CN104266618A - Ultrasonic thickness meter based on mobile display terminal - Google Patents
Ultrasonic thickness meter based on mobile display terminal Download PDFInfo
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- CN104266618A CN104266618A CN201410509014.6A CN201410509014A CN104266618A CN 104266618 A CN104266618 A CN 104266618A CN 201410509014 A CN201410509014 A CN 201410509014A CN 104266618 A CN104266618 A CN 104266618A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
- G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
- G01B17/025—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness for measuring thickness of coating
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Abstract
The invention relates to an ultrasonic thickness meter based on a mobile display terminal. The ultrasonic thickness meter based on the mobile display terminal comprises an ultrasonic probe and the mobile terminal, a cable component is arranged between the ultrasonic probe and the mobile terminal and comprises an ultrasonic emitting and receiving module, a measurement circuit, a power supply circuit and a control circuit, the ultrasonic emitting and receiving module, the measurement circuit, the power supply circuit and the control circuit are electrically connected, the ultrasonic thickness meter is connected with the mobile terminal through a 3.5mm audio head and has the advantages of being high in data processing capacity and display function, the production cost of the ultrasonic thickness meter is lowered effectively, universality is high, two voltage-stabilized sources are adopted, the problem that the ultrasonic emitting and receiving module and a microcontroller can not work under the same voltage condition is solved effectively, miniaturization and low power consumption of the ultrasonic thickness meter are ensured, a 50mA and 3V button cell can support the whole system to be in standby operation for more than one year, the ultrasonic thickness meter is convenient to carry and use, the measurement error does not exceed +/-0.01% of the thickness of a tested coating, the measurement precision is high, and performance is reliable.
Description
Technical field
The present invention relates to a kind of supersonic thickness meter, be applicable to Ultrasonic Nondestructive, be particularly useful for the coating thickness Non-Destructive Testing based on mobile display terminal, specifically, relate to a kind of supersonic thickness meter based on mobile display terminal, belong to technical field of nondestructive testing.
Background technology
The form that traditional supersonic thickness meter adopts main frame to add ultrasonic wave thickness measuring probe forms ultrasonic thickness detector, and as a kind of special instrument, this pattern has continued to use decades.But there is following shortcoming in this traditional coating thickness detector.
1, displaying contents is abundant not.
Current supersonic thickness meter many employings low resolution (normally 128*64) FSTN liquid crystal dot matrix, although some menus and measurement result can be shown, if but to caulocarpic comparative analysis be carried out, can only complete on computers by PC software, this just causes very large inconvenience.
2, the more difficult V course corrections algorithm realizing complexity.
For ultrasound wave double crystal probe, its hyperacoustic travel path is not straight line, but V-type, therefore the relation between thickness and travel-time exists certain non-linear, at this moment certain correction must be done, common way gets part measurement point to find out corresponding relation as calibration point, point between adjacent calibration point adopts the way of interpolation, so, ultrasonic propagation time corresponding relation is not smooth curve, it is thinner that this curve does, measuring accuracy is higher, but this will take the larger program space, and as Embedded controller, the program space is very limited.
3, data-handling capacity is limited.
Traditional ultrasonic only can complete simple measurement function and Presentation Function, and be helpless to the compare of analysis of mass data, data statistics, data mining, especially measure for corrosion thickness, the long Data Comparison of special needs, analyzes speed and the trend of corrosion.
4, traditional ultrasonic major part cost is that flower is on main frame, especially the non-measured circuit part of main frame, the cost of metering circuit only accounts for less than 1/8, that is most of cost has dropped on it and above the display be bad at, data processing, data transmission and other subsidiary functions, caused the wasting of resources.
Summary of the invention
The problem to be solved in the present invention is for above problem, a kind of supersonic thickness meter based on mobile display terminal is provided, solve the problem that traditional ultrasonic data-handling capacity is inadequate and Presentation Function is not powerful, the display effectively utilizing the mobile terminals such as mobile phone powerful and data-handling capacity, make up the deficiency of traditional instrument.
Object two of the present invention: be to provide a kind of measuring error be no more than tested coating thickness ± supersonic thickness meter of 0.01%, measuring accuracy is high.
Object three of the present invention: be to provide a kind of volume little, be convenient for carrying and the long supersonic thickness meter of stand-by time, to ensure that the power supply of 50mA can support the standby operation of supersonic thickness meter more than 1 year.
For solving the problem, the technical solution adopted in the present invention is: a kind of supersonic thickness meter based on mobile display terminal, it is characterized in that: described thicknessmeter comprises ultrasonic probe and mobile terminal, between ultrasonic probe and mobile terminal, be provided with cable component;
Described cable component comprises the ultrasound wave transmitting and receiving module of electrical connection, metering circuit, feed circuit and control circuit;
Described ultrasonic probe is for launching high-pressure sharp pulse, ultrasound wave transmitting and receiving module is for receiving echoed signal, metering circuit is for measuring ultrasonic echo time, feed circuit are used for providing stable voltage for ultrasound wave transmitting and receiving module, control circuit is used for the signal that mobile terminal receive sends, and transfers to metering circuit.
Adopt this technical scheme, the display that can effectively utilize the mobile terminals such as mobile phone powerful and data-handling capacity, reduce the production cost of thicknessmeter, and be convenient for carrying, highly versatile.
