CN104202923A - Circuit board plugging system with pushing device with detachable vacuum sucker head - Google Patents
Circuit board plugging system with pushing device with detachable vacuum sucker head Download PDFInfo
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- CN104202923A CN104202923A CN201410467558.0A CN201410467558A CN104202923A CN 104202923 A CN104202923 A CN 104202923A CN 201410467558 A CN201410467558 A CN 201410467558A CN 104202923 A CN104202923 A CN 104202923A
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Abstract
Disclosed is a circuit board plugging system with a pushing device (5) with a detachable vacuum sucker head. The system is characterized by comprising a circuit board device (9), a circuit board socket device (8) and the pushing device (5), the pushing device is used for pushing the circuit board device (9) to be plugged into the circuit board socket device (8) and comprises the vacuum sucker head, a pushing arm (53) and a vacuum supply pipe, the end face of the vacuum sucker head is circular, a flexible sealing ring (51) is adhered to the end face of the vacuum sucker head, seal can be allowed to be retained under the condition that the vacuum sucker head moves relative to the joint surface of the circuit board device (9), and the pushing arm (53) which is tubular is matched with a threaded protrusion on one side, back to the sealing ring (51), of the vacuum sucker head through an internal thread so as to enable the vacuum sucker head of the pushing device (5) to be detachable.
Description
Technical field
The application relates to field of circuit boards, is specially a kind of circuit board connector system.
Background technology
Circuit board is indispensable components and parts in large automatic equipment.The component movement that circuit board is main equipment provides to be controlled and monitoring, conventionally and between equipment communicates by a large amount of intensive contact pins.
Because circuit board belongs to easy infringement element in the running of equipment.Unstable, wherein components and parts the single property of voltage is damaged, the corrosion of running environment etc. all likely causes circuit board normally not move.
In the time that circuit board breaks down, equipment has conventionally corresponding to the warning of this circuit board signal that reports an error.Operator can plug to change to this circuit board.
Because the contact pin of circuit board is numerous, therefore in plug process, waste time and energy, and easily cause the damage to circuit board or PCB socket.
And the function that circuit board entirety often realizes is more, the component number of single circuit board and the scale of construction are also larger.For other circuit board of technical grade, it is often had relatively high expectations for reliability and stability, and therefore the production cost of circuit board entirety is very high.In the time that certain components and parts or certain chip break down, need to change whole circuit board, so often cause the huge wasting of resources of circuit board.Even if carry out circuit board repair, also to relate to the anelasticity wasting of resources of high maintenance cost and whole circuit board.
Become multiple circuit boards and circuit board is split, can cause again the scattered complexity of equipment overall structure, have adverse effect for integrated level and the structural design of whole equipment, and reliability reduction, and be not easy to safeguard.
Summary of the invention
The invention provides a kind of circuit board inserting mode, it can be plugged on multiple electronic circuit plate combinations in the slot of equipment, and can tolerate largely the error in each electronic circuit plate group termination process, and it is correctly inserted in slot the most at last.
