CN104253170A - High-integration solar photovoltaic module package backboard and preparation method thereof - Google Patents

High-integration solar photovoltaic module package backboard and preparation method thereof Download PDF

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Publication number
CN104253170A
CN104253170A CN201310255673.7A CN201310255673A CN104253170A CN 104253170 A CN104253170 A CN 104253170A CN 201310255673 A CN201310255673 A CN 201310255673A CN 104253170 A CN104253170 A CN 104253170A
Authority
CN
China
Prior art keywords
film layer
backboard
solar photovoltaic
pet film
module package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310255673.7A
Other languages
Chinese (zh)
Inventor
陈耀仓
闫洪嘉
李成利
张鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MINGGUAN ENERGY (JIANGXI) CO Ltd
Original Assignee
MINGGUAN ENERGY (JIANGXI) CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MINGGUAN ENERGY (JIANGXI) CO Ltd filed Critical MINGGUAN ENERGY (JIANGXI) CO Ltd
Priority to CN201310255673.7A priority Critical patent/CN104253170A/en
Publication of CN104253170A publication Critical patent/CN104253170A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Photovoltaic Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to a high-integration solar photovoltaic module package backboard and a preparation method thereof. The high-integration solar photovoltaic module package backboard comprises a PVDF film layer, wherein the lower surface of the PVDF film layer adopts a weather-resisting glue layer, and is composited with a PET film layer by a coating composite technology; and the lower surface of the PET film layer adopts a weather-resisting glue layer, and is composited with an EVA glue film by the coating composite technology. The high-integration solar photovoltaic module package backboard integrates a conventional solar backboard and the EVA glue film, and the preparation method replaces a production mode of separate purchasing and processing of a conventional TPT/TPE backboard and the EVA glue film; the production efficiency of a solar photovoltaic module manufacturer is greatly improved; the matching and the bonding strength between the solar module package backboard and an EVA glue surface are improved; the stability of the stripping strength is superior to that of a conventional module package mode; and the manufacturing cost and generation of defective products are reduced.

