CN104159646A - Systems and methods for computer room air conditioning - Google Patents

Systems and methods for computer room air conditioning Download PDF

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Publication number
CN104159646A
CN104159646A CN201180076451.8A CN201180076451A CN104159646A CN 104159646 A CN104159646 A CN 104159646A CN 201180076451 A CN201180076451 A CN 201180076451A CN 104159646 A CN104159646 A CN 104159646A
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CN
China
Prior art keywords
refrigerant
cooling circuit
condenser
evaporator coil
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201180076451.8A
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Chinese (zh)
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CN104159646B (en
Inventor
小约翰·H·比恩
智海·戈登·董
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schneider Electric IT Corp
Original Assignee
American Power Conversion Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Power Conversion Corp filed Critical American Power Conversion Corp
Publication of CN104159646A publication Critical patent/CN104159646A/en
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Publication of CN104159646B publication Critical patent/CN104159646B/en
Active legal-status Critical Current
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
    • F25B5/02—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in parallel
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/04—Refrigeration circuit bypassing means
    • F25B2400/0401—Refrigeration circuit bypassing means for the compressor

Abstract

A cooling system includes a condenser and first and second cooling circuits. The condenser is configured to condense refrigerant to a liquid. The first cooling circuit includes a direct expansion valve coupled to the condenser, a first evaporator coil coupled to the direct expansion valve, and a compressor coupled to the first evaporator coil. The first cooling circuit receives at least a first portion of the liquid refrigerant and output first refrigerant vapor, and the compressor receives the first refrigerant vapor and output a compressor refrigerant output to the condenser. The second cooling circuit includes a pump coupled to the condenser, an economizer valve coupled to the pump, and a second evaporator coil coupled to the economizer valve. The second cooling circuit receives at least a second portion of the liquid refrigerant and output a second vapor refrigerant to the condenser.

Description

System and method for machine room air conditioning
Background technology
The heat being produced by electronic equipment may produce adverse influence to the performance of equipment, reliability and service life, so heat is controlled, for its reliable operation, may be vital.It may be that a vital environment is the data center comprising such as the frame of the electronic equipment of server and CPU that heat is wherein controlled.For example, data center can comprise hundreds of frame.In order to solve the problem of the heat that for example electronic equipment of the electronic equipment of the frame installation of modern data center produces, used air cooling equipment to flow for electronic equipment provides cold air.In data center environment, these cooling devices can be called as machine room air conditioner (" CRAC ") unit.These CRAC unit suck hot gas from data center, and colder air is outputed to data center.When cold air is sucked in frame and through equipment, the electronic equipment in typical frame is cooled.Air is heated and is discharged to frame outside by this process.
The air-conditioning unit of data center or machine room is the main source of energy charge.Trial for increasing the efficiency of CRAC unit, once focused on and utilizes outside water or air to carry out cooling.Based on water cooling be usually directed to the to flow through current of top or underfloor.Based on the cooling of air, extraneous air is introduced to data center.
Summary of the invention
Provide and utilized refrigeration saving device, improved the system and method for the efficiency of CRAC unit.According to an aspect, provide and do not utilized outside water to improve the system and method for the efficiency of CRAC unit.In yet another aspect, provide and do not utilized outside air to improve the system and method for the efficiency of CRAC unit.
According to an aspect, cooling system comprises: condenser, the first cooling circuit and the second cooling circuit that to be configured to condensation of refrigerant be liquid.The first cooling circuit comprises: be coupled to condenser direct expansion valve, be coupled to the first evaporator coil of direct expansion valve and the compressor reducer that is coupled to the first evaporator coil; And the first cooling circuit is configured to: receive at least first of liquid refrigerant and export the first refrigerant vapour; And compressor reducer is configured to: receive the first refrigerant vapour output squeezing device cold-producing medium to condenser.The second cooling circuit comprises: be coupled to the pump of condenser, the second evaporator coil that is coupled to the saving device valve of pump and is coupled to saving device valve; And the second cooling circuit is configured to: receive at least second portion of liquid refrigerant and export the second gaseous refrigerant to condenser.
According to an embodiment, cooling system comprises: be coupled to compressor reducer and be configured to regulate the choke valve of the pressure of compressor reducer cold-producing medium output.According to another embodiment, the saving device valve of the second cooling circuit is configured to: by the selected portions of liquid refrigerant, from the first cooling circuit, transfer to the second cooling circuit.According to other embodiment, direct expansion valve is configured to: the first that regulates liquid refrigerant.
In one embodiment, pump is configured to: liquid refrigerant is pumped into the first evaporator coil and the second evaporator coil from condenser.In another embodiment, second refrigerant is at least one in saturated vapor and superheated steam.In other embodiment, cooling system comprises buffer, this buffer is coupled to the first cooling circuit and the second cooling circuit, and this buffer is configured to the output of compressor reducer cold-producing medium and second refrigerant to mix, and the refrigerant vapour that output mixes is to condenser.
According to another aspect, cooling means comprises: for the first cooling circuit provides the first of liquid refrigerant, wherein the first cooling circuit comprises: direct expansion valve, the first evaporator coil and compressor reducer; For the second cooling circuit provides the second portion of liquid refrigerant, wherein the second cooling circuit comprises: liquid pump, saving device valve and the second evaporator coil; At direct expansion valve, regulate the first of the liquid refrigerant that is provided for the first evaporator coil; The first gaseous refrigerant is outputed to compressor reducer from the first evaporator coil; At compressor compresses the first gaseous refrigerant; And the 3rd gaseous refrigerant is exported to condenser; At the second portion of saving device valve regulation liquid refrigerant, wherein the second portion of liquid refrigerant is provided to the second evaporator coil; And by the second gaseous refrigerant, from the second evaporator coil, output to condenser.
