CN104238799A - Single-chip glass touch panel device and manufacturing method thereof - Google Patents
Single-chip glass touch panel device and manufacturing method thereof Download PDFInfo
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- CN104238799A CN104238799A CN201310302792.3A CN201310302792A CN104238799A CN 104238799 A CN104238799 A CN 104238799A CN 201310302792 A CN201310302792 A CN 201310302792A CN 104238799 A CN104238799 A CN 104238799A
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- substrate
- printing frame
- frame layer
- layer
- panel device
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- 239000011521 glass Substances 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical group [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 1
- 238000005530 etching Methods 0.000 description 9
- 230000009194 climbing Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical group O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Abstract
A single-chip glass touch panel device comprises a substrate, a first printing frame layer arranged on the substrate and covering partial area of the substrate, a conducting layer arranged on the substrate and the first printing frame layer, and a second printing frame layer arranged on the conducting layer corresponding to the first printing frame layer.
Description
Technical field
The invention relates to a kind of one chip glass touch control panel device and manufacture method thereof, more particularly, reduce the difference in height of substrate printing between frame layer and non-printing zone about a kind of, easily spend because of printing frame floor height when circuit etching suddenly cause climbing disconnection problem to improve conductive layer, a kind of and promote the one chip glass touch control panel device of final finished yield, and method manufacturing one chip glass touch control panel device.
Background technology
In recent years because touch controllable function is generally equipped on Intelligent handhold device, therefore the requirement that electronic product is compact is added on contact panel too, existing one chip glass contact panel (One glass solution at present, OGS), show the solutions such as embedded contact panel (On-Cell Touch) and embedded touch control panel (In-Cell Touch), effectively reduce the integral thickness of product.
Wherein touch sensing is integrated into surface cap glass by one chip glass contact panel, because sensed layer is integrated with glass, compared to embedded touch control panel, and can not have air problem between LCD, processing procedure does not need comprehensive laminating, and nature can reduce costs.
But one chip glass contact panel is when printing frame, and the height of frame can cause sensed layer easily to cause because height is spent steep the problem that climbing is broken when circuit etching.Fig. 1 is the sectional view according to prior art instruction book bIade glass contactor control device.As Fig. 1 illustrate, the one chip glass contactor control device of prior art comprises substrate 100, printing frame layer 200 and conductive layer 300, wherein print frame layer 200 and can be arranged at the subregion of covered substrate 100 on substrate 100, conductive layer 300 can be arranged on substrate 100 and printing frame layer 200 subsequently.Conductive layer 300 may cause climbing broken string part 50 suddenly because of high the spending of printing frame layer 200 frame, and then affects the touch-control sensitivity of contact panel, and it is necessary for therefore addressing these problems.
Summary of the invention
Embodiments of the invention propose one can reduce the difference in height of substrate printing between frame layer and non-printing zone, easily spend because of printing frame floor height when circuit etching suddenly cause climbing disconnection problem to improve conductive layer, and promote one chip glass touch control panel device and the manufacture method thereof of final finished yield.
According to the aspect of the embodiment of the present invention, which provide one chip glass touch control panel device, comprise substrate, the first printing frame layer, conductive layer and the second printing frame layer.First printing frame layer can be arranged at the subregion of covered substrate on substrate, and conductive layer can be arranged on substrate and the first printing frame layer, and the second printing frame layer may correspond in the first printing frame layer and is arranged on conductive layer.
Preferably, below conductive layer and substrate and first print above frame layer, a wall is more set.
Preferably, substrate can be hardened glass substrate.
Preferably, the material of the first printing frame layer can be black ink.
Preferably, conductive layer can be tin indium oxide (ITO) layer.
Preferably, the material of the second printing frame layer can be black ink.
Preferably, the material of wall can be transparent cuticula (OC) glue.
According to the aspect of the embodiment of the present invention, which provide a kind of manufacture method of one chip glass touch control panel device, system first provides substrate, then make the subregion of substrate to be formed the first printing frame layer, on the first printing frame layer and substrate, form conductive layer again, on conductive layer, finally correspond to the first printing frame layer form the second printing frame layer.
Preferably, form the step of conductive layer, can comprise and conductive material plating is attached on substrate and the first printing frame layer, and acquisition conduction pattern is etched with to the attached conductive material of plating.
Preferably, before the step forming conductive layer, be more contained on substrate and the first printing frame layer and form wall, formed thereon for conductive layer.
Therefore, according to one chip glass touch control panel device and the manufacture method according to the embodiment of the present invention thereof, conductive layer is easily spent because of printing frame floor height when circuit etching and is suddenly caused climbing disconnection problem, can improve by minimizing substrate prints the difference in height between frame layer and non-printing zone, thus promote the final finished yield of one chip glass touch control panel device.
Accompanying drawing explanation
Fig. 1 is the sectional view of the one chip glass touch control panel device according to prior art of the present invention.
Fig. 2 is the sectional view of one chip glass touch control panel device according to a first embodiment of the present invention.
