CN104266097A - LED filament structure capable of improving transmittance - Google Patents
LED filament structure capable of improving transmittance Download PDFInfo
- Publication number
- CN104266097A CN104266097A CN201410519100.5A CN201410519100A CN104266097A CN 104266097 A CN104266097 A CN 104266097A CN 201410519100 A CN201410519100 A CN 201410519100A CN 104266097 A CN104266097 A CN 104266097A
- Authority
- CN
- China
- Prior art keywords
- filament
- transparent
- light transmittance
- support
- led silk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002834 transmittance Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 5
- 230000002950 deficient Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000001795 light effect Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to an LED filament structure capable of improving transmittance, which comprises transparent PC filaments and filament supports, wherein one end of each transparent PC filament is provided with the filament support; a plurality of light holes are uniformly distributed on the surface of each transparent PC filament; the transparent PC lamp filament is made of a transparent PC material high-temperature-resistant material, and the thickness of the transparent PC lamp filament is 0.3 mm; the end part of the filament support connected with the transparent PC filament is additionally provided with a tension groove. The invention has the beneficial effects that: the structural support is provided with the tension groove, so that the quantity of defective products can be reduced; the filament is made of transparent PC material high-temperature resistant material, the temperature is as high as 260 ℃, the effect of light effect is greatly increased, and the connection strength is increased; the lamp filament is provided with a light hole, and light can be reflected by the front surface and the back surface of the lamp filament, so that the brightness is improved; the thickness of the filament is 0.3mm, and the filament is resistant to deformation.
Description
Technical field
The present invention relates to lighting technical field, particularly relate to a kind of LED silk structure improving light transmittance.
Background technology
Filament is resistant to elevated temperatures wire in bulb or electron tube, energy directly luminous, heating during energising, or electron radiation, ultraviolet, formation high electric field or generation high-energy ray equal excitation fluorescent material, rare gas or formation plasma etc., produce shades of colour visible ray.LED silk can be applicable to the LED illumination products such as crystal pendant lamp, candle lamp, bulb lamp, wall lamp, is suitable for the room lightings such as five-star commercial hotel, high-grade mansion.
This case it is important to point out that its lamp line width of traditional like product is 1.0mm, one, and transparency is low, brightness is low, and light-emitting area is too little; Its two, filament width is 1.5mm, and width is too large, blocks brightness; Its three, filament thickness of steel product is 0.2-0.25mm, yielding, and the complete power of support is poor.Therefore, for above aspect, need effectively to innovate prior art.
Summary of the invention
For above defect, the invention provides and be a kind ofly conducive to reducing defective products quantity, greatly can increase light efficiency effect, improve brightness, the on-deformable LED silk structure improving light transmittance, to solve many deficiencies of prior art.
For achieving the above object, the present invention is by the following technical solutions:
Improve a LED silk structure for light transmittance, comprise transparent PC filament and filament support, each transparent PC filament wherein one end with filament support;
Each transparent PC filament surface is uniformly distributed some unthreaded holes;
Described transparent PC filament adopts transparent PC material exotic material, and transparent PC filament thickness is 0.3mm;
Tension groove is set up in the filament support end connected with transparent PC filament.
Described transparent PC filament is evenly distributed on substrate boards surface, and transparent PC filament is the arrangements of some row;
Described unthreaded hole ovalize and being obliquely installed;
Described tension groove is made up of semi-circular hole, and semi-circular hole is arranged at filament support side.
The beneficial effect improving the LED silk structure of light transmittance of the present invention is:
(1) this structure stand is provided with tension groove, can reduce defective products quantity;
(2) filament adopts transparent PC material exotic material, up to 260 DEG C, greatly increases the effect of light efficiency, increases bonding strength;
(3) filament is provided with unthreaded hole, can the mutual reflection ray in positive and negative two sides, improves brightness;
(4) filament thickness is 0.3mm, resistance to deformation;
(5) light is logical can improve 20%, and light transmittance can improve 30%.
Accompanying drawing explanation
With reference to the accompanying drawings the present invention is described in further detail below.
Fig. 1 is the production and assembly view of the LED silk structure that can improve light transmittance described in the embodiment of the present invention;
Fig. 2 is the LED silk structural representation that can improve light transmittance described in the embodiment of the present invention.
In figure:
1, substrate boards; 2, transparent PC filament; 3, tension groove; 4, unthreaded hole; 5, filament support.
Detailed description of the invention
embodiment 1
As shown in Figure 1-2, the LED silk structure of the improved light transmittance described in the embodiment of the present invention, comprise transparent PC filament 2 and filament support 5, described transparent PC filament 2 be evenly distributed on substrate boards 1 surface and each transparent PC filament 2 wherein one end with filament support 5, this transparent PC filament 2 in some row arrangements and each transparent PC filament 2 surface uniform distributes some unthreaded holes 4 be obliquely installed;
Correspondingly, tension groove 3 is set up in filament support 5 end connected with transparent PC filament 2, and this tension groove 3 is made up of semi-circular hole, and this semi-circular hole is arranged at filament support 5 side, and set tension groove 3 can reduce defective products quantity; Transparent PC filament 2 adopts transparent PC material exotic material, up to 260 DEG C, greatly increases the effect of light efficiency, increases bonding strength; Unthreaded hole 4 can the mutual reflection ray in positive and negative two sides, improves brightness; Transparent PC filament 2 thickness is 0.3mm, resistance to deformation.
embodiment 2
As shown in Figure 1-2, the LED silk structure of the improved light transmittance described in the embodiment of the present invention, comprise transparent PC filament 2 and filament support 5, described transparent PC filament 2 be evenly distributed on substrate boards 1 surface and each transparent PC filament 2 wherein one end is with filament support 5, this transparent PC filament 2 arranges and each transparent PC filament 2 surface uniform distributes some unthreaded holes 4 in some row; Tension groove 3 is set up in filament support 5 end connected with transparent PC filament 2.