According to aspects of the present invention, a kind of circuit board connector system with the ejector apparatus that can dismantle vacuum cup head, it is characterized in that, comprise circuit board arrangement, PCB socket device and described ejector apparatus, described ejector apparatus is inserted into described PCB socket device for circuit board arrangement described in ejection, described ejector apparatus comprises vacuum cup head, ejector arm and vacuum feed pipe, the end face of described vacuum cup head is circular, on it, be attached with sealing ring, described sealing ring has flexibility, can in the case of being subjected to displacement with respect to the composition surface of described circuit board arrangement, the described vacuum cup head of permission keep sealing, described ejector arm is tubulose, by internal thread with coordinate back to the screw thread protuberance in described sealing ring one side at described vacuum cup head, thereby the vacuum cup head of described ejector apparatus can be dismantled, described vacuum feed pipe is through described ejector arm inner side, described circuit board arrangement comprises first circuit board component in a longitudinal direction from top to bottom successively, second circuit board component, intermediate connector, tertiary circuit plank part and the 4th circuit board component, wherein, the upper left-hand of first circuit board component is provided with the first thin alignment pin laterally extending left, lower end can be connected with the upper end of second circuit board component detachable, the left surface of first circuit board component is provided with the pin groups of laterally extending left below the described first thin alignment pin, the development length left of described pin groups is less than the development length left of the described first thin alignment pin,
The upper left-hand of second circuit board component is provided with the second thin alignment pin laterally extending left, lower end can be connected with the upper end of intermediate connector detachable, the left surface of second circuit board component is provided with the pin groups of laterally extending left below the described second thin alignment pin, and the development length left of described pin groups is less than the development length left of the described second thin alignment pin;
The left side central portion of intermediate connector is provided with the middle coarse positioning pin extending left,
The lower left side of tertiary circuit plank part is provided with the 3rd thin alignment pin laterally extending left, upper end can be connected with the lower end of intermediate connector detachable, the left surface of tertiary circuit plank part is provided with the pin groups of laterally extending left above the described the 3rd thin alignment pin, and the development length left of described pin groups is less than the development length left of the described the 3rd thin alignment pin;
The lower left side of the 4th circuit board component is provided with the 4th thin alignment pin laterally extending left, upper end can be connected with the lower end of tertiary circuit plank part detachable, the left surface of the 4th circuit board component is provided with the pin groups of laterally extending left above the described the 4th thin alignment pin, and the development length left of described pin groups is less than the development length left of the described the 4th thin alignment pin;
Described first, second, third and the pin groups of the 4th circuit board component equal in length, and described first, second, third is all identical with outer profile size and the shape of the 4th thin alignment pin;
On described PCB socket device, be disposed with from top to bottom in a longitudinal direction the first thin location hole, the second thin location hole, middle coarse positioning hole, the 3rd thin location hole and the 4th thin location hole, be respectively used to coordinate with the described first thin alignment pin, the second thin alignment pin, coarse positioning pin, the 3rd thin alignment pin and the 4th thin alignment pin, wherein
Middle coarse positioning hole comprises the first round platform portion, the second round platform portion and cylindrical portion in a lateral direction from right to left successively, wherein, the smaller diameter end of the first round platform portion is connected with the larger diameter end of the second round platform portion, make thus described in the middle of coarse positioning hole entirety be the shape of convergent from right to left
In the middle of described, coarse positioning pin comprises circular arc top, round platform body and cylinder part in a lateral direction from left to right successively, the smaller diameter end of described circular arc top and described round platform body is tangent on bus, and the larger diameter end of described round platform body is connected with described cylinder part;
Described the first round platform portion is for contacting with the circular arc top of described middle coarse positioning pin, with to described circuit board arrangement coarse positioning, described the second round platform portion is identical with described round platform body bus inclined degree, and for coordinating with described round platform body, coordinates insertion process to carry out thickness alignment pin; The diameter of described cylindrical portion is identical with described cylinder part, and described cylindrical portion is for coordinating with described cylinder part, described circuit board arrangement is carried out to final location, middle part;
Shape and the size of the described first thin location hole, the second thin location hole, the 3rd thin location hole and the 4th thin location hole are all identical, comprise successively in the horizontal from right to left the first thin round platform hole, the second thin round platform hole and thin cylindrical hole, wherein, the smaller diameter end in the first thin round platform hole is connected with the larger diameter end in the second thin round platform hole, make thus described thin location hole entirety for the shape of convergent from right to left
Described thin alignment pin comprises arc end part, round platform position and cylinder position in a lateral direction from left to right successively, the smaller diameter end at described arc end part and described round platform position is tangent on bus, and the larger diameter end at described round platform position is connected with described cylinder position;
The described first thin round platform hole is for contacting with the arc end part of described thin alignment pin, coordinate insertion process to carry out above-mentioned thickness alignment pin, the described second thin round platform hole is identical with described round platform position bus inclined degree, and for coordinating with described round platform position, to carry out coordinating insertion process between thin alignment pin; The diameter of described thin cylindrical hole is identical with described cylinder position, and described thin cylindrical hole is for coordinating with described cylinder position, described circuit board arrangement is carried out to final full spots localization;
In the middle of described, the length of coarse positioning pin is greater than the length of described thin alignment pin, and the length of described thin alignment pin is greater than the length of described pin groups, makes thus:
When described the first round platform portion start with described in the middle of the circular arc top of coarse positioning pin contact when to described circuit board arrangement coarse positioning, described thin alignment pin does not contact described circuit board arrangement, in the time that described the second round platform portion starts to coordinate to carry out thickness alignment pin coordination insertion process with described round platform body, described coarse positioning finishes, and the arc end part of described thin alignment pin is positioned to all positions in contacting with the thin round platform of first of respective fine location hole hole by described coarse positioning;
During described thickness alignment pin is coordinated insertion process, in the middle of described, the described round platform body of coarse positioning pin and the interaction energy in the interaction of described the second round platform portion in middle coarse positioning hole and the described second thin round platform hole of the above-mentioned round platform position of described thin alignment pin and respective fine location hole synchronously drive described circuit board arrangement compatible deformation, thereby the cylindrical portion potential energy of described thin alignment pin and the thin cylindrical hole of respective fine location hole are coordinated, thereby described circuit board arrangement is carried out to final full spots localization;
After described full spots localization, described pin groups starts to coordinate with corresponding pin holes, thereby the grafting of circuit board arrangement is finally completed.
