CN104204122A - Method for separating member using laser light - Google Patents
Method for separating member using laser light Download PDFInfo
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- CN104204122A CN104204122A CN201280071785.0A CN201280071785A CN104204122A CN 104204122 A CN104204122 A CN 104204122A CN 201280071785 A CN201280071785 A CN 201280071785A CN 104204122 A CN104204122 A CN 104204122A
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- Prior art keywords
- component
- laser
- adhesive tape
- bonding coat
- bonding
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laser Beam Processing (AREA)
Abstract
A method for separating a first member (10) and a second member (20) which are stuck together with an adhesive tape (30) from one another, wherein a laser light non-transmissive part of at least one of the first member (10), the second member (20) and the adhesive tape (30) is irradiated and heated with a laser light (L), causing an adhesive layer of the adhesive tape (30) to be in at least one of a softened, melted, foamed or decomposed state with this heat in order to reduce the adhesive strength of the adhesive layer.
Description
Technical field
The present invention relates to a kind of laser that utilizes by the separation method of having separated with first component together of adhesive tape bonding and second component in advance.
Background technology
Up to the present, the known adhesive tape with bonding coat that for example uses when joining two parts.Different from caking agent, adhesive tape has the following advantages: do not need set time, moment just can be by two adhering components together, and two isolation of components when can avoiding because its Young's modulus is very low being impacted after bonding.Therefore, it is applied widely.For example, often use adhesive tape at the manufacture scene of household supplies, office supplies, household appliances, electronic product, automobile etc.The bonding coat of the adhesive tape using in above various occasions is formed by tackiness agent, and what use as this tackiness agent is to bring into play stronger bonding force and can the such tackiness agent of this stronger bonding force of long term maintenance after bonding.
There will be the bad situation of product by adhesive tape bonding.In this case, need temporarily parts are separated from another parts, and then carry out bondingly, need so-called doing over again (rework).The in the situation that of a bonding rear parts breakage, sometimes to only these breakage parts be changed, carry out sometimes so-called repair work.Also there will be and must carry out so-called recycling etc., bonding multiple parts products obtained therefroms are disassembled and reclaimed as recycling resource, commercialization again.
Carry out above-mentionedly doing over again, when repairing, recycling, if the bonding force of adhesive tape is stronger, there will be the situation that parts are separated from another parts of being difficult to.Generally take in this case following way: use the medicines such as solvent, tensio-active agent, acid, alkali etc., utilize this medicine to the soaking into, the lubrication of bonding portion is peeled off of bonding portion, or make bonding coat soften to peel off to whole product heating.
But, in the case of being mobile phone particularly the such electronic product of smart mobile phone, with adhesive tape, for example body and electronic unit are being bonded together and after commercialization, from protecting the viewpoint of each parts, can not use described medicine etc.; From the viewpoint of the recycling of To Be Protected from Heat the parts such as IC, can not entirety heat, be very difficult to carry out the separation of parts.
Therefore, can consider that adhesive tape that for example patent documentation 1,2 disclosed uses can be peeled off is again by adhering components such way of getting up.But, at the scene of manufacturing, generally use the object of adhesive tape to be to obtain stronger bonding force, if use the adhesive tape of removable, likely cause becoming qualified product because bonding force is not enough.
Present inventor had applied for a method patent of invention before this application, and its application number is No. 2010-208304, Patent.Its summary of the invention is: under the state that accompanies intermediate member between two parts irradiating laser by these two components bonding after, again to same position irradiating laser, make thus that intermediate member is softening, fusing etc. and parts are separated from another parts.
Patent documentation 1: Japanese Laid-Open Patent Publication JP 2009-209223 communique
Patent documentation 2: Japanese Laid-Open Patent Publication JP 2012-7047 communique
Summary of the invention
(technical problem that invention will solve)
In No. 2010-208304 related invention of above-mentioned Patent, because intermediate member is formed by hot melt material, be effective so make intermediate member become melted state and can separate in this point in the irradiation that utilizes laser.But at actual manufacture scene, the usage quantity of the adhesive tape of generally selling on the market for industrial, electric, electronics, family is very big, therefore need the method can efficiency well isolation of components opened these adhesive tapes in the situation that using.
Particularly, the in the situation that of smart mobile phone etc. because the price of electronic unit is high, thus think again to utilize when carrying out doing over again, repairing after adhesive tape bonding, do not exist bad parts require high.
