CN104198500A - Integrated circuit pin detection method and device - Google Patents
Integrated circuit pin detection method and device Download PDFInfo
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- CN104198500A CN104198500A CN201410241005.3A CN201410241005A CN104198500A CN 104198500 A CN104198500 A CN 104198500A CN 201410241005 A CN201410241005 A CN 201410241005A CN 104198500 A CN104198500 A CN 104198500A
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Abstract
The invention discloses an integrated circuit pin detection method and a device. The method includes steps as follows: loading an appearance image of an integrated circuit to be detected, labeling pin parts in the image as areas to be detected, scanning the most peripheral pixel of each pin image in the areas to be detected, labeling each pin image with a rectangle as a pin frame to be verified, and judging the pin frames to be verified, wherein if a condition 1, a condition 2 and a condition 3 are satisfied simultaneously, the pin frames to be verified pass verification successfully. The beneficial effects of the method and the device are that: image optimization processing allows the pin images and images of other parts to be obviously distinguished; the number of the areas to be detected is determined, corresponding threads are called, and scanning is performed simultaneously, thus increasing the working efficiency; and whether pins are abnormal or not is determined by setting the three conditions, an inclined pin can be detected, and a turn-up pin can also be detected, thus guaranteeing comprehensiveness of detection.
Description
Technical field
The present invention relates to integrated circuit detection field, be specifically related to a kind of stitch detection method and device of integrated circuit.
Background technology
Along with the demand of electronic equipment constantly increases, when producing integrated circuit fast, the yields of integrated circuit also must be controlled, abnormal if the stitch of integrated circuit exists, and will directly cause product can not use or affect the life-span.In the production run of integrated circuit, may cause the crooked of stitch or upwarp because of some external factors, traditional detection means is by appearance detecting instrument, integrated circuit to be taken pictures and generated plane picture, by the integrated circuit picture with standard, contrast again, have plenty of by artificial visually examine and contrast, labour is large, and inefficiency, easily occurs careless omission; Also have the target stitch feature of extracting picture by equipment, recycling software is analyzed contrast, but while making in this way, if had while generating photo extremely, while extracting target stitch, precision is low, causes comparing result deviation large.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of the present invention is to provide a kind of stitch detection method and device of integrated circuit, by treating, detect the appearance images of integrated circuit and carry out a series of pictures processing, system is analyzed contrast to the image of stitch part comprehensively again, has guaranteed the larger accuracy of comparing result.
For addressing the above problem, the technical solution adopted in the present invention is as follows:
A stitch detection method for integrated circuit, is characterized in that, comprises the following steps:
Steps A: be written into the appearance images of integrated circuit to be detected, and the stitch in this appearance images of mark is partly region to be detected;
Step F: scan the outermost pixel of each stitch image in region to be detected, and carried out frame choosing and be labeled as stitch frame to be verified with a rectangle;
Step G: judge for stitch frame to be verified, if satisfy condition simultaneously 1, condition 2 and condition 3, this stitch frame to be verified successfully passes through checking, otherwise this stitch frame to be verified is abnormal, condition 1 and condition 2 are for judging whether stitch has oblique pin abnormal, and condition 3 is for judging whether stitch has the pin of sticking up abnormal;
Wherein, condition 1 is: the distance of adjacent two stitch frames to be detected is less than or equal to the first default distance value; Condition 2 is: in each stitch frame to be detected, the slope of lines is less than or equal to default slope value; Condition 3 is: choose the stitch frame to be verified that is positioned at same row two ends, the outermost that connects respectively two stitch frames to be verified with a straight line, the outermost of stitch to be verified and the distance of this straight line between these two stitch to be verified are less than or equal to default second distance value.
Between steps A and step F, also comprise for appearance images being optimized to the step of processing,
Step B: this appearance images is made to image binary conversion treatment, stitch image and other parts image in this appearance images are distinguished with different colours;
Step C: carry out corrosion treatment for this appearance images, to eliminate the noise in appearance images;
Step D: carry out expansion process for this appearance images, making each the stitch image expansion in region to be detected is bulk.
Between steps A and step F, also comprise for further improving the step of detection efficiency:
Step e: judge the quantity in region to be detected, call multithreading and scan each region to be detected simultaneously if quantity is greater than 1, call single-threaded scanning region to be detected if quantity is 1.