In this way, due to circuit board is divided into multiple circuit board components according to function, then by mechanical structure interface, each component is combined, because each component can produce larger site error in manufacture process in assembling group termination process, the present invention is by carrying out the jack of socket unique reception design, by coordinating with the alignment pin being arranged on circuit board, and the process of cooperation is divided into multiple stages, the for example coarse positioning stage, thickness alignment pin is coordinated positioning stage and thin alignment pin positioning stage, and it is abundant by the strain reasonable distribution of the various piece of circuit board before contact pin inserts, thereby make contact pin can insert smoothly slot, avoid a part of contact pin can insert slot and another part contact pin can not insert the situation of slot, this mode can be tolerated to greatest extent and manufactures and group connects error, and be convenient to mechanical automation and realize the grafting of circuit board.By at described thickness alignment pin joint coordination position fixing process, contact and make the distortion of circuit board there is sufficient buffering by inclined-plane, and, in the round platform section of coarse positioning pin and coarse positioning hole, between corresponding round platform section, there is gap, can carry out the adjustment within the scope of certain degree of freedom at the thin alignment pin of the first round platform bore edges part for circular arc top in thin alignment pin, it is more stressedly entered in location hole well, increase thereby make it adjust degree of freedom; And make thin alignment pin lead circuit board to carry out dilatation, make full use of elasticity and the telescopicing performance of circuit board matrix trace itself, foozle is assigned to lentamente, equably to each section of circuit board, avoid certain section of circuit board be out of shape excessive and cause circuit board damage, can ensure that again circuit board can correctly insert and at utmost allow to manufacture and group connects error.
Embodiment
Fig. 1 is the structural representation of circuit board arrangement at a coarse positioning embodiment at first.
Fig. 2 is that coarse positioning finishes and starts thickness alignment pin and coordinate the schematic diagram of an embodiment that the circuit board of position fixing process is pegged graft.
Fig. 3 is that thickness alignment pin is coordinated position fixing process and finished and start the structural representation of a kind of situation example of carrying out full spots localization.
Fig. 4 is the enlarged drawing of the I part in Fig. 1.
Fig. 5 is the enlarged drawing of the II part in Fig. 1.
Fig. 6 is the enlarged drawing of the upper part of Fig. 2.
Fig. 7 is the enlarged drawing of the upper part of Fig. 3.
Fig. 8 and 9 is integrally-built schematic diagrames of circuit board arrangement of the present invention.
Figure 10 is the structural representation of ejector apparatus.
Embodiment
Below in conjunction with Fig. 1-10, the present invention is described in detail for the embodiment by instantiation.