Description

A kind of high integrated solar photovoltaic component encapsulating backboard and preparation method thereof
Technical field
The present invention relates to a kind of high integrated solar photovoltaic component encapsulating backboard and preparation method thereof.
Background technology
The photovoltaic encapsulation backboard used in the market is mainly TPT/TPE structure, in down-stream enterprise produces, need by EVA adhesive film (ethylene-vinyl acetate copolymer), backboard and cell piece to be at high temperature bonded together, this operating type because of in TPT/TPE backboard with the structure of EVA adhesive film adhesive surface, the difference of the situations such as surface treatment, cause the peel strength of lamination postnotum and EVA adhesive film unstable, and, because the difference of the EVA adhesive film formula of different manufacturer, the matching causing EVA adhesive film and photovoltaic back is not high, make members manufacturer to EVA adhesive film, the Market Selection of backboard is low.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of high integrated solar photovoltaic component encapsulating backboard and preparation method thereof, improve the matching of solar energy packaging back board, drastically increased the efficiency of component package, ensure that the stability of photovoltaic module in weatherability.
High integrated solar photovoltaic component encapsulating backboard of the present invention, comprise PVDF thin film layer, the lower surface of described PVDF thin film layer adopts weatherability glue layer and is compounded with PET film layer by coating combination process, and the lower surface of PET film layer adopts weatherability glue layer and is compounded with EVA adhesive film by coating combination process.
High integrated solar photovoltaic component encapsulating backboard of the present invention, the thickness of described PVDF thin film layer is 0.02-0.03mm, and the thickness of weatherability glue layer is 0.012mm, and the thickness of PET film layer is 0.188-0.25mm, and the thickness of EVA adhesive film is 0.20-0.80mm.
The preparation method of high integrated solar photovoltaic component encapsulating backboard of the present invention, comprises the following steps:
1) carry out gluing after PET film layer being carried out surface corona process, the solid content of glue furnishing about 40%, gluing entity is 0.012mm thickness;
2) by the PET film layer after step 1) process together with the roll extrusion of PVDF thin film layer compound, form TP composite construction;
3) gluing process is carried out again according to step 1) in the PET film layer of TP composite construction surface, then EVA adhesive film is carried out together with compound roll extrusion with another surface of PET film layer after 120 DEG C of preheatings, obtain high integrated solar photovoltaic component encapsulating backboard.
Compared with prior art beneficial effect of the present invention is: high integrated solar photovoltaic component encapsulating backboard of the present invention is integrated with original solar energy backboard and EVA adhesive film two kinds of photovoltaic materials, instead of the mode of production that original TPT/TPE backboard and EVA adhesive film are purchased respectively and processed; Drastically increase the production efficiency of solar photovoltaic assembly manufacturer, and the matching that improve between solar components packaging back board and EVA glue face and adhesion strength, the stability of peel strength is also better than traditional component package mode, reduces the generation of manufacturing cost and defective products.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of high integrated solar photovoltaic component encapsulating backboard described in the embodiment of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
As shown in Figure 1, a kind of high integrated solar photovoltaic component encapsulating backboard, comprise PVDF thin film layer 1, the lower surface of described PVDF thin film layer 1 adopts weatherability glue layer and is compounded with PET film layer 2 by coating combination process, and the lower surface of PET film layer 2 adopts weatherability glue layer and is compounded with EVA adhesive film 3 by coating combination process.
High integrated solar photovoltaic component encapsulating backboard of the present invention, the thickness of described PVDF thin film layer 1 is 0.02-0.03mm, the thickness of weatherability glue layer is 0.012mm, and the thickness of PET film layer 2 is 0.188-0.25mm, and the thickness of EVA adhesive film 3 is 0.20-0.80mm.
The preparation method of high integrated solar photovoltaic component encapsulating backboard of the present invention, comprises the following steps:
1) carry out gluing, the solid content of glue furnishing about 40% after PET film layer 2 being carried out surface corona process, gluing entity is 0.012mm thickness;
2) by the PET film layer 2 after step 1) process together with the roll extrusion of PVDF thin film layer 1 compound, form TP composite construction;
3) gluing process is carried out again according to step 1) in PET film layer 2 surface of TP composite construction, then EVA adhesive film 3 is carried out together with compound roll extrusion with another surface of PET film layer after 120 DEG C of preheatings, obtain high integrated solar photovoltaic component encapsulating backboard.
High integrated solar photovoltaic component encapsulating backboard of the present invention is integrated with original solar energy backboard and EVA adhesive film two kinds of photovoltaic materials, instead of the mode of production that original TPT/TPE backboard and EVA adhesive film are purchased respectively and processed; Drastically increase the production efficiency of solar photovoltaic assembly manufacturer, and the matching that improve between solar components packaging back board and EVA glue face and adhesion strength, the stability of peel strength is also better than traditional component package mode, reduces the generation of manufacturing cost and defective products.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvement and modification, these improve and modification also should be considered as protection scope of the present invention.

Claims (3)

1. one kind high integrated solar photovoltaic component encapsulating backboard, comprise PVDF thin film layer, it is characterized in that: the lower surface of described PVDF thin film layer adopts weatherability glue layer and is compounded with PET film layer by coating combination process, the lower surface of PET film layer adopts weatherability glue layer and is compounded with EVA adhesive film by coating combination process.
2. high integrated solar photovoltaic component encapsulating backboard according to claim 1, it is characterized in that: the thickness of described PVDF thin film layer is 0.02-0.03mm, the thickness of weatherability glue layer is 0.012mm, the thickness of PET film layer is 0.188-0.25mm, and the thickness of EVA adhesive film is 0.20-0.80mm.
3. the preparation method of high integrated solar photovoltaic component encapsulating backboard according to claim 1, is characterized in that, comprise the following steps:
1) carry out gluing after PET film layer being carried out surface corona process, the solid content of glue furnishing about 40%, gluing entity is 0.012mm thickness;
2) by the PET film layer after step 1) process together with the roll extrusion of PVDF thin film layer compound, form TP composite construction;
3) gluing process is carried out again according to step 1) in the PET film layer of TP composite construction surface, then EVA adhesive film is carried out together with compound roll extrusion with another surface of PET film layer after 120 DEG C of preheatings, obtain high integrated solar photovoltaic component encapsulating backboard.
CN201310255673.7A 2013-06-25 2013-06-25 High-integration solar photovoltaic module package backboard and preparation method thereof Pending CN104253170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310255673.7A CN104253170A (en) 2013-06-25 2013-06-25 High-integration solar photovoltaic module package backboard and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310255673.7A CN104253170A (en) 2013-06-25 2013-06-25 High-integration solar photovoltaic module package backboard and preparation method thereof