Further, in the condition 1 of step G, choose respectively two cornerwise joinings in each stitch frame to be verified, calculate the distance of the joining in adjacent two stitch frames to be detected, if the distance of adjacent two joinings is less than or equal to the first default distance value, the 1 also judgement of entry condition 2 satisfies condition;
In condition 2, choose respectively the lines on the length direction of adjacent two stitch frames to be detected and calculate respectively the slope of these lines, if slope is all less than or equal to default slope value, 2 also definite these adjacent two the represented stitch of stitch frame to be detected that satisfy condition all do not have oblique pin.
In condition 1, if the distance of adjacent two joinings is greater than the first default distance value, carry out as judge: the size of adjacent two stitch frames to be verified is contrasted with the size of default standard stitch frame respectively, if the size of a certain stitch frame to be verified is greater than default sizes values, this stitch frame to be verified is that oblique pin is abnormal.
The present invention also comprises that another program is:
A pick-up unit for integrated circuit stitch, comprises with lower module:
Modules A: for being written into the appearance images of integrated circuit to be detected, and the stitch in this appearance images of mark is partly region to be detected;
Module F: for scanning the outermost pixel of each stitch image of region to be detected, and carried out frame choosing and be labeled as stitch frame to be verified with a rectangle;
Module G: for judging for stitch frame to be verified, if satisfy condition simultaneously 1, condition 2 and condition 3, this stitch frame to be verified successfully passes through checking, otherwise this stitch frame to be verified is abnormal, condition 1 and condition 2 are for judging whether stitch has oblique pin abnormal, and condition 3 is for judging whether stitch has the pin of sticking up abnormal;
Wherein, condition 1 is: the distance of adjacent two stitch frames to be detected is less than or equal to the first default distance value; Condition 2 is: in each stitch frame to be detected, the slope of lines is less than or equal to default slope value; Condition 3 is: choose the stitch frame to be verified that is positioned at same row two ends, the outermost that connects respectively two stitch frames to be verified with a straight line, the outermost of stitch to be verified and the distance of this straight line between these two stitch to be verified are less than or equal to default second distance value.
Between modules A and module F, also comprise for appearance images being optimized to the module of processing,
Module B: for this appearance images is made to image binary conversion treatment, stitch image and other parts image in this appearance images are distinguished with different colours;
Module C: for carrying out corrosion treatment for this appearance images, to eliminate the noise in appearance images;
Module D: for carrying out expansion process for this appearance images, making each the stitch image expansion in region to be detected is bulk.
Between modules A and module F, also comprise for further improving the module of detection efficiency:
Module E: judge the quantity in region to be detected, call multithreading and scan each region to be detected simultaneously if quantity is greater than 1, call single-threaded scanning region to be detected if quantity is 1.
Further, in the condition 1 of module G, choose respectively two cornerwise joinings in each stitch frame to be verified, calculate the distance of the joining in adjacent two stitch frames to be detected, if the distance of adjacent two joinings is less than or equal to the first default distance value, the 1 also judgement of entry condition 2 satisfies condition;
In condition 2, choose respectively the lines on the length direction of adjacent two stitch frames to be detected and calculate respectively the slope of these lines, if slope is all less than or equal to default slope value, 2 also definite these adjacent two the represented stitch of stitch frame to be detected that satisfy condition all do not have oblique pin.
In condition 1, if the distance of adjacent two joinings is greater than the first default distance value, carry out as judge: the size of adjacent two stitch frames to be verified is contrasted with the size of default standard stitch frame respectively, if the size of a certain stitch frame to be verified is greater than default sizes values, this stitch frame to be verified is that oblique pin is abnormal.
Compared to existing technology, beneficial effect of the present invention is: by the stitch part in the appearance images of selected integrated circuit to be detected, can dwindle sweep limit, improve detection efficiency; Image is optimized to processing, stitch image and other parts of images can obviously be distinguished; By judge that the quantity in region to be detected calls corresponding thread and scan simultaneously, further improved work efficiency; Whether by three conditions stitch that is severe in judgment is set, exist extremely, both can detect oblique pin, clubfoot, also can detect and stick up pin, what guaranteed to detect is comprehensive.
embodiment
Embodiment 1:
A stitch detection method for integrated circuit, utilizes appearance detecting instrument to take pictures to integrated circuit to be detected, comprises the following steps:
Steps A: the appearance images that is written into the integrated circuit to be detected being generated by appearance detecting instrument, because the structure with a integrated circuit is fixed, can preset fixing frame with frame needle selecting foot part, therefore for the appearance images of this kind of integrated circuit, can be by identifying artificially frame needle selecting foot part, can also be by being written into default fixing frame, thereby frame selects the stitch part in this appearance images and is labeled as region to be detected accordingly, the scope that region to be detected can dwindle scanning is set, improves detection efficiency.
Step B: this appearance images is made to image binary conversion treatment, and the stitch image after processing is white, and other parts are black.