A kind of prioritization scheme, described feed circuit comprise boost converter U4, coil L1 is connected with between the switch terminals SW of boost converter U4 and the power end Vin of boost converter U4, diode D20 and resistance R24 is connected with between the switch terminals SW of boost converter U4 and the feedback end FB of boost converter U4, the positive pole of diode D20 is connected with the switch terminals SW of boost converter U4, the negative pole of diode D20 meets the feedback end FB of boost converter U4 through resistance R24, the feedback end FB of boost converter U4 is through resistance R23 ground connection;
Node between described resistance R24 and diode D20 is through electric capacity C3 ground connection, and the two ends of electric capacity C3 are parallel with electric capacity C21, and the node between the positive pole of electric capacity C3 and electric capacity C21 is connected with test point TP1;
Node between the positive pole of described electric capacity C3 and electric capacity C21 connects 5V power supply through field effect transistor VQ5, the positive pole of electric capacity C3 is connected with the source S of field effect transistor VQ5 with the node between electric capacity C21, the drain D of field effect transistor VQ5 is connected with 5V power supply, the grid G of field effect transistor VQ5 is electrically connected with control circuit, is connected with resistance R7 between the grid G of field effect transistor VQ5 and the source S of field effect transistor VQ5;
The power end Vin of described boost converter U4 is through electric capacity C30 ground connection, node between the positive pole of electric capacity C30 and the power end Vin of boost converter U4 is electrically connected with power supply P3, the positive pole of power supply P3 meets the power end Vin of boost converter U4, the minus earth of power supply P3;
The power end Vin of described boost converter U4 is electrically connected with control circuit;
The Enable Pin EN of described boost converter U4 is electrically connected with control circuit.
Adopt this technical scheme, adopt two-way stabilized voltage supply, wherein a road boosts to 5V for ultrasound wave transmitting and receiving module through boost converter U4 and provides power supply, an other road directly adopts 3V button cell to provide power supply for microcontroller U5, efficiently solve the difficult problem that ultrasound wave transmitting and receiving module and microcontroller U5 can not work under same voltage conditions, also assures that miniaturization and the low-power consumption of supersonic thickness meter simultaneously, the 3V button cell of 50mA can support the standby operation of whole system more than 1 year, therefore do not need in supersonic thickness meter to use on-off circuit, further ensure the miniaturization of supersonic thickness meter, easy to carry and use.
Another kind of prioritization scheme, described control circuit comprises microcontroller U5, the model of microcontroller U5 is MKL05Z32VFK4, the 23 foot meridian capacitor C6 of microcontroller U5 are electrically connected by audio head with the R channel output terminal RIGHT of mobile terminal, node between electric capacity C6 and 23 pin of microcontroller U5 is connected with the power end Vin of boost converter U4 through resistance R41, and the node between resistance R41 and 23 pin of microcontroller U5 is through electric capacity C41 ground connection;
1 pin of described microcontroller U5 is electrically connected with metering circuit, for receiving the look-at-me that metering circuit sends;
The 3 foot meridian capacitor C25 ground connection of described microcontroller U5, the node between electric capacity C25 and 3 pin of microcontroller U5 is connected with the power end Vin of boost converter U4;
The 4 pin ground connection of described microcontroller U5;
Crystal oscillating circuit is connected with between 5 pin of described microcontroller U5 and 6 pin of microcontroller U5;
7 pin of described microcontroller U5 are electrically connected with metering circuit;
8 pin of described microcontroller U5,9 pin of microcontroller U5,10 pin of microcontroller U5 and 11 pin of microcontroller U5 are electrically connected with metering circuit, for reading measurement result;
12 pin of described microcontroller U5 are connected with the Enable Pin EN of boost converter U4;
Be electrically connected with ultrasound wave transmitting and receiving module between 13 pin of described microcontroller U5 and 14 pin of microcontroller U5;
15 pin of described microcontroller U5 are electrically connected with metering circuit;
16 pin of described microcontroller U5 are connected with the grid G of field effect transistor VQ5;
17 pin of described microcontroller U5 connect audio head through resistance R11, are in series with electric capacity C8 between resistance R11 and audio head, and the node between electric capacity C8 and resistance R11 is through electric capacity C9 ground connection, and the node between electric capacity C8 and audio head is through resistance R12 ground connection;
The 18 foot meridian capacitor C5 of described microcontroller U5 meet the L channel output terminal LEFT of mobile terminal, node between electric capacity C5 and 18 pin of microcontroller U5 is through resistance R10 ground connection, and the node between resistance R10 and electric capacity C5 meets the power end Vin of boost converter U4 through resistance R9.
Adopt this technical scheme, effectively improve the usability of thicknessmeter.
Another prioritization scheme, described crystal oscillating circuit comprises crystal oscillator X2, resistance R5, electric capacity C31 and electric capacity C32, the two ends of described resistance R5 are electrically connected with 5 pin of microcontroller U5 and 6 pin of microcontroller U5 respectively, described crystal oscillator X2 is connected in parallel on the two ends of resistance R5, described electric capacity C31 and electric capacity C32 is connected on the two ends of crystal oscillator X2, the node ground connection between electric capacity C31 and electric capacity C32.
