CN104190711A - Production technology for pure copper plate - Google Patents
Production technology for pure copper plate Download PDFInfo
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- CN104190711A CN104190711A CN201410492666.3A CN201410492666A CN104190711A CN 104190711 A CN104190711 A CN 104190711A CN 201410492666 A CN201410492666 A CN 201410492666A CN 104190711 A CN104190711 A CN 104190711A
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- copper
- production technology
- heating
- rolling
- pickling
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Abstract
The invention discloses a production technology for a pure copper plate. The production technology for the pure copper plate comprises the steps of material preparing, acid cleaning, heating, intermediate rolling, annealing, drying and finish rolling, wherein cleaning treatment is conducted on the surface of copper billet that conforms to the required width; the copper billet is subject to the acid cleaning for a first time; acid cleaned copper billet is placed into a heating furnace for heating; the heating temperature ranges from 800 DEG C to 900 DEG C; heated copper billet is moved to a rolling mill for the intermediate rolling, so as to prepare middle copper plates; the middle copper plates are subject to the annealing; the annealing temperature ranges from 800 DEG C to 850 DEG C; the middle copper plates are subject to the acid cleaning for a second time; acid cleaned middle copper plates for the second time are moved to a rolling mill for the finish rolling, so as to prepare the finished copper plates. The production technology for the pure copper plate effectively improves the hot-rolling efficiency and quality of the copper plates, and overcomes surface defects of the copper plates and the lateral bending of the copper belts.
Description
Technical field
The present invention relates to a kind of the copperplate rolling method.
Background technology
Copper plate/strip production is at present mainly to carry out in slab hot-rolling cogging mode.But along with the development of industrial technology, quality and required precision to copper coin material are more and more higher, and traditional milling method can not meet the requirement of high-quality copper coin.Major defect is as follows, due to copper base rapid heat dissipation, causes the roll-force inequality of copper base in the operation of rolling, and then causes the blemish of copper plate/strip or the lateral bending of copper plate/strip.
Summary of the invention
In order to overcome the deficiencies in the prior art, the object of this invention is to provide a kind of fine copper board production technology.This technique has effectively improved efficiency and the quality of copper coin hot rolling, has overcome the blemish of copper plate/strip and the lateral bending of copper plate/strip.
Object of the present invention is achieved through the following technical solutions:
A kind of fine copper board production technology, is characterized in that this technique comprises the steps:
1) get the raw materials ready: cleaning is carried out on the copper base surface to the width that meets the requirements;
2) copper base is carried out to pickling for the first time;
3) the copper base after pickling is put into heating furnace and heat, heating-up temperature is at 800～900C °;
4) in, roll: in carrying out on the copper base immigration milling train after heating, roll copper coin in the middle of making;
5) middle copper coin is annealed, annealing temperature 800-850 C °;
6) middle copper coin is carried out to pickling for the second time; Dry;
7) finish rolling: the middle copper coin after pickling is for the second time moved on milling train and carries out finish rolling, make finished product copper coin.
In step 3) of the present invention, heating-up temperature is at 900C °.In step 5), annealing temperature is at 850 C °.
The invention has the beneficial effects as follows: adopt twice rolling, twice pickling, be rolled, effectively improved efficiency and the quality of copper coin hot rolling, overcome the blemish of copper plate/strip and the lateral bending of copper plate/strip.
Detailed description of the invention
Embodiment 1
A kind of fine copper board production technology, this technique comprises the steps:
Get the raw materials ready: cleaning is carried out on the copper base surface to the width that meets the requirements;
Copper base is carried out to pickling for the first time;
Copper base after pickling is put into heating furnace and heat, heating-up temperature is at 900C °;
In roll: the copper base after heating is moved in carrying out on milling train and is rolled, copper coin in the middle of making;
Middle copper coin is annealed, annealing temperature 850 C °;
Middle copper coin is carried out to pickling for the second time; Dry;
Finish rolling: the middle copper coin after pickling is for the second time moved on milling train and carries out finish rolling, make finished product copper coin.
