CN104281215A - Processor assembly - Google Patents
Processor assembly Download PDFInfo
- Publication number
- CN104281215A CN104281215A CN201410311979.4A CN201410311979A CN104281215A CN 104281215 A CN104281215 A CN 104281215A CN 201410311979 A CN201410311979 A CN 201410311979A CN 104281215 A CN104281215 A CN 104281215A
- Authority
- CN
- China
- Prior art keywords
- processor module
- cushion
- pressing part
- machine plate
- conducting strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a processor assembly, which includes a machine plate, a processor module, a pressing piece and an elastic pad. The machine plate is provided with a conductive sheet. The processor module is arranged on the conductive sheet. The pressing piece covers the processor module to be fixed on the machine plate. The elastic pad is arranged between the pressing piece and the processor module. During usage, the pressing piece is used for applying a force on the processor module, so that the processor module and the conductive sheet are electrically connected. The elastic pad is used for dispersing the force of the pressing piece on the processor module.
Description
Technical field
The present invention is relevant a kind of processor module, and particularly about a kind of processor module of no-welding type.
Background technology
Processor module is arranged on machine plate by known processor module in a welding manner.Welding processing procedure can spend a large amount of time and solder, and manufacturing cost is increased.In addition, owing to welding failed processor module and machine plate, may cause the situation of short circuit or open circuit, therefore the yield of processor module is difficult to promote.
Although exempt from the processor module possible in theory of welding processing procedure, but many problems are had to need to overcome.For example, when the processor module of processor module and machine plate are electrically connected in a contact fashion, then need cover plate to impose enough pressure to push down the processor module on machine plate, depart from machine plate to avoid processor module.
Thus, if when the pressure of cover plate is excessive, the wafer damage of processor module can be caused; If when the pressure of cover plate is too small, then can cause the stitch of processor module cannot the in electrical contact and conducting with machine plate.
Summary of the invention
A technology of the present invention is a kind of processor module.
According to an embodiment of the present invention, a kind of processor module comprises machine plate, processor module, pressing part and cushion.Wherein, machine plate has conducting strip.Processor module is positioned on conducting strip.Pressing part overriding processor module and being fixed on machine plate.Pressing part, in order to press to processor module, makes processor module and conducting strip be electrically connected.Cushion is between pressing part and processor module.The pressure that cushion imposes processor module in order to dispersion pressure component.
In an embodiment of the present invention, above-mentioned processor module has wafer.Cushion has opening, and wafer is exposed from the opening of cushion.
In an embodiment of the present invention, the thickness of above-mentioned wafer is less than the thickness of cushion.
In an embodiment of the present invention, above-mentioned cushion more comprises multiple salient point.Salient point is positioned at cushion towards on the surface of pressing part, and is connected to pressing part.
In an embodiment of the present invention, above-mentioned cushion more comprises multiple fin.Fin is positioned at cushion towards on the surface of pressing part, and is connected to pressing part.
In an embodiment of the present invention, above-mentioned conducting strip has multiple conduction protuberance.Processor module has multiple conductive feet position towards the surface of conducting strip.Conductive stud portion lays respectively in conductive feet position.
In an embodiment of the present invention, above-mentioned processor module more comprises support member.Support member carrying machine plate, and support member and pressing part lay respectively at relative two of machine plate on the surface.
In an embodiment of the present invention, above-mentioned processor module more comprises fixture.Fixture runs through pressing part and machine plate, and fixture is positioned in support member.
In an embodiment of the present invention, above-mentioned fixing piece is screw or rivet.
In an embodiment of the present invention, the material of above-mentioned cushion comprises rubber.
State on the invention in embodiment, when pressing part presses to processor module, processor module can be electrically connected conducting strip.Because cushion is between pressing part and processor module, therefore cushion dispersibles the pressure that pressing part imposes processor module, avoids processor module be subject to excessive pressure and damage.That is, processor module of the present invention bears equally distributed pressure by cushion by processor module, to guarantee the opering characteristic of electric apparatus uniform conducting of processor module and conducting strip, and can not injure processor module.Thus, the yield of processor module is promoted.
Accompanying drawing explanation
Fig. 1 illustrates the exploded view of processor module according to an embodiment of the present invention.
Fig. 2 illustrate the machine plate of Fig. 1, processor module and cushion combine after stereographic map.
Fig. 3 illustrates the partial enlarged drawing of conducting strip towards the surface of processor module of Fig. 1.
Fig. 4 illustrates the partial enlarged drawing of processor module towards the surface of conducting strip of Fig. 1.
Fig. 5 illustrates schematic diagram during cushion and the processor module pressurized of Fig. 2.
Fig. 6 illustrates according to the schematic diagram when cushion of another embodiment of the present invention and processor module pressurized.