Adopt this technical scheme, further increase serviceable life and the stability of thicknessmeter.
Further prioritization scheme, described ultrasound wave transmitting and receiving module comprises ultrasound wave transceiver circuit M1, ultrasound wave transceiver circuit M1 has ultrasound wave transmitting and receiving conditioning functions, the emissioning controling signal end PULSE of the high-voltage pulse of ultrasound wave transceiver circuit M1 is connected with 13 pin of microcontroller U5, the charging control signal end HV_CHARGE of the ultrasonic high pressure generation circuit of ultrasound wave transceiver circuit M1 is connected with 14 pin of microcontroller U5, the echoed signal transmitting terminal ECHO of ultrasound wave transceiver circuit M1 is electrically connected with metering circuit, the power supply termination 5V power supply of ultrasound wave transceiver circuit M1, the earth terminal ground connection of ultrasound wave transceiver circuit M1.
Adopt this technical scheme, ensure that the accuracy of coating thickness measured by thicknessmeter.
Further prioritization scheme, described metering circuit comprises time-to-digit converter U6, the crystal oscillator of time-to-digit converter U6 drives input end 1 pin to be connected with four pin crystal oscillator X1, output terminal OUT and the crystal oscillator of time-to-digit converter U6 of four pin crystal oscillator X1 drive input end 1 pin to be connected, the earth terminal GND ground connection of four pin crystal oscillator X1, the power end VCC of four pin crystal oscillator X1 meets the power end Vin of boost converter U4;
Supply voltage end 3 pin of described time-to-digit converter U6 meets the power end Vin of boost converter U4;
Electric capacity C40 is connected with, the power end Vin of a termination boost converter U4 of electric capacity C40, the other end ground connection of electric capacity C40 between earth terminal 4 pin of described time-to-digit converter U6 and supply voltage end 3 pin of time-to-digit converter U6;
" sing around method " signal input part 7 pin ground connection of described time-to-digit converter U6;
Look-at-me end 8 pin of described time-to-digit converter U6 connects 1 pin of microprocessor U5;
The serial line interface of described time-to-digit converter U6 connects 11 pin of microprocessor U5 from machine selecting side 9 pin, serial interface clock end 10 pin of time-to-digit converter U6 connects 10 pin of microprocessor U5, serial interface data input end 11 pin of time-to-digit converter U6 connects 9 pin of microprocessor U5, and serial interface data output terminal 12 pin of time-to-digit converter U6 connects 8 pin of microprocessor U5;
The RESET input 13 pin of described time-to-digit converter U6 connects 15 pin of microprocessor U5;
Core voltage end 14 pin of described time-to-digit converter U6 meets the power end Vin of boost converter U4, and the node between core voltage end 14 pin of time-to-digit converter U6 and the power end Vin of boost converter U4 is through electric capacity C47 ground connection;
The earth terminal 21 pin ground connection of described time-to-digit converter U6;
Electric capacity C34 is connected with, the power end Vin of a termination boost converter U4 of electric capacity C34, the other end ground connection of electric capacity C34 between earth terminal 21 pin of described time-to-digit converter U6 and supply voltage end 22 pin of time-to-digit converter U6;
Resistance R36 is connected with between Stop passage 2 enable port 25 pin of described time-to-digit converter U6 and the power end Vin of boost converter U4;
Resistance R35 is connected with between Stop passage 1 enable port 26 pin of described time-to-digit converter U6 and the power end Vin of boost converter U4;
Stop passage 2 port 27 pin of described time-to-digit converter U6 is through resistance R33 ground connection;
The earth terminal 28 pin ground connection of described time-to-digit converter U6;
Core voltage end 29 pin of described time-to-digit converter U6 meets the power end Vin of boost converter U4, node between core voltage end 29 pin of time-to-digit converter U6 and the power end Vin of boost converter U4 is through electric capacity C51 ground connection, the two ends of electric capacity C51 are parallel with electric capacity C50, the positive pole of electric capacity C50 is connected with core voltage end 29 pin of time-to-digit converter U6, the minus earth of electric capacity C50;
Stop passage 1 port 30 pin of described time-to-digit converter U6 connect ultrasound wave transceiver circuit M1 echoed signal transmitting terminal ECHO, receive the echoed signal that ultrasound wave transceiver circuit M1 sends;
Start access port 31 pin of described time-to-digit converter U6 is electrically connected with 7 pin of microcontroller U5;
Resistance R31 is connected with between Start passage enable port 32 pin of described time-to-digit converter U6 and the power end Vin of boost converter U4.
Adopt this technical scheme, effectively ensure that the measuring accuracy of coating thickness, through verification experimental verification, measuring error be no more than tested coating thickness ± supersonic thickness meter of 0.01%.
The present invention takes above technical scheme, have the following advantages: described supersonic thickness meter is connected with mobile terminal by 3.5mm audio head, the work of supersonic thickness meter is controlled by mobile terminal, the display effectively utilizing the mobile terminals such as mobile phone powerful and data-handling capacity, there is data-handling capacity and the powerful advantage of Presentation Function, and effectively reduce the production cost of supersonic thickness meter, highly versatile.