Fig. 3 is the sectional view of one chip glass touch control panel device according to a second embodiment of the present invention.
Fig. 4 is the manufacture method process flow diagram of one chip glass touch control panel device according to a first embodiment of the present invention.
Fig. 5 is the manufacture method process flow diagram of one chip glass touch control panel device according to a second embodiment of the present invention.
[description of reference numerals]
50: broken string part
100: substrate
200: printing frame layer
210: the first printing frame layers
220: the second printing frame layers
300: conductive layer
350: wall
Embodiment
For effect that the expensive auditor of profit understands the technical characteristic of the present invention, content and advantage and can reach, hereby the present invention is coordinated accompanying drawing, and be described in detail as follows with the expression-form of embodiment, and wherein use graphic, its purport is only the use of signal and aid illustration book, may not be actual proportions after the invention process and precisely configure, therefore should with regard to appended graphic ratio and configuration relation is not understood, the interest field limited the invention in actual enforcement, conjunction is first chatted bright.
Fig. 2 is the sectional view according to first embodiment of the invention instruction book bIade glass touch control panel device.As Figure 2 illustrates, the one chip glass touch control panel device of first embodiment of the invention comprises substrate 100, first printing frame layer 210, conductive layer 300 and the second printing frame layer 220.The material of substrate 100 can be hardened glass substrate, as the substrate of one chip glass contact panel.First printing frame layer 210 and the second material of printing frame layer 220 can be black ink, have black matrix (Black Matrix) shade function, prevent from producing leakage current because of irradiation and covering oblique light leak, avoid excitation to reduce, to increase image contrast.Wherein the second printing frame layer 220 is for causing the reinforcement printed layers of undercolour for the first printing frame layer 210 thinner thickness, to improve presenting of color.The material of conductive layer 300 can be tin indium oxide (ITO), wherein have X, Y-axis conduction pattern to provide touch controllable function.
First printing frame layer 210 can be arranged at the subregion of covered substrate 100 on substrate 100, then conductive layer 300 can be arranged on substrate 100 and the first printing frame layer 210, and the second last printing frame layer 220 may correspond in the first printing frame layer 210 and is arranged on conductive layer 300.
Please refer to Fig. 1 and Fig. 2, because first embodiment of the invention uses the method for the first printing frame layer 210 and the second printing frame layer 220 gradation printing, compared to the single printing frame layer 200 of Fig. 1 prior art, decrease conductive layer 300 prints on frame layer 210 and substrate 100 difference in height first, thus solve conductive layer 300 easily causes climbing broken string because height is spent suddenly problem when circuit etching.
Fig. 3 is the sectional view according to second embodiment of the invention instruction book bIade glass touch control panel device.Show as depicted in fig. 3, the one chip glass contactor control device of second embodiment of the invention comprises substrate 100, first and prints frame layer 210, conductive layer 300, second printing frame layer 220 and wall 350.The material of substrate 100 can be hardened glass substrate, as the substrate of one chip glass contact panel.First printing frame layer 210 and the second material of printing frame layer 220 can be black ink, have black matrix (Black Matrix) shade function, prevent from producing leakage current because of irradiation and covering oblique light leak, avoid excitation to reduce, to increase image contrast.Wherein the second printing frame layer 220 is for causing the reinforcement printed layers of undercolour for the first printing frame layer 210 thinner thickness, to improve presenting of color.The material of conductive layer 300 can be tin indium oxide (ITO), its have X, Y-axis conduction pattern to provide touch controllable function.The material of wall 350 can be transparent cuticula (OC) glue, can make conductive layer 300 on the first printing frame layer 210 and substrate 100 difference in height become less.
First printing frame layer 210 can be arranged at the subregion of covered substrate 100 on substrate 100, then wall 350 can be arranged on substrate 100 and the first printing frame layer 210, and conductive layer 300 can be arranged on wall 350 subsequently, the second last printing frame layer 220 may correspond in the first printing frame layer 210 and is arranged on conductive layer 300.
Please refer to Fig. 1 and Fig. 3, because second embodiment of the invention uses the method for the first printing frame layer 210 and the second printing frame layer 220 gradation printing, compared to the single printing frame layer 200 of Fig. 1 prior art, decrease the difference in height of conductive layer 300 on the first printing frame layer 210 and wall 350, thus solve conductive layer easily causes climbing broken string because height is spent suddenly problem when circuit etching.
Separately it is worth mentioning that, according to the spirit of the present invention, according to actual demand, more multi-layered printing frame layer and wall crossover can be arranged, finally conductive layer is set again.
Below graphic for cooperation explanation had the manufacture method of the one chip glass contactor control device of said structure.
As Fig. 4 illustrate, the one chip glass contact panel of first embodiment of the invention can according to the following step manufacture: provide a substrate 100, then on the subregion of substrate 100, print formation first print frame layer 210, print the 100 attached conductive materials of plating on frame layer 210 and substrate in first and carry out etching and form conductive layer 300 again, finally on conductive layer 300, printing formation second corresponding to the first printing frame layer 210 and print frame layer 220.
