connecting portion 100L17a, and the pair of conductors pattern that the pair of conductors pattern be made up of conductive pattern 100L12a and conductive pattern 100L15a is formed with by conductive pattern 100L18a and conductive pattern 100L21a is connected by this current path P1.On the cross section of Fig. 3, the end of current path P1 from first connecting portion 100L13b, 100L14b to conductive pattern 100L15a, again through second connecting portion 100L16d, 100L17d, the end of conductive pattern 100L18a, until first connecting portion 100L19c, 100L20c is formed as straight line.Electric current advances along this current path P1.Thus current path P1 is (from the first connecting portion 100L13b, 100L14b to the first connecting portion 100L19c, the diagonal of 100L20c) on current density uprise (current convergence is near current path P1), along with the distance from current path P1 more away from, current density sharply declines.Owing to can guarantee that this current path P1 is straight line, even if configure the first connecting portion 100bc and the second connecting portion 100d of present embodiment therefore mutually to coil pattern compared with long transmission line direction staggered positions, the flowing of electric current also can not be hindered.Therefore, DC resistance can not uprise.Like this, the laminated-type electronic component 100 of present embodiment configures each layer by the current density of each connecting portion that distributes.
Not apply the present invention here, in order to compare with present embodiment, therefore illustrate in the past adopted connected mode.
Fig. 4 is the vertical view that arrangement illustrates each layer of existing laminated-type electronic component 500.
Fig. 5 is the state that each layer cutting off lamination existing laminated-type electronic component 500 is shown identically with Fig. 3, and omits the sectional view of insulator layer.
But for existing laminated-type electronic component 500, the end having a part of identical function with the first above-mentioned execution mode marked identical symbol, and therefore suitably the repetitive description thereof will be omitted.
The conductive pattern 500a of existing laminated-type electronic component 500 shown here is identical with the shape of the conductive pattern 100a of the first execution mode.And not staggering compared with the position in long transmission line direction of the coil pattern of the first connecting portion 500bc and the second connecting portion 500d.
In the middle of this existing structure, electric current flows along the current path P5 shown in Fig. 5.But on the position away from current path P5, current density declines, and a lot of not used for the region of current path.Further, in the middle of existing structure, the part of multiple conductor overlap accounts for very large region.Such as, in the middle of the part of second connecting portion 500L16d, 500L17d, comprise conductive pattern 500L12a, 500L15a, 500L18a, 500L21a, and there is the very large regions that lamination has the conductor of totally 10 layers.Even if computation layer is pressed with the quantity of conductive pattern, also lamination has the conductive pattern of totally 4 layers.Thus, have in the part of this conductor at lamination, be easy to the shrinkage of conductor when being subject to sintering shrinkage and Ferrite Material in the past, and the impact of the stress of the difference expanded by difference and the line of contraction process etc., and cause the fault of construction as crackle etc.
To this, in the present embodiment, mutually the first connecting portion 100bc and the second connecting portion 100d is configured to staggered positions on the comparatively long transmission line direction of coil pattern.Thus, can the shortest air line distance be guaranteed as required MIN current path, and the Utopian conductor connect structure maintaining electrical characteristic can be obtained.In addition, when having the quantity of conductive pattern to calculate with lamination, the part being connected with conductor only lamination has 2 layers, and the laminated-type electronic component 100 of present embodiment can control the fault of construction of crackle etc.
Fig. 6 is the vertical view that arrangement illustrates each layer of the laminated-type electronic component 200 of the second execution mode.
Fig. 7 is the state of each layer that the laminated-type electronic component 200 cutting off lamination the second execution mode is shown, and omits the sectional view of insulator layer.
Show Fig. 6 and Fig. 7 identically with Fig. 2 and Fig. 3 in the first above-mentioned execution mode.Further, for the laminated-type electronic component 200 of the second execution mode, the end that there is the part of identical function with the first above-mentioned execution mode marked identical symbol, and suitably the repetitive description thereof will be omitted.
The laminated-type electronic component 200 of the second execution mode only overlap configures the first connecting portion 200bc and the second connecting portion 200d partially, and it is different from the laminated-type electronic component 100 of the first execution mode.But conductive pattern 200a is identical with the shape of the conductive pattern 100a of the first execution mode.