A kind of circuit board connector system with the ejector apparatus 5 that can dismantle vacuum cup head, it is characterized in that, comprise circuit board arrangement 9, PCB socket device 8 and described ejector apparatus 5, described ejector apparatus is inserted into described PCB socket device 8 for circuit board arrangement 9 described in ejection, described ejector apparatus 5 comprises vacuum cup head, ejector arm 53 and vacuum feed pipe, the end face of described vacuum cup head is circular, on it, be attached with sealing ring 51, described sealing ring 51 has flexibility, can in the case of being subjected to displacement with respect to the composition surface of described circuit board arrangement 9, the described vacuum cup head of permission keep sealing, described ejector arm 53 is tubulose, by internal thread with coordinate back to the screw thread protuberance in described sealing ring 51 1 sides at described vacuum cup head, thereby the vacuum cup head of described ejector apparatus 5 can be dismantled, described vacuum feed pipe is through described ejector arm 53 inner sides, described circuit board arrangement 9 comprises first circuit board component 91 in a longitudinal direction from top to bottom successively, second circuit board component 92, intermediate connector 90, tertiary circuit plank part 93 and the 4th circuit board component 94, wherein, the upper left-hand of first circuit board component 91 is provided with the first thin alignment pin 19 laterally extending left, lower end can be connected with the upper end of second circuit board component 92 detachable, the left surface of first circuit board component 91 is provided with the pin groups of laterally extending left below the described first thin alignment pin 19, the development length left of described pin groups is less than the development length left of the described first thin alignment pin 19,
The upper left-hand of second circuit board component 92 is provided with the second thin alignment pin 29 laterally extending left, lower end can be connected with the upper end of intermediate connector 90 detachable, the left surface of second circuit board component 92 is provided with the pin groups of laterally extending left below the described second thin alignment pin 29, and the development length left of described pin groups is less than the development length left of the described second thin alignment pin 29;
The left side central portion of intermediate connector 90 is provided with the middle coarse positioning pin 10 extending left,
The lower left side of tertiary circuit plank part 93 is provided with the 3rd thin alignment pin 39 laterally extending left, upper end can be connected with the lower end of intermediate connector 90 detachable, the left surface of tertiary circuit plank part 93 is provided with the pin groups of laterally extending left above the described the 3rd thin alignment pin 39, and the development length left of described pin groups is less than the development length left of the described the 3rd thin alignment pin 39;
The lower left side of the 4th circuit board component 94 is provided with the 4th thin alignment pin 49 laterally extending left, upper end can be connected with the lower end of tertiary circuit plank part 93 detachable, the left surface of the 4th circuit board component 94 is provided with the pin groups of laterally extending left above the described the 4th thin alignment pin 49, and the development length left of described pin groups is less than the development length left of the described the 4th thin alignment pin 49;
Described first, second, third and the pin groups of the 4th circuit board component 91,92,93,94 equal in length, and described first, second, third is all identical with outer profile size and the shape of the 4th thin alignment pin 19,29,39,49;
On described PCB socket device 8, be disposed with from top to bottom in a longitudinal direction the first thin location hole 18, the second thin location hole 28, middle coarse positioning hole 80, the 3rd thin location hole 38 and the 4th thin location hole 48, be respectively used to coordinate with the described first thin alignment pin 19, the second thin alignment pin 29, coarse positioning pin 10, the 3rd thin alignment pin 39 and the 4th thin alignment pin 49, wherein
Middle coarse positioning hole 80 comprises the first round platform portion 801, the second round platform portion 802 and cylindrical portion 803 in a lateral direction from right to left successively, wherein, the smaller diameter end of the first round platform portion 801 is connected with the larger diameter end of the second round platform portion, make thus described in the middle of coarse positioning hole 80 entirety be the shape of convergent from right to left
In the middle of described, coarse positioning pin 10 comprises circular arc top 901, round platform body 902 and cylinder part 903 in a lateral direction from left to right successively, described circular arc top 901 is tangent on bus with the smaller diameter end of described round platform body 902, and the larger diameter end of described round platform body 902 is connected with described cylinder part 903;
