CN104183255B - Flash disk - Google Patents
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- CN104183255B CN104183255B CN201310193846.7A CN201310193846A CN104183255B CN 104183255 B CN104183255 B CN 104183255B CN 201310193846 A CN201310193846 A CN 201310193846A CN 104183255 B CN104183255 B CN 104183255B
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- interface module
- module
- interface
- electrically connected
- flash disk
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Abstract
The present invention provides a kind of flash disk, including memory module, interconnecting module and switching mechanism.Memory module has the memory cell and first interface module being electrically connected to each other.The second interface module that interconnecting module has multi-form but is electrically connected to each other and the 3rd interface module, wherein second interface module are mutually corresponding with first interface module.Switching mechanism is arranged at the first position or the second place of relative memory module, and interconnecting module configuration is in switching mechanism.When switching mechanism is located at first position, the first interface module of memory module and the second interface module of interconnecting module are electrically connected with, and memory cell is electrically connected with the 3rd interface module and main frame.When switching mechanism is located at the second place, memory cell is electrically connected with first interface module and main frame.
Description
Technical field
The invention relates to a kind of flash disk, and in particular to a kind of flash disk with different switching interfaces.
Background technology
With the development of multimedia technology, made numerical digit archives become more and more big.The soft magnetic of traditional 1.44MB
Disk is although easy to carry, but its capacity can not meet current demand.In addition, though the hard disk of traditional magnetic disk structural formula can be provided
The memory space of Large Copacity, but because its volume is larger and caused by user carry inconvenient.In recent years, with universal serial convergence bus
The popularization of (Universal Serial Bus, abbreviation USB) interface and the price reduction of flash memory (Flash Memory), therefore
Have concurrently the flash disk (USB Flash Disk) that capacity is big, compatibility is good, be convenient for carrying be widely used in different computer and
Data transmission between storage device.
Flash disk possesses the characteristic that capacity is big, plug and play, volume are light and handy and is convenient for carrying, thus flash disk may replace it is soft
Dish.Because flash disk is electrical with host computer and storage device by a connection piece (such as USB plug or IEEE1394 plugs)
Connection.
The connector species of existing electronic installation are various, and how to allow flash disk to improve its scope of application is related personnel institute
It need to consider what is solved.
The content of the invention
The present invention provides a kind of flash disk, and it has the distinct interface connector for being available for conversion.
The flash disk of the present invention, including memory module, interconnecting module and switching mechanism.Memory module has electrically to be connected each other
The memory cell connect and first interface module.Second interface module that interconnecting module has multi-form but is electrically connected to each other with
3rd interface module, wherein second interface module are mutually corresponding with first interface module.Switching mechanism is arranged at relative storage mould
The first position or the second place of block, and interconnecting module configuration is in switching mechanism.When switching mechanism is located at first position, the
One interface module is electrically connected with second interface module, memory module is electrically connected with through the 3rd interface and a main frame.When turn
When converting mechanism is located at the second place, the memory module is electrically connected with through the first interface with the main frame.
In one example of the present invention embodiment, above-mentioned first interface module and the 3rd interface module is plug respectively,
Second interface module is socket.
In one example of the present invention embodiment, above-mentioned first interface module is universal serial bus plug or micro- general
Serial bus plug.Second interface module is General serial bus socket or micro- General serial bus socket.3rd interface module
It is micro- universal serial bus plug or universal serial bus plug.
In one example of the present invention embodiment, above-mentioned memory module also has the first noumenon.Memory cell arrangements in
In the first noumenon, first interface module is protruded from outside the first noumenon.
In one example of the present invention embodiment, above-mentioned the first noumenon has a pair of chutes, and switching mechanism includes the
Two bodies and lid.Second body has the lip and a pair of adjutages extended away from each other.This pair of adjutage difference is slidably
Ground is articulated in this pair of chute with the band manual converting mechanism between the first position and the second place.Lid is slideably socketed on
Lip is to cover or expose lip.Lid has opening, and its profile corresponds to the 3rd interface module.When lid is slided towards adjutage
Move to cover during lip, the 3rd interface module protrudes from lid by opening.