Be described as follows with concrete example, only overlapping 20 μm of ground configuration first connecting portion 200L13b, 200L14b and second connecting portion 200L16d, 200L17d on comparatively long transmission line direction.Equally, only overlapping 20 μm of ground configuration first connecting portion 200L19c, 200L20c and second connecting portion 200L16d, 200L17d on comparatively long transmission line direction.Thus, be identically formed current path P2 with the current path P1 of the first execution mode, but the area of section being orthogonal to current path P2 compared with the first execution mode on the lap of each connecting portion can increase.Therefore, when producing problem (obstruction) that DC resistance uprises on the portion, present embodiment is effective especially.
In addition, in the middle of the second execution mode, there is the part that local is overlapping, but its proportion compared with all overlapping existing structure is very little, and the effect therefore controlling the fault of construction of crackle etc. is very good.
(mode of texturing)
Fig. 8 is the vertical view that arrangement illustrates each layer of the laminated-type electronic component 300 of mode of texturing.
Fig. 9 is the state that each layer cutting off the existing laminated-type electronic component 300 of lamination is shown, and omits the sectional view of insulator layer.
Show Fig. 8 and Fig. 9 identically with Fig. 2 and Fig. 3 in the first above-mentioned execution mode.Further, for the laminated-type electronic component 300 of mode of texturing, the end that there is the part of identical function with the first above-mentioned execution mode marked identical symbol, and suitably the repetitive description thereof will be omitted.
Arbitrary first connecting portion 100bc in the first embodiment and the second connecting portion 100d is overlapping 2 layers, but it is overlapping lamination on identical position.In contrast, in the laminated-type electronic component 300 of mode of texturing, 2 fault open positions are configured arbitrary first connecting portion 300bc and the second connecting portion 300d.
Particularly, such as, comparatively long transmission line direction configures the first connecting portion 300L1b and the first connecting portion 300L2b to staggered positions.Equally, comparatively long transmission line direction configures the second connecting portion 300L4d and the second connecting portion 300L5d to staggered positions.Further, its shifting method must adopt the collocation method making current path P3 be formed as the position relationship of straight line.Thus, the laminated-type electronic component 300 of mode of texturing can obtain on the basis of the effect that the first above-mentioned execution mode and the second execution mode obtain, can while the line length of extension coil pattern compared with the first execution mode and the second execution mode, in the layered product being built-in with the more coil pattern of revolution, the height of this point of layered product can be reduced.
But conductive pattern 300a is not identical with the shape of the conductive pattern 100a of the first execution mode.
(comparison of each mode)
Figure 10 shows existing example more above-mentioned respectively, the first execution mode, the second execution mode, the form of the analog result of the DC resistance of mode of texturing etc.
As mentioned above, arbitrary first execution mode, the effect of the fault of construction of the control crackle of the second execution mode and mode of texturing etc. is all good than existing structure.On the other hand, can judge, at arbitrary first execution mode, in the middle of the second execution mode and mode of texturing, to only increase very little DC resistance.
(other modes of texturing)
But be not limited to execution mode described above, various distortion or change can be had, and this various distortion or change are also contained in scope of the present invention.
(1) in the first execution mode and the second execution mode, each connecting portion describing 2 Rotating fields is enumerated.Such as, but be not limited thereto, each connecting portion can be made up of individual layer.
(2) in mode of texturing, 2 fault open positions are configured arbitrary first connecting portion and the second connecting portion, but, as is illustrated by figs. 11 and 12, can in same position overlay configuration.Wherein, for the laminated-type electronic component 400 of mode of texturing, the end that there is the part of identical function with the first above-mentioned execution mode marked identical symbol, and suitably the repetitive description thereof will be omitted.
(3) at the first execution mode, second implements to place and in mode of texturing, as the example of laminated-type electronic component, illustrate inductor.Such as, but be not limited thereto, the present invention is applicable to the situation forming coil on part multilager base plate, and the present invention can also be applicable on various laminated-type electronic component.
Further, can also suitably combine each execution mode and mode of texturing, omit this detailed description at this, in addition, not limit the present invention by above-mentioned each execution mode.
Claims (5)
1. a laminated-type electronic component, its lamination has insulator layer and conductive pattern, and connects described conductive pattern between described insulator layer, and to form coil in layered product, the feature of described laminated-type electronic component is,
Described coil has pair of conductors pattern, and described pair of conductors pattern is formed by clipping stacked two conductive patterns of described insulator layer,
First connecting portion, is connected by described first connecting portion between the both ends of described two conductive patterns, to connect described two conductive patterns side by side,
Second connecting portion, the described pair of conductors pattern of many groups is connected in series by described second connecting portion,
Described first connecting portion and described second connecting portion is configured by the mutual comparatively long transmission line direction staggered positions to coil pattern.
