CN104212381A - Hot melt adhesive for production of resistance braid - Google Patents
Hot melt adhesive for production of resistance braid Download PDFInfo
- Publication number
- CN104212381A CN104212381A CN201410156722.6A CN201410156722A CN104212381A CN 104212381 A CN104212381 A CN 104212381A CN 201410156722 A CN201410156722 A CN 201410156722A CN 104212381 A CN104212381 A CN 104212381A
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- CN
- China
- Prior art keywords
- hot melt
- melt adhesive
- production
- resistance braid
- braid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a hot melt adhesive for production of a resistance braid. The hot melt adhesive is characterized by comprising low-density polyethylene, an ethylene-vinyl acetate copolymer, oleamide, octadecanamide, silicon oxide, a resin tackifier and a high-molecular antistatic agent. The hot melt adhesive has good bonding effects, improves resistance braid product quality and improves resistance braid use effects.
Description
Technical field
The present invention relates to electronic product wrapping material field, be specifically related to a kind of thermosol formula for the production of resistance braid material.
Background technology
At present, existing 01005 type Chip-R braid is made up of PET film layer, tack coat (polyethylene) and layer of paper, need when making first tack coat to be bonded in PET film, then layer of paper is connected on (because layer of paper can not directly be bonded on tack coat by production standard) on tack coat by melt viscosity, and existing hot melt adhesive adhesive effect is good not, there is familiar lacunas in the resistance braid made, makes troubles to user.
Summary of the invention
Object of the present invention is made up of PET film layer, tack coat (polyethylene) and layer of paper for existing 01005 type Chip-R braid at present exactly, need when making first tack coat to be bonded in PET film, then layer of paper is connected on (because layer of paper can not directly be bonded on tack coat by production standard) on tack coat by melt viscosity, and existing hot melt adhesive adhesive effect is good not, there is familiar lacunas in the resistance braid made, to the deficiency that user makes troubles, and provide a kind of thermosol formula for the production of resistance braid material.
The present invention is made up of Low Density Polyethylene, ethylene-vinyl acetate copolymer, amine hydroxybenzene, stearic amide, silicon oxide, tackifier resin and Polymer-metallic Catalyst, and its weight distribution ratio is:
Low Density Polyethylene 22-27
Ethylene-vinyl acetate copolymer 42-47
Amine hydroxybenzene 0.5-1.0
Stearic amide 0.2-0.6
Silicon oxide 0.1-0.6
Tackifier resin 37-42
Polymer-metallic Catalyst 17-23.
Advantage of the present invention is: this hot melt adhesive is bonding effective, improves the quality product of resistance braid, improves the result of use of resistance braid.
Embodiment
The present invention is made up of Low Density Polyethylene, ethylene-vinyl acetate copolymer, amine hydroxybenzene, stearic amide, silicon oxide, tackifier resin and Polymer-metallic Catalyst, and its weight distribution ratio is:
Low Density Polyethylene (LDPE) 25g, melting index MI=8g/min
Ethylene-vinyl acetate copolymer (EVA) 45g, melting index MI=15 g/min(ethene E: vinyl acetate between to for plastic VA=85:15)
Amine hydroxybenzene 0.8g
Stearic amide 0.4g
Silicon oxide 0.3g
Tackifier resin (C5 petroleum resin or C9 petroleum resin) 40g
Polymer-metallic Catalyst 20g.
Working method:
By the Polymer-metallic Catalyst of the silicon oxide of the stearic amide of the amine hydroxybenzene of the ethylene-vinyl acetate copolymer (melting index MI=15 g/min) of the Low Density Polyethylene (melting index MI=8g/min) of 25g, 45g, 0.8g, 0.4g, 0.3g, 40g tackifier resin, 20g mixing after send into granulator granulation hot melt adhesive.
Using method: granular hot melt adhesives is fed through in fuse machine and carries out being fused into gluey hot melt adhesive, can be coated with.
Claims (1)
1., for the production of a hot melt adhesive for resistance braid, it is characterized in that it is made up of Low Density Polyethylene, ethylene-vinyl acetate copolymer, amine hydroxybenzene, stearic amide, silicon oxide, tackifier resin and Polymer-metallic Catalyst, its weight is:
Low Density Polyethylene 22-27
Ethylene-vinyl acetate copolymer 42-47
Amine hydroxybenzene 0.5-1.0
Stearic amide 0.2-0.6
Silicon oxide 0.1-0.6
Tackifier resin 37-42
Polymer-metallic Catalyst 17-23.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410156722.6A CN104212381A (en) | 2014-04-18 | 2014-04-18 | Hot melt adhesive for production of resistance braid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410156722.6A CN104212381A (en) | 2014-04-18 | 2014-04-18 | Hot melt adhesive for production of resistance braid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104212381A true CN104212381A (en) | 2014-12-17 |
Family
ID=52094299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410156722.6A Pending CN104212381A (en) | 2014-04-18 | 2014-04-18 | Hot melt adhesive for production of resistance braid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104212381A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111500204A (en) * | 2020-06-15 | 2020-08-07 | 杭州福斯特应用材料股份有限公司 | Adhesive film, composition for forming the same, and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101254679A (en) * | 2007-03-01 | 2008-09-03 | 黄少林 | Surface sticking electronic component brede processing technique |
| TW201321456A (en) * | 2011-09-22 | 2013-06-01 | Tosoh Corp | Adhesive resin composition and easily peelable film |
| CN103320055A (en) * | 2013-05-17 | 2013-09-25 | 温州大学 | High-insulation hot melt adhesive membrane |
| CN103333625A (en) * | 2013-07-01 | 2013-10-02 | 江苏达胜热缩材料有限公司 | Heat-shrinkable composite insulating tape |
-
2014
- 2014-04-18 CN CN201410156722.6A patent/CN104212381A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101254679A (en) * | 2007-03-01 | 2008-09-03 | 黄少林 | Surface sticking electronic component brede processing technique |
| TW201321456A (en) * | 2011-09-22 | 2013-06-01 | Tosoh Corp | Adhesive resin composition and easily peelable film |
| CN103320055A (en) * | 2013-05-17 | 2013-09-25 | 温州大学 | High-insulation hot melt adhesive membrane |
| CN103333625A (en) * | 2013-07-01 | 2013-10-02 | 江苏达胜热缩材料有限公司 | Heat-shrinkable composite insulating tape |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111500204A (en) * | 2020-06-15 | 2020-08-07 | 杭州福斯特应用材料股份有限公司 | Adhesive film, composition for forming the same, and electronic device |
| EP4166618A4 (en) * | 2020-06-15 | 2023-11-08 | Hangzhou First Applied Material Co., Ltd. | Adhesive film, composition for forming same and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141217 |