In one example of the present invention embodiment, this pair of above-mentioned chute distinguishes a pair of lateral surfaces of the position in the first noumenon
On, and first interface module protrudes from the preceding surface of the first noumenon, and preceding surface contiguous is between this pair of lateral surface.
In one example of the present invention embodiment, above-mentioned switching mechanism for can removal formula, and if switching mechanism be displaced from
During memory module to the second place, first interface module is driven and dissociated（decoupled）In second interface module, so as to deposit
Storage unit is electrically connected with using first interface module as coffret with main frame.
In one example of the present invention embodiment, above-mentioned switching mechanism includes the second body and lid.Second body can
Discretely it is socketed on the first noumenon.Lid is slideably socketed on the second body to cover or expose the second body.Lid has
There is opening, its profile corresponds to the 3rd interface module.When lid is slided to be covered in the second body relative to the second body, the
Three interface modules protrude from lid by opening.
In one example of the present invention embodiment, above-mentioned interconnecting module includes the 3rd body with being connected circuit.3rd
Body has relative first end and the second end.Second interface module is configured at first end, and the 3rd interface module is configured at the second end.
Connection circuit configuration is on the 3rd body and is electrically connected between second interface module and the 3rd interface module.
In one example of the present invention embodiment, above-mentioned the 3rd body have back to first surface and second surface.
Connecting circuit includes configuration in first surface and multiple wires of second surface.
In one example of the present invention embodiment, the number of terminals of above-mentioned second interface module is different from the 3rd interface module
Number of terminals, so that an at least terminal for second interface module is not electrically connected at the 3rd interface module, or makes the 3rd interface module
An at least terminal be not electrically connected at second interface module.
Based on above-mentioned, in the above-mentioned exemplary embodiment of the present invention, flash disk passes through between transformational structure and memory module
State transformation, and make memory module in addition to the first interface module that has using its script is as its coffret, Shang Nengli
It is connected with interconnecting module of the configuration in transformational structure with first interface module, and changes memory module and made with the 3rd interface module
For its coffret.
For the features described above and advantage of the present invention can be become apparent, special embodiment below, and it is detailed to coordinate accompanying drawing to make
Carefully it is described as follows.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram of flash disk according to one example of the present invention embodiment；
Fig. 2 to Fig. 4 shows that Fig. 1 flash disk is converted into the process schematic of another state；
Fig. 5 and Fig. 6 show the schematic diagram of interconnecting module in Fig. 1 flash disk with different visual angles respectively；
Fig. 7 to Fig. 9 shows a kind of flash disk of another exemplary embodiment of the invention in the schematic diagram of State Transferring.
Description of reference numerals：
100、200：Flash disk；
110、210：Memory module；
112、214：The first noumenon；
112a：Chute；
114：Memory cell；
116、212：First interface module；
120、230：Interconnecting module；
122：Second interface module；
124、232：3rd interface module；
126：3rd body；
128：Connect circuit；
130、220：Switching mechanism；
132、222：Second body；
132a：Lip；
132b、132c：Adjutage；
134、224：Lid；
134a、224a：Opening；
D1、D2：Direction；
E1：First end；
E2：Second end；
P1、P3：First position；
P2：The second place；
S1、S2：Side surface；
S3：Preceding surface；
S4：First surface；
S5：Second surface；
T1~T4, M1~M5：Terminal；
W1~W4：Wire.