According to an embodiment, the method also comprises: second refrigerant and the 3rd gaseous refrigerant are mixed at buffer.According to another embodiment, the method also comprises: at throttle valve adjustment the 3rd gaseous refrigerant.According to other embodiment, adjusting comprises: at least one of the temperature and pressure of adjusting the 3rd gaseous refrigerant.In another embodiment, the method also comprises: at saving device valve, regulate the volume of the second portion of liquid refrigerant, wherein the second portion of this liquid refrigerant is provided for the second evaporator coil.In other embodiment, the method also comprises: at direct expansion valve, regulate the volume of the first of liquid refrigerant, wherein the first of liquid refrigerant is provided for the first evaporator coil.
According to another embodiment, cooling system comprises: condenser, the first cooling circuit, the second cooling circuit and being used for that is configured to receive at least second portion of liquid refrigerant regulate the device of the second portion of liquid refrigerant.It is liquid that condenser is configured to condensation of refrigerant.The first cooling circuit comprises: be coupled to condenser direct expansion valve, be coupled to the first evaporator coil of direct expansion valve and the compressor reducer that is coupled to the first evaporator coil.The first cooling circuit is configured to: receive at least first of liquid refrigerant, and output the first refrigerant vapour; And compressor reducer is configured to: receive the first refrigerant vapour output squeezing device cold-producing medium to condenser.The second cooling circuit comprises: the second evaporator coil that is coupled to condenser.The second cooling circuit is configured to: receive at least second portion of liquid refrigerant, and second refrigerant steam is outputed to condenser.
According to an embodiment, being used for regulating the device of the second portion of liquid refrigerant is saving device valve.According to another embodiment, be used for regulating the device of the second portion of liquid refrigerant, regulate the volume of the second portion of liquid refrigerant.According to other embodiment, be used for regulating the device of the second portion of liquid refrigerant to be configured to: by the selected portions of liquid refrigerant, from the first cooling circuit, to transfer to the second cooling circuit.
In one embodiment, cooling system comprises the choke valve that is coupled to compressor reducer, and choke valve is configured to: the pressure that regulates the output of compressor reducer cold-producing medium.In another embodiment, second refrigerant steam is at least one in saturated vapor and superheated steam.In other embodiment, cooling system comprises: the buffer that is coupled to the first cooling circuit and the second cooling circuit, and this buffer is configured to the output of compressor reducer cold-producing medium and second refrigerant steam to mix, and the refrigerant vapour that output mixes is to condenser.
Accompanying drawing explanation
Accompanying drawing is not intended to draw in proportion.In the accompanying drawings, in each figure, each identical or almost identical assembly of example, is used similar numeral.For purposes of clarity, be not that each assembly can be expressed out in each accompanying drawing.In the accompanying drawings:
Fig. 1 is the block diagram of an example of computer system, according to various aspects of the present invention, can in this example computer system, realize;
Fig. 2 is the schematic diagram of an example of the distributed system that comprises data center's management system;
Fig. 3 is according to the schematic block diagram of the machine room air conditioner unit of various aspects of the present invention;
Fig. 4 is according to the schematic block diagram of the machine room air conditioner unit of various aspects of the present invention;
Fig. 5 is according to the schematic block diagram of the machine room air conditioner unit of various aspects of the present invention; And
Fig. 6 is according to the schematic block diagram of the machine room air conditioner unit of various aspects of the present invention; And
Fig. 7 is about having used the flow chart of method of the machine room air conditioning of refrigeration saving device.
The specific embodiment
At least some embodiments according to the present invention relate to: utilize refrigeration saving device to improve each system and method for the efficiency of CRAC unit.These system and methods can not used outside water or air, improve the efficiency of CRAC unit.In each example, the system and method for machine room air conditioning can comprise: the direct expansion of compressor reducer, the saving use in loop and the use of choke valve.According to an aspect, CRAC unit may operate under a pattern in several patterns, and in the most effective pattern of special time, may depend on the temperature of outside air.
Various aspects of the present invention disclosed herein and embodiment, be not limited in its application in the layout of assembly and the details of structure in the exemplified or description afterwards of accompanying drawing, set forth.The embodiment that adopts other can be supposed in these aspects, and they can be put into practice or carry out in every way.Each example of specific implementation is provided herein, and these examples are not to be only intended to limit for the object of example explanation.Particularly, in conjunction with the behavior of discussing in any one or more embodiments, element and feature, be not intended to be excluded outside the similar action in what its embodiment in office.
For example, according to an embodiment of the invention, computer system is configured to carry out any function described herein, and it includes but not limited to, take selected pattern operation CRAC unit and be the most effective pattern of operation CRAC unit selection.In addition, the computer system in embodiment can be used to the ambient parameter at measurement data center automatically and the equipment such as cooler or freezer unit controlled with Optimal performance.And system described herein can be configured to comprise or get rid of any function discussed in this article.Therefore, embodiment is not limited in concrete function or function set.In addition, term used herein and wording are for illustrative purposes, and can not be considered to restriction." comprise " herein, the use of " comprising ", " having ", " containing ", " including " and various variations thereof, its meaning is to comprise item and its equivalent and the extra item of after this listing.
computer system
Discuss herein according to the various aspects of each current embodiment and function, can in one or more computer systems, as software or hardware, realize.There are many examples of the computer system of using at present.These examples comprise client, server, media server, application server, database server and the webserver etc. of network application, personal computer, work station, large scale computer, networking.Other example of computer system can comprise: such as the mobile computing device of cell phone and personal digital assistant and such as the network equipment of load equalizer, router and switch.In addition, according to the various aspects of current embodiment, can be placed in independent computing system, maybe can be distributed in a plurality of computing systems that are connected to one or more communication networks.
For example, various aspects and various function can be distributed among one or more computer systems, described computer system is configured to one or more client computers service is provided, or is configured to carry out an overall tasks as a part for distributed system.In addition, various aspects can be carried out in client-server or multilayer system, and wherein this multilayer system comprises: be distributed in the assembly that is used for carrying out various functions in one or more server systems.Therefore, embodiment is not constrained in arbitrarily specific system or system group and carries out.In addition, various aspects can realize in software, hardware or firmware or its any combination.Therefore, according to the various aspects of existing each embodiment, can in the method, behavior, system, system element and the assembly that utilize various hardware and software configurations, realize, and described embodiment is not limited in any specific distributed structure/architecture, network or communication protocol.
