CN104270555A - Surface CMOS image sensor camera shooting module - Google Patents

Surface CMOS image sensor camera shooting module Download PDF

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CN104270555A
CN104270555A CN201410479960.0A CN201410479960A CN104270555A CN 104270555 A CN104270555 A CN 104270555A CN 201410479960 A CN201410479960 A CN 201410479960A CN 104270555 A CN104270555 A CN 104270555A
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main lens
lens
image sensor
cmos image
optical fiber
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CN104270555B (en
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陈嘉胤
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Shanghai IC R&D Center Co Ltd
Chengdu Image Design Technology Co Ltd
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Shanghai Integrated Circuit Research and Development Center Co Ltd
Chengdu Image Design Technology Co Ltd
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Abstract

The invention discloses a surface CMOS image sensor camera shooting module. According to the surface CMOS image sensor camera shooting module, a double-Gauss lens without a spherical aberration corrective lens is adopted to serve as a main lens, the face, opposite to the face facing the main lens, of a sensor is designed to be a concave surface and correspond to the main lens, and the two ends of each optical fiber connected with a color filter in a coupling mode are connected with a photo diode and the main lens in a coupling mode to transmit the incident light, so that the incident light led out from the main lens can enter all the optical fibers in a divergent mode and arrive at the corresponding photo diodes after being restored by the corresponding color filters, reflection and crosstalk among pixels of the incident light can be eliminated effectively, the light sensitivity is improved, and the size of the module is contracted while the whole image quality is improved.

Description

A kind of curved surface cmos image sensor camera module
Technical field
The present invention relates to integrated circuit fields, more specifically, relate to a kind of curved surface cmos image sensor camera module improving light sensitivity and simplify main lens.
Background technology
Cmos image sensor camera module under prior art comprises two large parts: cmos image sensor and main lens.
Imageing sensor is device light signal being converted to the signal of telecommunication, is widely used in civilian and commercial category at Digital Television, face-to-face communication etc.According to the difference of photoelectric conversion mode, imageing sensor can be divided into ccd image sensor (Charge-coupled Device, CCD) and cmos image sensor (CMOS IMAGE SENSOR, CIS) two classes usually.
For CCD, on the one hand, at scientific research and the industrial circle of specialty, the CCD with high s/n ratio becomes first-selected; On the other hand, in high-end photography and vedio recording field, the CCD of high image quality can be provided also quite to be favored.And for CIS, have also been obtained extensive use at IP Camera and mobile phone photograph module.
CCD and CIS compares, and higher, the integrated difficulty of the former power consumption is comparatively large, and the latter is low in energy consumption, easy of integration and resolution is higher.Although CCD may be better than CIS in picture quality, but along with the significantly lifting with CMOS manufacturing technology level that improves constantly of CIS technology, the picture quality of a part of CIS is close to the CCD of same specification.CIS is obtaining substantial progress in performance, and advantage is widely used in all kinds of emerging field such as panel computer, smart mobile phone to rely on its low cost, high efficiency, transmission speed fast etc.Along with the promotion of the field of consumer electronics such as camera cell phone to CIS, the market prospects of following cmos image sensor will be more wide.The design of small size, high-performance CIS becomes one of important topic of this area research.
Imageing sensor one intuitively performance index is exactly the reproduction ability to image, and the pel array of imageing sensor is exactly the critical function module being directly connected to this index.In prior art, the pel array in CIS adopts CMOS active pixel sensor (Active Pixel Sensor, APS) as its photosensitive unit.An APS (i.e. a pixel cell) comprises a light sensitive diode (Photo Diode, PD) and an activated amplifier (Active Amplifier).Pel array can be divided into front illuminated formula (Front Side Illuminated, FSI) pel array and back-illuminated type (Back Side Illuminated, BSI) pel array.
Refer to Fig. 1, Fig. 1 is the structural profile schematic diagram of the FSI pel array of a kind of cmos image sensor of prior art.As shown in Figure 1, from section, pel array is divided into upper, middle and lower three flat beds substantially, and upper strata is filter layer 6, is used for placing lenticule (Micro-lens) 5 and the color filter (Color Filter) 4.Each lenticule 5 is convex lens, for focusing on incident light; The color filter 4 is usually pressed the arrangement of Bayer pattern and is formed color filter array.The corresponding optical channel 3 of a metal level 7, the optical channel 2 of photosensitive layer (also known as PD layer) 9 and PD1 below filter layer 6.Middle level is metal level 7, and matrix is silica material, is placed with multi-layer metal wiring 8 (being illustrated as 4 layers), and form circuit structure with electric connection mode, be used for transmitting the signal of telecommunication, the space between adjacent metal wiring forms optical channel 3, and from then on incident light can pass arrival PD1 by optical channel 3.Lower floor is PD layer 9, and host material is silicon, and the optical channel 2 being used for placing PD1, PD layer 9 is communicated with the optical channel 3 of metal level 7 and aims at.Lenticule 5 is used for collected light, incident light (as figure hollow core arrow indication) is by filter layer 6 enters metal level optical channel 3 successively, PD layer optical channel 2 arrives lower floor PD1, PD1 meets photon generation photoelectric effect, spread out of the signal of telecommunication again, the RAW data convert that PD collects by the color interpolation algorithm in digital processing flow process is coloured image.In the structure of FSI pel array, when incident light is by optical channel, because metal level wherein has plurality of layers metal line, some light will be reflected (as filled arrows indication in figure), light intensity is incurred loss, causes image quality to be affected.
