CN104277424A - Strong-thixotropy low dielectric epoxy resin composite material and manufacturing method thereof - Google Patents
Strong-thixotropy low dielectric epoxy resin composite material and manufacturing method thereof Download PDFInfo
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- CN104277424A CN104277424A CN201410600037.8A CN201410600037A CN104277424A CN 104277424 A CN104277424 A CN 104277424A CN 201410600037 A CN201410600037 A CN 201410600037A CN 104277424 A CN104277424 A CN 104277424A
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Abstract
The invention discloses a strong-thixotropy low dielectric epoxy resin composite material, which is characterized by being prepared from the following raw materials in parts by weight: 50-56 parts of an E-51 epoxy resin, 1-3 parts of sericite powder, 4-8 parts of polyamide wax, 0.6-0.9 part of sodium silicate, 20-24 parts of benzyl glycidyl ether, 9-12 parts of an acetic acid, 10-13 parts of 2-[2-(2-aminophenoxy)ethoxy]phenylamine, 3-5 parts of tert-butyl hydroperoxide, 1-2 parts of 2-dibromo-3-nitrilopropionamide, 7-9 parts of 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate, 6-9 parts of trimellitic anhydride, and 3-6 parts of an additive. A preparation process of the composite material disclosed by the invention is simple and easy to operate, and a problem that existing traditional epoxy resins are simple in performance is effectively solved; the epoxy resin disclosed by the invention has the advantages of good thixotropy, strong shock resistance, corrosion resistance, aging resistance, low power saving coefficient and the like; and prepregs prepared by using the epoxy resin are non-caked, and prepared copper-clad plates have relatively low dielectric coefficients and dielectric loss, so that the distortion rate in the process of signal transmission can be reduced.
Description
Technical field
The present invention relates to field of polymer composite material, be specifically related to strong low dielectric-epoxy resin composite materials of a kind of thixotropy and preparation method thereof.
Background technology
Epoxy resin is containing the organic compound of two or more active epoxide groups in general reference molecule, they can with polytype solidifying agent generation crosslinking reaction and formed and insoluble, not molten there is the cancellated superpolymer of three-dimensional.There is excellent electrical isolation, machinery, bonding, resistance to chemical corrosion and good physics, chemical property, be extensively used as lamination material, binding agent, coating etc., more and more come into one's own in fields such as steamer, automobile, aerospace.
At present, epoxy resin, by the matrix as matrix material, shows a lot of problem, as low in hardness, poor insulativity, by shortcomings such as thermal softening, easily layering, mass-and heat-transfer difficulty, smell are large, needs the preparation technology improving epoxy resin.
Summary of the invention
Object of the present invention is just to provide strong low dielectric-epoxy resin composite materials of a kind of thixotropy and preparation method thereof, to overcome the deficiencies in the prior art.
The object of the present invention is achieved like this:
The low dielectric-epoxy resin composite materials that a kind of thixotropy is strong, it is characterized in that, be made up of the raw material of following weight part: E-51 type epoxy resin 50-56, sericite in powder 1-3, polyamide wax 4-8, water glass 0.6-0.9, benzyl glycidyl ether 20-24, acetic acid 9-12,2,2 '-diamino ethylene diphenyl ether 10-13, tertbutyl peroxide 3-5,2,2-bis-bromo-3-nitrilo propionic acid amide 1-2, Lauryl Alcohol ester 7-9, trimellitic acid 1,2-anhydride 6-9, auxiliary agent 3-6.
Described auxiliary agent is made up of following raw materials in part by weight: tetrahydroglyoxaline 0.6-0.9, 2-mercaptobenzothiazole 0.7-1.2, phenylformic acid 5-7, butyl glycol ether 14-16, oleum lini 4-7, calcium stearate 0.8-1.3, eight Sodium Tetraborate 0.4-0.8, Viscogum BE 2-3, dioctyl sebacate 8-10, nano titanium oxide 1-2, cocoanut fatty acid diethanolamide 3-5, its preparation method is: by nano titanium oxide, tetrahydroglyoxaline, oleum lini, eight Sodium Tetraborate grindings 10-20 minute ultrasonic wave is scattered in butyl glycol ether, add phenylformic acid again, calcium stearate, Viscogum BE stirs 30-40 minute together, be warming up to 160-180 DEG C, insulation 3-5 hour, reaction product is cooled to 85-98 DEG C, add dioctyl sebacate, cocoanut fatty acid diethanolamide and other remaining components stir 1-2 hour and get final product.