Fig. 1 has shown the block diagram of Distributed Computer System 100, wherein according to the various aspects of existing each embodiment and function, can be put into practice.Distributed Computer System 100 can comprise one or more computer systems.For example, as example, Distributed Computer System 100 comprises computer system 102,104 and 106.As shown in the figure, computer system 102,104 and 106 interconnects by communication network 108, and can pass through communication network 108 swap datas.Network 108 can comprise any communication network, can swap data by this TICOG TI system.In order to utilize network 108 swap datas, computer system 102,104 and 106 and network 108 can make in all sorts of ways, protocol and standard, it comprises: token-ring network, Ethernet, wireless ethernet, indigo plant tCP/IP, UDP, Http, FTP, SNMP, SMS, MMS, SS7, Json, Soap and Corba etc.In order to guarantee that transfer of data is safe, computer system 102,104 and 106 can be passed through network 108, utilizes the various safety measures that comprise TLS, SSL or VPN and other safe practice, transmits data.Although Distributed Computer System 100 examples the computer system of three networkings, Distributed Computer System 100 can comprise the department of computer science of the arbitrary number that utilizes the networking of any media and the communication protocol computing equipment of unifying.
According to the various aspects of existing each embodiment and function, may be implemented as: special hardware and comprise the software of carrying out in one or more computer systems of the computer system 102 shown in Fig. 1.As described, computer system 102 comprises processor 110, memory 112, bus 114, interface 116 and holder 118.Processor 110 can be carried out a series of instructions that produce operated data.Processor 110 can be commercially available processor, such as running quickly of Intel processor, Motorola sGI's sun Ultra's or Hewlett-Packard processor, but can also be processor, multiprocessor, microprocessor or the controller such as any type of many other available processors and controller.Processor 110, is connected to other system element by bus 114, and described other system element comprises one or more memory devices 112.
In the process of operation computer system 102, memory 112 can be used to storage program and data.Therefore memory 112 can be relative high-performance, volatibility, random access memory, such as, dynamic random access memory (DRAM) or static memory (SRAM).Yet memory 112 can comprise for storing any equipment of data, the storage facilities of, nonvolatile non-volatile such as hard drive or other.In some cases, according to various embodiments of the present invention, memory 112 can be organized into special and unique structure, carry out various aspects disclosed herein and various function.
The assembly of computer system 102, can be coupled by the interconnection element such as bus 114.Bus 114 can comprise one or more physical bus, for example, is integrated into the bus between the assembly of same machines inside; But can also comprise: comprise any communication connection between the system element of dedicated computing bus or criterion calculation bussing technique, such as IDE, SCSI, PCI and unlimited broadband (InfiniBand).Therefore, bus 114 can communicate exchange between the system component of computer system 102, for example data and instruction exchange.
Computer system 102 also comprises one or more interface equipments 116, such as the combination of input equipment, output equipment and input-output apparatus.Interface equipment can receive input maybe can provide output.More specifically, output equipment can present the information that provides for outside.Input equipment can receive the information from external source.The example of interface equipment comprises keyboard, mouse device, tracking ball, microphone, touch-screen, printing device, display screen, loudspeaker and NIC etc.Interface equipment allows computer system 102 and carries out information exchange and communicate by letter such as the external entity of user and other system.
That stocking system 118 can comprise is computer-readable and writable, non-volatile, the storage medium of nonvolatile, has stored the instruction that has defined the program of being carried out by processor in this storage medium.Stocking system 118 can also comprise and is recorded on medium or the information of medium inside, and this information can be by routine processes.More specifically, this information can be stored in one or more data structures, and wherein this data structure is specially configured as saving memory space or improving exchanges data performance.Instruction can be continued is stored as code signal, and this instruction can cause processor and carries out any function described herein.For example, this medium can be CD, disk or flash memory etc.In operation, processor or some other controllers can cause data, from non-volatile recording medium, read in another memory such as memory 112, to allow processor than accessing quickly this information when being included in the access of storage medium stocking system 118.Memory can be placed in stocking system 118 or in memory 112, yet processor 110 may operate in the data in memory 112, and after processing finishes, can copy data to subsequently in the medium associated with stocking system 118.Various assemblies can the movement of management data between medium and integrated circuit memory element, and current described embodiment can not be constrained to like this.In addition, each embodiment is not restricted to specific storage system or data storage system.
Although computer system 102 is shown as the computer system of a type by way of example, can put into practice thereon according to the various aspects of existing each embodiment and function, but any aspect of current disclosed each embodiment is not restricted to: be implemented in the computer system shown in Fig. 1.According to the various aspects of current disclosed embodiment and function, can be practiced in: have on one or more computers of the assembly different with framework from the assembly shown in Fig. 1 and framework.For example, computer system 102 can comprise object hardware dedicated programmed, special-purpose, such as for example, is customized to the special IC (ASIC) of carrying out specific operation disclosed herein.Yet another one embodiment utilizes several operation MAC system X, with Motorola the general object computing equipment of processor, and the dedicated computing machine equipment of the proprietary hardware of several operation and operating system, can carry out identical function.
Computer system 102 can be the computer system that comprises operating system, and described operating system management is included at least a portion of the hardware element in computer system 102.Conventionally, such as processor or the controller executive operating system of processor 110, for example, described operating system can be such as Windows windows (Windows ), Windows or Windows operating system from micro- company obtain based on operating system, from apple the MAC that Computer Company obtains system X operating system, many based on operating system issue in one, for example can be public from red cap the enterprise version obtaining operating system, can be from the micro-system of Sun company obtains operating system or can obtain from various sources operating system.Much other operating system can be used, and each embodiment is not limited in any specific realization.
Processor has defined computer platform together with operating system, can write to this computer platform the application program of high-level programming language.These component applications can be the executable intermediary bytes codes such as C-, or can be the interpre(ta)tive codes that utilizes the communication network such as internet such as the communication protocol of TCP/IP to communicate.Similarly, according to the various aspects of current disclosed embodiment, can utilize Object-Oriented Programming Language to realize, such as utilizing .Net, SmallTalk, Java, C++, Ada or C# (C-Sharp) to realize.Other Object-Oriented Programming Language also can be used.Alternatively, function, script or logic programming language can be used.