Refer to Fig. 2, Fig. 2 is the structural profile schematic diagram of the BSI pel array of a kind of cmos image sensor of prior art.As shown in Figure 2, with FSI pel array unlike, in the structure of BSI pel array, be followed successively by filter layer 14, PD layer 15, metal level 16 3 flat beds from top to bottom, metal level 16 is positioned at the below of PD layer 15.Filter layer 14 is used for placing lenticule 13 and the color filter 12, and each lenticule 13 is convex lens, the optical channel 11 of a corresponding PD layer 15 and PD10 below it.Incident light (as figure hollow core arrow indication) only directly will need arrive PD10 by the optical channel 11 of PD layer 15, and need not pass through metal level 16, shortens optical channel.Therefore, the reflex of incident light and metal level 16 can not be there is in the structure of BSI pel array.Meanwhile, because optical channel does not need, because the metal line 17 of metal level 16 and manoeuvring space, to make the distance between neighbor suitably shorten.The problem of BSI picture element array structure is, compare FSI pel array, although the optical channel by shortening improves the light sensitivity of its pel array, but after the distance when between neighbor too shortens, crosstalk (crosstalk) between pixel will become obviously (as filled arrows indication in figure), cause the discolouration phenomena of coloured image.
When CIS is applied to field of photography, when design camera module, except need considering the performance of imageing sensor itself, the performance of its shooting main lens mated also to be considered.Except the application scenario at some lens changeables, the fields such as anti-in number list, high-definition digital film, the design objective of more occasions is that requirement uses the main lens of the imageing sensor of a fixed dimension and a fixing specification to mate, thus obtains optimum overall performance.
Refer to Fig. 3, Fig. 3 be opthalmic optics's structure with camera optical structure compare schematic diagram.As shown in Figure 3, in figure, the first half illustrates optical texture and the image-forming principle of human eye: the reflection ray on object 21 surface is reflected by the crystalline lens 20 of the eyeball 19 of people, converges to retina 18 image forming surface of eyeball 19 far-end.In figure, the latter half illustrates optical texture and the image-forming principle of camera: the reflection ray on object 21 surface is reflected by the main lens 23 of optical texture, has converged to CIS22 surface, has formed digital picture.Relatively these two imaging systems, can find three differences: first, the retina 18 of human eye is spherical female curved surface, and CIS22 is rectangle plane (please refer to Fig. 1, Fig. 2); Secondly, a human eye Phakic 20 1 eyeglasses, and the lens group that the main lens 23 of camera is made up of some eyeglasses (being illustrated as 6); Again, if using human lens 20 rear end to the distance of retina 18 as the flange focal distance fa being human eye, this flange focal distance fa wants much short according to the flange focal distance fb of the main lens 23 of camera system.
Refer to Fig. 4, Fig. 4 is the structural profile schematic diagram of a kind of cmos image sensor camera module of the prior art.As shown in Figure 4, camera module is made up of a main lens 31 and a cmos image sensor 24 (for FSI pel array).Main lens 31 is the design of typical double gauss, for having the lens group (containing spherical aberration correcting lens in lens group) of 6 eyeglasses.Cmos image sensor 24 designs for FSI, and its version is identical with the structure of the FSI pel array in Fig. 1, and have filter layer 32, metal level 33 and photosensitive layer 34 equally, metal level 33 is placed with multi-layer metal wiring 28, so place no longer launches repeat specification.The filter layer 32 of cmos image sensor 24 is oppositely arranged with 1 convex lens of main lens 31 bottom and is coupled.The flange focal distance fc of main lens 31 is bottom to the distance (being namely equal to the flange focal distance fb of the main lens 23 of indication Fig. 3) of pel array filter layer 32 upper surface of transducer 24 from lens group.From the incident ray (as figure hollow core arrow indication) that main lens 31 is derived, the optical axis vertical center line indication of main lens (in as the figure) is parallel to completely at optical center place, then gradually at a certain angle towards optical axis direction shape at lens edge place.Because incident ray is through after the lenticule 30 of cmos image sensor 24 and the color filter 29, the PD25 of photosensitive layer just can be made photosensitive through long and narrow metal level optical channel 27, photosensitive layer optical channel 26, the probability making the incident light with optical axis with certain angle occur to reflect is comparatively large, thus can lose certain light intensity at image border place.The whole height H of this camera lens module is topmost to the distance of pel array photosensitive layer 34 lower surface from lens group.As can be seen from the figure, lens group occupies most height space in whole camera lens module, seems very huge.
As shown in Figure 4, when being coupled with the lens group of main lens 31 by cmos image sensor 24, just there will be a problem, that is exactly the part that the image quality of picture centre will be better than image border far away.Its major reason is exactly that the light that incidence angle is comparatively tilted cannot arrive at PD25 and carry out photosensitive due to optical channel 27,26 comparatively long and narrow in FSI pel array.Compared with FSI pel array, BSI pel array is in the outside (below) of photosensitive layer because of metal level, therefore can be improved the lightsensitivity of its pel array by the optical channel of shortening.But, respond poor problem when BSI still thoroughly can not solve Ray obliquity incidence.
For the problems referred to above, the solution under prior art roughly has two kinds: a kind of is the optical design as far as possible optimizing lens group, makes the light of deriving from camera lens be with vertical direction incident image transducer from center to edge as far as possible; The second uses digital means, compensates in the light attenuation of image processing stage to image border.This two schemes, the former sacrifices the portability of system greatly, and the latter, while increase assesses the cost, also can only compensate brightness, really can not play the effect improving picture quality.
