CN104260904B - The heat pipe built-in process of low thermal contact resistance - Google Patents
The heat pipe built-in process of low thermal contact resistance Download PDFInfo
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- CN104260904B CN104260904B CN201410461343.8A CN201410461343A CN104260904B CN 104260904 B CN104260904 B CN 104260904B CN 201410461343 A CN201410461343 A CN 201410461343A CN 104260904 B CN104260904 B CN 104260904B
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Abstract
The present invention provides the heat pipe built-in process of a kind of low thermal contact resistance, comprises the steps: step 1, by glued membrane raw material previously baked 60min under 90 DEG C of temperature, 30% humidity, obtains stand-by glued membrane；Step 2, according to heat pipe actual size, the stand-by glued membrane obtained in heat pipe region coating step 1, controls the glued membrane number of bubbles of heat pipe region coating simultaneously.There is advantages that (1) can reduce pre-buried heat pipe and honeycomb core thermal contact resistance, improve adopting heat pipes for heat transfer performance, beneficially unit and dispel the heat and realize isothermal design；(2) process means is simple, and material source is abundant, it is easy to accomplish, implementation cost is relatively low.
Description
Technical field
The present invention relates to a kind of hot tube process for field of space technology, be specifically related to the heat of a kind of low thermal contact resistance
Pipe built-in process.
Background technology
Heat pipe is a kind of to utilize the evaporation of working medium, condensation phase change and circulate and the apparatus that works.Owing to liquid steams
Thermal resistance when sending out and condense is the least, may be implemented in hence with heat pipe and transmits big heat under the little temperature difference.From 1964
Since proposing heat pipe concept first, hot pipe technique is sufficiently developed, and is successfully applied to field of space technology.
Due to heat pipe, to have heat output big, compact conformation, movement-less part and do not consume the outstanding feature of the energy, and nearly tens
One of year Main Means having become spacecraft thermal control.On satellite, most widely used heat pipe is aluminium ammonia axle at present
To axial-grooved heat pipe.Its envelope material is aluminium alloy, and internal working medium is ammonia.The temperature range-60 DEG C～90 DEG C used,
Between optimum working temperature scope-30 DEG C～60 DEG C.
Heat pipe mainly has pre-buried and outer patch two kinds in spaceborne application mode.Radiating surface main for satellite and load
Installing plate, forms hot pipe network network by pre-buried heat pipe in plate, evens up the temperature between instrument, to realize isothermal
Design philosophy.Owing to heat pipe height is inconsistent, surface irregularity, it is easy to connecing of heat pipe and installing plate inner core
Forming a fixed gap in contacting surface, cause certain thermal contact resistance, according to existing research, thermal contact resistance accounts for entire thermal resistance
The overwhelming majority, even more than 99%, the space carrying out process modification is the biggest.The existence of this thermal resistance is unfavorable for that heat exists
Transmission between plate core and heat pipe and balance, limit the performance of heat pipe effect.Especially for satellite north plate, north
The hot-fluid more concentrated areas such as plate and load deck board, need the pre-buried technique of heat pipe using low thermal contact resistance to reduce and connect
Touch thermal resistance, reduce unit temperature.
Cellular board pre-buried heat pipe thermal resistance size depends on the production technology of the pre-buried heat pipe of cellular board, and number range is relatively big,
Design manual is recommended as 0.05～2 DEG C/W.The pre-buried heat pipe design of legacy cellular plate and production technology be: on cellular board
Lower dash board is the thick one layer of lead-covering of 0.3mm, and pre-buried heat pipe height is identical with honeycomb core, and heat pipe passes through 0.15mm
Thick solid glued membrane is cementing with levels lead-covering compound.There are some defects in this technique, causes thermal resistance bigger than normal, main
Self heat conductivility of solid gum membrane material to be embodied in is poor, and thermal resistance is big；Existing major part pre-buried heat pipe product is actual
Aspect ratio nominal value is less than normal, and heat pipe the most highly exists certain deviation, and the solid glued membrane of same thickness can not adapt to
All heat pipes, heat pipe section region there may be starved phenomenon, causes between pre-buried heat pipe and the upper and lower dash board of cellular board
Thermal contact resistance increase considerably；In cellular board forming process, glued membrane easily produces gas, and gas inclusions is in pre-buried warm
It is difficult to discharge between pipe and up and down dash board, too increases the thermal contact resistance of pre-buried heat pipe and the upper and lower dash board of cellular board.Cause
This, it is necessary to launch to improve for the above, effectively to reduce the pre-buried thermal resistance of heat pipe.