But the bonding coat of normal tape, adopts for improving force of cohesion the method for utilizing heat, ultraviolet ray to improve cross-linking density, the mode being therefore difficult to can again utilizing will not exist bad isolation of components to open.
And, be not limited to the electronic products such as mobile phone, there is following requirement in a lot of fields: separate in the case of not damaging the parts that are bonded together securely with adhesive tape.
The present invention is for having addressed the above problem.Its object is: just the isolation of components by adhesive tape bonding can be opened easily.
(in order to the technical scheme of technical solution problem)
Present inventor has found: use laser to change the state of bonding coat, just can reduce easily bonding strength, made therefrom the present invention.
The invention of first aspect is such, in to the separation method separating with second component with adhesive tape bonding first component together, the non-permeation parts irradiating laser of laser one of at least having in described first component, described second component and described adhesive tape is made to the non-permeation parts heating of this laser, utilize this heat to make at least one state of the bonding coat of described adhesive tape in becoming softening, fusing, bubble and decomposing that the bonding force that this bonding coat produces is declined, described first component and described second component are separated.
According to this structure, the non-permeation parts of laser generates heat by absorbing laser.By utilizing this heat to make the bonding coat of adhesive tape softening etc., the bonding force of bonding coat will decline, and first component and second component can be separated.
Therefore, in the case of using the normal tape that bonding force is stronger, do not use the medicines such as solvent, just isolation of components can be opened.And, because can be selectively the position irradiating laser to needs heating only, so heat can be limited in minimum extent the impact of To Be Protected from Heat the parts such as such as electronic unit (crystal liquid substrate, touch panel device).
The invention of second aspect is such, in the invention of first aspect, utilizes printing to form the non-permeation parts of laser.
According to this structure, because printing has the opacifying property that blocks laser, so can make the non-permeation parts of laser absorbing laser and generating heat reliably.
The invention of the third aspect is such, and in the invention of first aspect, the non-permeation parts of laser forms by making laser see through at least 5% pigmentary resin.
According to this structure, when irradiating laser, the non-permeation parts of laser not only irradiating surface is heated, also can be heated successively along thickness direction.So,, because the heat of the non-permeation parts of laser increases, so heat is easy to be delivered to the bonding coat of adhesive tape, and can make bonding coat softening etc. reliably.
The invention of fourth aspect is such, and in the invention of first aspect, the non-permeation parts of laser is formed by metal or metal oxide.
According to this structure, when irradiating laser, have reflection to a certain degree at the surface laser of the non-permeation parts of laser, remaining laser is absorbed by the non-permeation parts of laser.So, the non-permeation parts of laser just can suitably generate heat, and the bonding coat that can make adhesive tape is softening etc. reliably.
The invention of the 5th aspect is such, aspect first to fourth in the invention of either side, allow power along the directive effect that described first component is separated with described second component on the bonding coat of described adhesive tape, and at this state to the non-permeation parts irradiating laser of laser.
According to this structure, because the power of isolation of components is acted on the bonding coat of adhesive tape always, so can start sequentially to peel off down from the softening part waiting of bonding coat, well isolation of components be opened with less laser radiation amount efficiency.
The invention of the 6th aspect is such, aspect first to the 5th, in the invention of either side, a same part is irradiated to twice above laser.
According to this structure, in the situation that laser radiation for the first time can not accumulation of heat, by for the second time, laser radiation for the third time improves heat storage capacity, the bonding coat that so just can make adhesive tape is softening etc. reliably.
In the time that the non-permeation parts of laser is thicker, the bonding coat that there will be heat to be delivered to adhesive tape need to spend the situation of certain hour.In this case, by irradiating laser repeatedly, can be little by little to bonding coat, heating makes it softening etc.
At laser, the non-portion that sees through is afraid of high temperature in the situation that, by irradiating laser repeatedly, so in the case of do not make the non-temperature that sees through portion of laser improve too many, just can little by little make it softening etc. to bonding coat heating.
(effect of invention)
According to the invention of first aspect, utilize laser to make at least one state of the bonding coat of adhesive tape in becoming softening, fusing, bubble and decomposing, be easy to isolation of components to open, therefore can successfully do over again, repairing, recycling.