Summary of the invention
The camera module portability that the object of the invention is to overcome prior art existence is poor, the above-mentioned defect of image border image quality difference, a kind of curved surface cmos image sensor camera module is provided, by adopting the double Gauss lens not containing spherical aberration correction mirror as main lens, cmos image sensor is designed to concave curvatures towards the opposite face of main lens corresponding with main lens, and by being coupled with the fiber optic conduction incident light of the color filter, main lens is simplified, shorten flange focal distance, effectively can reduce the reflection of incident light, improve light sensitivity, realize while reducing module size, improve overall picture quality.
For achieving the above object, technical scheme of the present invention is as follows:
A kind of curved surface cmos image sensor camera module, comprising:
Main lens, described main lens is not containing the double Gauss lens of spherical aberration correction mirror;
Cmos image sensor, be located at the below of described main lens, the pel array of described transducer comprises color filter array, metal level and photosensitive layer, described sensor cover is concave curvatures to the opposite face of described main lens, described concave curvatures is symmetrical centered by the optical axis of described main lens, and with the lower end convex surface opposite face each other of described main lens; The optical channel of each light sensitive diode being communicated with described photosensitive layer respectively is inwardly provided with from described concave curvatures, optical fiber is provided with in described optical channel, each described optical fiber lower end is coupled to described light sensitive diode, upper end is coupled with the corresponding color filter of described color filter array, and is evenly coupled to the opposite face of described main lens;
Wherein, from the incident light that described main lens is derived, each described optical fiber can be entered in divergent shape, and by after described the color filter reduction, arrive at described light sensitive diode along described optical fiber.
Preferably, described main lens comprises the first convex lens, concavees lens, the second convex lens from top to bottom successively, described first convex lens, the second convex lens are single convex lens, its convex surface is arranged towards the lateral direction of described main lens, described concavees lens are biconcave lens, the described convex surface of described second convex lens and the described concave curvatures opposite face each other of described transducer; The upper end of each described optical fiber is coupled with described the color filter, and is evenly coupled to the opposite face of described main lens with plumbness.
Preferably, the upper end of each described optical fiber is evenly coupled to the opposite face of described main lens with plumbness by described the color filter.
Preferably, the inner couplings at the proximal end face place, upper end of each described optical fiber has described the color filter, and is evenly coupled to the opposite face of described main lens with plumbness.
Preferably, the inner couplings of the end, upper end of each described optical fiber has described the color filter, and is evenly coupled to the opposite face of described main lens with plumbness together with described the color filter.
Preferably, the described concave curvatures of described transducer has the curvature different from the opposite face of described main lens.
Preferably, the described concave curvatures of described transducer and the opposite face of described main lens have spacing, and described spacing equals the flange focal distance of described main lens.
Preferably, the described concave curvatures of described transducer has the curvature identical with the opposite face of described main lens.
Preferably, the described concave curvatures of described transducer and the opposite face of described main lens fit, and the flange focal distance of described main lens is zero.
Preferably, described sensor cover is the concave curvatures of described metal level or described photosensitive layer to the opposite face of described main lens.
Can find out that the present invention has the following advantages from technique scheme:
1, by adopting the double Gauss lens not containing spherical aberration correction mirror as main lens, eyeglass number is reduced to 3, and the design of main lens is simplified, and has greatly reduced the size of main lens;
2, the filter layer of the cmos image sensor of prior art is eliminated, cmos image sensor is designed to concave curvatures towards the opposite face of main lens corresponding with the lower end convex surface of main lens, as the plane of incidence of incident light, and optical fiber is coupled with the color filter, and then be coupled to the lower end convex surface of main lens, utilize main lens to instead of lenticule, highly shortened flange focal distance;
3, adopt the optical fiber instead of optical channel that are coupled with the color filter to conduct incident light, each fiber end face is coupled by vertical direction with the lower end convex surface of main lens, and distribute at its surface uniform, approximately parallel angle the incident ray of the divergent shape of deriving from main lens almost nondestructively can be passed to light sensitive diode array by optical fiber, effectively reduce the reflex that incident light occurs when the incidence of main lens edge, make to accept uniformly with the light sensitive diode array of coupling fiber, the incident light of high light intensity, thus while greatly shortening flange focal distance, output does not decay from center to edge image quality, the digital picture that imaging results consistency is very high.
Therefore, curved surface cmos image sensor camera module of the present invention can meet the demand of high portability and high image quality simultaneously, efficiently solves the deficiency that prior art exists, is truly improve the overall performance of camera module system.
Accompanying drawing explanation
Fig. 1 is the structural profile schematic diagram of the FSI pel array of a kind of cmos image sensor of prior art;
Fig. 2 is the structural profile schematic diagram of the BSI pel array of a kind of cmos image sensor of prior art;
Fig. 3 be opthalmic optics's structure with camera optical structure compare schematic diagram;
Fig. 4 is the structural profile schematic diagram of a kind of cmos image sensor camera module of the prior art;
Fig. 5 is the structural profile schematic diagram of the curved surface cmos image sensor camera module in the embodiment of the present invention one;
Fig. 6 is the structural profile schematic diagram of the curved surface cmos image sensor camera module in the embodiment of the present invention two;
Fig. 7 is the structural profile schematic diagram of the curved surface cmos image sensor camera module in the embodiment of the present invention three.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
It should be noted that, in following embodiment, when describing embodiments of the present invention in detail, in order to clearly represent structure of the present invention so that explanation, special to the structure in accompanying drawing not according to general scale, and carried out partial enlargement, distortion and simplify processes, therefore, should avoid being understood in this, as limitation of the invention.