Symbol description
100: processor module 142: opening
110: machine plate 143: surface
111: surface 144: salient point
112: conducting strip 145: end face
113: surface 146: fin
114: surface 147: surface
115: perforation 149: end face
116: conduction protuberance 150: support member
120: processor module 152: pilot hole
122: wafer 160: fixture
124: surperficial D1: thickness
126: conductive feet position D2: thickness
130: pressing part D3: thickness
132: perforation F: pressure
Embodiment
Below will with graphic exposure multiple embodiment of the present invention, as clearly stated, the details in many practices will be explained in the following description.But should be appreciated that, the details in these practices is not applied to limit the present invention.That is, in some embodiments of the present invention, the details in these practices is non-essential.In addition, for the purpose of simplicity of illustration, some known usual structures and element illustrate in the mode simply illustrated in the drawings.
Fig. 1 illustrates the exploded view of processor module 100 according to an embodiment of the present invention.Fig. 2 illustrates the machine plate 110 of Fig. 1, processor module 120 combine with cushion 140 after stereographic map.Consult Fig. 1 and Fig. 2, processor module 100 comprises machine plate 110, processor module 120, pressing part 130 and cushion 140 simultaneously.Wherein, the surface 111 of machine plate 110 has conducting strip 112.Processor module 120 is positioned on conducting strip 112.Processor module 120 in a contact fashion with conducting strip 112 conducting.Pressing part 130 overriding processor module 120 and being fixed on machine plate 110.Cushion 140 is between pressing part 130 and processor module 120.
In addition, processor module 100 also can comprise support member 150 and fixture 160.Support member 150 carries machine plate 110, and support member 150 and pressing part 130 lay respectively on relative two surfaces 111,113 of machine plate 110.Machine plate 110 has perforation 115, and pressing part 130 has perforation 132, and support member 150 has pilot hole 152.When assembling, fixture 160 sequentially can run through pressing part 130 and machine plate 110 through perforation 132,115, and is positioned in the pilot hole 152 of support member 150, makes pressing part 130 can impose downward pressure to cushion 140 and processor module 120.
In the present embodiment, processor module 120 can be CPU (central processing unit) (Central Processor Unit; CPU), but not as limit.The material of cushion 140 can comprise rubber or other have flexible material.Cushion 140 has elasticity, can be used to abut pressing part 130, prevents pressing part 130 directly contact pairs device module 120.Fixture 160 can be screw or rivet, and pilot hole 152 can be screw.Fixture 160 can be attached in pilot hole 152.In addition, the material of pressing part 130 can be metal, and such as copper or aluminium, have the function of heat radiation.
Fig. 3 illustrates the partial enlarged drawing of conducting strip 112 towards the surface 114 of processor module 120 of Fig. 1.Fig. 4 illustrates the partial enlarged drawing of processor module 120 towards the surface 124 of conducting strip 112 of Fig. 1.Consult Fig. 3 and Fig. 4, the surface 114 of conducting strip 112 has multiple conduction protuberance 116, and the surface 124 of processor module 120 has multiple conductive feet position 126 simultaneously.Wherein, the position of the corresponding conductive feet position 126 of difference, position of conduction protuberance 116.
When processor module 120 is installed on conducting strip 112, the conductive feet position 126 of processor module 120 can be coupled the conduction protuberance 116 of conducting strip 112, and conduction protuberance 116 is laid respectively in conductive feet position 126.When pressing part 130 pairs of processor modules 120 of Fig. 1 press, can guarantee that conduction protuberance 116 is combined closely with conductive feet position 126, processor module 120 and conducting strip 112 are electrically connected.
Should be appreciated that, the element annexation described and material are by it is no longer repeated, and conjunction is first chatted bright.In the following description, structure and effect of cushion 140 will be described.
Fig. 5 illustrates the cushion 140 of Fig. 2 and schematic diagram during processor module 120 pressurized.Consult Fig. 1 and Fig. 5, processor module 120 has wafer 122 simultaneously.Cushion 140 has opening 142, and the position of the corresponding wafer 122 in the position of opening 142.Thus, when cushion 140 is positioned on processor module 120, wafer 122 can be exposed from the opening 142 of cushion 140, and the heat that wafer 122 is produced is easier to discharge.
In the present embodiment, cushion 140 also comprises multiple salient point 144.Salient point 144 is positioned at cushion 140 towards on the surface 143 of pressing part 130, and the thickness D1 of wafer 122 is less than the thickness D2 of cushion 140.In the present embodiment, the thickness D2 of cushion 140 mean the end face 145 of salient point 144 and cushion 140 towards processor module 120 surface 147 between distance.
