CN104231405A - 35KV and below bonding type semi-conductive internal shielding material for cable with extruded insulation - Google Patents

35KV and below bonding type semi-conductive internal shielding material for cable with extruded insulation Download PDF

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Publication number
CN104231405A
CN104231405A CN201310250690.1A CN201310250690A CN104231405A CN 104231405 A CN104231405 A CN 104231405A CN 201310250690 A CN201310250690 A CN 201310250690A CN 104231405 A CN104231405 A CN 104231405A
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CN
China
Prior art keywords
carbon black
parts
antioxidant
shielding material
type semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310250690.1A
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Chinese (zh)
Inventor
曹华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU DONGFANG CABLE MATERIAL Co Ltd
Original Assignee
JIANGSU DONGFANG CABLE MATERIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU DONGFANG CABLE MATERIAL Co Ltd filed Critical JIANGSU DONGFANG CABLE MATERIAL Co Ltd
Priority to CN201310250690.1A priority Critical patent/CN104231405A/en
Publication of CN104231405A publication Critical patent/CN104231405A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02Organic and inorganic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/17Protection against damage caused by external factors, e.g. sheaths or armouring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • C08L2203/202Applications use in electrical or conductive gadgets use in electrical wires or wirecoating

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention relates to the technical field of insulating materials and particularly relates to a 35KV and below bonding type semi-conductive internal shielding material for a cable with extruded insulation. The 35KV and below bonding type semi-conductive internal shielding material comprises the following components in parts by weight: 50-55 parts of carbon black, 5-8 parts of an antioxidant, 0.1-5 parts of a cross-linking agent, 30-50 parts of ethylene-vinyl acetate copolymer and 8-10 parts of a lubricant, wherein the carbon black is common conductive carbon black or superconductive carbon black. The antioxidant is an antioxidant 1010 or an antioxidant 300. The 35KV and below bonding type semi-conductive internal shielding material has excellent conductive performance and low volume resistivity, so that surfaces of extruded cables are good.

Description

Below 35KV adhesion type cables with extruded insulation semiconduction inner shield material
Technical field
The present invention relates to Insulation Material technical field, especially a kind of below 35KV adhesion type cables with extruded insulation semiconduction inner shield material.
Background technology
Semiconductive shielding layer is mainly divided into semi-conductive tape and two kinds, semiconduction plastics usually, semi-conductive tape is that fabricbase is wrapped, therefore to be not easily wrappedly convinced, and cause occurring inevitable space or pore between conductor, screen layer, insulation layer, these spaces or pore are under high-voltage field intensity, and in hole, gas ionizes, Damage to insulation layer, then generation tree branch discharge, finally causes insulation layer to puncture.So, general use semiconduction plastics as shielding material, and in current twisted polyethylene cable is produced, more advanced technique be adopt crosslinkable semiconductive shielding layer and insulation layer three-layer co-extruded go out, to guarantee closely cooperating each other, thus obtain the high pressure resistant cable of high-quality.But semiconduction plastics in the market generally use EVA as base material, this system cost compare is low, but because the VA of EVA resin easily decomposes by high temperature when extruding, and then can small-particle be produced from the teeth outwards, affect the work-ing life of cable, meanwhile, the semiconductive shieldin material of EVA base material, also be unfavorable for effective arrangement of graphitized carbon black, cause the conductivity shielding material to decline.
Summary of the invention
In order to overcome the deficiency of existing technology, the invention provides a kind of voltage rating 35KV following adhesion type cables with extruded insulation semiconduction inner shield material.
The technical solution adopted for the present invention to solve the technical problems is: a kind of below 35KV adhesion type cables with extruded insulation semiconduction inner shield material, and its component is:
Carbon black 50 ~ 55
Oxidation inhibitor 5 ~ 8
Linking agent 0.1 ~ 5
Ethene-vinyl acetate copolymer 30 ~ 50
Lubricant 8 ~ 10
According to another embodiment of the invention, comprising described carbon black is further common conductive carbon black or superconductive carbon black.
According to another embodiment of the invention, comprising described oxidation inhibitor is further antioxidant 1010 or antioxidant 300.
The invention has the beneficial effects as follows, the present invention has very excellent conductivity, and volume specific resistance is lower, extrudes cable surface better.
Embodiment
A kind of below 35KV adhesion type cables with extruded insulation semiconduction inner shield material, its component is:
Carbon black 50 ~ 55
Oxidation inhibitor 5 ~ 8
Linking agent 0.1 ~ 5
Ethene-vinyl acetate copolymer 30 ~ 50
Lubricant 8 ~ 10
Described carbon black is common conductive carbon black or superconductive carbon black.
Described oxidation inhibitor is antioxidant 1010 or antioxidant 300.
The present invention has very excellent conductivity, and volume specific resistance is lower, extrudes cable surface better.

Claims (3)

1. below a 35KV adhesion type cables with extruded insulation semiconduction inner shield material, it is characterized in that, its component is:
Carbon black 50 ~ 55
Oxidation inhibitor 5 ~ 8
Linking agent 0.1 ~ 5
Ethene-vinyl acetate copolymer 30 ~ 50
Lubricant 8 ~ 10.
2. below 35KV adhesion type cables with extruded insulation semiconduction inner shield material according to claim 1, it is characterized in that, described carbon black is common conductive carbon black or superconductive carbon black.
3. below 35KV adhesion type cables with extruded insulation semiconduction inner shield material according to claim 1, it is characterized in that, described oxidation inhibitor is antioxidant 1010 or antioxidant 300.
CN201310250690.1A 2013-06-24 2013-06-24 35KV and below bonding type semi-conductive internal shielding material for cable with extruded insulation Pending CN104231405A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310250690.1A CN104231405A (en) 2013-06-24 2013-06-24 35KV and below bonding type semi-conductive internal shielding material for cable with extruded insulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310250690.1A CN104231405A (en) 2013-06-24 2013-06-24 35KV and below bonding type semi-conductive internal shielding material for cable with extruded insulation

Publications (1)

Publication Number Publication Date
CN104231405A true CN104231405A (en) 2014-12-24

Family

ID=52220375

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310250690.1A Pending CN104231405A (en) 2013-06-24 2013-06-24 35KV and below bonding type semi-conductive internal shielding material for cable with extruded insulation

Country Status (1)

Country Link
CN (1) CN104231405A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114940784A (en) * 2022-03-16 2022-08-26 重庆大学 Water-blocking cable semiconductive shielding layer material and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114940784A (en) * 2022-03-16 2022-08-26 重庆大学 Water-blocking cable semiconductive shielding layer material and preparation method thereof

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C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141224