The preparation method of the low dielectric-epoxy resin composite materials that described a kind of thixotropy is strong, is characterized in that comprising the following steps:
(1) by sericite in powder calcination processing 1-2 hour at 560-650 DEG C, take out cooling and add polyamide wax, water glass grinding 30-40 minute, then joined in E-51 type epoxy resin, supersound process 20-40 minute;
(2) benzyl glycidyl ether, acetic acid, 2,2'-diamino ethylene diphenyl ethers are put into reactor and stirred 30-40 minute, add tertbutyl peroxide, be warming up to 130-150 DEG C, insulated and stirred 4-6 hour;
(3) step (2) reaction product is cooled to 75-90 DEG C, adds the stirring of step (1) reaction mass, 2,2-bis-bromo-3-nitrilo propionic acid amides, Lauryl Alcohol ester, trimellitic acid 1,2-anhydride and other remaining components and at 85-115 DEG C, solidify 4-6 hour in 20-40 minute.
The present invention has following beneficial effect: preparation technology's simple operations of the present invention is easy, efficiently solve the problem that existing conventional epoxies performance is single, epoxy resin of the present invention has the advantages such as thixotropy is good, shock resistance is strong, corrosion-resistant, anti-aging, economize on electricity coefficient is low, the prepreg adopting this epoxy resin to prepare is non-caked, prepared copper-clad plate has lower dielectric coefficient and dielectric loss, can reduce the distortion rate in signals transmission.
Embodiment
The low dielectric-epoxy resin composite materials that described a kind of thixotropy is strong, it is characterized in that, be made up of the raw material of following weight part: E-51 type epoxy resin 53, sericite in powder 1, polyamide wax 8, water glass 0.6, benzyl glycidyl ether 23, acetic acid 9,2,2 '-diamino ethylene diphenyl ether 10, the bromo-3-nitrilo propionic acid amide 2 of tertbutyl peroxide 3,2,2-bis-, Lauryl Alcohol ester 9, trimellitic acid 1,2-anhydride 7, auxiliary agent 6.
Described auxiliary agent is made up of following raw materials in part by weight: tetrahydroglyoxaline 0.6, 2-mercaptobenzothiazole 1.2, phenylformic acid 5, butyl glycol ether 15, oleum lini 6, calcium stearate 1.2, eight Sodium Tetraboratees 0.7, Viscogum BE 2, dioctyl sebacate 8, nano titanium oxide 1, cocoanut fatty acid diethanolamide 4, its preparation method is: by nano titanium oxide, tetrahydroglyoxaline, oleum lini, eight Sodium Tetraborate grindings 10-20 minute ultrasonic wave is scattered in butyl glycol ether, add phenylformic acid again, calcium stearate, Viscogum BE stirs 30-40 minute together, be warming up to 160-180 DEG C, insulation 3-5 hour, reaction product is cooled to 85-98 DEG C, add dioctyl sebacate, cocoanut fatty acid diethanolamide and other remaining components stir 1-2 hour and get final product.
Making method comprises the following steps:
(1) by sericite in powder calcination processing 1-2 hour at 560-650 DEG C, take out cooling and add polyamide wax, water glass grinding 30-40 minute, then joined in E-51 type epoxy resin, supersound process 20-40 minute;
(2) benzyl glycidyl ether, acetic acid, 2,2'-diamino ethylene diphenyl ethers are put into reactor and stirred 30-40 minute, add tertbutyl peroxide, be warming up to 130-150 DEG C, insulated and stirred 4-6 hour;
(3) step (2) reaction product is cooled to 75-90 DEG C, adds the stirring of step (1) reaction mass, 2,2-bis-bromo-3-nitrilo propionic acid amides, Lauryl Alcohol ester, trimellitic acid 1,2-anhydride and other remaining components and at 85-115 DEG C, solidify 4-6 hour in 20-40 minute.
The technical parameter index of the epoxy resin composite material using the present invention to produce is as follows:
(1) shock strength (non-notch) (KJ/m
2): 43.62;
(2) weathering resistance is good, manually ageing-resistant reaches 1000 hours.
