CN104201251A - Solar cell packaging method - Google Patents
Solar cell packaging method Download PDFInfo
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- CN104201251A CN104201251A CN201410479865.0A CN201410479865A CN104201251A CN 104201251 A CN104201251 A CN 104201251A CN 201410479865 A CN201410479865 A CN 201410479865A CN 104201251 A CN104201251 A CN 104201251A
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- solar cell
- epoxy resin
- graphene
- modified epoxy
- packing
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 title abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 59
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 57
- 239000003822 epoxy resin Substances 0.000 claims abstract description 48
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 48
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 9
- 239000002131 composite material Substances 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 238000011049 filling Methods 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 25
- 238000012856 packing Methods 0.000 claims description 17
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- 239000004593 Epoxy Substances 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 11
- -1 aliphatic cyclic amine Chemical class 0.000 claims description 8
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 6
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 6
- 229920002620 polyvinyl fluoride Polymers 0.000 claims description 6
- 150000008065 acid anhydrides Chemical class 0.000 claims description 4
- 238000013019 agitation Methods 0.000 claims description 4
- 150000008064 anhydrides Chemical class 0.000 claims description 4
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 2
- 229910002804 graphite Inorganic materials 0.000 claims description 2
- 239000010439 graphite Substances 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 2
- 150000003512 tertiary amines Chemical class 0.000 claims description 2
- 238000002156 mixing Methods 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 abstract description 2
- 239000001301 oxygen Substances 0.000 abstract description 2
- 229910052760 oxygen Inorganic materials 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention relates to a solar cell, in particular to a solar cell packaging method which has efficient water-oxygen isolation capacity and can effectively protect the solar cell so as to remarkably prolong service life of the solar cell. The method includes: adding graphene into epoxy resin, and dispersing the graphene in the epoxy resin to obtain graphene modified epoxy resin; adding a curing agent into the graphene modified epoxy resin for blending to obtain a curable graphene modified epoxy resin composite, if the area of a solar cell device is less than or equal to 2.5cm*2.5cm, adopting an adhesive dropping process; if the area of the solar cell device is more than 2.5cm*2.5cm, taking photovoltaic ultra-clear glass as an upper layer and a photovoltaic back plate as a lower layer, filling a gap between the upper layer and the lower layer with the curable graphene modified epoxy resin composite to enable the solar cell to be wrapped; curing the curable graphene modified epoxy resin composite to complete packaging of the solar cell.
Description
Technical field
The present invention relates to solar cell, especially relate to a kind of method for packing of solar cell.
Background technology
Existing solar cell mainly relies on heat zone compression technology or vacuum pouring technique to encapsulate.
Heat zone compression technology be mainly glued membrane (as EVA) by hot setting as bonding agent, the material of glass or other high protectiveness and solar battery chip are bonded as one.This kind of mode complex technical process, and need the environment such as high-temperature vacuum, production cost costliness, is generally used for large-scale production.
Dripping adhesive process is mainly to adopt glue (multiplex epoxy resin glue) to drip the form of glue, solar cell is wrapped up, to reach the requirement intercepting with extraneous air ambient.But due to the physical characteristic restriction of glue, sealing is not good, adopt this kind of product trend short-time characteristic that technique is packaged, cannot reach the object of long-time effectively protection solar cell, be therefore used for the device test in laboratory.
Chinese patent CN103595340A discloses the method for packing of a kind of solar cell frame and solar cell.Solar cell frame comprises: housing, and housing is monolithic construction, housing comprises backstop frame; And inside casing, inside casing is monolithic construction, inside casing fixed cover is located in housing, and forms with the inwall of backstop frame the encapsulated space that encapsulates solar panel.The encapsulated space that housing and inside casing form can pack solar cell into, and all-in-one-piece housing and inside casing have improved the structural stability of the package assembling of solar cell frame, makes the package assembling of solar cell frame more durable in use.
Chinese patent CN102637769A discloses a kind of method for packing of silicon-based film solar cells, described silicon-based film solar cells is made up of the hermetically-sealed construction in the encapsulating structure between header board cell piece, backboard and described header board cell piece and described backboard and encapsulating structure outside, comprises the following steps: described encapsulating structure is cut; Described encapsulating structure after cutting is configured on described header board cell piece; By coating system, along the edge of described encapsulating structure, the strip hermetically-sealed construction of thawing is coated on described header board cell piece; Described backboard is configured on the silicon-based film solar cells assembly after gluing; Use two-chamber two step laminating methods to complete the encapsulation of described silicon-based film solar cells.