Adopt two-way stabilized voltage supply, wherein a road boosts to 5V for ultrasound wave transceiver circuit M1 through boost converter U4 and provides power supply, an other road directly adopts 3V button cell to provide power supply for microcontroller U5, efficiently solve the difficult problem that ultrasound wave transceiver circuit M1 and microcontroller U5 can not work under same voltage conditions, also assures that miniaturization and the low-power consumption of supersonic thickness meter simultaneously, the 3V button cell of 50mA can support the standby operation of whole system more than 1 year, therefore do not need in supersonic thickness meter to use on-off circuit, further ensure the miniaturization of supersonic thickness meter, easy to carry and use.
Through verification experimental verification, adopt supersonic thickness meter of the present invention measure coating thickness, its measuring error be no more than tested coating thickness ± 0.01%, measuring accuracy is high, dependable performance.
Below in conjunction with drawings and Examples, the invention will be further described.
Accompanying drawing explanation
Accompanying drawing 1 is the theory diagram of supersonic thickness meter in the embodiment of the present invention;
Accompanying drawing 2 is electrical schematic diagrams of control circuit in the embodiment of the present invention;
Accompanying drawing 3 is electrical schematic diagrams of feed circuit in the embodiment of the present invention;
Accompanying drawing 4 is electrical schematic diagrams of metering circuit in the embodiment of the present invention.
Embodiment
Embodiment 1, as shown in Figure 1, a kind of supersonic thickness meter based on mobile display terminal, comprise ultrasonic probe and mobile terminal, cable component is provided with between ultrasonic probe and mobile terminal, described cable component comprises the ultrasound wave transmitting and receiving module of electrical connection, metering circuit, feed circuit and control circuit, described ultrasonic probe is for launching high-pressure sharp pulse, ultrasound wave transmitting and receiving module is for receiving echoed signal, metering circuit is used for delicate metering ultrasonic echo time and is converted to one-tenth-value thickness 1/10, one-tenth-value thickness 1/10 sends to mobile terminal the most at last, feed circuit are used for providing stable voltage for ultrasound wave transmitting and receiving module, control circuit is used for the signal that mobile terminal receive sends, and transfer to metering circuit, mobile terminal is for sending detect thickness sign on and processing the one-tenth-value thickness 1/10 signal received, transmission and display etc.
Described microprocessor is electrically connected by audio head with between mobile terminal, and the present embodiment sound intermediate frequency head adopts 3.5mm audio head, improves versatility.
As shown in Figure 2, described control circuit comprises microcontroller U5, the model of microcontroller U5 is MKL05Z32VFK4, the 23 foot meridian capacitor C6 of microcontroller U5 are electrically connected by audio head with the R channel output terminal RIGHT of mobile terminal, the signal that the R channel output terminal RIGHT of mobile terminal sends is for resetting to microcontroller U5, node between electric capacity C6 and 23 pin of microcontroller U5 is electrically connected with feed circuit through resistance R41, and the node between resistance R41 and 23 pin of microcontroller U5 is through electric capacity C41 ground connection.
1 pin of described microcontroller U5 is electrically connected with metering circuit, for receiving the look-at-me that metering circuit sends.
The 3 foot meridian capacitor C25 ground connection of described microcontroller U5, the node between electric capacity C25 and 3 pin of microcontroller U5 is electrically connected with feed circuit.
The 4 pin ground connection of described microcontroller U5.
Crystal oscillating circuit is connected with between 5 pin of described microcontroller U5 and 6 pin of microcontroller U5, described crystal oscillating circuit comprises crystal oscillator X2, resistance R5, electric capacity C31 and electric capacity C32, the two ends of described resistance R5 are electrically connected with 5 pin of microcontroller U5 and 6 pin of microcontroller U5 respectively, described crystal oscillator X2 is connected in parallel on the two ends of resistance R5, described electric capacity C31 and electric capacity C32 is connected on the two ends of crystal oscillator X2, the node ground connection between electric capacity C31 and electric capacity C32.
7 pin of described microcontroller U5 are electrically connected with metering circuit.
8 pin of described microcontroller U5,9 pin of microcontroller U5,10 pin of microcontroller U5 and 11 pin of microcontroller U5 are electrically connected with metering circuit, for reading measurement result.
12 pin of described microcontroller U5 are electrically connected with feed circuit.
Be electrically connected with ultrasound wave transmitting and receiving module between 13 pin of described microcontroller U5 and 14 pin of microcontroller U5, described ultrasound wave transmitting and receiving module comprises ultrasound wave transceiver circuit M1, ultrasound wave transceiver circuit M1 has ultrasound wave transmitting and receiving conditioning functions, adopt the known ultrasound wave transceiver circuit of those skilled in that art, therefore repeat no more in the present embodiment, the emissioning controling signal end PULSE of the high-voltage pulse of ultrasound wave transceiver circuit M1 is connected with 13 pin of microcontroller U5, the charging control signal end HV_CHARGE of the ultrasonic high pressure generation circuit of ultrasound wave transceiver circuit M1 is connected with 14 pin of microcontroller U5, the echoed signal transmitting terminal ECHO of ultrasound wave transceiver circuit M1 is electrically connected with metering circuit, the power supply termination 5V power supply of ultrasound wave transceiver circuit M1, the earth terminal ground connection of ultrasound wave transceiver circuit M1.
15 pin of described microcontroller U5 are electrically connected with metering circuit.