According to the invention of second aspect, because form the non-permeation parts of laser by printing, thus can make the non-permeation parts of laser generate heat reliably, thus the bonding force of the bonding coat of adhesive tape can be reduced.
According to the invention of the third aspect, make laser see through at least 5% pigmentary resin because serving as reasons and formed the non-permeation parts of laser, so the bonding coat that can make adhesive tape is softening etc. reliably, thereby can parts be separated reliably with recycling form.
According to the invention of fourth aspect, because formed the non-permeation parts of laser with metal or metal oxide, thus can make the non-permeation parts of laser suitably generate heat, thus can parts be separated reliably with recycling form.
According to the invention of the 5th aspect, because exert all one's strength along the directive effect that first component is separated with second component irradiating laser on the bonding coat of described adhesive tape and under this state, so can efficiency well isolation of components be opened.
According to the invention of the 6th aspect, because to irradiating twice above laser with a part, thus can little by little improve heat storage capacity, thus the bonding coat that makes adhesive tape softens etc. reliably.
Brief description of the drawings
Fig. 1 is the stereographic map with product that second component becomes with adhesive tape bonding first component.
Fig. 2 is the exploded perspective view of product.
Fig. 3 is the amplification view of adhesive tape.
Fig. 4 is the stereographic map that has formed the first component of printed layers.
Fig. 5 is the stereographic map of having pasted the first component of adhesive tape.
Fig. 6 is the figure that makes the step that first component and second component separate in order to explanation.
Embodiment
Describe with reference to the accompanying drawings embodiments of the present invention in detail.In addition, below preferred implementation be the example explaining in essence, the intention of unrestricted the present invention, applicable object of the present invention and purposes of the present invention.
(embodiment 1)
Fig. 1 illustrates with adhesive tape 30 after bonding to first component 10 and second component 20 and the product A forming.By forming the first component 10 of this product A when second component 20 separates, use laser L (being shown in Fig. 6).
First component 10 for example can be formed by transparency glass plate, resin-made membrane, resin flap (sheet) etc.In this embodiment 1, first component 10 is rectangular glass sheet, and its shape, material can be set arbitrarily.First component 10 can water white transparency.In addition, can also be painted thinly, to can make the major part of laser see through.
Fig. 4 observes the figure that obtains of first component 10 from the back side one side (second component 20 1 sides), as shown in the drawing, is provided with printed layers 40 at the circumference of the face by second component 20 1 sides of first component 10.By like this printed layers 40 is arranged on first component 10 by the face of second component 20 1 sides, printed layers 40 and adhesive tape 30 just become neighbouring relations.
Printed layers 40, for example, can adopt the various printing processes such as lithography (offset printing), intaglio printing (gravure printing), silk screen printing (screen printing) to form.Printed layers 40 is the non-permeation parts of laser of the present invention.The non-permeation parts of laser refers to have when irradiating laser the part of the laser absorption that absorbs this laser.Even if laser absorption refers to a part for laser and sees through and/or reflection, also can absorb the character of remaining laser, also comprise the situation that irradiated laser is all absorbed.As the color of printed layers 40, preferably block the higher color of opacifying property of laser, the dark colours such as such as black.
Printed layers 40 is that so-called binding agent (binder) forms with laser absorbent by resin.Organic binder bond can use common thermoplastic resin, thermosetting resin, ultraviolet curable resin etc.As laser absorbent, for example, can use laser absorption material, the carbon black etc. on pigment dyestuff, organic dye, market, sold.
Printed layers 40, can be for by written record in product A, product A is decorated and painted etc. and establish to product A.
Can also metal steam plated film be set at the circumference by the face of second component 20 1 sides of first component 10 replaces at the circumference of the face by second component 20 1 sides of first component 10 printed layers 40 is set.This metal steam plated film also has laser absorption.
Second component 20 is the sheet material being formed by such as resin etc.But in addition, second component can also be used the formation such as sheet glass, resin-made membrane, resin flap.Second component 20 can be transparent, also can be opaque.And the shape of second component 20 is also not limited to tabular.
Adhesive tape 30, can use the adhesive tape of selling on the open market for industrial, electric, electronics, family for example; Can also use the one side adhesive tape that is provided with bonding coat 30b on a face of Fig. 3 (a) film like base material 30a that is shown in; Also can use the double sticky tape that is provided with respectively bonding coat 30b, 30b on two faces of Fig. 3 (b) base material 30a that is shown in.