In addition, while checking above-mentioned file in the window at browser program, according to the various aspects of current disclosed each embodiment and function, can under non-programmed environment, realize, the document form of for example setting up with HTML, XML or other form is realized, the various aspects of figure-user interface to be provided or to carry out other each function.Further, according to various embodiments of the present invention, may be implemented as programmable element or non-programmable element or its any combination.For example, webpage can utilize HTML to realize, but can write with C++ from the data object of webpage intrinsic call.Therefore current disclosed each embodiment, is not limited in certain programmed language, but can also uses any suitable programming language.
Be included in the computer system of embodiment inside, can carry out other function outside the scope of current disclosed each embodiment.For example, the various aspects of system can utilize existing commercial product to realize, such as for example, such as can be from the Seattle of the State of Washington micro- the SQL Server that company obtains, can obtain from the Oracle company of the redwood seashore of California database and the MySQL wide area information server management system that can obtain from MySQL AB, such as the A Mengke city from New York the Web of company the Oracle subsidiary products of middleware or integrated software product.Yet for example, the computer system of operation SQL Server, can support the various aspects according to current disclosed each embodiment simultaneously, and for the database of various application.
example system architecture
Fig. 2 has presented the physical component that comprises distributed system 200 and the Background of logic element.As shown in the figure, distributed system 200 is specially configured according to current disclosed each embodiment.The system architecture of quoting from about Fig. 2 and content are only used to exemplary object, are not to be intended to described each embodiment to be limited in the application specific architecture shown in Fig. 2.Any one those of ordinary skill of this area is all clear that, can construct many different system architectures and not depart from the scope of current disclosed each embodiment.The specific arrangements that Fig. 2 presents is selected to improve clear degree.
Information can be utilized any technology, between the described subsystem of element, assembly and Fig. 2, circulates.For example, these technology are included in network passes through ICP/IP protocol transmission of information, transmission of information between the module of memory, and by writing in files, database or some other nonvolatile storage, carry out transmission of information.Other technology and agreement can be used, and do not depart from the scope of current disclosed each embodiment.
With reference to figure 2, system 200 comprises user 202, interface 204, data center's design and management system 206, communication network 208He data center database 210.System 200 can allow such as the designer of data center or the staff's of other data center user 202 and interface 204 mutual, to create or to revise the model of one or more data center configuration.According to a kind of embodiment, interface 204 can comprise the various aspects of patent cooperation treaty application disclosed floor editing machine and frame editing machine; Wherein this patent cooperation treaty application was submitted on May 15th, 2008, exercise question is " for handling facility electric power and cooling method and system (Methods and Systems for Managing Facility Power and Cooling) ", and the patent cooperation treaty application that application number is PCT/US08/63675, and this application is transferred to American Electric Power conversion company, i.e. the application's assignee.Application number is the patent cooperation treaty application of PCT/US08/63675, and it is all incorporated to by reference at this, and after this this application is cited as PCT/US08/63675.In other embodiments, interface 204 can be realized with special facilities, and wherein said special facilities can allow the model of expression of the physical layout that user 202 comprises data center or its any subset with drag and drop form design.This layout can comprise the expression of data center's construction package and data center apparatus.As found in various embodiments according to the present invention, the feature of interface 204 is further discussed hereinafter.In at least one embodiment, about the information exchange of data center, cross interface and be imported in system 200, and the evaluation of data center and recommendation are provided for to user.In addition, at least one embodiment, optimizing process can be performed, and comes the cooling performance at optimization data center and the energy to use.
As shown in Figure 2, data center's design and management system 206 present design data interface 204 for user 202.According to a kind of embodiment, data center's design and management system 206 can comprise, as the design of disclosed data center and management system in PCT/US08/63675.In this embodiment, design interface 204 can be incorporated to the function of the input module, display module and the structure module that are included in PCT/US08/63675, and can store and retrieve data by usage data library module.
As example, data center's design and management system 206 can be carried out information exchange by network 208He data center database 210.This information can comprise: each feature of needed supported data Center and management system 206 and any information of various functions.For example, in one embodiment, data center's database 210 can comprise: at least some part that is stored in the data in the described data center apparatus database of PCT/US08/63675.In another embodiment, this information can comprise: needed any information for supporting interface 204, for example, the physical layout of one or more data centers model configuration, the Matter production and allocation characteristic that is included in the cooling supplier in model configuration, the consumption characteristics of the cooling consumer in model configuration and be included in cooling supplier in cluster and the list of equipment rack etc.
In one embodiment, data center's database 210 can be stored cooling supplier's type, the temperature of the quantity of the cold air that provided by the cooling supplier of every type and the cold air that provided by cooling supplier.Therefore, for example, data center's database 210 comprises the record of the CRAC unit of particular type, and the specified transmission of the speed with 5,600 cubic feet (cfm) per minute temperature is the air-flow of 68 degrees Fahrenheits.In addition, data center's database 210 can be stored one or more cooling tolerance, such as the inlet temperature of CRAC and the inlet temperature of outlet temperature and one or more equipment racks and exhaust outlet temperature.Temperature can periodically be measured, and is imported in system; Or in other embodiments, utilize the equipment that is coupled to system 200, temperature can be monitored constantly.
Data center's database 210 can adopt any logical construct form of the information of can storing in computer-readable medium, comprising: flat file, index file, hierarchical data base, relational database or object-oriented database etc.Utilizing uniqueness relation and index and external key relation and index, can be data modeling.Can, between each field and each table, set up uniqueness and external key relation and index, to guarantee the integrality of data and the switching performance of data simultaneously.