Thus, when pressing part 130 pairs of processor modules 120 and cushion 140 press F, the salient point 144 of cushion 140 can first be connected to pressing part 130, has buffering and the function of dispersive pressure F, avoids the wafer 122 of processor module 120 to damage by excessive pressure.
Fig. 6 illustrates according to the schematic diagram when cushion 140a of another embodiment of the present invention and processor module 120 pressurized.The place different from Fig. 5 embodiment is: cushion 140a comprises multiple fin 146, and does not comprise the salient point 144 of Fig. 5.The cushion 140 of Fig. 1 can be replaced by cushion 140a.Consult Fig. 1 and Fig. 6, fin 146 is positioned at cushion 140a towards on the surface 143 of pressing part 130, and the thickness D1 of wafer 122 is less than the thickness D3 of cushion 140a simultaneously.In the present embodiment, the thickness D3 of cushion 140a mean the end face 149 of fin 146 and cushion 140a towards processor module 120 surface 147 between distance.
Thus, when pressing part 130 pairs of processor modules 120 and cushion 140a press F, the fin 146 of cushion 140a can first be connected to pressing part 130, has buffering and the function of dispersive pressure F, avoids the wafer 122 of processor module 120 to damage by excessive pressure.
Consult Fig. 5 and Fig. 6, when wafer 122 is not high for the demand of dispelling the heat, cushion 140,140a can not have opening 142, determine according to deviser's demand simultaneously.In addition, salient point 144 and the arrangement mode of fin 146 be not in order to limit the present invention.
In other embodiments, single cushion can have salient point 144 and fin 146 simultaneously, or neither has salient point 144 and fin 146.Because the material behavior of cushion itself has elasticity, still can have buffering and the function of dispersive pressure F even if do not have a cushion of salient point 144 and fin 146, avoid the wafer 122 of processor module 120 to damage by excessive pressure.But salient point 144 and fin 146 can promote the effect of cushion dispersive pressure F, and deviser can select suitable cushion according to actual demand, not in order to limit the present invention.
Consult Fig. 1, processor module 100 of the present invention and known art, when pressing part 130 pairs of processor modules 120 press, processor module 120 can be electrically connected the conducting strip 112 on machine plate 110.Because cushion 140 is between pressing part 130 and processor module 120, therefore cushion 140 dispersibles the pressure that pressing part 130 pairs of processor modules 120 impose, and avoids processor module 120 to damage by excessive pressure.
That is, processor module 100 of the present invention allows processor module 120 bear equally distributed pressure by cushion 140, to guarantee the opering characteristic of electric apparatus uniform conducting of processor module 120 and conducting strip 112, and can not injure processor module 120.Thus, the yield of processor module 100 is promoted.
Although the present invention discloses as above with embodiment; so itself and be not used to limit the present invention, anyly have the knack of this those skilled in the art, without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, therefore protection scope of the present invention is as the criterion with the content defined in claim.
Claims (10)
1. a processor module, is characterized in that, comprises:
One machine plate, has a conducting strip;
One processor module, is positioned on this conducting strip;
One pressing part, covers this processor module and is fixed on this machine plate, in order to impose a pressure to this processor module, this processor module and this conducting strip is electrically connected; And
One cushion, between this pressing part and this processor module, in order to this pressure disperseing this pressing part to impose this processor module.
2. processor module as claimed in claim 1, it is characterized in that, this processor module has a wafer, and this cushion has an opening, and this wafer is exposed from this opening of this cushion.
3. processor module as claimed in claim 2, it is characterized in that, the thickness of this wafer is less than the thickness of this cushion.
4. processor module as claimed in claim 2, it is characterized in that, this cushion more comprises:
Multiple salient point, is positioned at this cushion towards on the surface of this pressing part, and is connected to this pressing part.
5. processor module as claimed in claim 2, it is characterized in that, this cushion more comprises:
Multiple fin, is positioned at this cushion towards on the surface of this pressing part, and is connected to this pressing part.
6. processor module as claimed in claim 1, it is characterized in that, this conducting strip has multiple conduction protuberance, and this processor module has multiple conductive feet position towards the surface of this conducting strip, and those conductive stud portions lay respectively in those conductive feet positions.
7. processor module as claimed in claim 1, is characterized in that, more comprise:
One support member, carries this machine plate, and this support member and this pressing part lay respectively at relative two of this machine plate on the surface.
8. processor module as claimed in claim 7, is characterized in that, more comprise:
One fixture, run through this pressing part and this machine plate, and this fixture is positioned in this support member.
9. processor module as claimed in claim 8, it is characterized in that, this fixture is screw or rivet.