Embodiment one
In the present embodiment, refer to Fig. 5, Fig. 5 is the structural profile schematic diagram of the curved surface cmos image sensor camera module in the embodiment of the present invention one.As shown in Figure 5, curved surface cmos image sensor camera module of the present invention comprises the main lens 46 and cmos image sensor 35 2 parts that are coupled.Main lens 46 based on double Gauss lens, but eliminates spherical aberration correcting lens.Therefore, eyeglass number decreases 3 than the double Gauss lens be typically made up of 6 eyeglasses, and it comprises the first convex lens 45, concavees lens 44, second convex lens 43 from top to bottom successively.Wherein, described first convex lens 45, second convex lens 43 are single convex lens, and its convex surface is arranged towards the lateral direction of described main lens 46 groups, and described concavees lens 44 are biconcave lens.After main lens 46 eliminates spherical aberration correcting lens, from the incident light that described main lens 46 is derived, can change divergent shape light injection (as figure hollow core arrow indication) centered by the optical axis of described main lens 46 vertical center line of main lens (namely in figure) into, this is different from the direction of the incident ray of deriving from typical 6 eyeglass double Gauss lens in Fig. 4.And, by adopting the double Gauss lens not containing spherical aberration correction mirror as main lens, eyeglass number is reduced to 3, and the design of main lens 46 is simplified, compare the main lens 31 of prior art in Fig. 4, the height dimension of the main lens 46 in the present embodiment substantially reduces.
Please continue to refer to Fig. 5.The pel array of cmos image sensor 35 designs based on FSI structure, comprises metal level 47 and photosensitive layer 48, but eliminates filter layer.Therefore, described transducer 35 is the surface 40 of metal level 47 towards the opposite face of described main lens 46.Identical with traditional FSI pel array, metal level 47 is provided with multi-layer metal wiring 38 (being illustrated as 4 layers), metal level 47 and photosensitive layer 48 are respectively equipped with the vertical optical channel 41 and 37 be connected, and the lower end of photosensitive layer optical channel 37 is communicated with PD (light sensitive diode) 36.With the something in common of traditional FSI pel array, namely the present embodiment no longer launches repeat specification, please refer to Fig. 1 and is understood.In the present embodiment, the surface 40 of metal level 47 is processed to a concave curvatures 40, corresponding with the convex surface of the second convex lens 43 of described main lens 46 bottom, opposite face each other.Described concave curvatures 40 is symmetrical centered by the optical axis of described main lens 46; Be processed with each optical channel 41 from described concave curvatures 40 to the inner vertical of metal level 47, be communicated with aligning respectively with each vertical optical channel 37 of photosensitive layer 48, the below of each optical channel 41,37 is communicated with each PD36 of described photosensitive layer 48.
Please continue to refer to Fig. 5.In order to eliminate the reflex of metal line 38 pairs of incident raies of existing FSI pel array metal level 47, in each described optical channel 41,37, be respectively equipped with 1 optical fiber 39, described optical fiber 39 adopts the flexible optical fibre that can conduct visible ray.The lower end of each described optical fiber 39 is coupled to corresponding PD36, and with PD36 fluid-tight engagement.Binder and other existing applicable patterns can be used to ensure that optical fiber 39 and PD36 are mutually closely sealed and to be communicated with.The upper end of optical fiber 39 is exposed from described concave curvatures 40 surface of metal level 47, has 1 the color filter 42 in the inner couplings of the end of optical fiber 39; Then, the upper end end face of each optical fiber 39 to be coupled to the convex surface of described main lens 46 bottom second convex lens 43 perpendicular to the state on described second convex lens 43 surface, and to engage with the convex surface sits of described second convex lens 43 together with the upper surface of the color filter 42.The end face that each described optical fiber 39 is coupled with the second convex lens 43 is evenly distributed at the convex surface of described second convex lens 43.Between optical fiber 39 and the color filter 42 and and the convex surface of described second convex lens 43 between the mode such as merging (Fuse) can be adopted to be coupled, also can use if desired index matching glue in order to promote merge performance; Or use binder and other existing applicable patterns to be coupled.Optical fiber 39 is inserted in optical channel 41,37 and when being coupled with the second convex lens 43 on time, such as free-space coupling technology (Free Space Coupling) can be adopted, use micro-control position table (its motor stepping is minimum) optical fiber 39 is put into optical channel 41,37 and aligns with the position of optical channel; Further, advantage optical fiber and arbitrary surface can being carried out splicing utilizing this technology to have, can be connected with the second convex lens 43 well by optical fiber 39.
As the another kind of implementation of the present embodiment, the color filter can be coupled with optical fiber in the inside of optical fiber upper end near end, then, then is coupled with the second convex lens equably with plumbness by the upper end end face of optical fiber.By this kind of mode, between the color filter and the second convex lens, certain gap will be there is.In addition, also have a kind of mode to be that end coupling is carried out in the upper end of optical fiber and the color filter, then, then the color filter is coupled with the second convex lens.That is, optical fiber is evenly coupled to the second convex lens by the color filter with plumbness.
In the present embodiment, the color filter array (color filter array be namely made up of whole the color filter 42) of the CIS pel array that the present invention discusses also uses Bayer pattern, the corresponding PD36 of a color filter 42 of often kind of color.The RAW data convert that PD36 can collect by the color interpolation algorithm in digital processing flow process is coloured image.
The present invention by arranging optical fiber in the optical channel of CIS pel array, makes that the light path of incident light is actual to be formed in optical fiber, and the incident light of deriving from main lens can be made can not to be covered, typically with metal layers reflection and to lose light intensity the path arriving photosensitive layer.Because incident light almost can arrive at photosensitive region to areflexia, the utilance of incident light is improved greatly, the high efficiency of transmission of incident optical signal can be realized.