Described the first round platform portion 801 is for contacting with the circular arc top 901 of described middle coarse positioning pin 10, with to described circuit board arrangement 9 coarse positionings, described the second round platform portion 802 is identical with described round platform body 902 bus inclined degrees, and for coordinating with described round platform body 902, coordinate insertion process to carry out thickness alignment pin; The diameter of described cylindrical portion 803 is identical with described cylinder part 903, and described cylindrical portion 803 is for coordinating with described cylinder part 903, described circuit board arrangement 9 is carried out to final location, middle part;
Shape and the size of the described first thin location hole 18, the second thin location hole 28, the 3rd thin location hole 38 and the 4th thin location hole 48 are all identical, comprise successively in the horizontal from right to left the first thin round platform hole 181, the second thin round platform hole 182 and thin cylindrical hole 183, wherein, the smaller diameter end in the first thin round platform hole 181 is connected with the larger diameter end in the second thin round platform hole, make thus described thin location hole 18,28,38,48 entirety for the shape of convergent from right to left
Described thin alignment pin 19,29,39,49 comprises arc end part 191, round platform position 192 and cylinder position 193 in a lateral direction from left to right successively, described arc end part 191 is tangent on bus with the smaller diameter end at described round platform position 192, and the larger diameter end at described round platform position 192 is connected with described cylinder position 193;
The described first thin round platform hole 181 is for contacting with the arc end part 191 of described thin alignment pin 19,29,39,49, coordinate insertion process to carry out above-mentioned thickness alignment pin, the described second thin round platform hole 182 is identical with described round platform position 192 bus inclined degrees, and for coordinating with described round platform position 192, to carry out coordinating insertion process between thin alignment pin; The diameter of described thin cylindrical hole 183 is identical with described cylinder position 193, and described thin cylindrical hole 183 is for coordinating with described cylinder position 193, so that described circuit board arrangement 9 is carried out to final full spots localization;
In the middle of described, the length of coarse positioning pin 10 is greater than the length of described thin alignment pin 19,29,39,49, and the length of described thin alignment pin 19,29,39,49 is greater than the length of described pin groups, makes thus:
When described the first round platform portion 801 starts to contact with the circular arc top 901 of described centre coarse positioning pin 10 when to described circuit board arrangement 9 coarse positioning, described thin alignment pin 19, 29, 39, 49 do not contact described circuit board arrangement 9, in the time that described the second round platform portion 802 starts to coordinate to carry out thickness alignment pin coordination insertion process with described round platform body 902, described coarse positioning finishes, and described coarse positioning is by described thin alignment pin 19, 29, 39, 49 arc end part 191 be positioned to all in can with respective fine location hole 18, 28, 38, the position that the first thin round platform hole 181 of 48 contacts,
During described thickness alignment pin is coordinated insertion process, the described round platform body 902 of coarse positioning pin 10 and interaction and the described thin alignment pin 19 of the described second round platform portion 802 in middle coarse positioning hole 80 in the middle of described, 29, 39, 49 above-mentioned round platform position 192 and respective fine location hole 18, 28, 38, the interaction energy in the described second thin round platform hole 182 of 48 synchronously drives described circuit board arrangement 9 compatible deformations, thereby make described thin alignment pin 19, 29, 39, 49 cylinder position 193 can with respective fine location hole 18, 28, 38, 48 thin cylindrical hole 183 coordinates, thereby described circuit board arrangement 9 is carried out to final full spots localization,
After described full spots localization, described pin groups starts to coordinate with corresponding pin holes, thereby the grafting of circuit board arrangement 9 is finally completed.
As used herein term, the meaning of location, middle part refers to that the middle part of whole circuit board arrangement completes location, middle part completes location; Other alignment pins that full spots localization refers to, for example thin alignment pin, has also completed location, and the location of these alignment pins spreads all over the upper and lower of whole circuit board arrangement, is therefore a kind of full spots localization.
To it is pointed out that the size in accompanying drawing is only to represent qualitatively the principle that the present invention moves, to carry out exaggerating and limiting case is in use shown on yardstick in order showing clear, therefore needn't explain the present invention with the concrete dimensioning in accompanying drawing.The above embodiments are only to exemplified of the present invention, but not restriction to protection scope of the present invention.Protection scope of the present invention is only defined by the claims.