As the tackiness agent that forms bonding coat 30b, the common acrylic adhesives that for example has the heat utilized, ultraviolet ray that its force of cohesion is improved.Can also use elastomerics class tackiness agent, in this case, can list as styrenic elastomerics: SIS (isoprene-styrenic block polymers), SBS (styrene butadiene styrenic block polymers), SEBS (styrene-ethylene-diene block polymkeric substance) etc.; Can list as other elastomerics: acrylic elastomer, amido formate (urethane) class elastomerics, ethylene octane copolymer etc.Also can use common rubber adhesive.
Next, the processing step of the A that manufactures a product is described.First, as shown in Figure 4, on first component 10, form printed layers 40.Afterwards, as shown in Figure 5, a bonding coat 30b of double sticky tape 30, by being pressed in printed layers 40, is attached to adhesive tape 30 on first component 10.
Afterwards, as shown in Figure 2, arrange first component 10 and second component 20, by another bonding coat 30b of adhesive tape 30 by being pressed on the fixed position of second component 20.So, first component 10 with second component 20 just with 30 moments of adhesive tape and bonded together securely.Use like this adhesive tape 30, caking agent is different from using, and without set time, productivity improves.
For example there are household supplies, office supplies, household appliances, electronic product, trolley part etc. as product A.What can list as electronic product is mobile phone, particularly smart mobile phone.But in addition, as long as can with the bonding product of adhesive tape 30 all can be using it as product A.
Next, the situation that the first component of the product A by making as mentioned above 10 is separated from second component 20 is explained.The separation reason that can list for example has: in the time that first component 10, with respect to the bonding location of second component 20, skew has occurred etc., first component 10 is temporarily separated from second component 20, while then needing to carry out again bonding doing over again; Bonding rear first component 10 breakages, and only first component 10 is changed while carrying out so-called repairing; Reclaim respectively first component 10 and second component 20 recycling recycling time etc.
Doing over again described in carrying out, when repairing, recycling, one of must avoid in first component 10 and second component 20 side or both sides' breakage, damage etc.
In present embodiment, utilize laser L that first component 10 is separated from second component 20.
In other words, as shown in Figure 6, first, be hung in second component 20 times with weight W, make the bonding coat 30b of power along the directive effect that first component 10 is separated with second component 20 in adhesive tape 30 upper, preferably this makes the size of the power in the direction of separation for example more than 0.01MPa.
Under this state, aim at printed layers 40 irradiating laser L from the surface of first component 10 side.Laser is absorbed in printed layers 40, and therefore printed layers 40 generates heat.The heat of printed layers 40 passes to the bonding coat 30b of adhesive tape 30.Now, because bonding coat 30b is adjacent with printed layers 40, so the heat of printed layers 40 just passes to bonding coat 30b soon, the temperature of bonding coat 30b rises soon.
The laser L using, can use the acquisitions such as such as gas laser, solid statelaser, semiconductor laser, fibre laser.The infrared semiconductor laser to 1500nm from wavelength 800nm of special easy handling is preferred.
In addition, in advance the output of laser L, sweep velocity are set as to first component 10, second component 20 does not melt, does not damage so large.
The temperature of bonding coat 30b is due to after irradiating laser L rises, and bonding coat 30b is softening etc., and bonding force declines.Now, act in the direction that first component 10 and second component 20 are separated because utilize weight W to exert all one's strength, so the part that bonding coat 30b can start to soften from it starts sequentially to peel away, thereby first component 10 separates gradually with second component 20, last first component 10 is separated from second component 20.
The weight of weight W can be set arbitrarily, but preferably makes the size of the power in direction that first component 10 separates with second component 20 more than 0.01MPa.If this power is less than 0.01MPa, even irradiating laser L, first component 10 is also difficult to separate with second component 20, therefore must increase the irradiation dose of laser L.The size of the power in the direction that first component 10 separates with second component 20 if make is excessive, likely causes first component 10, second component 20 breakages.Therefore preferably in the not damaged scope of two parts 10,20, set the weight of weight W.
Act on the method making in direction that first component 10 separates with second component 20 as exerting all one's strength, except the above-mentioned method of utilizing weight W, can also list following methods: vacuum suction is with the method that separates, by power being added in inserting other parts between first component 10 and second component 20 to method making direction that first component 10 separates from second component 20 etc.Aforesaid methods etc. can be looked the suitably choice for use such as structure of product A.