Chinese patent CN101894687A discloses a kind of method for packing of DSSC, by by encapsulating material presintering on photocathode conducting glass substrate, light anode conducting glass substrate is docked with photocathode conducting glass substrate, then adopt irradiation bomb (as laser, infrared light) to add hot encapsulation material, make its fusing that two glass substrates are sealed to dissolve and under the condition of laser, carry out sealing-in; A kind of transition metal that reduces fusing point has at least adulterated in described encapsulating material, also doping reduces the filler of thermal coefficient of expansion, thereby in the time having irradiation bomb to irradiate, encapsulating material is softening forms strip of paper used for sealing and bonding upper lower glass substrate, avoid High-temperature Packaging to decompose sensitizing dyestuff, ensured good air-tightness and good mechanical strength simultaneously.
Chinese patent CN1770481 discloses a kind of method for packing of large area light weight solar battery, comprises the following steps: the solar cell silicon wafer that (1) will encapsulate is connected in series or in parallel in a row; (2) be stacked according to following order from top to bottom: EVA, solar cell, EVA, PVF film, FR-4 epoxy glass fiber substrate; (3), after lamination 5~10min, laminating temperature is 100 DEG C; (4) at 140~160 DEG C, carry out 5~10min constant temperature solidify.
Summary of the invention
For the deficiencies in the prior art, the object of the present invention is to provide and there is High-efficient Water oxygen isolation capacity, can effectively protect solar cell, thereby significantly improve the method for packing of a kind of solar cell of solar battery life.
The present invention includes following steps:
1) Graphene is added in epoxy resin, Graphene is disperseed in epoxy resin, obtain Graphene modified epoxy;
2) curing agent is joined to blend in Graphene modified epoxy, obtain curable Graphene modified epoxy resin composition;
3) if the area≤2.5cm × 2.5cm of solar cell device adopts and drips adhesive process; If the area > 2.5cm × 2.5cm of solar cell device, using photovoltaic ultra-clear glasses as upper strata, photovoltaic back is as lower floor, and in the gap between the upper and lower, the curable Graphene modified epoxy resin composition of filling, is wrapped solar cell;
4) curable Graphene modified epoxy resin composition is solidified, complete the encapsulation of solar cell.
In step 1) in, described Graphene can adopt ultrasonic the peeling off of native graphite to prepare or obtain by redox graphene; The diameter of Graphene can be 0.3~10 μ m, and thickness can be 0.4~20nm; The addition of described Graphene can be 0.5%~2% of epoxy resin by mass percentage; Described epoxy resin can adopt commercially available prod, and epoxy resin can be selected from bisphenol A type epoxy resin or bisphenol f type epoxy resin etc.; Described dispersion can disperse by mechanical agitation, and the described churned mechanically duration can be 10min~5h, preferably 30min~3h.
In step 2) in, described curing agent can adopt commercially available prod, curing agent can be selected from fatty amine, aliphatic cyclic amine, aromatic amine, polyamide, acid anhydrides, resinae, one in tertiary amine etc., preferred aliphatic series and cyclic aliphatic, or aromatic polycarboxylic acid acid anhydride, curing agent is phthalic anhydride preferably, tetrabydrophthalic anhydride (THPA), hexahydrophthalic anhydride (HHPA), methyl hydrogen phthalic anhydride, methyl tetrahydrophthalic anhydride (MTHPA), methylhexahydrophthalic anhydride (MHHPA), at least one in methyl carbic anhydride (MNA) etc.,
The epoxy resin of Graphene modification can be selected different ratios according to the length of required curing time from the blend ratio of curing agent; Described blend can be in blend under vacuum condition, and described vacuum condition can be and is less than 100mbar, is preferably less than 50mbar; The time of described blend can be 10min~24h, preferably 1~3h.
In step 3) in, the concrete grammar of described adhesive process can be: use curable Graphene modified epoxy resin composition to cover solar cell light accepting part position, make it evenly, closely be wrapped solar cell; The thickness of curable Graphene modified epoxy resin composition can be 0.1~10mm; Described photovoltaic back can adopt the polymer such as polyphenyl dioctyl phthalate glycol ester (PET) or polyvinyl fluoride composite membrane (TPT), preferably polyvinyl fluoride composite membrane (TPT).