Please continue to refer to Fig. 5.The described concave curvatures 40 of described transducer 35 has the curvature different from the convex surface of the second convex lens 43 (i.e. the opposite face of described main lens 46 and described concave curvatures 40), i.e. the convex shape Incomplete matching of the shape of described concave curvatures 40 and the second convex lens 43 of main lens 46.Therefore, described concave curvatures 40 and the second convex lens 43 leave spacing between the two, and this spacing is the flange focal distance fd of described main lens 46.By curved surface cmos image sensor camera module of the present invention in Fig. 5 compared with the camera module (there is the main lens of 6 eyeglasses) of the planar shaped cmos image sensor of prior art in Fig. 4, present invention eliminates filter layer, layer on surface of metal is designed to concave curvatures corresponding with main lens, as the plane of incidence of incident light, and optical fiber is coupled with the color filter, and then be coupled to main lens, utilize main lens to instead of lenticule; Further, by adopting the double Gauss lens not containing spherical aberration correction mirror as main lens, eyeglass number is made to be reduced to 3.Therefore, the flange focal distance fd of camera module main lens 46 of the present invention is much smaller than the main lens flange focal distance fc of prior art, and the whole height ha of camera module of the present invention, also much smaller than the whole height H of the camera module of prior art, almost shortens the height of half.
The opthalmic optics structure imaging system of the present invention just shown by Fig. 3 gains enlightenment, the retina of the upper surface of pel array simulation human eye is designed to concave curvatures shape corresponding with main lens, adopt the optical fiber instead of optical channel that are coupled with the color filter to conduct incident light, each fiber end face is coupled by vertical direction with main lens surface, and distributes at main lens surface uniform.When cmos image sensor 35 of the present invention is coupled with shooting main lens 46, can approximately parallel angle, by the incident ray (as figure hollow core arrow indication) of divergent shape of deriving from main lens 46 by as described in after the color filter 42 reduces, almost nondestructively be passed to light sensitive diode 36 array by optical fiber 39, effectively reduce the reflex that incident light occurs when the incidence of main lens 46 edge, make light sensitive diode 36 array be coupled with optical fiber 39 can accept the incident light of uniform, high light intensity.Due to higher to the oblique incidence light tolerance of shooting main lens 46 edge, make the cmos image sensor 35 with concave curvatures 40 can as eyes imaging system, the number of lenses of the lens design that matching optics structure is more succinct---main lens can be reduced by least a slice, the half (namely as 3 in the present embodiment slice) of even original 6 numbers, and can ensure that the imaging under same view angle is more outstanding simultaneously, thus while the flange focal distance greatly shortening main lens and whole imaging system size, output does not decay from center to edge image quality, the digital picture that imaging results consistency is very high.
Therefore, curved surface cmos image sensor camera module of the present invention can meet the demand of high portability and high image quality simultaneously, efficiently solves the deficiency that prior art exists, is truly improve the overall performance of camera module system.
Embodiment two
In the present embodiment, refer to Fig. 6, Fig. 6 is the structural profile schematic diagram of the curved surface cmos image sensor camera module in the embodiment of the present invention two.As shown in Figure 6, curved surface cmos image sensor camera module of the present invention comprises the main lens 46 and cmos image sensor 49 2 parts that are coupled.The design and implementation example one of main lens 46 is identical (because being employed herein identical figure notation), and equally based on double Gauss lens, but eliminate spherical aberration correcting lens, eyeglass number is similarly 3.Main lens 46 comprises the first convex lens 45, concavees lens 44, second convex lens 43 from top to bottom successively.Wherein, described first convex lens 45, second convex lens 43 are single convex lens, and its convex surface is arranged towards the lateral direction of described main lens 46 groups, and described concavees lens 44 are biconcave lens.After main lens 46 eliminates spherical aberration correcting lens, from the incident light that described main lens 46 is derived, can change divergent shape light injection (as figure hollow core arrow indication) centered by the optical axis of described main lens 46 vertical center line of main lens (namely in figure) into, this is different from the direction of the incident ray of deriving from typical 6 eyeglass double Gauss lens in Fig. 4.And, by adopting the double Gauss lens not containing spherical aberration correction mirror as main lens 46, eyeglass number is reduced to 3, and the design of main lens 46 is simplified, compare the main lens 31 of prior art in Fig. 4, the height dimension of the main lens 46 in the present embodiment substantially reduces.
Please continue to refer to Fig. 6.The pel array of cmos image sensor 49 designs based on BSI structure, comprises photosensitive layer 56 and metal level 57, but eliminates filter layer.Therefore, described transducer 49 is the surface 53 of photosensitive layer 56 towards the opposite face of described main lens 46.Identical with traditional BSI pel array, metal level 57 is provided with multi-layer metal wiring 50 (being illustrated as 4 layers), and photosensitive layer 56 is provided with the vertical optical channel 52 being communicated with PD (light sensitive diode) 51.With the something in common of traditional BSI pel array, namely the present embodiment no longer launches repeat specification, please refer to Fig. 2 and is understood.In the present embodiment, the surface 53 of photosensitive layer 56 is processed to a concave curvatures 53, corresponding with the convex surface of the second convex lens 43 of described main lens 46 bottom, opposite face each other.Described concave curvatures 53 is symmetrical centered by the optical axis of described main lens 46; Be processed with each optical channel 52 from described concave curvatures 53 to the inner vertical of photosensitive layer 56, the below correspondence of each optical channel 52 is communicated with each PD51 of described photosensitive layer 56.