Currently without explanation or the report of discovery technology similar to the present invention, the most not yet collect similar money
Material.
Summary of the invention
It is an object of the invention to the needs according to reality application, propose the heat pipe built-in process of a kind of low thermal contact resistance.
The method on the basis of heat pipe operation principle and thermal contact resistance affect heat-transfer mechanism, consider pre-buried heat pipe height and
The affecting laws of thermal contact resistance is proposed by it with honeycomb core height relativeness, has and preferably plays adopting heat pipes for heat transfer
The feature of effect.
The present invention is achieved by the following technical solutions.
The heat pipe built-in process of a kind of low thermal contact resistance, comprises the steps:
Step 1, carries out previously baked to glued membrane raw material, obtains stand-by glued membrane；
Step 2, according to heat pipe actual size, the stand-by glued membrane obtained in heat pipe region coating step 1, simultaneously
Control the glued membrane number of bubbles of heat pipe region coating.
Preferably, described previously baked condition is: previously baked 60min under 90 DEG C of temperature, 30% humidity.
Preferably, described glued membrane raw material uses the high heat-conducting liquid glued membrane of J133.
Preferably, the film thickness of described coating can adjust according to product actual size.
Preferably, the film thickness of described coating is 0.15mm.
Preferably, the glued membrane number of bubbles of described coating is less than or equal to 3/dm2。
Preferably, also include being arranged at the step 0 before step 1:
Step 0, is embedded in heat pipe between the dash board up and down of cellular board, the height of described heat pipe and the honeybee of cellular board
Nest core is highly consistent.
Compared with prior art, there is advantages that
(1) pre-buried heat pipe and honeycomb core thermal contact resistance can be reduced, improve adopting heat pipes for heat transfer performance, beneficially unit
Dispel the heat and realize isothermal design；
(2) process means is simple, and material source is abundant, it is easy to accomplish, implementation cost is relatively low.
Accompanying drawing explanation
The detailed description made non-limiting example with reference to the following drawings by reading, other of the present invention is special
Levy, purpose and advantage will become more apparent upon:
Fig. 1 is the heat pipe built-in process schematic diagram of the low thermal contact resistance of the present invention；
In figure, 1 is honeycomb core, and 2 is heat pipe, and 3 is installing plate dash board, and 4 is glued membrane.
Detailed description of the invention
Below embodiments of the invention are elaborated: the present embodiment carries out reality under premised on technical solution of the present invention
Execute, give detailed embodiment and concrete operating process.It should be pointed out that, the ordinary skill people to this area
For Yuan, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into this
Bright protection domain.
As it is shown in figure 1, present embodiments provide the heat pipe built-in process of a kind of low thermal contact resistance, comprise the steps:
Step 1, carries out previously baked to glued membrane raw material, obtains stand-by glued membrane；
Step 2, according to heat pipe actual size, the stand-by glued membrane obtained in heat pipe region coating step 1, simultaneously
Control the glued membrane number of bubbles of heat pipe region coating.
Further, described previously baked condition is: previously baked 60min under 90 DEG C of temperature, 30% humidity.
Further, described glued membrane raw material uses the high heat-conducting liquid glued membrane of J133.
Further, the film thickness of described coating is 0.15mm.
Further, the glued membrane number of bubbles of described coating is less than or equal to 3/dm2。
Further, also include being arranged at the step 0 before step 1:
Step 0, is embedded in heat pipe between the dash board up and down of cellular board, the height of described heat pipe and the honeybee of cellular board
Nest core is highly consistent.
Further, described heat pipe is some, and each of which root heat pipe is diplopore heat pipe, diplopore heat pipe every
One hole the most independently constitutes heat pipe.
Below the concrete case of the present embodiment is described in detail.
In certain satellite thermal control design, the hot-fluid of south plate, north plate and north, load cabin plate is more concentrated, and is respectively required for pre-buried
9,10,7 heat pipes, pre-buried heat pipe is diplopore heat pipe, and each hole the most independently constitutes heat pipe, improves reliable
Property, and increase heat-transfer capability.