The above-mentioned description to embodiment can understand and apply this case technology for the ease of those skilled in the art, person skilled in the art obviously can make various amendment to these examples easily, and General Principle described herein is applied in other embodiment and need not through performing creative labour.Therefore, this case is not limited to above embodiment, for this case improvement and amendment all should in the protection domain of this case.
Claims (6)
1. can improve a LED silk structure for light transmittance, comprise transparent PC filament (2) and filament support (5), it is characterized in that:
Each transparent PC filament (2) wherein one end with filament support (5);
Described transparent PC filament (2) adopts transparent PC material exotic material;
Described transparent PC filament (2) thickness is 0.3mm;
Each transparent PC filament (2) surface uniform distributes some unthreaded holes (4);
Tension groove (3) is set up in filament support (5) end connected with transparent PC filament (2).
2. the LED silk structure improving light transmittance according to claim 1, is characterized in that: described transparent PC filament (2) is evenly distributed on substrate boards (1) surface.
3. the LED silk structure improving light transmittance according to claim 1, is characterized in that: described transparent PC filament (2) arranges in some row.
4. the LED silk structure improving light transmittance according to claim 1, is characterized in that: described unthreaded hole (4) ovalize and being obliquely installed.
5. the LED silk structure improving light transmittance according to claim 1, is characterized in that: described tension groove (3) is made up of semi-circular hole.
6. the LED silk structure improving light transmittance according to claim 5, is characterized in that: described semi-circular hole is arranged at filament support (5) side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410519100.5A CN104266097A (en) | 2014-10-07 | 2014-10-07 | LED filament structure capable of improving transmittance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410519100.5A CN104266097A (en) | 2014-10-07 | 2014-10-07 | LED filament structure capable of improving transmittance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104266097A true CN104266097A (en) | 2015-01-07 |
Family
ID=52157651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410519100.5A Pending CN104266097A (en) | 2014-10-07 | 2014-10-07 | LED filament structure capable of improving transmittance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104266097A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428501A (en) * | 2015-12-10 | 2016-03-23 | 山东晶泰星光电科技有限公司 | Multifunctional LED lamp filament support material plate |
| CN106783822A (en) * | 2016-12-28 | 2017-05-31 | 铜陵市同芯电子科技有限公司 | A kind of high-color development LED quartz wafer filament |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103388805A (en) * | 2013-07-01 | 2013-11-13 | 临安市新三联照明电器有限公司 | LED (Light Emitting Diode) filament support series connection forming method based on support material plate |
| CN203453855U (en) * | 2013-08-29 | 2014-02-26 | 四川柏狮光电技术有限公司 | LED lamp filament with adjustable light |
| CN203628400U (en) * | 2013-09-24 | 2014-06-04 | 王志根 | Full-angle luminous filament |
| CN103851388A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED (light-emitting diode) lamp filament base plate and lighting device |
| CN103994349A (en) * | 2014-05-04 | 2014-08-20 | 杭州杭科光电股份有限公司 | LED bulb lamp with high lighting efficiency |
| CN104033774A (en) * | 2014-06-25 | 2014-09-10 | 连云港晶德照明电器有限公司 | LED filament bulb |
-
2014
- 2014-10-07 CN CN201410519100.5A patent/CN104266097A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103388805A (en) * | 2013-07-01 | 2013-11-13 | 临安市新三联照明电器有限公司 | LED (Light Emitting Diode) filament support series connection forming method based on support material plate |
| CN203453855U (en) * | 2013-08-29 | 2014-02-26 | 四川柏狮光电技术有限公司 | LED lamp filament with adjustable light |
| CN203628400U (en) * | 2013-09-24 | 2014-06-04 | 王志根 | Full-angle luminous filament |
| CN103851388A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED (light-emitting diode) lamp filament base plate and lighting device |
| CN103994349A (en) * | 2014-05-04 | 2014-08-20 | 杭州杭科光电股份有限公司 | LED bulb lamp with high lighting efficiency |
| CN104033774A (en) * | 2014-06-25 | 2014-09-10 | 连云港晶德照明电器有限公司 | LED filament bulb |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428501A (en) * | 2015-12-10 | 2016-03-23 | 山东晶泰星光电科技有限公司 | Multifunctional LED lamp filament support material plate |
| CN105428501B (en) * | 2015-12-10 | 2017-11-28 | 山东晶泰星光电科技有限公司 | A kind of Multifunctional LED filament support flitch |
| CN106783822A (en) * | 2016-12-28 | 2017-05-31 | 铜陵市同芯电子科技有限公司 | A kind of high-color development LED quartz wafer filament |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150107 |