Embodiment
Fig. 1 is a kind of schematic diagram of flash disk according to one example of the present invention embodiment.Fig. 2 to Fig. 4 shows Fig. 1 flash disk
It is converted into the process schematic of another state.To further appreciate that the corresponding relation of associated components, herein by flash disk internals
It is local with dotted lines.Please also refer to Fig. 1 to Fig. 4, in this exemplary embodiment, flash disk 100 include memory module 110,
Interconnecting module 120 and switching mechanism 130.Memory module 110 can be considered the primary structure of flash disk 100, and it has the first noumenon
112nd, memory cell 114 and first interface module 116, wherein memory cell 114 is, for example, flash memory cell, and it can
Pass through system in package（System In Package, SIP）Technology and it is made with plastic cement, metal, ceramic material or epoxy resin
The encapsulation mode of the system integration is constituted, and by dependent control element, memory element and circuit board（Do not show in this exemplary embodiment
Go out）It is packaged together with these electronic components in protection packaging structure.First interface module 116 is electrically connected with memory cell
114 and protrude from outside the first noumenon 112 so that the memory cell 114 of memory module 110 can using first interface module 116 as
Its coffret, and be connected with other electronic installations.
Furthermore, interconnecting module 120 has form difference but the second interface module 122 and the 3rd being electrically connected with each other each other
Interface module 124, wherein second interface module 122 and the first interface module 116 of memory module 110 are mutually corresponding.This institute
Meaning mutually correspondence refers to two interface modules for it can be mutually butted in structure and electrical relationship.Switching mechanism 130 may move
Ground is assembled in memory module 110, and interconnecting module 120 is configured in switching mechanism 130.Consequently, it is possible to work as 130 groups of switching mechanism
The first position P1 that arrives loaded on memory module 110 and the appropriate angle of rotation（It is illustrated in Fig. 1）When, it just can make first interface module
116 with second interface module 122 is mutually corresponding connects, and memory cell 114 is electrically connected at via second interface module 122
3rd interface module 124, thus memory cell 114 be able to the 3rd interface module 124 as its coffret and with other electronics
The main frame connection of device.On the contrary, when interconnecting module 120 is moved away from the first interface of memory module 110 by switching mechanism 130
Module 116 is to arrive at second place P2（It is illustrated in Fig. 4）When, memory cell 114 is recovered to pass using first interface module 116 as it
Defeated interface.Accordingly, memory module 110 just can have various forms of coffrets by the motion change of switching mechanism 130
（Switch as described above between the interface module 124 of first interface module 116 and the 3rd）.
In this exemplary embodiment, the interface module 124 of first interface module 116 and the 3rd is plug respectively, and second connects
Mouth mold block 122 is then socket.Further say, the first interface module 116 of this exemplary embodiment is universal serial bus
（Universal serial bus, abbreviation USB）Plug, second interface module 122 is General serial bus socket, and the 3rd connects
Mouth mold block 124 is micro- universal serial bus plug.First interface module 116 for example with encapsulate or welding manner and and memory cell
114 be electrically connected with, using as memory module 110 in first state（As shown in Figure 4）Occupation mode.When switching mechanism 130 according to
When sequence is connected to memory module 110 as shown in Fig. 4, Fig. 3 to Fig. 2, interconnecting module 120 of the position in switching mechanism 130, it second
Interface module 122 is correspondingly connected to first interface module 116, thus memory cell 114 is able to the second state（As shown in Figure 1）
Pass through the 3rd interface module 124（Micro- universal serial bus plug）It is used as coffret.
Fig. 4 is refer again to, the first noumenon 112 of this exemplary embodiment is illustrated in figure 4 rectangular parallelepiped structure, and there is position to exist for it
A pair of chute 112a on one contralateral surface S1, S2, and first interface module 116 protrudes from the front surface S 3 of the first noumenon 112,
Wherein front surface S 3 is abutted against between the contralateral surface S1, S2.Furthermore, switching mechanism 130 includes the second body 132 and lid
134, wherein the second body 132 has the lip 132a and a pair of adjutages 132b, 132c extended away from each other.Lid 134 can
Slidably it is socketed on the lip 132a of the second body 132.Each one end of adjutage 132b, 132c away from lip 132a is slideably
It is articulated in the chute 112a of the first noumenon 112.Only show that the chute 112a of the wherein side of the first noumenon 112 makees in the present embodiment
To represent.