Publications (1)

Publication Number Publication Date
CN104253170A true CN104253170A (en) 2014-12-31

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Country Status (1)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104659131A (en) * 2015-02-09 2015-05-27 无锡德明科技有限公司 Integrated cross-linkable solar component
CN104659133A (en) * 2015-02-09 2015-05-27 无锡德明科技有限公司 Anti-PID solar battery assembly
CN107972296A (en) * 2017-11-16 2018-05-01 明冠新材料股份有限公司 A kind of connecting line production equipment of glued membrane backboard composite material
CN108242473A (en) * 2016-12-26 2018-07-03 上迈(香港)有限公司 Color photovoltaic module and preparation method thereof
CN110126408A (en) * 2019-05-16 2019-08-16 苏州赛伍应用技术股份有限公司 A kind of method for curing of transparent back panel

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101814542A (en) * 2010-03-26 2010-08-25 明冠能源(江西)有限公司 Solar energy back film with high water vapor rejection rate and making method thereof
CN102403410A (en) * 2011-11-25 2012-04-04 浙江帝龙光电材料有限公司 Production process of solar cell back plate
CN102514343A (en) * 2011-11-29 2012-06-27 浙江帝龙光电材料有限公司 Solar cell backboard and production technique thereof
CN102938426A (en) * 2012-11-01 2013-02-20 常州大学 Solar photovoltaic back plate material and preparation method thereof
CN202940254U (en) * 2012-10-25 2013-05-15 杭州新子光电材料有限公司 Solar cell back film structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101814542A (en) * 2010-03-26 2010-08-25 明冠能源(江西)有限公司 Solar energy back film with high water vapor rejection rate and making method thereof
CN102403410A (en) * 2011-11-25 2012-04-04 浙江帝龙光电材料有限公司 Production process of solar cell back plate
CN102514343A (en) * 2011-11-29 2012-06-27 浙江帝龙光电材料有限公司 Solar cell backboard and production technique thereof
CN202940254U (en) * 2012-10-25 2013-05-15 杭州新子光电材料有限公司 Solar cell back film structure
CN102938426A (en) * 2012-11-01 2013-02-20 常州大学 Solar photovoltaic back plate material and preparation method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104659131A (en) * 2015-02-09 2015-05-27 无锡德明科技有限公司 Integrated cross-linkable solar component
CN104659133A (en) * 2015-02-09 2015-05-27 无锡德明科技有限公司 Anti-PID solar battery assembly
CN104659133B (en) * 2015-02-09 2017-09-29 无锡德明科技有限公司 A kind of anti-PID solar cell module
CN108242473A (en) * 2016-12-26 2018-07-03 上迈(香港)有限公司 Color photovoltaic module and preparation method thereof
CN107972296A (en) * 2017-11-16 2018-05-01 明冠新材料股份有限公司 A kind of connecting line production equipment of glued membrane backboard composite material
CN110126408A (en) * 2019-05-16 2019-08-16 苏州赛伍应用技术股份有限公司 A kind of method for curing of transparent back panel
CN110126408B (en) * 2019-05-16 2022-03-08 苏州赛伍应用技术股份有限公司 Hardening method of transparent back plate

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Address after: 336000 Yichun economic and Technological Development Zone, Jiangxi, Yichun, No. 32, No.

Applicant after: CROWN ADVANCED MATERIAL CO., LTD.

Address before: 336000 suitable business road, Yichun economic and Technological Development Zone, Jiangxi

Applicant before: Mingguan Energy (Jiangxi) Co., Ltd.

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Free format text: CORRECT: APPLICANT; FROM: CROWN ENERGY (JIANGXI) CO., LTD. TO: CROWN ADVANCED MATERIAL CO., LTD.

RJ01 Rejection of invention patent application after publication

Application publication date: 20141231

RJ01 Rejection of invention patent application after publication