16 pin of described microcontroller U5 are electrically connected with feed circuit.
17 pin of described microcontroller U5 connect audio head through resistance R11, are in series with electric capacity C8 between resistance R11 and audio head, and the node between electric capacity C8 and resistance R11 is through electric capacity C9 ground connection, and the node between electric capacity C8 and audio head is through resistance R12 ground connection.
The 18 foot meridian capacitor C5 of described microcontroller U5 meet the L channel output terminal LEFT of mobile terminal, and the node between described electric capacity C5 and 18 pin of microcontroller U5 is through resistance R10 ground connection, and the node between resistance R10 and electric capacity C5 connects feed circuit through resistance R9.
As shown in Figure 3, described feed circuit comprise boost converter U4, in the present embodiment boost converter U4 select model be TPS61040DBV, coil L1 is connected with between the switch terminals SW of boost converter U4 and the power end Vin of boost converter U4, diode D20 and resistance R24 is connected with between the switch terminals SW of boost converter U4 and the feedback end FB of boost converter U4, the model that diode D20 selects is MBR0530, the positive pole of diode D20 is connected with the switch terminals SW of boost converter U4, the negative pole of diode D20 meets the feedback end FB of boost converter U4 through resistance R24, the feedback end FB of boost converter U4 is through resistance R23 ground connection.
Node between described resistance R24 and diode D20 is through electric capacity C3 ground connection, and the two ends of electric capacity C3 are parallel with electric capacity C21, and the node between the positive pole of electric capacity C3 and electric capacity C21 is connected with test point TP1.
Node between the positive pole of described electric capacity C3 and electric capacity C21 connects 5V power supply through field effect transistor VQ5, the positive pole of electric capacity C3 is connected with the source S of field effect transistor VQ5 with the node between electric capacity C21, the drain D of field effect transistor VQ5 is connected with 5V power supply, the grid G of field effect transistor VQ5 is connected with 16 pin of microcontroller U5, be connected with resistance R7 between the grid G of field effect transistor VQ5 and the source S of field effect transistor VQ5, the model that described field effect transistor VQ5 selects is SI2323DS.
The power end Vin of described boost converter U4 is through electric capacity C30 ground connection, node between the positive pole of electric capacity C30 and the power end Vin of boost converter U4 is electrically connected with power supply P3, power supply P3 selects 3V button cell, the positive pole of power supply P3 meets the power end Vin of boost converter U4, the minus earth of power supply P3.
The power end Vin of described boost converter U4 is connected with 3 pin of microcontroller U5.
The Enable Pin EN of described boost converter U4 is connected with 12 pin of microprocessor U5.
As shown in Figure 4, described metering circuit comprises time-to-digit converter U6, the model that time-to-digit converter U6 selects is TDC-GP21, the crystal oscillator of time-to-digit converter U6 drives input end 1 pin to be connected with four pin crystal oscillator X1, output terminal OUT and the crystal oscillator of time-to-digit converter U6 of four pin crystal oscillator X1 drive input end 1 pin to be connected, the earth terminal GND ground connection of four pin crystal oscillator X1, the power end VCC of four pin crystal oscillator X1 meets the power end Vin of boost converter U4.
Supply voltage end 3 pin of described time-to-digit converter U6 meets the power end Vin of boost converter U4.
Electric capacity C40 is connected with, the power end Vin of a termination boost converter U4 of electric capacity C40, the other end ground connection of electric capacity C40 between earth terminal 4 pin of described time-to-digit converter U6 and supply voltage end 3 pin of time-to-digit converter U6.
" sing around method " signal input part 7 pin ground connection of described time-to-digit converter U6.
Look-at-me end 8 pin of described time-to-digit converter U6 connects 1 pin of microprocessor U5.
The serial line interface of described time-to-digit converter U6 connects 11 pin of microprocessor U5 from machine selecting side 9 pin, serial interface clock end 10 pin of time-to-digit converter U6 connects 10 pin of microprocessor U5, serial interface data input end 11 pin of time-to-digit converter U6 connects 9 pin of microprocessor U5, and serial interface data output terminal 12 pin of time-to-digit converter U6 connects 8 pin of microprocessor U5.
The RESET input 13 pin of described time-to-digit converter U6 connects 15 pin of microprocessor U5.
Core voltage end 14 pin of described time-to-digit converter U6 meets the power end Vin of boost converter U4, and the node between core voltage end 14 pin of time-to-digit converter U6 and the power end Vin of boost converter U4 is through electric capacity C47 ground connection.
The earth terminal 21 pin ground connection of described time-to-digit converter U6.
Electric capacity C34 is connected with, the power end Vin of a termination boost converter U4 of electric capacity C34, the other end ground connection of electric capacity C34 between earth terminal 21 pin of described time-to-digit converter U6 and supply voltage end 22 pin of time-to-digit converter U6.
Resistance R36 is connected with between Stop passage 2 enable port 25 pin of described time-to-digit converter U6 and the power end Vin of boost converter U4.
Resistance R35 is connected with between Stop passage 1 enable port 26 pin of described time-to-digit converter U6 and the power end Vin of boost converter U4.
Stop passage 2 port 27 pin of described time-to-digit converter U6 is through resistance R33 ground connection.
The earth terminal 28 pin ground connection of described time-to-digit converter U6.