Computer system comprises data center's design and management system 206, network 208 and data center apparatus database 210 as shown in Figure 2; Each can comprise one or more computer systems.As what above discuss about Fig. 1, computer system can have one or more processors or controller, memory and interface equipment.The customized configuration of the system 200 described in Fig. 2, only for the object of example, and embodiments of the present invention can be put into practice under other background.Therefore, embodiments of the present invention are not limited in user and the system of given number.
machine room air conditioner example
Fig. 3 is the schematic block diagram of machine room air conditioner unit 300, and it comprises outdoor condenser combination 302 and carries out with outdoor condenser combination the indoor CRAC unit 304 that fluid is connected.Outdoor condensation combination 302 comprises: condenser 306 and the receiver 308 with cold-producing medium supply.Indoor CRAC unit 304 comprises liquid pump 358, the compressor reducer 310 that simultaneously carries out main refrigerating circuit that fluid is connected and auxiliary cooling loop and be connected with major loop fluid with liquid pump.In one embodiment, major loop comprises the pipeline 320 that is directed to direct expansion valve 316 from liquid pump 358, and it is controlled successively the cold-producing medium that pressure is reduced and is delivered to evaporator coil 312.Subsidiary loop comprises: from liquid pump 358, be directed to the pipeline 370 of regulator valve 356, it is controlled successively liquid refrigerant is delivered to evaporator coil 352.Indoor CRAC unit also comprises: fan 314a, 314b, it is provided, the major loop with mobile air by separately and the first evaporator coil and second evaporator coil 312,352 of subsidiary loop.Filter 318 is placed between liquid pump 358 and major loop and subsidiary loop, to filter cold-producing medium before entering major loop and subsidiary loop.Choke valve 402 is provided son in the downstream of compressor reducer 310, to control the pressure from the cold-producing medium of compressor reducer.Buffer 360 is also provided, before Yi return chamber external condenser combination 302, has mixed the cold-producing medium being transmitted by major loop and subsidiary loop.
When condensation temperature is on space air returns to temperature, CRAC unit 300 moves under the first mode shown in Fig. 3.In first mode, the cooling capacity of CRAC unit 300 is controlled by the major loop that comprises direct expansion valve 316, evaporator coil 312 and compressor reducer 310.As described below, for the cold-producing medium by CRAC unit 300 in each pattern of CRAC unit, flow, in Fig. 3-6, by adding thick line, illustrate.
According to an embodiment, under first mode as shown in Figure 3, the condenser 306 in outdoor condenser combination 302 receives cold-producing medium, and it is converted to liquid form.Liquid pump 358 drives liquid refrigerant, from condenser 306, moves to direct expansion valve pipeline 320.In this embodiment, regulator valve 356 is in closed position.Direct expansion valve 316 reduces and swell refrigeration agent, and regulates the quantity of the cold-producing medium that flow to evaporator coil 312.Cold-producing medium is converted into steam at evaporator coil 312, and gaseous refrigerant flow to compressor reducer 310 from evaporator coil 312.Compressor reducer 310 has reduced the volume of gaseous refrigerant, has increased thus its pressure and temperature.Gaseous refrigerant flow back into condenser 306 from compressor reducer 310.According to an example, choke valve 402 and buffer 360 do not use in first mode, and cold-producing medium directly flows by it.Condenser 306 transforms back liquid form by cold-producing medium.Liquid refrigerant flows back to direct expansion valve 316 from condenser 306, and circulation starts again.By the parallel receiver 308 accumulation cold-producing mediums that are connected to condenser 306.Inner in data center, fan 314a, 314b air amount are through evaporator coil 312, with cooling air temperature.
Fig. 4 is the schematic block diagram that operates in the machine room air conditioner unit 300 under the second pattern.According to an embodiment, when condensation temperature drops to space air and returns under temperature, CRAC unit 300 moves under the second pattern.Under the second pattern, cold-producing medium two the parallel evaporator coil pipelines of flowing through, guide direct expansion valve pipeline 320 and the saving device pipeline 370 of major loop and subsidiary loop.The direct expansion valve pipeline 320 of major loop, as above about described the playing a role of first mode of Fig. 3.Yet some cold-producing medium is transferred in the saving pipeline 370 of subsidiary loop.According to a feature, the saving device pipeline 370 of subsidiary loop, provides the cooler environment of more economical (efficiency is higher) than the direct expansion valve pipeline 320 of major loop.And the use of the saving device circuit 370 of subsidiary loop, has reduced the quantity of cold-producing medium of direct expansion valve 316, evaporator coil 312 and the compressor reducer 310 of the major loop of flowing through, its energy that has reduced CRAC unit 300 is used.
As shown in Figure 4, condenser 306 receives the cold-producing medium of gasification, and it is converted to liquid refrigerant.Liquid refrigerant flow in liquid pump 358, and it promotes cold-producing medium and flow to filter from condenser.Refrigerant tubing, from filter 318, is divided into two parallelpipeds.Direct expansion valve circuit 320 as above about described the playing a role of first mode of Fig. 3.Other pipeline is saving device pipeline 370, and saving device pipeline 370 starts from control valve 356, and wherein control valve 356 allows the cold-producing medium of selected quantity through saving device pipeline 370.Cold-producing medium, as liquid, from control valve 356, flow to second group of evaporator coil 352.The cold-producing medium of the gasification of being heated completely, directly, from second group of evaporator coil 352, flow to buffer 360, and the cold-producing medium of the gasification of being heated completely herein, with the refrigerant mixed of gasification from major loop.Although in one embodiment, from the cold-producing medium of coil 352 output, be saturated clean steam, in other embodiments, the cold-producing medium of exporting from coil 352 by superheated the steam in several years.
According to an embodiment, the direct expansion valve pipeline 320 of major loop, outputs to buffer 360 by the refrigerant vapour from compressor reducer 310.At buffer 360, from the refrigerant vapour of compressor reducer 310, mix with the cold-producing medium of heated gasification from saving device pipeline 370.According to an embodiment, choke valve 402 is not used in the second pattern, and this output is fed directly to buffer 360 from compressor reducer 310.Buffer 360 balances are from the pressure of the refrigerant vapour of major loop with from the pressure of the heated cold-producing medium of subsidiary loop, and it flow back into condenser 306.Inner in data center, fan 314a, 314b air amount be through second group of evaporator coil 352, and subsequently through first group of evaporator coil 312, with the air themperature of cooling data center.