Step C: carry out corrosion treatment for this appearance images, to eliminate the white noise of stitch part in appearance images, stitch image and other parts of images can obviously be distinguished.
Step D: carry out expansion process for this appearance images, make each stitch image be expanded to bulk, make the profile of stitch image more clear.
Above-mentioned steps B, step C and step D are image optimization and process, and the precision that stitch image after treatment makes it to extract in rear step characteristic processing is higher.The related parameter of corrosion treatment and expansion process requires to have different settings according to the integrated circuit of different moneys.
Step e: judge the quantity in region to be detected, call multithreading and scan each region to be detected simultaneously if quantity is greater than 1, call single-threaded scanning region to be detected if quantity is 1; In an integrated circuit, may have several stitch region, for example, common structure is the four row's stitch that distributing on its four direction round chip part, this structure has four regions to be detected, now will call 4 threads and respectively scan process be carried out in four regions simultaneously, thereby can save a large amount of time, significantly improve efficiency.
Step F: scan the outermost pixel of each stitch image in region to be detected, and carried out frame choosing and be labeled as stitch frame to be verified with a rectangle.Concrete mode is, determine the pixel of the outermost of a stitch image, the outermost vegetarian refreshments of the same side is connected with straight line, utilize which to determine four straight lines and guarantee four rectilinear(-al) one rectangles, this rectangle is the maximum rectangle that frame is lived stitch image, and every straight line is all cut in the outermost pixel of this stitch image.
Step G: judge for stitch frame to be verified, deterministic process is provided with condition 1, condition 2 and condition 3, condition 1 and condition 2 be for judging whether stitch has oblique pin abnormal, and the judgement of condition 2 is to carry out satisfying condition after 1 again, and condition 3 is for judging whether stitch has the pin of sticking up abnormal.
Wherein, condition 1 is: choose respectively two cornerwise joinings in each stitch frame to be verified, point centered by this joining, calculate the distance of the central point in adjacent two stitch frames to be detected, if the distance of adjacent two central points is less than or equal to the first default distance value, the 1 also judgement of entry condition 2 satisfies condition.The effect of condition 1 is set: if very serious oblique pin appears in certain stitch, there is situation about contacting with adjacent stitches, in stitch image, will there will be two stitch to intersect is communicated with, two crossing stitch can be identified as a stitch so, rectangle frame in step F can select two stitch by frame, the distance of the central point of its central point and adjacent stitches must be greater than the first default distance value, can judge that in two stitch, must have one or two is all that oblique pin is abnormal.
If the distance of adjacent two joinings is greater than the first default distance value in condition 1, carry out as follows for determining that adjacent two which stitch of stitch are the abnormal judgements of oblique pin: the size of these adjacent two stitch frames to be verified is contrasted with the size of default standard stitch frame respectively, if the size of a certain stitch frame to be verified is greater than default sizes values, determine that this stitch frame to be verified is that oblique pin is abnormal and send oblique pin abnormality warnings.
Condition 2 is: the lines of choosing respectively on adjacent two stitch frames to be detected also calculate respectively the slope of these lines, if slope is all less than or equal to default slope value, 2 also definite these adjacent two the represented stitch of stitch frame to be detected that satisfy condition all do not have oblique pin, if be greater than default slope value, determine that this stitch frame to be verified is oblique pin and sends oblique pin abnormality warnings.Above-mentioned slope calculates wherein lines or many lines that can only calculate in stitch frame to be detected and calculates, depending on different accuracy requirements, the slope that calculates four lines is the most stable, the most accurate mode, if this stitch is that oblique pin is abnormal, the slope of these lines must be greater than the lines slope of standard.
Condition 3 is: choose the stitch frame to be verified that is positioned at same row two ends, the outermost that connects respectively two stitch frames to be verified with a straight line, outermost refer to chip contact jaw away from the other end, if the outermost of stitch to be verified and the distance of this straight line between these two stitch to be verified are less than or equal to default second distance value, 3 also definite these stitch to be verified that satisfy condition do not stick up pin, if be greater than default second distance value, determine that this stitch frame to be verified sticks up pin abnormality warnings for sticking up pin and sending.The effect of condition 3 is set: if a certain stitch is abnormal for sticking up pin, this stitch is expressed as shorter than standard stitch image on image, therefore utilize the straight line of two ends connection farthest as datum line, as long as wherein certain stitch is abnormal for sticking up pin, its distance a bit and between datum line that approaches datum line most also can be greater than default second distance value.
If satisfy condition simultaneously 1, condition 2 and condition 3, this stitch successfully passes through checking, otherwise is that stitch is abnormal.