Claims (1)
1. one kind has the circuit board connector system of the ejector apparatus (5) that can dismantle vacuum cup head, it is characterized in that, comprise circuit board arrangement (9), PCB socket device (8) and described ejector apparatus (5), described ejector apparatus is inserted into described PCB socket device (8) for circuit board arrangement (9) described in ejection, described ejector apparatus (5) comprises vacuum cup head, ejector arm (53) and vacuum feed pipe, the end face of described vacuum cup head is circular, on it, be attached with sealing ring (51), described sealing ring (51) has flexibility, can in the case of being subjected to displacement with respect to the composition surface of described circuit board arrangement (9), the described vacuum cup head of permission keep sealing, described ejector arm (53) is tubulose, by internal thread with coordinate back to the screw thread protuberance in described sealing ring (51) one sides at described vacuum cup head, thereby the vacuum cup head of described ejector apparatus (5) can be dismantled, described vacuum feed pipe is through described ejector arm (53) inner side, described circuit board arrangement (9) comprises first circuit board component (91) in a longitudinal direction from top to bottom successively, second circuit board component (92), intermediate connector (90), tertiary circuit plank part (93) and the 4th circuit board component (94), wherein, the upper left-hand of first circuit board component (91) is provided with the first thin alignment pin (19) laterally extending left, lower end can be connected with the upper end of second circuit board component (92) detachable, the left surface of first circuit board component (91) is provided with the pin groups of laterally extending left in the below of the described first thin alignment pin (19), the development length left of described pin groups is less than the development length left of the described first thin alignment pin (19),
The upper left-hand of second circuit board component (92) is provided with the second thin alignment pin (29) laterally extending left, lower end can be connected with the upper end of intermediate connector (90) detachable, the left surface of second circuit board component (92) is provided with the pin groups of laterally extending left in the below of the described second thin alignment pin (29), the development length left of described pin groups is less than the development length left of the described second thin alignment pin (29);
The left side central portion of intermediate connector (90) is provided with the middle coarse positioning pin (10) extending left,
The lower left side of tertiary circuit plank part (93) is provided with the 3rd thin alignment pin (39) laterally extending left, upper end can be connected with the lower end of intermediate connector (90) detachable, the left surface of tertiary circuit plank part (93) is provided with the pin groups of laterally extending left in the top of the described the 3rd thin alignment pin (39), the development length left of described pin groups is less than the development length left of the described the 3rd thin alignment pin (39);
The lower left side of the 4th circuit board component (94) is provided with the 4th thin alignment pin (49) laterally extending left, upper end can be connected with the lower end of tertiary circuit plank part (93) detachable, the left surface of the 4th circuit board component (94) is provided with the pin groups of laterally extending left in the top of the described the 4th thin alignment pin (49), the development length left of described pin groups is less than the development length left of the described the 4th thin alignment pin (49);
Described first, second, third and the pin groups of the 4th circuit board component (91,92,93,94) equal in length, and described first, second, third is all identical with outer profile size and the shape of the 4th thin alignment pin (19,29,39,49);
On described PCB socket device (8), be disposed with from top to bottom in a longitudinal direction the first thin location hole (18), the second thin location hole (28), middle coarse positioning hole (80), the 3rd thin location hole (38) and the 4th thin location hole (48), be respectively used to coordinate with the described first thin alignment pin (19), the second thin alignment pin (29), coarse positioning pin (10), the 3rd thin alignment pin (39) and the 4th thin alignment pin (49), wherein
Middle coarse positioning hole (80) comprises the first round platform portion (801), the second round platform portion (802) and cylindrical portion (803) in a lateral direction from right to left successively, wherein, the smaller diameter end of the first round platform portion (801) is connected with the larger diameter end of the second round platform portion, make thus described in the middle of coarse positioning hole (80) entirety be the shape of convergent from right to left
In the middle of described, coarse positioning pin (10) comprises circular arc top (901), round platform body (902) and cylinder part (903) in a lateral direction from left to right successively, described circular arc top (901) is tangent on bus with the smaller diameter end of described round platform body (902), and the larger diameter end of described round platform body (902) is connected with described cylinder part (903);
Described the first round platform portion (801) is for contacting with the circular arc top (901) of described middle coarse positioning pin (10), with to described circuit board arrangement (9) coarse positioning, described the second round platform portion (802) is identical with described round platform body (902) bus inclined degree, and for coordinating with described round platform body (902), coordinate insertion process to carry out thickness alignment pin; The diameter of described cylindrical portion (803) is identical with described cylinder part (903), and described cylindrical portion (803) is for coordinating with described cylinder part (903), described circuit board arrangement (9) is carried out to final location, middle part;