Please continue to refer to Fig. 6.In order to effectively suppress the crosstalk phenomenon that exists between the pixel cell of existing BSI pel array, in each described optical channel 52, be respectively equipped with 1 optical fiber 54, described optical fiber 54 adopts the flexible optical fibre that can conduct visible ray.The lower end of each described optical fiber 54 is coupled to corresponding PD51, and with PD51 fluid-tight engagement.Binder and other existing applicable patterns can be used to ensure that optical fiber 54 and PD51 are mutually closely sealed and to be communicated with.The upper end of optical fiber 54 is exposed from described concave curvatures 53 surface of photosensitive layer 56, has 1 the color filter 55 in the inner couplings of the end of optical fiber 54; Then, the upper end end face of each optical fiber 54 to be coupled to the convex surface of described main lens 46 bottom second convex lens 43 perpendicular to the state on described second convex lens 43 surface, and to engage with the convex surface sits of described second convex lens 43 together with the upper surface of the color filter 55.The end face that each described optical fiber 54 is coupled with the second convex lens 43 is evenly distributed at the convex surface of described second convex lens 43.Between optical fiber 54 and the color filter 55 and and the convex surface of described second convex lens 43 between the mode such as merging (Fuse) can be adopted to be coupled, also can use if desired index matching glue in order to promote merge performance; Or use binder and other existing applicable patterns to be coupled.Optical fiber 54 is inserted in optical channel 52 and when being coupled with the second convex lens 43 on time, such as free-space coupling technology (Free Space Coupling) can be adopted, use micro-control position table (its motor stepping is minimum) optical fiber 54 is put into optical channel 52 and aligns with the position of optical channel; Further, advantage optical fiber and arbitrary surface can being carried out splicing utilizing this technology to have, can be connected with the second convex lens 43 well by optical fiber 54.
As the another kind of implementation of the present embodiment, the color filter can be coupled with optical fiber in the inside of optical fiber upper end near end, then, then is coupled with the second convex lens equably with plumbness by the upper end end face of optical fiber.By this kind of mode, between the color filter and the second convex lens, certain gap will be there is.In addition, also have a kind of mode to be that end coupling is carried out in the upper end of optical fiber and the color filter, then, then the color filter is coupled with the second convex lens.That is, optical fiber is evenly coupled to the second convex lens by the color filter with plumbness.
In the present embodiment, the color filter array (color filter array be namely made up of whole the color filter 55) of the CIS pel array that the present invention discusses also uses Bayer pattern, the corresponding PD51 of a color filter 55 of often kind of color.The RAW data convert that PD51 can collect by the color interpolation algorithm in digital processing flow process is coloured image.
The present invention by arranging optical fiber in the optical channel of CIS pel array photosensitive layer, make that the light path of incident light is actual to be formed in optical fiber, the incident light of deriving from main lens not only can be made the path arriving photosensitive layer can not to lose light intensity, and, utilize the shielding action of optical fiber, effectively can suppress the crosstalk phenomenon existed between pixel cell.
Please continue to refer to Fig. 6.The described concave curvatures 53 of described transducer 49 has the curvature different from the convex surface of the second convex lens 43 (i.e. the opposite face of described main lens 46 and described concave curvatures 53), i.e. the convex shape Incomplete matching of the shape of described concave curvatures 53 and the second convex lens 43 of main lens 46.Therefore, described concave curvatures 53 and the second convex lens 43 leave spacing between the two, and this spacing is the flange focal distance fe of described main lens 46.By curved surface cmos image sensor camera module of the present invention in Fig. 6 compared with the camera module (there is the main lens of 6 eyeglasses) of the planar shaped cmos image sensor of prior art in Fig. 4, present invention eliminates filter layer, be that concave curvatures is corresponding with main lens by photosensitive layer surface design, as the plane of incidence of incident light, and optical fiber is coupled with the color filter, and then be coupled to main lens, utilize main lens to instead of lenticule; Further, by adopting the double Gauss lens not containing spherical aberration correction mirror as main lens, eyeglass number is made to be reduced to 3.Therefore, the flange focal distance fe of camera module main lens 46 of the present invention is much smaller than the main lens flange focal distance fc of prior art, and the whole height hb of camera module of the present invention, also much smaller than the whole height H of the camera module of prior art, almost shortens the height of half.
In the present embodiment, it is corresponding with main lens that the retina of the photosensitive layer upper surface of pel array simulation human eye is designed to concave curvatures shape by the present invention, adopt the optical fiber instead of optical channel that are coupled with the color filter to conduct incident light, each fiber end face is coupled by vertical direction with main lens surface, and distributes at main lens surface uniform.When cmos image sensor 49 of the present invention is coupled with shooting main lens 46, can approximately parallel angle, by the incident ray (as figure hollow core arrow indication) of divergent shape of deriving from main lens 46 by as described in after the color filter 55 reduces, almost nondestructively be passed to light sensitive diode 51 array by optical fiber 54, effectively reduce the reflex that incident light occurs when the incidence of main lens 46 edge, thus eliminate BSI array can not thoroughly solve Ray obliquity incident time respond poor problem, also can make accept more uniform with the light sensitive diode array of coupling fiber, the incident light of high light intensity.And, utilize the shielding action of optical fiber, effectively can suppress the crosstalk phenomenon existed between BSI pixel cell.Due to higher to the oblique incidence light tolerance of shooting main lens 46 edge, make the cmos image sensor 49 with concave curvatures 53 can as eyes imaging system, the number of lenses of the lens design that matching optics structure is more succinct---main lens can be reduced by least a slice, the half (namely as 3 in the present embodiment slice) of even original 6 numbers, and can ensure that the imaging under same view angle is more outstanding simultaneously, thus while the flange focal distance greatly shortening main lens and whole imaging system size, output does not decay from center to edge image quality, the digital picture that imaging results consistency is very high.
