CN104157493A - Switch module and contact point manufacturing method thereof - Google Patents
Switch module and contact point manufacturing method thereof Download PDFInfo
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- CN104157493A CN104157493A CN201410366899.9A CN201410366899A CN104157493A CN 104157493 A CN104157493 A CN 104157493A CN 201410366899 A CN201410366899 A CN 201410366899A CN 104157493 A CN104157493 A CN 104157493A
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- contact
- switch
- switch module
- metal clips
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Abstract
The invention provides a contact point manufacturing method of a switch module. The contact point manufacturing method is used for manufacturing the switch contact point of the switch module. The contact point manufacturing method comprises the following steps: providing a copper-based material; manufacturing a silver contact layer on the surface of the copper-based material, so as to form a composite conductive material on which a silver contact layer and the copper-based material are arranged in an overlapped manner; stamping the composite conductive material by adopting a stamping process to achieve a predetermined shape, namely obtaining the switch contact point with the predetermined shape. The invention further provides the switch module with the switch contact point manufactured by adopting the contact point manufacturing method.
Description
Technical field
The present invention relates to switch module fabrication techniques, especially, relate to a kind of switch module and contact manufacture method thereof.
Background technology
Switch module is widely used in automotive seat, is used for the position of vehicles seat and the gradient of backrest etc. thereof.The switch contact of traditional switch module adopts copper as base material, is used for contacting conducting with conductive contact.But, in general conductive contact and switch contact easily produce moment heating or spark at Contact, and therefore copper switch contact easily produces oxidation or electrolysis after long-term use, thereby affect the useful life of switch module.
Summary of the invention
In view of the above problems, the invention provides a kind of contact manufacture method of switch module, meanwhile, the present invention also provides a kind of switch module that adopts above-mentioned manufacture method.
The contact manufacture method of switch module provided by the invention, for making the switch contact of switch module, described contact manufacture method comprises: copper base material is provided; Make silver-colored contact layer at described copper substrate surface, form the composite conducting material of silver-colored contact layer and the superimposed setting of copper base material; Adopt Sheet Metal Forming Technology to strike out reservation shape to described composite conducting material, obtain having the switch contact of described reservation shape.
In a kind of preferred embodiment of the contact manufacture method of switch module provided by the invention, described silver-colored contact layer is formed into one of them surface of described copper base material by chemical deposition process.
In a kind of preferred embodiment of the contact manufacture method of switch module provided by the invention, described silver-colored contact layer is formed into one of them surface of described copper base material by electroplating technology.
In a kind of preferred embodiment of the contact manufacture method of switch module provided by the invention, adopt with a Sheet Metal Forming Technology and stamp out multiple switch contacts with described reservation shape simultaneously.
Switch module provided by the invention, comprise housing and accommodate the switch element that is fixed on described enclosure interior, described switch element comprises the first switch contact, second switch contact and metal clips, wherein said the first switch contact and second switch contact are oppositely arranged, described metal clips comprises the contact electrode being arranged between described the first switch contact and described second switch contact, and described the first switch contact and described second switch contact adopt contact as above manufacture method to make and form.
In a kind of preferred embodiment of switch module provided by the invention, described housing definition has switch element installation region, described switch element installation region is provided with metal clips fixed leg, and described metal clips fixed leg is adjacent to one of them sidewall setting of described housing.
In a kind of preferred embodiment of switch module provided by the invention, described metal clips fixed leg is U-shaped metal fixed leg.
In a kind of preferred embodiment of switch module provided by the invention, described metal clips comprises stiff end and free end, wherein said stiff end is fixed on described metal clips fixed leg, and described free end is between described the first switch contact and second switch contact.
In a kind of preferred embodiment of switch module provided by the invention, described contact electrode is arranged on the free end of described metal clips.
In a kind of preferred embodiment of switch module provided by the invention, described the first switch contact and described second switch contact are adjacent to another sidewall setting of described housing.
Adopt the contact manufacture method of switch module provided by the invention, can produce simply efficiently the switch contact with silver-colored contact layer, described switch contact can be applied to switch module, and its silver-colored contact layer can carry out optionally in electrical contactly realizing switching manipulation with contact electrode, because the character of general silver-colored contact layer is more stable, be not easy oxidation or electrolysis occur, the switch contact that therefore can adopt the contact manufacture method of described switch module to make can improve the whole service life of described switch module.
Brief description of the drawings
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing using during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing, wherein:
Fig. 1 is the planar structure schematic diagram of a kind of embodiment of switch module provided by the invention.