In step 4) in, described solidifying can adopt hot curing mode, and the condition of hot curing is according to the kind of selected curing agent and blend ratio and difference, and curing temperature can be 70~120 DEG C, and the curing time can be 1~15h.
The present invention adopts the additive of Graphene as epoxy resin, to increase the epoxy resin barrier of environmental air, moisture to external world, improves sealing property.Graphene is a kind of densification, firm, stable two-dimensional material, is also the thinnest in known materials.Graphene uniform is dispersed in glue, can fills the hole in glue, improve sealing and the barrier of glue.Adopt the epoxy resin of doped graphene to carry out solar cell package, can well sealed solar energy battery chip, intercept air and moisture in external environment, reach the object that promotes solar battery life and stability.
Compared with the conventional method, the present invention has the following advantages:
The present invention has avoided the defect of two kinds of conventional package methods simultaneously, and simple process, with low cost, good seal performance, without relying on high-temperature vacuum, just can complete preparation under home.No matter adopt solar cell of the present invention to have very long lifetime, be that large-area solar module or small-sized solar cell device are all very applicable.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
Embodiment 1: the encapsulation of the perovskite solar cell device that is 2cm × 2cm to area
Concrete steps are as follows:
1) by diameter be 0.3~5 μ m, thickness is that the Graphene of 10~20nm adds in bisphenol A type epoxy resin, the mass ratio of Graphene and bisphenol A type epoxy resin is (1~2): 100, make Graphene dispersed in epoxy resin by the mechanical agitation of 2h, obtain Graphene modified epoxy;
2) curing agent phthalic anhydride is joined in Graphene modified epoxy, the mass ratio of phthalic anhydride and Graphene modified epoxy is 1: (1~2), mechanical blending 2h under the vacuum condition of 50mbar, obtains curable Graphene modified epoxy resin composition;
3) adopt and drip adhesive process: use curable Graphene modified epoxy resin composition to cover solar cell light accepting part position, make it evenly, closely be wrapped solar cell, the THICKNESS CONTROL of curable Graphene modified epoxy resin composition is at 0.1~10mm.
4) at 90 DEG C, make curable Graphene modified epoxy resin composition solidify, be 10h curing time.
Packaging effect is as follows:
At AM 1.5G, 100mW cm
-2simulated solar irradiation under, test through encapsulation after perovskite solar cell electricity conversion over time, result is as shown in table 1, can find out that, after 45 days, the efficiency of perovskite solar cell is substantially constant, illustrate encapsulate effect fine.
The photoelectric conversion efficiency of the perovskite solar cell of table 1 after encapsulation over time
Embodiment 2: the encapsulation of the perovskite solar cell device that is 10cm × 10cm to area
1) by diameter be 0.3~5 μ m, thickness is that the Graphene of 0.3~10nm adds in bisphenol A type epoxy resin, the mass ratio of Graphene and bisphenol A type epoxy resin is (0.5~1): 100, make Graphene dispersed in epoxy resin by the mechanical agitation of 3h, obtain Graphene modified epoxy;
2) curing agent tetrabydrophthalic anhydride (THPA) is joined in Graphene modified epoxy, tetrabydrophthalic anhydride (THPA) is 1 with the mass ratio of Graphene modified epoxy: (1~2), mechanical blending 3h under the vacuum condition of 30mbar, obtains curable Graphene modified epoxy resin composition;
3) using photovoltaic ultra-clear glasses as upper strata, polyvinyl fluoride composite membrane (TPT) is as lower floor, and the curable Graphene modified epoxy resin composition of filling in the gap between the upper and lower makes solar cell evenly, be closely wrapped.
4) at 80 DEG C, make curable Graphene modified epoxy resin composition solidify, be 8h curing time.
Packaging effect is as follows:
At AM 1.5G, 100mW cm
-2simulated solar irradiation under, test through encapsulation after perovskite solar cell electricity conversion over time, result is as shown in table 2.
The photoelectric conversion efficiency of table 2 perovskite solar cell after encapsulation over time
As can be seen from Table 2, after 45 days, the efficiency of perovskite solar cell is substantially constant, illustrates that the effect of encapsulation is fine.