Embodiment three
In the present embodiment, refer to Fig. 7, Fig. 7 is the structural profile schematic diagram of the curved surface cmos image sensor camera module in the embodiment of the present invention three.As shown in Figure 7, the present embodiment is the another kind of implementation of embodiment one.The difference part of the present embodiment and embodiment one is, described concave curvatures 40 surface of the described metal level 47 of described transducer 35 has the curvature identical with the convex surface of the second convex lens 43 of described main lens 46, and namely the shape of described concave curvatures 40 is mated completely with the convex shape of the second convex lens 43 of main lens 46.Therefore, described concave curvatures 40 fits between the two with the second convex lens 43 and is coupled, completely without spacing.That is, now the flange focal distance of described main lens 46 is zero.Accordingly, the upper end of described optical fiber 39 is no longer exposed, but the optical channel 41 on described concave curvatures 40 surface of metal level 47 described in indentation, and the upper end end face of each described optical fiber 39, described the color filter 42 upper surface of its end face inner couplings and described concave curvatures 40 surface forms coplanar curved surface, and fit with the convex surface of described second convex lens 43 simultaneously.
Therefore, when curved surface cmos image sensor height is identical, the whole height of the curved surface cmos image sensor camera module in the present embodiment has had further reduction relative to embodiment one.
Other structures of the present embodiment and functional realiey identical with embodiment one, therefore no longer launch illustrate, please refer to embodiment one and understood.
It should be noted that, when designing needs, also the another kind of implementation as embodiment three form can be adopted to embodiment two, even if the described concave curvatures surface of the described photosensitive layer of described transducer has the curvature identical with the convex surface of the second convex lens of described main lens, described concave curvatures is fitted between the two with the second convex lens be coupled, the flange focal distance of described main lens is similarly zero.Those skilled in the art can be implemented with reference to the above embodiment of the present invention, therefore no longer carry out expansion explanation.
Above-describedly be only the preferred embodiments of the present invention; described embodiment is also not used to limit scope of patent protection of the present invention; therefore the equivalent structure that every utilization specification of the present invention and accompanying drawing content are done changes, and in like manner all should be included in protection scope of the present invention.

Claims (10)

1. a curved surface cmos image sensor camera module, is characterized in that, comprising:
Main lens, described main lens is not containing the double Gauss lens of spherical aberration correction mirror;
Cmos image sensor, be located at the below of described main lens, the pel array of described transducer comprises color filter array, metal level and photosensitive layer, described sensor cover is concave curvatures to the opposite face of described main lens, described concave curvatures is symmetrical centered by the optical axis of described main lens, and with the lower end convex surface opposite face each other of described main lens; The optical channel of each light sensitive diode being communicated with described photosensitive layer respectively is inwardly provided with from described concave curvatures, optical fiber is provided with in described optical channel, each described optical fiber lower end is coupled to described light sensitive diode, upper end is coupled with the corresponding color filter of described color filter array, and is evenly coupled to the opposite face of described main lens;
Wherein, from the incident light that described main lens is derived, each described optical fiber can be entered in divergent shape, and by after described the color filter reduction, arrive at described light sensitive diode along described optical fiber.
2. curved surface cmos image sensor camera module according to claim 1, it is characterized in that, described main lens comprises the first convex lens, concavees lens, the second convex lens from top to bottom successively, described first convex lens, the second convex lens are single convex lens, its convex surface is arranged towards the lateral direction of described main lens, described concavees lens are biconcave lens, the described convex surface of described second convex lens and the described concave curvatures opposite face each other of described transducer; The upper end of each described optical fiber is coupled with described the color filter, and is evenly coupled to the opposite face of described main lens with plumbness.
3. curved surface cmos image sensor camera module according to claim 1 and 2, is characterized in that, the upper end of each described optical fiber is evenly coupled to the opposite face of described main lens with plumbness by described the color filter.
4. curved surface cmos image sensor camera module according to claim 1 and 2, is characterized in that, the inner couplings at the proximal end face place, upper end of each described optical fiber has described the color filter, and is evenly coupled to the opposite face of described main lens with plumbness.
5. curved surface cmos image sensor camera module according to claim 1 and 2, it is characterized in that, the inner couplings of the end, upper end of each described optical fiber has described the color filter, and is evenly coupled to the opposite face of described main lens with plumbness together with described the color filter.
6. curved surface cmos image sensor camera module according to claim 1 and 2, is characterized in that, the described concave curvatures of described transducer has the curvature different from the opposite face of described main lens.
7. curved surface cmos image sensor camera module according to claim 6, is characterized in that, the described concave curvatures of described transducer and the opposite face of described main lens have spacing, and described spacing equals the flange focal distance of described main lens.
8. curved surface cmos image sensor camera module according to claim 1 and 2, is characterized in that, the described concave curvatures of described transducer has the curvature identical with the opposite face of described main lens.
9. curved surface cmos image sensor camera module according to claim 8, is characterized in that, the described concave curvatures of described transducer and the opposite face of described main lens fit, and the flange focal distance of described main lens is zero.