Show as shown graphically in fig 5, the one chip glass contact panel of second embodiment of the invention can according to the following step manufacture: provide a substrate 100, then on the subregion of substrate 100, print formation first print frame layer 210,100 formation walls 350 on the first printing frame layer 210 and substrate again, then on wall 350, plate attached conductive material and carry out etching and forming conductive layer 300, finally on conductive layer 300, printing formation second corresponding to the first printing frame layer 210 and print frame layer 220.
According to the embodiment of the invention described above, conductive layer is easily spent because of printing frame floor height when circuit etching and is suddenly caused climbing disconnection problem, can improve by minimizing substrate prints the difference in height between frame layer and non-printing zone, thus promote the final finished yield of one chip glass touch control panel device.
When embodiments of the invention are shown especially with reference to its exemplary embodiments and are described, its can be art have usually know that the knowledgeable understands be, not departing from by following claim and spirit of the present invention that equivalent defined and category thereof, the various changes in form and details can be carried out to it.
Claims (10)
1. an one chip glass touch control panel device, is characterized in that, described one chip glass touch control panel device comprises:
Substrate;
First printing frame layer, it is arranged at the subregion this substrate covering this substrate;
Conductive layer, it is arranged on this substrate and this first printing frame layer; And
Second printing frame layer, it corresponds to this first printing frame layer and is arranged on this conductive layer.
2. one chip glass touch control panel device as claimed in claim 1, is characterized in that, below this conductive layer and this substrate and this first to print above frame layer, more wall is set.
3. one chip glass touch control panel device as claimed in claim 2, it is characterized in that, this substrate is hardened glass substrate.
4. one chip glass touch control panel device as claimed in claim 2, is characterized in that, the material of this first printing frame layer is black ink.
5. one chip glass touch control panel device as claimed in claim 2, it is characterized in that, this conductive layer is indium tin oxide layer.
6. one chip glass touch control panel device as claimed in claim 2, is characterized in that, the material of this second printing frame layer is black ink.
7. one chip glass touch control panel device as claimed in claim 2, it is characterized in that, the material of this wall is transparent cuticula glue.
8. a manufacture method for one chip glass touch control panel device, is characterized in that, described manufacture method comprises following steps:
Substrate is provided;
Make the subregion of this substrate to be formed the first printing frame layer;
Conductive layer is formed on this first printing frame layer and this substrate; And
On this conductive layer, correspond to this first printing frame layer form the second printing frame layer.
9. manufacture method as claimed in claim 8, it is characterized in that, the step forming this conductive layer comprises: conductive material plating be attached on this substrate and this first printing frame layer; And acquisition conduction pattern is etched with to this attached conductive material of plating.
10. manufacture method as claimed in claim 8, is characterized in that, before the step forming this conductive layer, is more contained on this substrate and this first printing frame layer and forms wall, formed thereon for this conductive layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102121816A TW201500986A (en) | 2013-06-19 | 2013-06-19 | One glass solution device and method of manufacturing the same |
| TW102121816 | 2013-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104238799A true CN104238799A (en) | 2014-12-24 |
Family
ID=52227023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310302792.3A Pending CN104238799A (en) | 2013-06-19 | 2013-07-18 | Single-chip glass touch panel device and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104238799A (en) |
| TW (1) | TW201500986A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103744565A (en) * | 2014-01-08 | 2014-04-23 | 湖州健邦科技有限公司 | Touch screen and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202404553U (en) * | 2012-03-01 | 2012-08-29 | 祥达光学（厦门）有限公司 | Touch screen structure with shielding metal line |
| TWI372993B (en) * | 2008-08-12 | 2012-09-21 | Cando Corp | Cover lens with touch-sensing function and method for fabricating the same |
| CN102768599A (en) * | 2012-05-09 | 2012-11-07 | 友达光电股份有限公司 | touch panel |
| CN102880340A (en) * | 2012-08-28 | 2013-01-16 | 北京京东方光电科技有限公司 | Single-layer externally hanging touch panel and manufacturing method thereof and liquid crystal display |
-
2013
- 2013-06-19 TW TW102121816A patent/TW201500986A/en unknown
- 2013-07-18 CN CN201310302792.3A patent/CN104238799A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI372993B (en) * | 2008-08-12 | 2012-09-21 | Cando Corp | Cover lens with touch-sensing function and method for fabricating the same |
| CN202404553U (en) * | 2012-03-01 | 2012-08-29 | 祥达光学（厦门）有限公司 | Touch screen structure with shielding metal line |
| CN102768599A (en) * | 2012-05-09 | 2012-11-07 | 友达光电股份有限公司 | touch panel |
| CN102880340A (en) * | 2012-08-28 | 2013-01-16 | 北京京东方光电科技有限公司 | Single-layer externally hanging touch panel and manufacturing method thereof and liquid crystal display |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103744565A (en) * | 2014-01-08 | 2014-04-23 | 湖州健邦科技有限公司 | Touch screen and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201500986A (en) | 2015-01-01 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141224 |