Embodiment 2:
Based on embodiment 1, remove step B, step C and step D, also can realize this scheme, but not pass through picture optimization process, precision can be lower.
Embodiment 3:
Based on embodiment 1, remove step e, also can implement this scheme, only with single-threaded, go to one by one to scan region to be detected, efficiency can be lower.
Embodiment 4:
A pick-up unit for integrated circuit stitch, comprises with lower module:
Modules A: for being written into the appearance images of integrated circuit to be detected, and the stitch in this appearance images of mark is partly region to be detected.
Module B: for this appearance images is made to image binary conversion treatment, stitch image and other parts image in this appearance images are distinguished with different colours.
Module C: for carrying out corrosion treatment for this appearance images, to eliminate the noise in appearance images.
Module D: for carrying out expansion process for this appearance images, making each the stitch image expansion in region to be detected is bulk.
Module E: for judging the quantity in region to be detected, call multithreading and scan each region to be detected simultaneously if quantity is greater than 1, call single-threaded scanning region to be detected if quantity is 1.
Module F: for scanning the outermost pixel of each stitch image of region to be detected, and carried out frame choosing and be labeled as stitch frame to be verified with a rectangle.
Module G: for judging for stitch frame to be verified, if satisfy condition simultaneously 1, condition 2 and condition 3, this stitch frame to be verified successfully passes through checking, otherwise this stitch frame to be verified is abnormal, condition 1 and condition 2 are for judging whether stitch has oblique pin abnormal, and condition 3 is for judging whether stitch has the pin of sticking up abnormal;
Wherein, condition 1 is: the distance of adjacent two stitch frames to be detected is less than or equal to the first default distance value; Condition 2 is: in each stitch frame to be detected, the slope of lines is less than or equal to default slope value; Condition 3 is: choose the stitch frame to be verified that is positioned at same row two ends, the outermost that connects respectively two stitch frames to be verified with a straight line, the outermost of stitch to be verified and the distance of this straight line between these two stitch to be verified are less than or equal to default second distance value.
Further, in the condition 1 of module G, choose respectively two cornerwise joinings in each stitch frame to be verified, calculate the distance of the joining in adjacent two stitch frames to be detected, if the distance of adjacent two joinings is less than or equal to the first default distance value, the 1 also judgement of entry condition 2 satisfies condition;
In condition 2, choose respectively the lines on the length direction of adjacent two stitch frames to be detected and calculate respectively the slope of these lines, if slope is all less than or equal to default slope value, 2 also definite these adjacent two the represented stitch of stitch frame to be detected that satisfy condition all do not have oblique pin.
In condition 1, if the distance of adjacent two joinings is greater than the first default distance value, carry out as judge: the size of adjacent two stitch frames to be verified is contrasted with the size of default standard stitch frame respectively, if the size of a certain stitch frame to be verified is greater than default sizes values, this stitch frame to be verified is that oblique pin is abnormal.
To one skilled in the art, can make other various corresponding changes and deformation according to technical scheme described above and design, and within these all changes and deformation all should belong to the protection domain of the claims in the present invention.
Claims (10)
1. a stitch detection method for integrated circuit, is characterized in that, comprises the following steps:
Steps A: be written into the appearance images of integrated circuit to be detected, and the stitch in this appearance images of mark is partly region to be detected;
Step F: scan the outermost pixel of each stitch image in region to be detected, and carried out frame choosing and be labeled as stitch frame to be verified with a rectangle;
Step G: judge for stitch frame to be verified, if satisfy condition simultaneously 1, condition 2 and condition 3, this stitch frame to be verified successfully passes through checking, otherwise this stitch frame to be verified is abnormal, condition 1 and condition 2 are for judging whether stitch has oblique pin abnormal, and condition 3 is for judging whether stitch has the pin of sticking up abnormal;
Wherein, condition 1 is: the distance of adjacent two stitch frames to be detected is less than or equal to the first default distance value; Condition 2 is: in each stitch frame to be detected, the slope of lines is less than or equal to default slope value; Condition 3 is: choose the stitch frame to be verified that is positioned at same row two ends, the outermost that connects respectively two stitch frames to be verified with a straight line, the outermost of stitch to be verified and the distance of this straight line between these two stitch to be verified are less than or equal to default second distance value.
2. the stitch detection method of integrated circuit according to claim 1, is characterized in that, between steps A and step F, also comprise for appearance images being optimized to the step of processing,
Step B: this appearance images is made to image binary conversion treatment, stitch image and other parts image in this appearance images are distinguished with different colours;
Step C: carry out corrosion treatment for this appearance images, to eliminate the noise in appearance images;
Step D: carry out expansion process for this appearance images, making each the stitch image expansion in region to be detected is bulk.