The irradiation number of times of laser L can be once can be repeatedly also.If make laser L be output as low output and irradiate repeatedly laser at same position, can either make the temperature rising of first component 10, can make again the temperature of bonding coat 30b raise gradually and little by little reduce bonding force.So, just can prevent first component 10, second component 20 breakages.
Side is damaged and can not recycle in the situation that (repairing) one of in first component 10 and second component 20, first component 10 is that body, second component 20 are that internal part and discarded first component 10 use in the situation of second component 20, or object is only (recycling) in situation about separating, once or repeatedly export higher laser L by irradiation, also can only decompose bonding coat 30b, just two isolation of components can be opened easily.
Can be reaching that bonding coat 30b is softening, irradiating laser L always till the temperature of fusing, can also be till reaching the temperature that bonding coat 30b bubbles, decomposes irradiating laser L always.By decomposing bonding coat 30b, can first component 10 be separated from second component 20 by extremely weak power.
In the case of the base material 30a of adhesive tape 30 is formed by the foams with separated foam structure, base material 30a can wreck by hot exapnsion due to the air in bubble, so can first component 10 be separated from second component 20 with extremely weak power.
Because utilize like this laser L that first component 10 is separated from second component 20, so without using solvent, tensio-active agent, acid, alkaline drug etc. to separate.And, because can be selectively position (the stickup position of adhesive tape 30) the irradiating laser L to needs heating only, so can by heat, on such as electronic unit (crystal liquid substrate, touch panel device) etc., To Be Protected from Heat that impact that parts cause is limited in minimum extent.
Therefore, according to this embodiment 1, because can utilize laser L that at least one state of the bonding coat 30b of adhesive tape 30 in becoming softening, fusing, bubble and decomposing separated first component 10 and second component 20, so can two parts 10,20 both sides or a side or needed parts, material etc. be separated with recycling form, thereby can successfully do over again, repairing, recycling.
The printed layers 40 that has an opacifying property because serving as reasons forms the non-permeation parts of laser, thus can make the non-permeation parts of laser absorbing laser L and generating heat reliably, thus can make the bonding force of bonding coat 30b decline reliably.
Allow power along the directive effect that first component 10 and second component 20 are separated irradiating laser L under the state on the bonding coat 30b at adhesive tape 30, so just can efficiency well isolation of components be opened by less laser radiation amount.
In addition second component 20 can also be separated from first component 10.
Can make second component 20 for transparent component, leaning on the face of first component 10 1 sides of this second component 20, printed layers (the non-permeation parts of laser) 40 is set.In this case, can, from second component 20 1 side irradiating laser L, by the bonding coat 30b heating of adhesive tape 30, and first component 10 be separated from second component 20.
First component 10, second component 20 can be electronic units.For example, both can make first component 10 with the electronic unit that IC etc. has been installed, with the body of storage first component 10 as second component 20; Can also make first component 10 with display panels, use the substrate that display panels is installed to make second component 20.
(embodiment 2)
Embodiment 2, different from embodiment 1 with laser L is formed in first component 10 this point through at least 5% pigmentary resin, other parts are all the same with embodiment 1.Below, describe in detail and embodiment 1 distinct portions.
As the pigmentary resin that forms first component 10, for example, can obtain by allowing dyestuff, pigment etc. be contained in resin.So will form the non-permeation parts of laser at first component 10.Can also be for only to have a part for first component 10 to be formed by pigmentary resin, other parts water white transparency is so-called double-colored shaping.
The resin kind that becomes matrix (base) is a lot, for example, have thermoplastic polyethylene, polypropylene, polyvinyl chloride, polycarbonate, glucose three vinegar [second] acid esters, ethylene terephthalate, acrylic resin etc.Can also be thermosetting resin, can list in this case: epoxy resin, resol, melamine resin (melamine resin), guanamine resin (guanamine resin) etc.Also can be ultraviolet curable resin.In this case, can list unsaturated acrylic resin, vibrin, cationoid polymerisation epoxy resin and monomer whose.
On the first component 10 of embodiment 2, printed layers is not set.