2. laminated-type electronic component according to claim 1, is characterized in that,
The projection of shape of observing from laminating direction is made not configure described first connecting portion and described second connecting portion overlappingly.
3. laminated-type electronic component according to claim 1, is characterized in that,
The projection of shape local observed from laminating direction is made to configure described first connecting portion and described second connecting portion overlappingly.
4. laminated-type electronic component according to any one of claim 1 to 3, is characterized in that,
Being parallel on the cross section compared with long transmission line direction perpendicular to laminate surface, pass through
Be positioned at be connected in series described pair of conductors pattern wherein side on described first connecting portion;
Be arranged at least one of two conductive patterns on the wherein side being connected in series described pair of conductors pattern;
Described second connecting portion;
Be arranged at least one of two conductive patterns on the opposite side being connected in series described pair of conductors pattern, and,
Be positioned at be connected in series described pair of conductors pattern opposite side on described first connecting portion, make the current path of described coil configure described first connecting portion and described second connecting portion as the crow flies.
5. a laminated-type electronic component, its lamination has insulator layer and conductive pattern, and connects described conductive pattern between described insulator layer, and to form coil in layered product, the feature of described laminated-type electronic component is,
Described coil has pair of conductors pattern, and described pair of conductors pattern is formed by clipping stacked two conductive patterns of described insulator layer,
First connecting portion, is connected by described first connecting portion between the both ends of described two conductive patterns, to connect described two conductive patterns side by side,
Second connecting portion, the described pair of conductors pattern of many groups is connected in series by described second connecting portion,
Configure described first connecting portion and described second connecting portion to the mutual comparatively long transmission line direction staggered positions to coil pattern, be positioned on same diagonal to make the diagonal of the diagonal of described first connecting portion and described second connecting portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013143315A JP6030512B2 (en) | 2013-07-09 | 2013-07-09 | Multilayer electronic components |
| JP2013-143315 | 2013-07-09 |
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| CN104282409A true CN104282409A (en) | 2015-01-14 |
| CN104282409B CN104282409B (en) | 2017-12-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410303008.5A Active CN104282409B (en) | 2013-07-09 | 2014-06-27 | Laminated-type electronic component |
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| US (1) | US9510451B2 (en) |
| JP (1) | JP6030512B2 (en) |
| CN (1) | CN104282409B (en) |
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| CN106373711A (en) * | 2015-07-24 | 2017-02-01 | Tdk株式会社 | Multilayer coil component |
| CN109559877A (en) * | 2017-09-25 | 2019-04-02 | Tdk株式会社 | Multilayer coil component |
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| JP6507027B2 (en) * | 2015-05-19 | 2019-04-24 | 新光電気工業株式会社 | Inductor and method of manufacturing the same |
| JP6589446B2 (en) * | 2015-08-05 | 2019-10-16 | Tdk株式会社 | Multilayer coil parts |
| JP7288288B2 (en) * | 2017-05-02 | 2023-06-07 | 太陽誘電株式会社 | Magnetically coupled coil parts |
| JP6686979B2 (en) * | 2017-06-26 | 2020-04-22 | 株式会社村田製作所 | Multilayer inductor |
| US10892079B2 (en) * | 2017-12-07 | 2021-01-12 | Murata Manufacturing Co., Ltd. | Multilayer coil component |
| JP7099345B2 (en) * | 2019-02-04 | 2022-07-12 | 株式会社村田製作所 | Coil parts |
| JP7196831B2 (en) * | 2019-12-27 | 2022-12-27 | 株式会社村田製作所 | Laminated coil parts |
| JP7151738B2 (en) | 2020-03-10 | 2022-10-12 | 株式会社村田製作所 | Laminated coil parts |
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Also Published As
| Publication number | Publication date |
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| US9510451B2 (en) | 2016-11-29 |
| JP6030512B2 (en) | 2016-11-24 |
| JP2015018852A (en) | 2015-01-29 |
| US20150014042A1 (en) | 2015-01-15 |
| CN104282409B (en) | 2017-12-22 |
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