3. the stitch detection method of integrated circuit according to claim 1, is characterized in that, also comprises for further improving the step of detection efficiency between steps A and step F:
Step e: judge the quantity in region to be detected, call multithreading and scan each region to be detected simultaneously if quantity is greater than 1, call single-threaded scanning region to be detected if quantity is 1.
4. the stitch detection method of integrated circuit according to claim 1, it is characterized in that, in the condition 1 of step G, choose respectively two cornerwise joinings in each stitch frame to be verified, calculate the distance of the joining in adjacent two stitch frames to be detected, if the distance of adjacent two joinings is less than or equal to the first default distance value, the 1 also judgement of entry condition 2 satisfies condition;
In condition 2, the lines of choosing respectively on adjacent two stitch frames to be detected also calculate respectively the slope of these lines, if slope is all less than or equal to default slope value, 2 also definite these adjacent two the represented stitch of stitch frame to be detected that satisfy condition all do not have oblique pin.
5. the stitch detection method of integrated circuit according to claim 4, it is characterized in that, in condition 1, if the distance of adjacent two joinings is greater than the first default distance value, carry out as judge: the size of adjacent two stitch frames to be verified is contrasted with the size of default standard stitch frame respectively, if the size of a certain stitch frame to be verified is greater than default sizes values, this stitch frame to be verified is that oblique pin is abnormal.
6. a pick-up unit for integrated circuit stitch, is characterized in that, comprises with lower module:
Modules A: for being written into the appearance images of integrated circuit to be detected, and the stitch in this appearance images of mark is partly region to be detected;
Module F: for scanning the outermost pixel of each stitch image of region to be detected, and carried out frame choosing and be labeled as stitch frame to be verified with a rectangle;
Module G: for judging for stitch frame to be verified, if satisfy condition simultaneously 1, condition 2 and condition 3, this stitch frame to be verified successfully passes through checking, otherwise this stitch frame to be verified is abnormal, condition 1 and condition 2 are for judging whether stitch has oblique pin abnormal, and condition 3 is for judging whether stitch has the pin of sticking up abnormal;
Wherein, condition 1 is: the distance of adjacent two stitch frames to be detected is less than or equal to the first default distance value; Condition 2 is: in each stitch frame to be detected, the slope of lines is less than or equal to default slope value; Condition 3 is: choose the stitch frame to be verified that is positioned at same row two ends, the outermost that connects respectively two stitch frames to be verified with a straight line, the outermost of stitch to be verified and the distance of this straight line between these two stitch to be verified are less than or equal to default second distance value.
7. the stitch pick-up unit of integrated circuit according to claim 6, is characterized in that, between modules A and module F, also comprise for appearance images being optimized to the module of processing,
Module B: for this appearance images is made to image binary conversion treatment, stitch image and other parts image in this appearance images are distinguished with different colours;
Module C: for carrying out corrosion treatment for this appearance images, to eliminate the noise in appearance images;
Module D: for carrying out expansion process for this appearance images, making each the stitch image expansion in region to be detected is bulk.
8. the stitch pick-up unit of integrated circuit according to claim 6, is characterized in that, also comprises for further improving the module of detection efficiency between modules A and module F:
Module E: judge the quantity in region to be detected, call multithreading and scan each region to be detected simultaneously if quantity is greater than 1, call single-threaded scanning region to be detected if quantity is 1.
9. the stitch pick-up unit of integrated circuit according to claim 6, it is characterized in that, in the condition 1 of module G, choose respectively two cornerwise joinings in each stitch frame to be verified, calculate the distance of the joining in adjacent two stitch frames to be detected, if the distance of adjacent two joinings is less than or equal to the first default distance value, the 1 also judgement of entry condition 2 satisfies condition;
In condition 2, choose respectively the lines on the length direction of adjacent two stitch frames to be detected and calculate respectively the slope of these lines, if slope is all less than or equal to default slope value, 2 also definite these adjacent two the represented stitch of stitch frame to be detected that satisfy condition all do not have oblique pin.
10. the stitch pick-up unit of integrated circuit according to claim 9, it is characterized in that, in condition 1, if the distance of adjacent two joinings is greater than the first default distance value, carry out as judge: the size of adjacent two stitch frames to be verified is contrasted with the size of default standard stitch frame respectively, if the size of a certain stitch frame to be verified is greater than default sizes values, this stitch frame to be verified is that oblique pin is abnormal.
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