Core voltage end 29 pin of described time-to-digit converter U6 meets the power end Vin of boost converter U4, node between core voltage end 29 pin of time-to-digit converter U6 and the power end Vin of boost converter U4 is through electric capacity C51 ground connection, the two ends of electric capacity C51 are parallel with electric capacity C50, the positive pole of electric capacity C50 is connected with core voltage end 29 pin of time-to-digit converter U6, the minus earth of electric capacity C50.
Stop passage 1 port 30 pin of described time-to-digit converter U6 connect ultrasound wave transceiver circuit M1 echoed signal transmitting terminal ECHO, receive the echoed signal that ultrasound wave transceiver circuit M1 sends.
Start access port 31 pin of described time-to-digit converter U6 is electrically connected with 7 pin of microcontroller U5.
Resistance R31 is connected with between Start passage enable port 32 pin of described time-to-digit converter U6 and the power end Vin of boost converter U4.
During use, the R channel output terminal RIGHT of mobile terminal sends signal, microcontroller U5 is resetted, after reset, the L channel output terminal LEFT of mobile terminal sends signal to microcontroller U5, supersonic thickness meter startup work, when 12 pin of microcontroller U5 are high level, boost converter U4 boosts, the 5V voltage of stable output, for ultrasound wave transceiver circuit M1 provides power supply, after the voltage of 16 pin of microcontroller U5 is dragged down, ultrasound wave transceiver circuit M1 works, once the echoed signal that the echoed signal transmitting terminal ECHO that time-to-digit converter U6 receives ultrasound wave transceiver circuit M1 sends, time-to-digit converter U6 draws time value, and send look-at-me by look-at-me end 8 pin of time-to-digit converter U6 to microcontroller U5, after microcontroller U5 receives look-at-me, by 8 pin of microcontroller U5, 9 pin of microcontroller U5, 10 pin of microcontroller U5 and 11 pin of microcontroller U5 read the time result measured, the time results conversion measured is become one-tenth-value thickness 1/10 by microcontroller U5, then mobile terminal is given by 17 human hair combing wastes of microcontroller U5.
When not needing to measure, supersonic thickness meter enters holding state, its process is: after microcontroller U5 does not receive the signal that mobile terminal sends for a long time, 12 pin of microcontroller U5 are set to low level, boost converter U4 stops boosting, because microcontroller U5 is powered by power supply P3, therefore microcontroller U5 still keeps work, but enter low-power consumption mode, the voltage of 16 pin of microcontroller U5 is driven high, stop powering to metering circuit, power supply P3 is only microcontroller U5 and resistance R9, resistance R10, resistance R23, resistance R24 powers, the standby current of microcontroller U5 can drop to 2 μ about A, resistance R9, resistance R10, resistance R23 and resistance R24 current sinking are no more than 3 μ A, the electric current that the Enable Pin EN of boost converter U4 consumes is 1 μ A, therefore in the standby state, the wastage in bulk or weight electric current of supersonic thickness meter is greatly about 6 μ A, assuming that power supply P3 selects is the 3V button cell of 50mA, this power supply P3 can support the standby operation of whole system more than 1 year, therefore do not need in supersonic thickness meter to use on-off circuit, the miniaturization of supersonic thickness meter can also be ensured, easy to carry and use.
Last it is noted that the foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, although with reference to previous embodiment to invention has been detailed description, for a person skilled in the art, it still can be modified to the technical scheme described in previous embodiment, or carries out equivalent replacement to wherein portion of techniques feature.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. based on a supersonic thickness meter for mobile display terminal, it is characterized in that: described thicknessmeter comprises ultrasonic probe and mobile terminal, between ultrasonic probe and mobile terminal, be provided with cable component;
Described cable component comprises the ultrasound wave transmitting and receiving module of electrical connection, metering circuit, feed circuit and control circuit;
Described ultrasonic probe is for launching high-pressure sharp pulse, ultrasound wave transmitting and receiving module is for receiving echoed signal, metering circuit is for measuring ultrasonic echo time, feed circuit are used for providing stable voltage for ultrasound wave transmitting and receiving module, control circuit is used for the signal that mobile terminal receive sends, and transfers to metering circuit.
2. a kind of supersonic thickness meter based on mobile display terminal as claimed in claim 1, it is characterized in that: described feed circuit comprise boost converter U4, coil L1 is connected with between the switch terminals SW of boost converter U4 and the power end Vin of boost converter U4, diode D20 and resistance R24 is connected with between the switch terminals SW of boost converter U4 and the feedback end FB of boost converter U4, the positive pole of diode D20 is connected with the switch terminals SW of boost converter U4, the negative pole of diode D20 meets the feedback end FB of boost converter U4 through resistance R24, the feedback end FB of boost converter U4 is through resistance R23 ground connection,
Node between described resistance R24 and diode D20 is through electric capacity C3 ground connection, and the two ends of electric capacity C3 are parallel with electric capacity C21, and the node between the positive pole of electric capacity C3 and electric capacity C21 is connected with test point TP1;
Node between the positive pole of described electric capacity C3 and electric capacity C21 connects 5V power supply through field effect transistor VQ5, the positive pole of electric capacity C3 is connected with the source S of field effect transistor VQ5 with the node between electric capacity C21, the drain D of field effect transistor VQ5 is connected with 5V power supply, the grid G of field effect transistor VQ5 is electrically connected with control circuit, is connected with resistance R7 between the grid G of field effect transistor VQ5 and the source S of field effect transistor VQ5;
The power end Vin of described boost converter U4 is through electric capacity C30 ground connection, node between the positive pole of electric capacity C30 and the power end Vin of boost converter U4 is electrically connected with power supply P3, the positive pole of power supply P3 meets the power end Vin of boost converter U4, the minus earth of power supply P3;
The power end Vin of described boost converter U4 is electrically connected with control circuit;
The Enable Pin EN of described boost converter U4 is electrically connected with control circuit.