Claims (10)
1. a method for packing for solar cell, is characterized in that comprising the following steps:
1) Graphene is added in epoxy resin, Graphene is disperseed in epoxy resin, obtain Graphene modified epoxy;
2) curing agent is joined to blend in Graphene modified epoxy, obtain curable Graphene modified epoxy resin composition;
3) if the area≤2.5cm × 2.5cm of solar cell device adopts and drips adhesive process; If the area > 2.5cm × 2.5cm of solar cell device, using photovoltaic ultra-clear glasses as upper strata, photovoltaic back is as lower floor, and in the gap between the upper and lower, the curable Graphene modified epoxy resin composition of filling, is wrapped solar cell;
4) curable Graphene modified epoxy resin composition is solidified, complete the encapsulation of solar cell.
2. a kind of method for packing of solar cell as claimed in claim 1, is characterized in that in step 1) in, described Graphene adopts ultrasonic the peeling off of native graphite to prepare or obtain by redox graphene.
3. a kind of method for packing of solar cell as claimed in claim 1, is characterized in that in step 1) in, the diameter of described Graphene is 0.3~10 μ m, thickness is 0.4~20nm; The addition of described Graphene can be 0.5%~2% of epoxy resin by mass percentage.
4. a kind of method for packing of solar cell as claimed in claim 1, is characterized in that in step 1) in, described epoxy resin is selected from bisphenol A type epoxy resin or bisphenol f type epoxy resin.
5. a kind of method for packing of solar cell as claimed in claim 1, is characterized in that in step 1) in, described dispersion disperses by mechanical agitation, and the described churned mechanically duration is 10min~5h, preferably 30min~3h.
6. a kind of method for packing of solar cell as claimed in claim 1, it is characterized in that in step 2) in, described curing agent is selected from the one in fatty amine, aliphatic cyclic amine, aromatic amine, polyamide, acid anhydrides, resinae, tertiary amine, preferred aliphatic series and cyclic aliphatic, or aromatic polycarboxylic acid acid anhydride.
7. a kind of method for packing of solar cell as claimed in claim 1, it is characterized in that in step 2) in, curing agent is selected from least one in phthalic anhydride, tetrabydrophthalic anhydride, hexahydrophthalic anhydride, methyl hydrogen phthalic anhydride, methyl tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyl carbic anhydride.
8. a kind of method for packing of solar cell as claimed in claim 1, is characterized in that in step 2) in, described blend is blend under vacuum condition, described vacuum condition, for being less than 100mbar, is preferably less than 50mbar; The time of described blend is 10min~24h, preferably 1~3h.
9. a kind of method for packing of solar cell as claimed in claim 1, it is characterized in that in step 3) in, the concrete grammar of described adhesive process is: use curable Graphene modified epoxy resin composition to cover solar cell light accepting part position, make it evenly, closely be wrapped solar cell; The thickness of curable Graphene modified epoxy resin composition can be 0.1~10mm; Described photovoltaic back can adopt polyphenyl dioctyl phthalate glycol ester or polyvinyl fluoride composite membrane, preferably polyvinyl fluoride composite membrane.
10. a kind of method for packing of solar cell as claimed in claim 1, is characterized in that in step 4) in, described curing employing hot curing mode, curing temperature is 70~120 DEG C, the curing time is 1~15h.
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106159009A (en) * | 2015-03-26 | 2016-11-23 | 汉能新材料科技有限公司 | A kind of flexible package composite membrane and manufacture method thereof |
CN110416415A (en) * | 2019-08-07 | 2019-11-05 | 陕西科技大学 | A kind of method for packaging photoelectric device |
CN111557128A (en) * | 2017-12-27 | 2020-08-18 | 3M创新有限公司 | Cured epoxy resin compositions, articles, and methods suitable for electronic device housings |
CN112373165A (en) * | 2020-11-30 | 2021-02-19 | 芜湖航天特种电缆厂股份有限公司 | Self-rolling type braided sleeve for aerospace and preparation method thereof |
CN112687828A (en) * | 2020-12-28 | 2021-04-20 | 华东师范大学 | Perovskite solar cell packaging method |
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US20120048332A1 (en) * | 2010-08-26 | 2012-03-01 | Hitachi Chemical Company, Ltd. | Adhesive film for solar cell electrode and method for manufacturing solar cell module using the same |
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