By with the bonding first component 10 of adhesive tape 30 when second component 20 separates, from the surface one side irradiating laser L of first component 10.Because first component 10 is colored, so the laser L irradiating can be absorbed by first component 10.The first component 10 of absorbing laser L generates heat, and the heat of this first component 10 can pass to the bonding coat 30b of adhesive tape 30, that bonding coat 30b becomes is softening, fusing, bubble and decompose at least one state, the bonding force being produced by bonding coat 30b declines.So just first component 10 has been separated from second component 20.
If first component 10 is to the transmitance of laser L lower than 5%, the major part of laser L can be absorbed by the surface of first component 10 (shadow surface of laser L), and the surface of first component 10 is convenient to be damaged by laser L, therefore also not preferred.
On the other hand, if first component 10 to the transmitance of laser L more than 80%, the major part of laser L can be converted into heat hardly, efficiency can decline, therefore also not preferred.
Therefore, first component 10 to the transmitance of laser L more than 5% 80% less than being preferable range.More preferably scope is more than 10% below 70%.
Therefore, the same with embodiment 1, according to embodiment 2, can utilize laser L make the bonding coat 30b of adhesive tape 30 become softening, fusing, bubble and decompose at least one state, first component 10 is separated with second component 20, so can separate two parts 10,20 with recycling form, thereby can successfully do over again, repairing, recycling.
In addition, the bonding coat 30b of adhesive tape 30 also can have the non-perviousness of laser.In this case, soften because of the absorbing laser L of bonding coat 30b own etc., so even the situation that first component 10 all sees through laser, first component 10 is also just can separate from second component 20 easily.
In the situation that adhesive tape 30 has the non-permeation parts of laser, even for example, the laser transmittance of first component 10 higher (more than 80%), bonding coat 30b also can absorbing laser L and is generated heat.So, can make at least one state of bonding coat 30b in becoming softening, fusing, bubble and decomposing, bonding force is declined, and first component 10 be separated with second component 20.
Can make the laser transmittance of base material 30a of adhesive tape 30 more than 10%.In this case, adhesive tape 30 also has the non-permeation parts of laser, therefore can utilize laser L that first component 10 is separated with second component 20.
Also can allow second component 20 be formed by described pigmentary resin.
(embodiment 3)
Embodiment 3, is forming in first component 10 this point different from embodiment 1 by metal or its oxide compound.Other parts are all identical with embodiment 1.Below, to elaborating with embodiment 1 distinct portions.
As form the metal of first component 10 can enumerate tap a blast furnace, the alloy of copper, silver, aluminium, magnesium and these metals.Can also use oxide compound and the alloy thereof of described metal to form first component 10.
By with the bonding first component 10 of adhesive tape 30 when second component 20 separates, from the surface one side irradiating laser L of first component 10.The laser L irradiating has reflection to a certain degree on the surface of first component 10, but remaining laser L is absorbed by first component 10.The first component 10 of absorbing laser L generates heat, and the heat of this first component 10 passes to the bonding coat 30b of adhesive tape 30, that bonding coat 30b becomes is softening, fusing, bubble and decompose at least one state, the bonding force being produced by bonding coat 30b declines.So, first component 10 will separate from second component 20.
Therefore, the same with embodiment 1, according to embodiment 3, utilize laser L make the bonding coat 30b of adhesive tape 30 become softening, fusing, bubble and decompose at least one state, just can make first component 10 separate with second component 20, so can separate parts 10,20 with the form of recycling two parts 10,20, thereby can successfully do over again, repairing, recycling.
In addition, in the case of using silver, so higher metal and the oxide compound thereof of thermal conductivity of aluminium to form first component 10, if the thickness of first component 10 is thicker, the heating that there will be laser L to cause passes to the position beyond adhesive tape 30, and cannot the efficiency situation to bonding coat 30b heating well.Therefore,, in the case of being the material that thermal conductivity is higher, preferably make thinner thickness.
Can allow second component 20 be formed by metal or its oxide compound.
Can allow a part for first component 10 be formed by metal or its oxide compound, allow other parts be formed by resin, glass.
[embodiment]
Below, embodiments of the invention are explained.
(embodiment 1)
First component 10 is sheet glass, and width is 50mm, and length is 100mm, and thickness is 1mm.
The black (Jujo Chemical Co, Ltd. produces: ProductName: RECUREGA4100) of printed layers 40 use UV screen printing inks forms.The formation scope of printed layers 40 first component 10 by the whole circumference of the face of second component 20 1 sides one week, its width is 2mm.To ink irradiation ultraviolet radiation, make thus ink solidification with metal halide lamp, obtained printed layers 40.Ultraviolet irradiation amount is now 300mJ/mm
2.