Using the heat pipe built-in process of low thermal contact resistance, its implementation is:
Heat pipe region glued membrane have employed the liquid laminate that material is J133, and its thermal conductivity factor is tradition adhesive film material J78B
3.1 times, glued membrane coating time under 90 DEG C of temperature, 30% humidity previously baked 60min；
According to heat pipe actual size 30*29.1, determining that the thickness that glued membrane coats is 0.15mm, coating time control heats pipe
Region glued membrane number of bubbles should be not more than 3/dm2。
In the present embodiment: heat pipe region glued membrane uses high heat-conducting liquid glued membrane, and film thickness can be according to actual product
Size adjusting, during glued membrane coating under 90 DEG C of temperature, 30% humidity previously baked 60min, control heat pipe region glue
Film number of bubbles should be not more than 3/dm2。
The heat pipe built-in process of the low thermal contact resistance that the present embodiment provides, can effectively reduce thermal contact resistance, is conducive to fall
Low unit temperature, it is achieved isothermal design.
Above the specific embodiment of the present invention is described.It is to be appreciated that the invention is not limited in
Stating particular implementation, those skilled in the art can make various deformation or amendment within the scope of the claims,
This has no effect on the flesh and blood of the present invention.
Claims (1)
1. the heat pipe built-in process of a low thermal contact resistance, it is characterised in that comprise the steps:
Step 1, carries out previously baked to glued membrane raw material, obtains stand-by glued membrane；
Step 2, according to heat pipe actual size, the stand-by glued membrane obtained in heat pipe region coating step 1,
Control the glued membrane number of bubbles of heat pipe region coating simultaneously；
Described previously baked condition is: previously baked 60min under 90 DEG C of temperature, 30% humidity；
Described glued membrane raw material uses the high heat-conducting liquid glued membrane of J133；
The glued membrane number of bubbles of described coating is less than or equal to 3/dm2；
Also include being arranged at the step 0 before step 1:
Step 0, is embedded in heat pipe between the dash board up and down of cellular board, the height of described heat pipe and honeycomb
The honeycomb core of plate is highly consistent.
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| CN201410461343.8A CN104260904B (en) | 2014-09-11 | 2014-09-11 | The heat pipe built-in process of low thermal contact resistance |
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| CN201410461343.8A CN104260904B (en) | 2014-09-11 | 2014-09-11 | The heat pipe built-in process of low thermal contact resistance |
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| CN104260904B true CN104260904B (en) | 2016-08-24 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455450B (en) * | 2016-11-22 | 2019-01-25 | 上海卫星工程研究所 | The high isothermal lightweight application method of star heat pipe |
| CN107328279A (en) * | 2017-05-16 | 2017-11-07 | 上海卫星工程研究所 | The phase transformation heat pipe of high-reliability high heat-transfer performance |
| CN112284172A (en) * | 2020-10-29 | 2021-01-29 | 上海卫星装备研究所 | Space radiation radiator |
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| US5862462A (en) * | 1994-06-15 | 1999-01-19 | Space Systems/Loral, Inc. | Power enhancement techniques for high power satellites |
| EP1031511A2 (en) * | 1999-02-26 | 2000-08-30 | DORNIER GmbH | Satellite radiator structure |
| CN103274061A (en) * | 2013-04-25 | 2013-09-04 | 上海卫星工程研究所 | Heat tube-fluid loop coupling heating radiator used for spacecraft |
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| CN104335712B (en) * | 2007-12-25 | 2015-07-25 | 上海卫星工程研究所 | The thermal controls apparatus of spaceborne radar launch and accept chip assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2840394B1 (en) * | 2002-05-30 | 2004-08-27 | Cit Alcatel | HEAT TRANSFER DEVICE FOR SATELLITE COMPRISING AN EVAPORATOR |
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| US5862462A (en) * | 1994-06-15 | 1999-01-19 | Space Systems/Loral, Inc. | Power enhancement techniques for high power satellites |
| EP1031511A2 (en) * | 1999-02-26 | 2000-08-30 | DORNIER GmbH | Satellite radiator structure |
| CN104335712B (en) * | 2007-12-25 | 2015-07-25 | 上海卫星工程研究所 | The thermal controls apparatus of spaceborne radar launch and accept chip assembly |
| CN103274061A (en) * | 2013-04-25 | 2013-09-04 | 上海卫星工程研究所 | Heat tube-fluid loop coupling heating radiator used for spacecraft |
| CN103434659A (en) * | 2013-05-14 | 2013-12-11 | 北京空间飞行器总体设计部 | High-temperature-uniformity heat radiator for navigation satellite |
| CN103448304A (en) * | 2013-08-08 | 2013-12-18 | 上海卫星工程研究所 | Low-thermal-resistance honeycomb sandwich plate for satellite and manufacturing method of low-thermal-resistance honeycomb sandwich plate |
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