Then Fig. 1 to Fig. 4 is refer again to, passes through adjutage 132b, 132c and chute 112a collocation, the second body 132
It is able to carry out back rotation along direction D1 relative to memory module 110 and is slidably reciprocated along direction D2.When the second body 132 turn to as
It shown in Fig. 3 during position, can be slided again along direction D2, thus the second body 132 is mutually socketed with the first noumenon 112, and make to prolong
Semi-girder 132b, 132c are completely covered on side surface S1, S2 respectively, so that the second body 132 is integrated into list with the first noumenon 112
One cuboid, as shown in Fig. 2 that is, the second body 132 can be considered the extension of the first noumenon 112 in structure.Relatively,
When one interface module 116 is not yet docked with second interface module 122, the first noumenon 112, the second body 132 and this pair of adjutage
132b, 132c be then collectively forming all around around and the oppositely disposed structure of opening（Such as Fig. 3 and Fig. 4）.
In addition, lid 134 and lip 132a slideably connects together each other, to reach in elongation state（Such as Fig. 2 or
Shown in Fig. 3）With shortening state（As shown in Figure 1）Between change.Lid 134 has opening 134a, and when the second body, 132 sets are connected to
After the first noumenon 112, that is, the second interface module 122 of interconnecting module 120 is also connected with first interface module 116 therewith
Afterwards, opening 134a is right against threeth interface module 124 of the position in the second body 132, and when lid 134 is along direction D2 towards extension
When arm 132b, 132c are slided to be covered in outside lip 132a, the 3rd interface module 124 will protrude from lid by opening 134a
Outside body 134.This, switching mechanism 130 moves to the first position P1 relative to memory module 110, and makes the first noumenon 112,
Two bodies 132 and the shell structure of the formation globality of lid 134, and it is used as flash disk to protrude from the 3rd outer interface module 124
100 are used to the coffret with the main frame electric connection of other electronic installations.
If on the contrary, being intended to recover the coffret using first interface module 116 as flash disk 100 again, it is only necessary to by lid 134
Slided along direction D2 away from adjutage 132b, 132c, then drive the second body 132 to be slided away from the first noumenon 112 along direction D2,
Just second interface module 122 can be made to exit first interface module 116, then only needs to rotate the second body 132 to the along direction D1
After two position P2, just first interface module 116 can be made to expose once again and be used.
Fig. 5 and Fig. 6 show the schematic diagram of interconnecting module in Fig. 1 flash disk with different visual angles respectively.Please also refer to Fig. 5 with
Fig. 6, the interconnecting module 120 of this exemplary embodiment also includes the 3rd body 126 with being connected circuit 128.3rd body 126 has phase
To first end E1 and the second end E2, second interface module 122 configured in first end E1, and the 3rd interface module 124 is configured
Two end E2, and connect circuit 128 and configure on the 3rd body 126 and be electrically connected at the interface of second interface module 122 and the 3rd
Between module 124.
Further say, the 3rd body 126 also have back to first surface S4 and second surface S5, second interface module
122 include multiple terminal T1~T4, and the 3rd interface module 124 includes multiple terminal M1~M5.For example, this example is implemented
Terminal T1~T4 of example is power supply terminal (VBUS), the differential signal terminals (D+/D-) for meeting universal sequential bus interface respectively
With ground terminal (GND), and terminal M1~M5 is the power supply terminal (VBUS), differential for meeting micro- universal sequential bus interface respectively
Signal terminal (D+/D-), identification terminal（ID）With ground terminal (GND).
Connection circuit 128 includes the multiple wire W1~W4 for being arranged respectively at first surface S4 and second surface S5, wherein
Position has been connected respectively terminal T1, T3, T4 and M1, M3, M5 in first surface S4 those wires W1~W3, and position is second
Surface S5 wire W4 is then corresponded to and has been connected terminal T2 and M2.The surface area that this measure allows the 3rd body 126 to have can be abundant
Ground is used in the configuration of connection circuit 128, and then compact appearance is produced to it.In addition, also can be real by this example
Apply example to learn, the number of terminals of second interface module 122 is the number of terminals different from the 3rd interface module 124, so that second interface
An at least terminal for module 122（Herein by taking terminal T2 as an example）The 3rd interface module 124 is not electrically connected at.Similarly, in another
In one unshowned embodiment, an at least terminal for the 3rd interface module can not also be electrically connected at second interface module.