Second component 20 is polycarbonate clear sheets processed, and width is 60mm, and length is 120mm, and thickness is 2mm.
Adhesive tape 30 is that (Dainippon Ink Chemicals produces double sticky tape: 8402B).This double sticky tape is struck out to rectangular frame shape.Its Outside Dimensions is width 50mm, length 100mm, and the width of frame part is 1mm.
After peeling the mould release film (mould releasing film) of adhesive tape 30, a bonding coat 30b of adhesive tape 30 is pressed in the printed layers 40 of first component 10, adhesive tape 30 is attached on first component 10.
Afterwards, another bonding coat 30b of adhesive tape 30 is pressed on second component 20, utilizes adhesive tape 30 that first component 10 and second component 20 are bonded together.
Next, as shown in Figure 6, the weight W of weight 500g is contained on second component 20, and first component 10 is attached on water white fastening glass panels (not shown) with adhesive tape for fixing.Make adhesive tape for fixing mutually not overlapping with printed layers 40.
Under this state, exert all one's strength along the directive effect that first component 10 is separated with second component 20 on bonding coat 30b, its size is 0.015MPa.
Afterwards, from surface one side of first component 10 to printed layers 40 irradiating laser L.The wavelength of laser L is 940nm, be output as 10W, focus diameter is 3mm.And sweep velocity is that 600mm/ divides.The irradiation number of times of laser L is five times.
The bonding coat 30b of adhesive tape 30 softens by irradiating laser L, and second component 20 separates with first component 10 and falls down.First component 10 and all not damageds of second component 20 now seen.
(embodiment 2)
First component 10 is copper coins of thickness 0.5mm, and width and length are identical with the first component 10 in embodiment 1.
Second component 20 is the same with embodiment 1.
Adhesive tape 30 is Y-4914 that Sumitomo 3M Co., Ltd. produces.
In the same manner as in Example 1, under the state of installing weight W, irradiated laser L.Laser L is output as 30W.Wavelength, focus diameter, sweep velocity are all the same with embodiment 1.Irradiate number of times for once.
The bonding coat 30b of adhesive tape 30 softens by irradiating a laser L, and second component 20 separates with first component 10 and falls down.First component 10 and all not damageds of second component 20 now seen.
(embodiment 3)
First component 10 is to be colored as blue polycarbonate panel.Each size is identical with the first component 10 in embodiment 1.First component 10 is 10% for the transmitance of the laser of wavelength 940nm.
Allow second component 20 in the same manner as in Example 1.
Adhesive tape 30 is 5000-NS that Nitto Denko Corp produces.
In the same manner as in Example 1, under the state of installing weight W, irradiated laser L.Laser L is output as 10W.Wavelength, focus diameter, sweep velocity are all the same with embodiment 1.
Second component 20 is irradiated and is separated and fall down with first component 10 by the laser L of the 8th time.First component 10 and all not damageds of second component 20 now seen.
(embodiment 4)
Second component 20 is the same with embodiment 1.
Adhesive tape 30 is 5230NSB that Sekisui Chemical Co., Ltd produces.
In the same manner as in Example 1, under the state of installing weight W, irradiated laser L.Laser L is output as 20W.Wavelength, focus diameter, sweep velocity are all the same with embodiment 1.
Second component 20 is irradiated and is separated and fall down with first component 10 by the laser L of the 15 time.First component 10 and all not damageds of second component 20 now seen.
(industry utilizability)
In sum, the involved in the present invention separation method that utilizes separation by laser parts, is extensively suitable for for the situation that the parts that bond together securely with adhesive tape are separated.(nomenclature)
A product
10 first components
20 second components
30 adhesive tapes
30a base material
30b bonding coat
40 printed layers (the non-permeation parts of laser)
L laser
Claims (6)
1. utilize an isolation of components method for laser, it,, to separating with second component with adhesive tape bonding first component together, is characterized in that:
The non-permeation parts irradiating laser of laser one of at least having in described first component, described second component and described adhesive tape is allowed to the non-permeation parts heating of this laser, utilize this heat to make the bonding coat of described adhesive tape at least one state in becoming softening, fusing, bubble and decomposing that the bonding force that this bonding coat produces is declined, described first component and described second component are separated.