Embodiment 2
Another fine copper board production technology, this technique comprises the steps:
Get the raw materials ready: cleaning is carried out on the copper base surface to the width that meets the requirements;
Copper base is carried out to pickling for the first time;
Copper base after pickling is put into heating furnace and heat, heating-up temperature is at 850C °;
In roll: the copper base after heating is moved in carrying out on milling train and is rolled, copper coin in the middle of making;
Middle copper coin is annealed, annealing temperature 800 C °;
Middle copper coin is carried out to pickling for the second time; Dry;
Finish rolling: the middle copper coin after pickling is for the second time moved on milling train and carries out finish rolling, make finished product copper coin.
The present invention adopts twice rolling, twice pickling, is rolled, and has effectively improved efficiency and the quality of copper coin hot rolling, has overcome the blemish of copper plate/strip and the lateral bending of copper plate/strip.
Claims (3)
1. a fine copper board production technology, is characterized in that this technique comprises the steps:
1) get the raw materials ready: cleaning is carried out on the copper base surface to the width that meets the requirements;
2) copper base is carried out to pickling for the first time;
3) the copper base after pickling is put into heating furnace and heat, heating-up temperature is at 800～900C °;
4) in, roll: in carrying out on the copper base immigration milling train after heating, roll copper coin in the middle of making;
5) middle copper coin is annealed, annealing temperature 800-850 C °;
6) middle copper coin is carried out to pickling for the second time; Dry;
7) finish rolling: the middle copper coin after pickling is for the second time moved on milling train and carries out finish rolling, make finished product copper coin.
2. fine copper board production technology according to claim 1, is characterized in that: in step 3), heating-up temperature is at 900C °.
3. fine copper board production technology according to claim 1, is characterized in that: in step 5), annealing temperature is at 850 C °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410492666.3A CN104190711A (en) | 2014-09-24 | 2014-09-24 | Production technology for pure copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410492666.3A CN104190711A (en) | 2014-09-24 | 2014-09-24 | Production technology for pure copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104190711A true CN104190711A (en) | 2014-12-10 |
Family
ID=52076158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410492666.3A Pending CN104190711A (en) | 2014-09-24 | 2014-09-24 | Production technology for pure copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104190711A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088982A (en) * | 2021-04-01 | 2021-07-09 | 江西中晟金属有限公司 | Production method of glossy copper rod |
| CN115569987A (en) * | 2022-09-09 | 2023-01-06 | 舞阳钢铁有限责任公司 | Production method of copper plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101110285A (en) * | 2006-07-20 | 2008-01-23 | 靖江市泰力有色合金实业有限公司 | High-conductivity electronic brass plate manufacturing technique |
| CN102199711A (en) * | 2011-04-15 | 2011-09-28 | 中天合金技术有限公司 | Production method of high-precision ultralong oxygen-free copper strip |
| CN102652182A (en) * | 2009-12-22 | 2012-08-29 | 三菱伸铜株式会社 | Manufacturing method of pure copper plates, and pure copper plate |
| CN103752609A (en) * | 2013-12-13 | 2014-04-30 | 金川集团股份有限公司 | Method for rolling current-conducting copper bar or plate by using hot rolling machine |
-
2014
- 2014-09-24 CN CN201410492666.3A patent/CN104190711A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101110285A (en) * | 2006-07-20 | 2008-01-23 | 靖江市泰力有色合金实业有限公司 | High-conductivity electronic brass plate manufacturing technique |
| CN102652182A (en) * | 2009-12-22 | 2012-08-29 | 三菱伸铜株式会社 | Manufacturing method of pure copper plates, and pure copper plate |
| CN102199711A (en) * | 2011-04-15 | 2011-09-28 | 中天合金技术有限公司 | Production method of high-precision ultralong oxygen-free copper strip |
| CN103752609A (en) * | 2013-12-13 | 2014-04-30 | 金川集团股份有限公司 | Method for rolling current-conducting copper bar or plate by using hot rolling machine |
Non-Patent Citations (2)
| Title |
|---|
| 王碧文: "中国铜加工业的技术装备现状及展望", 《上海有色金属》 * |
| 耿浩然等: "《铸造锌、铜合金》", 24 September 2006 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113088982A (en) * | 2021-04-01 | 2021-07-09 | 江西中晟金属有限公司 | Production method of glossy copper rod |
| CN115569987A (en) * | 2022-09-09 | 2023-01-06 | 舞阳钢铁有限责任公司 | Production method of copper plate |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141210 |