Fig. 2 is the side structure schematic diagram of the switch module shown in Fig. 1.
Fig. 3 is the schematic flow sheet of the contact manufacture method of the switch module described in Fig. 1.
Embodiment
To the technical scheme in the embodiment of the present invention be clearly and completely described below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
See also Fig. 1 and Fig. 2, wherein Fig. 1 is the structural representation of a kind of embodiment of switch module with silver-colored contact layer provided by the invention, and Fig. 2 is the side structure schematic diagram of the switch module described in Fig. 1.Described switch module 100 comprises housing 110 and switch element 120, and the number of described switch element 120 can be decided according to the actual requirements, and the present embodiment describes taking two as example.
Described housing 110 comprises base plate and multiple sidewall, wherein said base plate can be rectangle or square floor, described multiple sidewall vertically extends from the edge of described base plate respectively, and coordinates with described base plate and surround a receiving space that is used for accommodating fixing described switch element 120 and other functional units.
Two switch elements of the present embodiment are separately positioned on the both sides of the receiving space of described housing 110, and each switch element 120 comprises the first switch contact 121, second switch contact 122 and metal clips 123.Wherein, described the first switch contact 121 and described second switch contact 122 are oppositely arranged, and the two corresponds respectively to two different on off states.Particularly, described metal clips 123 can comprise stiff end 131 and free end 132, wherein said stiff end 131 is fixed on the U-shaped fixed leg 133 of described housing 110 internal edges, and described free end 132 is arranged between described the first switch contact 121 and described second switch contact 122, and there is contact electrode 130.
In the time that described switch module 100 is worked, user's operation can drive the contact electrode 130 of free end 132 of described metal clips 123 optionally in electrical contact with described the first switch contact 121 or described second switch contact 122.Such as, under normal condition, the contact electrode 130 of described metal clips 123 can contact with described second switch contact 122, and makes described switch element 120 have the first on off state; Drive described metal clips 123 with described the first switch contact 121 time in electrical contact when user applies external force, described switch element 120 can be switched to second switch state.
In the present invention, described the first switch contact 121 and described second switch contact 122 are the switch contact that adopts composite conducting material, particularly, described the first switch contact 121 and second switch contact 122 all can comprise copper base material and silver-colored contact layer 140, wherein, described copper base material can be electrically connected mutually with the pin of described switch element 120 150, described silver-colored contact layer 140 platings are located at the surface that described copper base material is relative with described metal clips 122, are used for the contact electrode 130 of described metal clips 122 free ends 132 in electrical contact.
Refer to Fig. 3, it is the schematic flow sheet of the contact manufacture method of switch module provided by the invention.The contact manufacture method of described switch module can be used for making the first switch contact 121 and the described second switch contact 122 of described switch element 120, and particularly, described electric shock manufacture method can comprise:
Step S1, provides copper base material;
Step S2, makes silver-colored contact layer at described copper substrate surface, forms the composite conducting material of silver-colored contact layer and the superimposed setting of copper base material;
Particularly, described silver-colored contact layer can be formed into by depositing operation the surface of described copper base material, such as, described silver-colored contact layer can be formed into by chemical deposition process or electroplating technology one of them surface of described copper base material.
Step S3, adopts Sheet Metal Forming Technology to strike out reservation shape to described composite conducting material, obtains having the switch contact of described reservation shape.
Be fabricated into described copper substrate surface and after forming described composite conducting material at described silver-colored contact layer, can be according to the specific design requirement of switch contact, adopt Sheet Metal Forming Technology to carry out punching press processing to described composite conducting material, described composite conducting material is struck out to reservation shape, and the composite conducting material with described reservation shape that punching press forms just can be used as described switch contact.In specific embodiment, can adopt a Sheet Metal Forming Technology can form multiple switch contacts, thereby enhance productivity.
Further, the switch contact that punching press forms can be installed to the inside of described housing 110, thereby as described the first switch contact 121 or described second switch contact 122.
Adopt the contact manufacture method of switch module provided by the invention, can produce simply efficiently the switch contact with silver-colored contact layer, described switch contact can be applied to switch module, and its silver-colored contact layer can carry out optionally in electrical contactly realizing switching manipulation with contact electrode, because the character of general silver-colored contact layer is more stable, be not easy oxidation or electrolysis occur, the switch contact that therefore can adopt the contact manufacture method of described switch module to make can improve the whole service life of described switch module.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, within being all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a contact manufacture method for switch module, for making the switch contact of switch module, is characterized in that, described contact manufacture method comprises:
Copper base material is provided;
Make silver-colored contact layer at described copper substrate surface, form the composite conducting material of silver-colored contact layer and the superimposed setting of copper base material;
Adopt Sheet Metal Forming Technology to strike out reservation shape to described composite conducting material, obtain having the switch contact of described reservation shape.