2. the isolation of components method of utilizing laser according to claim 1, is characterized in that:
Form the non-permeation parts of laser by printing.
3. the isolation of components method of utilizing laser according to claim 1, is characterized in that:
The non-permeation parts of laser forms by making laser see through at least 5% pigmentary resin.
4. the isolation of components method of utilizing laser according to claim 1, is characterized in that:
The non-permeation parts of laser is formed by metal or metal oxide.
5. according to the isolation of components method of utilizing laser described in any one in claim 1 to 4, it is characterized in that:
Exert all one's strength along the directive effect that described first component is separated with described second component on the bonding coat of described adhesive tape, and under this state to the non-permeation parts irradiating laser of laser.
6. according to the isolation of components method of utilizing laser described in any one in claim 1 to 5, it is characterized in that:
To irradiating twice above laser with a part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012081230 | 2012-03-30 | ||
| JP2012-081230 | 2012-03-30 | ||
| PCT/JP2012/006283 WO2013145036A1 (en) | 2012-03-30 | 2012-10-01 | Method for separating member using laser light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104204122A true CN104204122A (en) | 2014-12-10 |
Family
ID=49258406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280071785.0A Pending CN104204122A (en) | 2012-03-30 | 2012-10-01 | Method for separating member using laser light |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6009540B2 (en) |
| KR (1) | KR20140142704A (en) |
| CN (1) | CN104204122A (en) |
| TW (1) | TWI464027B (en) |
| WO (1) | WO2013145036A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105964512A (en) * | 2016-04-26 | 2016-09-28 | 乐视控股（北京）有限公司 | Method for reworking touch control panel |
| CN106475680A (en) * | 2016-12-09 | 2017-03-08 | 深圳市吉祥云科技有限公司 | A kind of method that OCA optical cement in interlayer is disassembled using laser |
| CN109087932A (en) * | 2018-06-26 | 2018-12-25 | 武汉华星光电半导体显示技术有限公司 | The stripping means and display panel of flexible base board |
| CN114458667A (en) * | 2022-01-29 | 2022-05-10 | 苏州富润泽激光科技有限公司 | Workpiece bonding method and electronic product thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6352645B2 (en) * | 2014-02-13 | 2018-07-04 | 浜松ホトニクス株式会社 | Laser processing apparatus and laser processing method |
| FR3094905B1 (en) * | 2019-04-12 | 2022-11-11 | Psa Automobiles Sa | PART MARKING PROCESS TO GUIDE MATERIAL DEPOSIT DURING AN ASSEMBLY PROCESS |
| JP2023049529A (en) * | 2021-09-29 | 2023-04-10 | 日東電工株式会社 | Pressure sensitive adhesive sheet for temporarily fixing electronic component and electronic component processing method |
| JP2023049530A (en) * | 2021-09-29 | 2023-04-10 | 日東電工株式会社 | Pressure sensitive adhesive sheet for temporarily fixing electronic component and electronic component processing method |
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- 2012-10-01 JP JP2014507023A patent/JP6009540B2/en active Active
- 2012-10-01 WO PCT/JP2012/006283 patent/WO2013145036A1/en active Application Filing
- 2012-10-01 KR KR1020147025862A patent/KR20140142704A/en not_active Application Discontinuation
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105964512A (en) * | 2016-04-26 | 2016-09-28 | 乐视控股（北京）有限公司 | Method for reworking touch control panel |
| CN106475680A (en) * | 2016-12-09 | 2017-03-08 | 深圳市吉祥云科技有限公司 | A kind of method that OCA optical cement in interlayer is disassembled using laser |
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| CN109087932A (en) * | 2018-06-26 | 2018-12-25 | 武汉华星光电半导体显示技术有限公司 | The stripping means and display panel of flexible base board |
| CN114458667A (en) * | 2022-01-29 | 2022-05-10 | 苏州富润泽激光科技有限公司 | Workpiece bonding method and electronic product thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201338899A (en) | 2013-10-01 |
| JPWO2013145036A1 (en) | 2015-08-03 |
| TWI464027B (en) | 2014-12-11 |
| JP6009540B2 (en) | 2016-10-19 |
| KR20140142704A (en) | 2014-12-12 |
| WO2013145036A1 (en) | 2013-10-03 |
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Application publication date: 20141210 |