Shape and the size of the described first thin location hole (18), the second thin location hole (28), the 3rd thin location hole (38) and the 4th thin location hole (48) are all identical, comprise successively in the horizontal from right to left the first thin round platform hole (181), the second thin round platform hole (182) and thin cylindrical hole (183), wherein, the smaller diameter end in the first thin round platform hole (181) is connected with the larger diameter end in the second thin round platform hole, make thus described thin location hole (18,28,38,48) entirety for the shape of convergent from right to left
Described thin alignment pin (19,29,39,49) comprises arc end part (191), round platform position (192) and cylinder position (193) in a lateral direction from left to right successively, described arc end part (191) is tangent on bus with the smaller diameter end at described round platform position (192), and the larger diameter end at described round platform position (192) is connected with described cylinder position (193);
The described first thin round platform hole (181) is for contacting with the arc end part (191) of described thin alignment pin (19,29,39,49), coordinate insertion process to carry out above-mentioned thickness alignment pin, the described second thin round platform hole (182) is identical with described round platform position (192) bus inclined degree, and for coordinating with described round platform position (192), to carry out coordinating insertion process between thin alignment pin; The diameter of described thin cylindrical hole (183) is identical with described cylinder position (193), and described thin cylindrical hole (183) is for coordinating with described cylinder position (193), so that described circuit board arrangement (9) is carried out to final full spots localization;
In the middle of described, the length of coarse positioning pin (10) is greater than the length of described thin alignment pin (19,29,39,49), and the length of described thin alignment pin (19,29,39,49) is greater than the length of described pin groups, makes thus:
When described the first round platform portion (801) starts to contact with the circular arc top (901) of described centre coarse positioning pin (10) when to described circuit board arrangement (9) coarse positioning, described thin alignment pin (19, 29, 39, 49) do not contact described circuit board arrangement (9), in the time that described the second round platform portion (802) starts to coordinate to carry out thickness alignment pin coordination insertion process with described round platform body (902), described coarse positioning finishes, and described coarse positioning is by described thin alignment pin (19, 29, 39, 49) arc end part (191) be positioned to all in can with respective fine location hole (18, 28, 38, 48) position of the first thin round platform hole (181) contact,
During described thickness alignment pin is coordinated insertion process, interaction and the described thin alignment pin (19 of the described round platform body (902) of coarse positioning pin (10) and the described second round platform portion (802) in middle coarse positioning hole (80) in the middle of described, 29, 39, 49) above-mentioned round platform position (192) and respective fine location hole (18, 28, 38, 48) interaction energy in the described second thin round platform hole (182) synchronously drives described circuit board arrangement (9) compatible deformation, thereby make described thin alignment pin (19, 29, 39, 49) cylinder position (193) can with respective fine location hole (18, 28, 38, 48) thin cylindrical hole (183) coordinates, thereby described circuit board arrangement (9) is carried out to final full spots localization,
After described full spots localization, described pin groups starts to coordinate with corresponding pin holes, thereby the grafting of circuit board arrangement (9) is finally completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410467558.0A CN104202923B (en) | 2014-09-15 | 2014-09-15 | There is the circuit board connector system of the ejector apparatus dismantling vacuum cup head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410467558.0A CN104202923B (en) | 2014-09-15 | 2014-09-15 | There is the circuit board connector system of the ejector apparatus dismantling vacuum cup head |
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| Publication Number | Publication Date |
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| CN104202923A true CN104202923A (en) | 2014-12-10 |
| CN104202923B CN104202923B (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410467558.0A Active CN104202923B (en) | 2014-09-15 | 2014-09-15 | There is the circuit board connector system of the ejector apparatus dismantling vacuum cup head |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108598839A (en) * | 2018-03-07 | 2018-09-28 | 华域汽车系统股份有限公司 | A kind of board to board connector mounting tool and method |
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| JP2000165034A (en) * | 1998-11-26 | 2000-06-16 | Asahi Optical Co Ltd | Flexible printed wiring board and its connecting method |
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| CN201000986Y (en) * | 2006-07-07 | 2008-01-02 | 中国科学院长春光学精密机械与物理研究所 | Switching connector for multitime plug for common hard disk |
| CN201417837Y (en) * | 2009-06-22 | 2010-03-03 | 乔讯电子(上海)有限公司 | Card edge connector |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598839A (en) * | 2018-03-07 | 2018-09-28 | 华域汽车系统股份有限公司 | A kind of board to board connector mounting tool and method |
| CN108598839B (en) * | 2018-03-07 | 2019-09-24 | 华域汽车系统股份有限公司 | A kind of board to board connector mounting tool and method |
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| CN104202923B (en) | 2015-11-25 |
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