Fig. 7 to Fig. 9 shows a kind of flash disk of another exemplary embodiment of the invention in the schematic diagram of State Transferring.Please join simultaneously
Examine Fig. 7 to Fig. 9, it is unlike those described above to be in this exemplary embodiment, the switching mechanism 220 of flash disk 200 be can removal formula, also
I.e. it is separably assembled in memory module 210.Further say, switching mechanism 220 includes the second body 222 and lid
224, wherein the second body 222 is connected to the first noumenon 214 of memory module 210 to cover, to allow first interface module 212 can be with
The second interface module of interconnecting module 230（It is not shown here）Correspondence connection.Afterwards, because lid 224 is slideably to be socketed
On the second body 222, and there is opening 224a to correspond to the 3rd interface module 232 for it.Therefore, when lid 224 towards first
Body 214 is slided and is covered in after the second body 222, i.e., make switching mechanism from state shown in State Transferring to Fig. 7 shown in Fig. 8
220 move to the first position P3 relative to memory module 210, therefore the 3rd interface module 232 is protruded from by opening 224a
Outside lid 224, and enable the interface module 232 of memory module 210 the 3rd as its coffret with other electronic installations
Main frame is electrically connected with.Relatively, once switching mechanism 220 moves to the second place relative to memory module 210, that is, in this model
Memory module 210 is moved away from equivalent to switching mechanism 220 in example embodiment, memory module 210 is just able to by first interface module
212 are used as the transmission interface with the electric connection of the main frame of other electronic installations.
The form of above-mentioned interface module is not limiting as herein, that is, in this exemplary embodiment, can also be connect different from the 3rd
Other interface modules of mouth mold block 232 and allow first interface module 212 to change otherwise as the output par, c of interconnecting module
Interface module be used as its coffret.
In summary, in the above-mentioned exemplary embodiment of the present invention, flash disk passes through between transformational structure and memory module
State transformation, and make memory module in addition to the first interface module that has using its script is as its coffret, Shang Nengli
It is connected with interconnecting module of the configuration in transformational structure with first interface module, and changes memory module and made with the 3rd interface module
For its coffret.Accordingly, no matter so that the switching mechanism of assembling form can be changed, or the switching mechanism detachably assembled, deposit
The coffret that storage module all can arrange in pairs or groups from it and have applied to different electronic installations, model is applicable effectively to expand it
Enclose.
Finally it should be noted that：Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations；To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that：Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (7)
1. a kind of flash disk, it is characterised in that including：
One memory module, with a first noumenon, a memory cell and a first interface module, the memory cell first connects with this
Mouth mold block is electrically connected to each other, and the memory cell arrangements are in the first noumenon, and the first interface module protrudes from the first
In vitro；
One interconnecting module, with multi-form but the second interface module that is electrically connected to each other and one the 3rd interface module, its
In the second interface module and the first interface module it is mutually corresponding；And
One switching mechanism, is arranged at one of the relative memory module first position or a second place, and the interconnecting module is configured
In the switching mechanism, and interconnecting module is connected to memory module through changeover mechanism structure, and wherein the first noumenon has one
To chute, the switching mechanism also includes：
One second body, with the lip and a pair of adjutages extended away from each other, this pair of adjutage respectively slidably pivot
This pair of chute is connected to drive the switching mechanism between the first position and the second place；And
One lid, is slideably socketed on the lip to cover or expose the lip, and the lid has an opening, its profile pair
Should be in the 3rd interface module, when the lid is slided to cover the lip towards the adjutage, the 3rd interface module passes through this
It is open and protrudes from the lid；Wherein,
When the switching mechanism is located at the first position, the first interface module is electrically connected with the second interface module, makes this
Memory module is electrically connected with through the 3rd interface and a main frame,
When the switching mechanism is located at the second place, the memory module is electrically connected with through the first interface with the main frame.