Fig. 5 shows the schematic block diagram that operates in the CRAC unit 300 under three-mode.According to an embodiment, when condensation temperature drops to the minimum condensation temperature (or under) of compressor reducer 310, CRAC unit 300 operates under three-mode.Three-mode comprises: use choke valve 402 to prevent that compressor reducer 310 lost efficacy, it may occur along with condensation temperature drops under the minimum condensation temperature of compressor reducer 310.Particularly, when condensation temperature drops under the minimum condensation temperature of compressor reducer 310, at the pressure of compressor reducer 310 outputs, may be reduced under the minimum degree playing a role, therefore cause inefficacy and/or the bust of potential compressor reducer 310.Therefore,, when condensation temperature reaches the minimum condensation temperature of compressor reducer 310, choke valve 402 starts to be adjusted in the pressure of the output of compressor reducer 310, to guarantee that pressure is kept enough highly, for the suitable function of compressor reducer 310.Maintain sufficiently high pressure and will guarantee that temperature remains on minimum condensation temperature or remains on minimum condensation temperature.According to an example, the pressure at the buffer side 404b place of choke valve 402, may be lower than the pressure at the buffer side 404a place of choke valve 402.
In one embodiment, choke valve 402 can be substituted by turbine expander.According to a feature, turbine expander can recover a few thing from pressure changes.According to an embodiment, the minimum condensation temperature of compressor reducer 310 can be determined in advance, and is stipulated by the manufacturer of compressor reducer 310.
According to an embodiment, when the operating rate of condensation temperature decline and compressor reducer 310 is lowered to its minimum of a value, the 4th operational mode is used.When minimum of a value (predetermined the same with manufacturer) in allowed speed of the operating rate of compressor reducer 310, compressor reducer 310 keeps moving with minimum speed.Under the 4th kind of pattern, the flowing of the saving device pipeline 370 by subsidiary loop by constraint cold-producing medium, controls the cooling capacity of CRAC unit 400 subsequently.For example, when compressor reducer 310 operates in minimum-rate, in order to reduce the cooling capacity of CRAC unit 400, cold-producing medium still less flows through saving device pipeline 370.
Fig. 6 is the schematic block diagram that operates in the CRAC unit 300 under the 5th pattern.Under the 5th pattern, direct expansion valve pipeline 320 is turned off by closing direct expansion valve 316.According to an embodiment, when condensation temperature is reduced to while being enough to only utilize saving device pipeline 370 cooling data center, CRAC unit 300 just operates in the 5th pattern.Saving device pipeline 370 is according to above moving about the mode described in Fig. 4-5.In one embodiment, when being reduced to, ambient temperature is enough to turn-off the fan of condenser 306 and when condenser 306 keeps its heats to suppress ability simultaneously, CRAC unit 300 operates in the 6th pattern.
As described above, CRAC unit 300 plays a role under six kinds of different operational modes.The given temperature that enters the outside air that condenser 306 installs therein, CRAC unit 300 is just with the most efficient possible mode operation.In this manner, CRAC unit 300 is by maximizing efficiency.In one example, when the very high and condensation temperature of the air themperature in data center is returned to temperature higher than space air, CRAC unit 300 operates in as about under the described first mode of Fig. 3.Under first mode, the saving pipeline of subsidiary loop can not used.Under the second pattern, condensation temperature drops under room temperature, and the saving pipeline 370 of subsidiary loop used, and saves pipeline 370 parallel with the direct expansion valve pipeline 320 of major loop.Under three-mode, outside air temperature is also declining; And condensation temperature is lowered to minimum condensation temperature; And choke valve 402 is used to the output pressure of compressor reducer to maintain minimum degree.Under four-mode, outside air temperature further declines and condenser operates in its minimum permission speed; And by constrained flow, through the cold-producing medium of saving device pipeline 370, control the cooling capacity of CRAC unit.Under the 5th pattern, outside air temperature and condenser temperature are lowered to is enough to turn-off direct expansion valve pipeline 320; And only with saving pipeline 370, move CRAC unit.Under the 6th pattern, outside air temperature is lowered to is enough to only utilize saving pipeline 370 to move CRAC unit, and has also closed condenser fan simultaneously.
Fig. 7 is for using the flow chart of method 500 of the machine room air conditioning of refrigeration saving device.In module 502, the first of liquid refrigerant is provided for the first cooling circuit.The first cooling circuit comprises: direct expansion valve, the first evaporator coil and compressor reducer.In module 504, the second portion of liquid refrigerant is provided for the second cooling circuit.The second cooling circuit comprises: saving device valve and the second evaporator coil.In module 506, the first of direct expansion valve regulation liquid refrigerant, wherein the first of this liquid refrigerant is provided for the first evaporator coil.For example, direct expansion valve can regulate the volume of the first of liquid refrigerant, and direct expansion valve can reduce the first with expansion liquid state cold-producing medium.In module 508, the first evaporator coil is exported the first gaseous refrigerant to compressor reducer.The volume of compressor reducer condensation the first gaseous refrigerant, and the 3rd gaseous refrigerant is exported to condenser.
In module 510, the second portion of saving device valve regulation liquid refrigerant, wherein the second portion of liquid refrigerant is provided for the second evaporator coil.For example, saving device valve can regulate the volume of the second portion of liquid refrigerant.In module 512, the second evaporator coil is exported to condenser by the second gaseous refrigerant.In one embodiment, buffer mixes the 3rd gaseous refrigerant and the second gaseous refrigerant, and this mix refrigerant is outputed to condenser.
Described in about Fig. 3-7, CRAC unit can play a role under several different modes.Emulation has been carried out in operation to CRAC unit under different mode, and its result is listed in table 1 below.Pattern in table comprises: only have direct expansion valve pipeline (only having DX, first mode); Direct expansion valve pipeline and saving pipeline (DX+ECO, the second pattern); Direct expansion valve pipeline and the saving pipeline (DX+ is with the ECO of choke valve, three-mode) with choke valve; Direct expansion valve pipeline and there is choke valve and with the saving pipeline (DX+ is with the ECO of the minimum of a value of choke valve and 30Hz, four-mode) of the compressor reducer of minimum-rate operation with 30Hz; Only has saving pipeline (only having ECO, the 5th pattern); And make condenser fan close and only use saving device pipeline (making condenser fan close and only use ECO, the 6th pattern).