10. processor module as claimed in claim 1, it is characterized in that, the material of this cushion comprises rubber.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361843037P | 2013-07-04 | 2013-07-04 | |
| US61/843,037 | 2013-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104281215A true CN104281215A (en) | 2015-01-14 |
Family
ID=52256193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410311979.4A Pending CN104281215A (en) | 2013-07-04 | 2014-07-02 | Processor assembly |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104281215A (en) |
| TW (1) | TWI559620B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5998875A (en) * | 1996-12-19 | 1999-12-07 | Telefonaktiebolaget Lm Ericsson | Flip-chip type connection with elastic contacts |
| TW410997U (en) * | 1999-03-23 | 2000-11-01 | Ju Yung Tsai | Computer heat radiator and elastic locking member |
| CN2567770Y (en) * | 2002-04-23 | 2003-08-20 | 神基科技股份有限公司 | Chip cooling structure |
| CN2751441Y (en) * | 2004-12-30 | 2006-01-11 | 英业达股份有限公司 | Mechanism for coupling radiating fin to chip unit |
| CN2781447Y (en) * | 2005-01-03 | 2006-05-17 | 史秋伟 | Fixing device for computer CPU fin |
| CN200965868Y (en) * | 2006-11-03 | 2007-10-24 | 中芯国际集成电路制造(上海)有限公司 | A device for holding the wafer |
| CN101351107A (en) * | 2007-07-20 | 2009-01-21 | 富准精密工业(深圳)有限公司 | Back board combination for heat radiator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM393874U (en) * | 2010-05-18 | 2010-12-01 | Hon Hai Prec Ind Co Ltd | Electrical connector and assembly thereof |
-
2014
- 2014-06-25 TW TW103121939A patent/TWI559620B/en not_active IP Right Cessation
- 2014-07-02 CN CN201410311979.4A patent/CN104281215A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5998875A (en) * | 1996-12-19 | 1999-12-07 | Telefonaktiebolaget Lm Ericsson | Flip-chip type connection with elastic contacts |
| TW410997U (en) * | 1999-03-23 | 2000-11-01 | Ju Yung Tsai | Computer heat radiator and elastic locking member |
| CN2567770Y (en) * | 2002-04-23 | 2003-08-20 | 神基科技股份有限公司 | Chip cooling structure |
| CN2751441Y (en) * | 2004-12-30 | 2006-01-11 | 英业达股份有限公司 | Mechanism for coupling radiating fin to chip unit |
| CN2781447Y (en) * | 2005-01-03 | 2006-05-17 | 史秋伟 | Fixing device for computer CPU fin |
| CN200965868Y (en) * | 2006-11-03 | 2007-10-24 | 中芯国际集成电路制造(上海)有限公司 | A device for holding the wafer |
| CN101351107A (en) * | 2007-07-20 | 2009-01-21 | 富准精密工业(深圳)有限公司 | Back board combination for heat radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI559620B (en) | 2016-11-21 |
| TW201511416A (en) | 2015-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20170251549A1 (en) | Electronic circuit board assembly including emi shielding structure and thermal pad | |
| CN104853566B (en) | The method of the fixed structure of electronic unit and fixed electronic unit | |
| US9543681B2 (en) | Terminal for an antenna connector | |
| TWM393874U (en) | Electrical connector and assembly thereof | |
| EP2706828A2 (en) | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same | |
| JP2013077781A (en) | Electronic apparatus | |
| ATE542273T1 (en) | ELECTRICAL CONNECTION DEVICE FOR CONDUCTIVE CONTACTS, IN PARTICULAR BLADE CONTACTS | |
| US9817030B2 (en) | Testing device for testing an under-test object | |
| CN107210592B (en) | Circuit structure | |
| WO2016117276A1 (en) | Jack connector and connector | |
| CN107453104B (en) | Connector, power supply module and terminal equipment | |
| KR20160072758A (en) | Electric terminal contact | |
| CN103943993A (en) | CPU socket combination and protective cover thereof | |
| JP6162441B2 (en) | Substrate reinforcement structure | |
| CN104281215A (en) | Processor assembly | |
| TW201027849A (en) | Connector | |
| CN104124534B (en) | The method of hybrid antenna, punch elements and manufacture hybrid antenna | |
| JP2012134200A (en) | Semiconductor heat radiator | |
| CN101068456B (en) | Radiating device | |
| JP7483351B2 (en) | Systems and methods for thermal monitoring - Patents.com | |
| JP6422376B2 (en) | Semiconductor device inspection jig | |
| JP2017122657A (en) | Inspection unit of semiconductor device | |
| CN112399772B (en) | Heat dissipation and noise shielding combined structure of electronic device | |
| CN101902892A (en) | Heat radiator fixing device | |
| JP2013206637A (en) | Connection fixture for terminal block |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150114 |
|
| WD01 | Invention patent application deemed withdrawn after publication |