2. flash disk according to claim 1, it is characterised in that this pair of chute difference position is lateral at a pair of the first noumenon
On surface, and the first interface module protrudes from a preceding surface of the first noumenon, and the preceding surface contiguous is in this pair of lateral table
Between face.
3. flash disk according to claim 1, it is characterised in that the interconnecting module includes：
One the 3rd body, with a relative first end and one second end, the second interface module is configured at the first end, and this
Three interface modules are configured at second end；
One connection circuit, configuration on the 3rd body and be electrically connected at the second interface module and the 3rd interface module it
Between.
4. flash disk according to claim 3, it is characterised in that the 3rd body have back to a first surface and one the
Two surfaces, the connection circuit includes configuration in the first surface and multiple wires of the second surface.
5. flash disk according to claim 1, it is characterised in that the number of terminals of the second interface module connects different from the 3rd
The number of terminals of mouth mold block, so that an at least terminal for the second interface module is not electrically connected at the 3rd interface module, or should
An at least terminal for 3rd interface module is not electrically connected at the second interface module.
6. flash disk according to claim 1, it is characterised in that the first interface module is respectively with the 3rd interface module
One plug, the second interface module is socket.
7. flash disk according to claim 1, it is characterised in that the first interface module is universal serial bus plug or micro-
Universal serial bus plug, the second interface module is General serial bus socket or micro- General serial bus socket, and this
Three interface modules are micro- universal serial bus plug or universal serial bus plug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310193846.7A CN104183255B (en) | 2013-05-22 | 2013-05-22 | Flash disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310193846.7A CN104183255B (en) | 2013-05-22 | 2013-05-22 | Flash disk |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104183255A CN104183255A (en) | 2014-12-03 |
| CN104183255B true CN104183255B (en) | 2017-09-08 |
Family
ID=51964240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310193846.7A Active CN104183255B (en) | 2013-05-22 | 2013-05-22 | Flash disk |
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| Country | Link |
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| CN (1) | CN104183255B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112993702A (en) * | 2021-02-08 | 2021-06-18 | 青岛九日软件科技服务有限责任公司 | Connection interface of intelligent bidirectional memory and control method thereof |
| CN112905115A (en) * | 2021-02-08 | 2021-06-04 | 青岛九日软件科技服务有限责任公司 | Intelligent connection interface capable of being split bidirectionally of memory and control method thereof |
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| US6733329B2 (en) * | 2002-08-21 | 2004-05-11 | Fu-I Yang | USB flash drive |
| CN101425323A (en) * | 2007-10-31 | 2009-05-06 | 群联电子股份有限公司 | Dual-port data storage device |
| CN201247595Y (en) * | 2008-07-18 | 2009-05-27 | 联想(北京)有限公司 | U-disk |
| CN202167245U (en) * | 2011-08-31 | 2012-03-14 | 黎岱宗 | Dual-interface universal USB flash disk provided with micro USB interface |
| CN202549304U (en) * | 2012-04-26 | 2012-11-21 | 孙济宇 | Multipurpose mobile storage equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7811101B2 (en) * | 2007-03-20 | 2010-10-12 | Kingston Technology Corporation | Retractable memory drive |
| US8166220B2 (en) * | 2008-08-04 | 2012-04-24 | Sandisk Il Ltd. | Device for connection with a storage device and a host |
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|---|---|---|---|---|
| US6733329B2 (en) * | 2002-08-21 | 2004-05-11 | Fu-I Yang | USB flash drive |
| CN101425323A (en) * | 2007-10-31 | 2009-05-06 | 群联电子股份有限公司 | Dual-port data storage device |
| CN201247595Y (en) * | 2008-07-18 | 2009-05-27 | 联想(北京)有限公司 | U-disk |
| CN202167245U (en) * | 2011-08-31 | 2012-03-14 | 黎岱宗 | Dual-interface universal USB flash disk provided with micro USB interface |
| CN202549304U (en) * | 2012-04-26 | 2012-11-21 | 孙济宇 | Multipurpose mobile storage equipment |
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| CN104183255A (en) | 2014-12-03 |
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