Table 1
Line display in table: the measurement of take the extraneous dry air bulb temperature that degrees Fahrenheit is unit of institute's emulation, the condensation temperature that the degrees Fahrenheit of take is unit, take that kilowatt (kW) be unit at the power of saving cold-producing medium coil place, take the power at direct expansion valve cold-producing medium coil place that kilowatt (kW) be unit, the coefficient of performance of cooling circuit (COP), the compressor reducer frequency that the hertz of take is unit, the Position Control of choke valve, whether condenser fan moves in emulation, and whether liquid pump moves in emulation.
Several aspects of so having described at least one embodiment, need to be appreciated that: various changes, modification or improvement will easily be expected for those skilled in the art.It is a part for present disclosure that these changes, modification and improvement are intended to, and is intended to fall in the spirit and scope of the present invention.Therefore, foregoing description and accompanying drawing are only the modes of example, and scope of the disclosure, should from the suitable explanation of claims and its equivalents, determine.

Claims (20)

1. a cooling system, comprising:
Condenser, it is configured to condensation of refrigerant is liquid;
The first cooling circuit, it comprise be coupled to described condenser direct expansion valve, be coupled to the first evaporator coil of described direct expansion valve and the compressor reducer that is coupled to described the first evaporator coil, wherein said the first cooling circuit is configured to receive at least first of liquid refrigerant and export the first refrigerant vapour, and described compressor reducer is configured to receive described the first refrigerant vapour and output squeezing device cold-producing medium outputs to described condenser; And
The second cooling circuit, it comprises and is coupled to the pump of described condenser, the second evaporator coil that is coupled to the saving device valve of described pump and is coupled to described saving device valve, and wherein said the second cooling circuit is configured to receive at least second portion of described liquid refrigerant and exports the second gaseous refrigerant to described condenser.
2. cooling system as claimed in claim 1, also comprises choke valve, and this choke valve is coupled to described compressor reducer and is configured to regulate the pressure of described compressor reducer cold-producing medium output.
3. cooling system as claimed in claim 1, wherein, the described saving device valve of described the second cooling circuit is configured to the selected portions of described liquid refrigerant, from described the first cooling circuit, transfers to described the second cooling circuit.
4. cooling system as claimed in claim 1, wherein, described direct expansion valve is configured to regulate the described first of described liquid refrigerant.
5. cooling system as claimed in claim 1, wherein, described pump is configured to described liquid refrigerant to be pumped into described the first evaporator coil and described the second evaporator coil from described condenser.
6. cooling system as claimed in claim 1, wherein, described second refrigerant is at least one in saturated vapor and superheated steam.
7. cooling system as claimed in claim 1, also comprise the buffer that is coupled to described the first cooling circuit and described the second cooling circuit, described buffer is configured to described compressor reducer cold-producing medium output and described second refrigerant to mix, and the refrigerant vapour that output mixes is to described condenser.
8. a cooling means, comprising:
For the first cooling circuit provides the first of liquid refrigerant, wherein said the first cooling circuit comprises direct expansion valve, the first evaporator coil and compressor reducer;
For the second cooling circuit provides the second portion of liquid refrigerant, wherein said the second cooling circuit comprises liquid pump, saving device valve and the second evaporator coil;
At described direct expansion valve, regulate the described first of the liquid refrigerant that is provided for described the first evaporator coil;
The first gaseous refrigerant is outputed to described compressor reducer from described the first evaporator coil;
At described compressor reducer, compress described the first gaseous refrigerant, and the 3rd gaseous refrigerant is exported to condenser;
At described saving device valve, regulate the described second portion of the liquid refrigerant that is provided to described the second evaporator coil; And
The second gaseous refrigerant is outputed to described condenser from described the second evaporator coil.
9. method as claimed in claim 8, also comprises described second refrigerant and described the 3rd gaseous refrigerant is mixed at buffer place.
10. method as claimed in claim 8, is also included in choke valve place and regulates described the 3rd gaseous refrigerant.
11. methods as claimed in claim 10, wherein, adjusting comprises: at least one of temperature and pressure that regulates described the 3rd gaseous refrigerant.
12. methods as claimed in claim 8, also comprise: at described saving device valve, regulate the volume of the described second portion of the described liquid refrigerant that is provided for described the second evaporator coil.
13. methods as claimed in claim 8, are also included in described direct expansion valve place, regulate the volume of the described first of the described liquid refrigerant that is provided for described the first evaporator coil.
14. 1 kinds of cooling systems, comprising:
Condenser, it is configured to condensation of refrigerant is liquid;
The first cooling circuit, it comprise be coupled to described condenser direct expansion valve, be coupled to the first evaporator coil of described direct expansion valve and the compressor reducer that is coupled to described the first evaporator coil, wherein said the first cooling circuit is configured to receive at least first of liquid refrigerant and export the first refrigerant vapour, and described compressor reducer is configured to receive described the first refrigerant vapour and output squeezing device cold-producing medium outputs to described condenser;
The second cooling circuit, it comprises the second evaporator coil that is coupled to described condenser, wherein said the second cooling circuit is configured to receive at least second portion of described liquid refrigerant, and second refrigerant steam is outputed to described condenser; And
Be used for regulating the device of the described second portion of described liquid refrigerant.
15. cooling systems as claimed in claim 14, wherein, being used for regulating the device of the described second portion of described liquid refrigerant is saving device valve.
16. cooling systems as claimed in claim 14, wherein, are used for regulating the device of the described second portion of described liquid refrigerant to regulate the volume of the described second portion of described liquid refrigerant.
17. cooling systems as claimed in claim 14, wherein, are used for regulating the device of the described second portion of described liquid refrigerant to be configured to the selected portions of described liquid refrigerant to transfer to described the second cooling circuit from described the first cooling circuit.
18. cooling systems as claimed in claim 14, also comprise choke valve, and this choke valve is coupled to described compressor reducer and is configured to regulate the pressure of described compressor reducer cold-producing medium output.