3. a kind of supersonic thickness meter based on mobile display terminal as claimed in claim 2, it is characterized in that: described control circuit comprises microcontroller U5, the model of microcontroller U5 is MKL05Z32VFK4, the 23 foot meridian capacitor C6 of microcontroller U5 are electrically connected by audio head with the R channel output terminal RIGHT of mobile terminal, node between electric capacity C6 and 23 pin of microcontroller U5 is connected with the power end Vin of boost converter U4 through resistance R41, and the node between resistance R41 and 23 pin of microcontroller U5 is through electric capacity C41 ground connection;
1 pin of described microcontroller U5 is electrically connected with metering circuit, for receiving the look-at-me that metering circuit sends;
The 3 foot meridian capacitor C25 ground connection of described microcontroller U5, the node between electric capacity C25 and 3 pin of microcontroller U5 is connected with the power end Vin of boost converter U4;
The 4 pin ground connection of described microcontroller U5;
Crystal oscillating circuit is connected with between 5 pin of described microcontroller U5 and 6 pin of microcontroller U5;
7 pin of described microcontroller U5 are electrically connected with metering circuit;
8 pin of described microcontroller U5,9 pin of microcontroller U5,10 pin of microcontroller U5 and 11 pin of microcontroller U5 are electrically connected with metering circuit, for reading measurement result;
12 pin of described microcontroller U5 are connected with the Enable Pin EN of boost converter U4;
Be electrically connected with ultrasound wave transmitting and receiving module between 13 pin of described microcontroller U5 and 14 pin of microcontroller U5;
15 pin of described microcontroller U5 are electrically connected with metering circuit;
16 pin of described microcontroller U5 are connected with the grid G of field effect transistor VQ5;
17 pin of described microcontroller U5 connect audio head through resistance R11, are in series with electric capacity C8 between resistance R11 and audio head, and the node between electric capacity C8 and resistance R11 is through electric capacity C9 ground connection, and the node between electric capacity C8 and audio head is through resistance R12 ground connection;
The 18 foot meridian capacitor C5 of described microcontroller U5 meet the L channel output terminal LEFT of mobile terminal, node between electric capacity C5 and 18 pin of microcontroller U5 is through resistance R10 ground connection, and the node between resistance R10 and electric capacity C5 meets the power end Vin of boost converter U4 through resistance R9.
4. a kind of supersonic thickness meter based on mobile display terminal as claimed in claim 3, it is characterized in that: described crystal oscillating circuit comprises crystal oscillator X2, resistance R5, electric capacity C31 and electric capacity C32, the two ends of described resistance R5 are electrically connected with 5 pin of microcontroller U5 and 6 pin of microcontroller U5 respectively, described crystal oscillator X2 is connected in parallel on the two ends of resistance R5, described electric capacity C31 and electric capacity C32 is connected on the two ends of crystal oscillator X2, the node ground connection between electric capacity C31 and electric capacity C32.
5. a kind of supersonic thickness meter based on mobile display terminal as claimed in claim 3, it is characterized in that: described ultrasound wave transmitting and receiving module comprises ultrasound wave transceiver circuit M1, ultrasound wave transceiver circuit M1 has ultrasound wave transmitting and receiving conditioning functions, the emissioning controling signal end PULSE of the high-voltage pulse of ultrasound wave transceiver circuit M1 is connected with 13 pin of microcontroller U5, the charging control signal end HV_CHARGE of the ultrasonic high pressure generation circuit of ultrasound wave transceiver circuit M1 is connected with 14 pin of microcontroller U5, the echoed signal transmitting terminal ECHO of ultrasound wave transceiver circuit M1 is electrically connected with metering circuit, the power supply termination 5V power supply of ultrasound wave transceiver circuit M1, the earth terminal ground connection of ultrasound wave transceiver circuit M1.