Claims (2)
1. the low dielectric-epoxy resin composite materials that a thixotropy is strong, it is characterized in that, be made up of the raw material of following weight part: E-51 type epoxy resin 50-56, sericite in powder 1-3, polyamide wax 4-8, water glass 0.6-0.9, benzyl glycidyl ether 20-24, acetic acid 9-12,2,2 '-diamino ethylene diphenyl ether 10-13, tertbutyl peroxide 3-5,2,2-bis-bromo-3-nitrilo propionic acid amide 1-2, Lauryl Alcohol ester 7-9, trimellitic acid 1,2-anhydride 6-9, auxiliary agent 3-6, described auxiliary agent is made up of following raw materials in part by weight: tetrahydroglyoxaline 0.6-0.9, 2-mercaptobenzothiazole 0.7-1.2, phenylformic acid 5-7, butyl glycol ether 14-16, oleum lini 4-7, calcium stearate 0.8-1.3, eight Sodium Tetraborate 0.4-0.8, Viscogum BE 2-3, dioctyl sebacate 8-10, nano titanium oxide 1-2, cocoanut fatty acid diethanolamide 3-5, its preparation method is: by nano titanium oxide, tetrahydroglyoxaline, oleum lini, eight Sodium Tetraborate grindings 10-20 minute ultrasonic wave is scattered in butyl glycol ether, add phenylformic acid again, calcium stearate, Viscogum BE stirs 30-40 minute together, be warming up to 160-180 DEG C, insulation 3-5 hour, reaction product is cooled to 85-98 DEG C, add dioctyl sebacate, cocoanut fatty acid diethanolamide and other remaining components stir 1-2 hour and get final product.
2. the making method of the low dielectric-epoxy resin composite materials that a kind of thixotropy according to claim 1 is strong, is characterized in that comprising the following steps:
(1) by sericite in powder calcination processing 1-2 hour at 560-650 DEG C, take out cooling and add polyamide wax, water glass grinding 30-40 minute, then joined in E-51 type epoxy resin, supersound process 20-40 minute;
(2) benzyl glycidyl ether, acetic acid, 2,2'-diamino ethylene diphenyl ethers are put into reactor and stirred 30-40 minute, add tertbutyl peroxide, be warming up to 130-150 DEG C, insulated and stirred 4-6 hour;
(3) step (2) reaction product is cooled to 75-90 DEG C, adds the stirring of step (1) reaction mass, 2,2-bis-bromo-3-nitrilo propionic acid amides, Lauryl Alcohol ester, trimellitic acid 1,2-anhydride and other remaining components and at 85-115 DEG C, solidify 4-6 hour in 20-40 minute.
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| CN201410600037.8A CN104277424A (en) | 2014-10-31 | 2014-10-31 | Strong-thixotropy low dielectric epoxy resin composite material and manufacturing method thereof |
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| CN201410600037.8A CN104277424A (en) | 2014-10-31 | 2014-10-31 | Strong-thixotropy low dielectric epoxy resin composite material and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107629417A (en) * | 2017-11-05 | 2018-01-26 | 滁州格锐矿业有限责任公司 | A kind of composite containing sericite and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040147640A1 (en) * | 2003-01-16 | 2004-07-29 | Kuen-Yuan Hwang | Halogen-free resin composition |
| CN102363688A (en) * | 2011-11-09 | 2012-02-29 | 厦门双瑞船舶涂料有限公司 | Antifouling paint for underwater coating construction |
| CN103320071A (en) * | 2013-06-28 | 2013-09-25 | 上海悍马建筑科技有限公司 | Modified epoxy transparent crack sealing compound |
-
2014
- 2014-10-31 CN CN201410600037.8A patent/CN104277424A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040147640A1 (en) * | 2003-01-16 | 2004-07-29 | Kuen-Yuan Hwang | Halogen-free resin composition |
| CN102363688A (en) * | 2011-11-09 | 2012-02-29 | 厦门双瑞船舶涂料有限公司 | Antifouling paint for underwater coating construction |
| CN103320071A (en) * | 2013-06-28 | 2013-09-25 | 上海悍马建筑科技有限公司 | Modified epoxy transparent crack sealing compound |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107629417A (en) * | 2017-11-05 | 2018-01-26 | 滁州格锐矿业有限责任公司 | A kind of composite containing sericite and preparation method thereof |
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