19. cooling systems as claimed in claim 14, wherein, described second refrigerant steam is at least one in saturated vapor and superheated steam.
20. cooling systems as claimed in claim 14, also comprise the buffer that is coupled to described the first cooling circuit and described the second cooling circuit, described buffer is configured to described compressor reducer cold-producing medium output and described second refrigerant steam to mix, and the refrigerant vapour that output mixes is to described condenser.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104967286A (en) * 2015-07-20 2015-10-07 中国北车集团大连机车研究所有限公司 Flow boiling cooling system for electric locomotive and train set
CN107850355A (en) * 2015-06-10 2018-03-27 力博特公司 Cooling system with direct expansion cooling and pump refrigerant energy-conservation cooling

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104457006A (en) * 2013-09-17 2015-03-25 珠海格力电器股份有限公司 Heating power device cooling system
CN103486752A (en) * 2013-09-25 2014-01-01 珠海格力电器股份有限公司 Power electronic device cooling system and distributed power generation system
US10525182B2 (en) * 2014-10-10 2020-01-07 Nxstage Medical, Inc. Flow balancing devices, methods, and systems
EP3153257B1 (en) * 2015-10-09 2019-07-17 Sandvik Intellectual Property AB Method to machine a metal work piece by turning
WO2017070211A1 (en) * 2015-10-21 2017-04-27 Liebert Corporation Cooling systems for small equipment rooms and methods of cooling small equipment rooms
US9788462B2 (en) 2015-12-01 2017-10-10 At&T Mobility Ii Llc Data center cooling system
US10653042B2 (en) 2016-11-11 2020-05-12 Stulz Air Technology Systems, Inc. Dual mass cooling precision system
US20210325095A1 (en) * 2016-12-15 2021-10-21 Mitsubishi Electric Corporation Refrigeration cycle apparatus
US11408626B2 (en) * 2019-01-11 2022-08-09 Johnson Controls Tyco IP Holdings LLP Central plant control system with dynamic computation reduction
US10999954B2 (en) 2019-04-23 2021-05-04 Vertiv Corporation Modular roof mounted cooling system and method for data center
EP3889820A1 (en) * 2020-03-31 2021-10-06 Schneider Electric IT Corporation Systems and methods for determining liquid cooled architectures in an it room
US20210356152A1 (en) * 2020-05-14 2021-11-18 Johnson Controls Technology Company Condenser fan operation for hvac system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410889A (en) * 1994-01-14 1995-05-02 Thermo King Corporation Methods and apparatus for operating a refrigeration system
US6138467A (en) * 1998-08-20 2000-10-31 Carrier Corporation Steady state operation of a refrigeration system to achieve optimum capacity
US20060042282A1 (en) * 2004-08-26 2006-03-02 Thermo King Corporation Control method for operating a refrigeration system
CN101243257A (en) * 2005-08-09 2008-08-13 开利公司 Refrigerant system with suction line restrictor for capacitycorrection
US20100010681A1 (en) * 2002-12-09 2010-01-14 Hudson Technologies, Inc. Method and apparatus for optimizing refrigeration systems

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2133962A (en) * 1936-10-30 1938-10-25 Westinghouse Electric & Mfg Co Refrigerating apparatus
US3722230A (en) * 1970-12-10 1973-03-27 United Brands Co Ship refrigeration
US3664150A (en) * 1970-12-30 1972-05-23 Velt C Patterson Hot gas refrigeration defrosting system
US3710590A (en) * 1971-07-19 1973-01-16 Vilter Manufacturing Corp Refrigerant cooled oil system for a rotary screw compressor
US4120173A (en) * 1977-06-02 1978-10-17 Borg-Warner Corporation Head pressure control system for refrigeration apparatus
DE3323223A1 (en) 1983-06-28 1985-01-10 Eckhard Dr.-Ing. 4630 Bochum Beese Method and refrigeration control station for direct air cooling via a multiplicity of air coolers
DE19839477B4 (en) 1998-08-29 2005-12-29 Robert Bosch Gmbh Device for heat dissipation in a motor vehicle
US6775993B2 (en) * 2002-07-08 2004-08-17 Dube Serge High-speed defrost refrigeration system
CN1745282B (en) 2002-12-09 2010-04-21 哈德逊技术公司 Method and apparatus for optimizing refrigeration systems
CN101319826B (en) 2004-09-22 2011-09-28 株式会社电装 Ejector type refrigeration cycle
US7658079B2 (en) * 2006-11-22 2010-02-09 Bailey Peter F Cooling system and method
CN101755495B (en) 2007-05-15 2013-10-16 美国能量变换公司 Methods and systems for managing facility power and cooling
TWM347545U (en) 2008-07-22 2008-12-21 Eco Energy Dev Co Ltd Improved structure of air conditioning set
US8156750B2 (en) * 2008-07-29 2012-04-17 Agri Control Technologies, Inc. Dynamic superheat control for high efficiency refrigeration system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410889A (en) * 1994-01-14 1995-05-02 Thermo King Corporation Methods and apparatus for operating a refrigeration system
US6138467A (en) * 1998-08-20 2000-10-31 Carrier Corporation Steady state operation of a refrigeration system to achieve optimum capacity
US20100010681A1 (en) * 2002-12-09 2010-01-14 Hudson Technologies, Inc. Method and apparatus for optimizing refrigeration systems
US20060042282A1 (en) * 2004-08-26 2006-03-02 Thermo King Corporation Control method for operating a refrigeration system
CN101243257A (en) * 2005-08-09 2008-08-13 开利公司 Refrigerant system with suction line restrictor for capacitycorrection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107850355A (en) * 2015-06-10 2018-03-27 力博特公司 Cooling system with direct expansion cooling and pump refrigerant energy-conservation cooling
CN107850355B (en) * 2015-06-10 2020-07-14 维谛公司 Cooling system with direct expansion cooling and pumped refrigerant economized cooling
CN104967286A (en) * 2015-07-20 2015-10-07 中国北车集团大连机车研究所有限公司 Flow boiling cooling system for electric locomotive and train set

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