6. a kind of supersonic thickness meter based on mobile display terminal as claimed in claim 5, it is characterized in that: described metering circuit comprises time-to-digit converter U6, the crystal oscillator of time-to-digit converter U6 drives input end 1 pin to be connected with four pin crystal oscillator X1, output terminal OUT and the crystal oscillator of time-to-digit converter U6 of four pin crystal oscillator X1 drive input end 1 pin to be connected, the earth terminal GND ground connection of four pin crystal oscillator X1, the power end VCC of four pin crystal oscillator X1 meets the power end Vin of boost converter U4;
Supply voltage end 3 pin of described time-to-digit converter U6 meets the power end Vin of boost converter U4;
Electric capacity C40 is connected with, the power end Vin of a termination boost converter U4 of electric capacity C40, the other end ground connection of electric capacity C40 between earth terminal 4 pin of described time-to-digit converter U6 and supply voltage end 3 pin of time-to-digit converter U6;
" sing around method " signal input part 7 pin ground connection of described time-to-digit converter U6;
Look-at-me end 8 pin of described time-to-digit converter U6 connects 1 pin of microprocessor U5;
The serial line interface of described time-to-digit converter U6 connects 11 pin of microprocessor U5 from machine selecting side 9 pin, serial interface clock end 10 pin of time-to-digit converter U6 connects 10 pin of microprocessor U5, serial interface data input end 11 pin of time-to-digit converter U6 connects 9 pin of microprocessor U5, and serial interface data output terminal 12 pin of time-to-digit converter U6 connects 8 pin of microprocessor U5;
The RESET input 13 pin of described time-to-digit converter U6 connects 15 pin of microprocessor U5;
Core voltage end 14 pin of described time-to-digit converter U6 meets the power end Vin of boost converter U4, and the node between core voltage end 14 pin of time-to-digit converter U6 and the power end Vin of boost converter U4 is through electric capacity C47 ground connection;
The earth terminal 21 pin ground connection of described time-to-digit converter U6;
Electric capacity C34 is connected with, the power end Vin of a termination boost converter U4 of electric capacity C34, the other end ground connection of electric capacity C34 between earth terminal 21 pin of described time-to-digit converter U6 and supply voltage end 22 pin of time-to-digit converter U6;
Resistance R36 is connected with between Stop passage 2 enable port 25 pin of described time-to-digit converter U6 and the power end Vin of boost converter U4;
Resistance R35 is connected with between Stop passage 1 enable port 26 pin of described time-to-digit converter U6 and the power end Vin of boost converter U4;
Stop passage 2 port 27 pin of described time-to-digit converter U6 is through resistance R33 ground connection;
The earth terminal 28 pin ground connection of described time-to-digit converter U6;
Core voltage end 29 pin of described time-to-digit converter U6 meets the power end Vin of boost converter U4, node between core voltage end 29 pin of time-to-digit converter U6 and the power end Vin of boost converter U4 is through electric capacity C51 ground connection, the two ends of electric capacity C51 are parallel with electric capacity C50, the positive pole of electric capacity C50 is connected with core voltage end 29 pin of time-to-digit converter U6, the minus earth of electric capacity C50;
Stop passage 1 port 30 pin of described time-to-digit converter U6 connect ultrasound wave transceiver circuit M1 echoed signal transmitting terminal ECHO, receive the echoed signal that ultrasound wave transceiver circuit M1 sends;
Start access port 31 pin of described time-to-digit converter U6 is electrically connected with 7 pin of microcontroller U5;
Resistance R31 is connected with between Start passage enable port 32 pin of described time-to-digit converter U6 and the power end Vin of boost converter U4.
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| CN201410509014.6A CN104266618A (en) | 2014-09-28 | 2014-09-28 | Ultrasonic thickness meter based on mobile display terminal |
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| CN201410509014.6A CN104266618A (en) | 2014-09-28 | 2014-09-28 | Ultrasonic thickness meter based on mobile display terminal |
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| CN106382899A (en) * | 2016-11-18 | 2017-02-08 | 上海市特种设备监督检验技术研究院 | Multifunctional integrated checking terminal device and checking method associated with pressure vessel and pressure pipeline |
| CN108426519A (en) * | 2018-04-04 | 2018-08-21 | 成都众宜天成科技有限公司 | A kind of paint coating thickness based on temperature-compensation circuit accurately measures instrument |
| CN108759757A (en) * | 2018-04-04 | 2018-11-06 | 成都众宜天成科技有限公司 | A kind of paint coating thickness measuring instrument |
| CN108759756A (en) * | 2018-04-04 | 2018-11-06 | 成都众宜天成科技有限公司 | Paint coating thickness based on Ni-MH battery test constantly accurately measures instrument |
| CN110160474A (en) * | 2019-05-24 | 2019-08-23 | 电子科技大学 | A kind of lathe that idle is standby is in machine ultrasonic thickness measurement device |
| CN110646516A (en) * | 2019-10-29 | 2020-01-03 | 杭州欧贲科技有限公司 | Palm type ultrasonic flaw detector with extremely simple framework |
| CN113239100A (en) * | 2021-03-19 | 2021-08-10 | 济宁鲁科检测器材有限公司 | Workpiece thickness measurement data imaging method and system based on mobile phone |
| CN115355856A (en) * | 2022-10-21 | 2022-11-18 | 东莞市森威电子有限公司 | Ultrasonic thickness gauge |
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| CN110160474B (en) * | 2019-05-24 | 2020-11-10 | 电子科技大学 | Ultrasonic thickness measuring device for machine tool on machine |
| CN110646516A (en) * | 2019-10-29 | 2020-01-03 | 杭州欧贲科技有限公司 | Palm type ultrasonic flaw detector with extremely simple framework |
| CN113239100A (en) * | 2021-03-19 | 2021-08-10 | 济宁鲁科检测器材有限公司 | Workpiece thickness measurement data imaging method and system based on mobile phone |
| CN115355856A (en) * | 2022-10-21 | 2022-11-18 | 东莞市森威电子有限公司 | Ultrasonic thickness gauge |
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