10. curved surface cmos image sensor camera module according to claim 1, is characterized in that, described sensor cover is the described concave curvatures of described metal level or described photosensitive layer to the opposite face of described main lens.
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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104730688A (en) * 2015-04-17 2015-06-24 张家港中贺自动化科技有限公司 Wide-visual-field and high-resolution optical system
CN104965294A (en) * 2015-08-03 2015-10-07 江苏南大五维电子科技有限公司 Large-view-field miniature imaging system
CN105185800A (en) * 2015-08-19 2015-12-23 启芯瑞华科技(武汉)有限公司 Complementary metal oxide semiconductor image sensor and manufacturing method thereof
CN106973203A (en) * 2017-04-21 2017-07-21 华为机器有限公司 Camera module
CN108111732A (en) * 2017-12-27 2018-06-01 信利光电股份有限公司 A kind of camera module
CN108769477A (en) * 2018-06-07 2018-11-06 信利光电股份有限公司 A kind of camera module
CN109151273A (en) * 2018-08-27 2019-01-04 彭波 A kind of light fan stereo camera and stereoscopic measurement method
CN110049218A (en) * 2019-04-19 2019-07-23 信利光电股份有限公司 Imaging method, device, system and the readable storage medium storing program for executing of flexible sensor
CN110579858A (en) * 2019-08-12 2019-12-17 西北大学 Mobile phone lens and preparation method thereof
US10638032B2 (en) 2017-04-27 2020-04-28 Ap Photonics Limited Lens control apparatus configured in an imaging device
CN112435637A (en) * 2020-11-30 2021-03-02 Oppo广东移动通信有限公司 Brightness compensation method, brightness compensation equipment and brightness compensation system of curved screen
WO2021244340A1 (en) * 2020-06-05 2021-12-09 中兴通讯股份有限公司 Camera, camera control method, terminal, electronic device, and storage medium
CN113820774A (en) * 2021-09-28 2021-12-21 深圳市海谱纳米光学科技有限公司 Hyperspectral imaging system
CN114125238A (en) * 2021-11-30 2022-03-01 维沃移动通信有限公司 Image sensor, camera module and electronic equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050200977A1 (en) * 2004-03-11 2005-09-15 Vision Technologies, Inc. Lens assembly and optical imaging using same
CN101188208A (en) * 2006-10-26 2008-05-28 全视科技有限公司 Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating
CN101378068A (en) * 2007-08-30 2009-03-04 夏普株式会社 Solid-state image capturing device, manufacturing method thereof and electronic information device
CN102437169A (en) * 2011-11-25 2012-05-02 格科微电子(上海)有限公司 Manufacturing method of image sensor
CN103441134A (en) * 2013-09-02 2013-12-11 上海集成电路研发中心有限公司 Pixel array of CIS
CN103545334A (en) * 2013-10-30 2014-01-29 上海集成电路研发中心有限公司 Pixel unit of 3D CMOS image sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050200977A1 (en) * 2004-03-11 2005-09-15 Vision Technologies, Inc. Lens assembly and optical imaging using same
CN101188208A (en) * 2006-10-26 2008-05-28 全视科技有限公司 Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating
CN101378068A (en) * 2007-08-30 2009-03-04 夏普株式会社 Solid-state image capturing device, manufacturing method thereof and electronic information device
CN102437169A (en) * 2011-11-25 2012-05-02 格科微电子(上海)有限公司 Manufacturing method of image sensor
CN103441134A (en) * 2013-09-02 2013-12-11 上海集成电路研发中心有限公司 Pixel array of CIS
CN103545334A (en) * 2013-10-30 2014-01-29 上海集成电路研发中心有限公司 Pixel unit of 3D CMOS image sensor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
姜秀彬: "CMOS图像传感器系统设计", 《中国优秀硕士学位论文全文数据库 信息科技辑》 *

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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CN104965294A (en) * 2015-08-03 2015-10-07 江苏南大五维电子科技有限公司 Large-view-field miniature imaging system
CN105185800A (en) * 2015-08-19 2015-12-23 启芯瑞华科技(武汉)有限公司 Complementary metal oxide semiconductor image sensor and manufacturing method thereof
CN105185800B (en) * 2015-08-19 2017-08-25 启芯瑞华科技(武汉)有限公司 Cmos image sensor and its manufacture method
CN106973203A (en) * 2017-04-21 2017-07-21 华为机器有限公司 Camera module
WO2018192579A1 (en) * 2017-04-21 2018-10-25 华为技术有限公司 Camera module
CN106973203B (en) * 2017-04-21 2020-11-17 华为机器有限公司 Camera module
US10638032B2 (en) 2017-04-27 2020-04-28 Ap Photonics Limited Lens control apparatus configured in an imaging device
CN108111732A (en) * 2017-12-27 2018-06-01 信利光电股份有限公司 A kind of camera module
CN108769477A (en) * 2018-06-07 2018-11-06 信利光电股份有限公司 A kind of camera module
CN109151273A (en) * 2018-08-27 2019-01-04 彭波 A kind of light fan stereo camera and stereoscopic measurement method
CN109151273B (en) * 2018-08-27 2020-09-04 彭波 Fan stereo camera and stereo measurement method
CN110049218A (en) * 2019-04-19 2019-07-23 信利光电股份有限公司 Imaging method, device, system and the readable storage medium storing program for executing of flexible sensor
CN110579858A (en) * 2019-08-12 2019-12-17 西北大学 Mobile phone lens and preparation method thereof
WO2021244340A1 (en) * 2020-06-05 2021-12-09 中兴通讯股份有限公司 Camera, camera control method, terminal, electronic device, and storage medium
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