2. the contact manufacture method of switch module as claimed in claim 1, is characterized in that, described silver-colored contact layer is formed into one of them surface of described copper base material by chemical deposition process.
3. the contact manufacture method of switch module as claimed in claim 1, is characterized in that, described silver-colored contact layer is formed into one of them surface of described copper base material by electroplating technology.
4. the contact manufacture method of the switch module as described in claims 1 to 3, is characterized in that, adopts with a Sheet Metal Forming Technology and stamps out multiple switch contacts with described reservation shape simultaneously.
5. a switch module, it is characterized in that, comprise housing and accommodate the switch element that is fixed on described enclosure interior, described switch element comprises the first switch contact, second switch contact and metal clips, wherein said the first switch contact and second switch contact are oppositely arranged, described metal clips comprises the contact electrode being arranged between described the first switch contact and described second switch contact, and described the first switch contact and described second switch contact adopt contact as claimed in claim 1 manufacture method to make and form.
6. switch module as claimed in claim 1, it is characterized in that, described housing definition has switch element installation region, and described switch element installation region is provided with metal clips fixed leg, and described metal clips fixed leg is adjacent to one of them sidewall setting of described housing.
7. switch module as claimed in claim 6, is characterized in that, described metal clips fixed leg is U-shaped metal fixed leg.
8. switch module as claimed in claim 6, it is characterized in that, described metal clips comprises stiff end and free end, and wherein said stiff end is fixed on described metal clips fixed leg, and described free end is between described the first switch contact and second switch contact.
9. switch module as claimed in claim 8, is characterized in that, described contact electrode is arranged on the free end of described metal clips.
10. switch module as claimed in claim 5, is characterized in that, described the first switch contact and described second switch contact are adjacent to another sidewall setting of described housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366899.9A CN104157493A (en) | 2014-07-29 | 2014-07-29 | Switch module and contact point manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366899.9A CN104157493A (en) | 2014-07-29 | 2014-07-29 | Switch module and contact point manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN104157493A true CN104157493A (en) | 2014-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410366899.9A Pending CN104157493A (en) | 2014-07-29 | 2014-07-29 | Switch module and contact point manufacturing method thereof |
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| CN (1) | CN104157493A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107393747A (en) * | 2017-08-31 | 2017-11-24 | 四川艾达电器有限公司 | Contact shell fragment and its processing technology, processing unit (plant) |
| CN107749364A (en) * | 2017-09-27 | 2018-03-02 | 国家电网公司 | A kind of high voltage isolation switch contact fingertip and its production technology |
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| CN2257076Y (en) * | 1995-11-24 | 1997-06-25 | 金帅万企业股份有限公司 | Relay with improved slide structure |
| CN202855650U (en) * | 2012-10-23 | 2013-04-03 | 郏威栋 | Push-and-pull type magnetic latching relay |
| CN203481147U (en) * | 2013-10-21 | 2014-03-12 | 宁波金点电子有限公司 | Combined relay |
| CN103946946A (en) * | 2011-11-22 | 2014-07-23 | 恩益禧肖特电子零件有限公司 | Temperature fuse and sliding electrode used in temperature fuse |
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2014
- 2014-07-29 CN CN201410366899.9A patent/CN104157493A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2257076Y (en) * | 1995-11-24 | 1997-06-25 | 金帅万企业股份有限公司 | Relay with improved slide structure |
| CN103946946A (en) * | 2011-11-22 | 2014-07-23 | 恩益禧肖特电子零件有限公司 | Temperature fuse and sliding electrode used in temperature fuse |
| CN202855650U (en) * | 2012-10-23 | 2013-04-03 | 郏威栋 | Push-and-pull type magnetic latching relay |
| CN203481147U (en) * | 2013-10-21 | 2014-03-12 | 宁波金点电子有限公司 | Combined relay |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107393747A (en) * | 2017-08-31 | 2017-11-24 | 四川艾达电器有限公司 | Contact shell fragment and its processing technology, processing unit (plant) |
| CN107393747B (en) * | 2017-08-31 | 2020-01-10 | 四川艾达电器有限公司 | Contact spring piece and processing technology and processing device thereof |
| CN107749364A (en) * | 2017-09-27 | 2018-03-02 | 国家电网公司 | A kind of high voltage isolation switch contact fingertip and its production technology |
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Application publication date: 20141119 |