CN104142747A - Sputtering type touch panel bridging structure and manufacturing method thereof - Google Patents
Sputtering type touch panel bridging structure and manufacturing method thereof Download PDFInfo
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- CN104142747A CN104142747A CN201310173142.3A CN201310173142A CN104142747A CN 104142747 A CN104142747 A CN 104142747A CN 201310173142 A CN201310173142 A CN 201310173142A CN 104142747 A CN104142747 A CN 104142747A
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Abstract
The invention discloses a puttering type touch panel bridging structure and a manufacturing method thereof. The method comprises the steps as follows: a substrate is prepared firstly, a first electrode layer is formed on the substrate with a primary sputtering technology and comprises a plurality of first sensing pads, second sensing pads and first bridging wires, and the first bridging wires are electrically connected with the first sensing pads; then a plurality of insulating pads are formed on the first bridging wires with a dispensing technology to constitute an insulating layer; and finally, a plurality of second bridging wires are formed on the insulating pads with a secondary sputtering technology and are electrically connected with the second sensing pads, a second electrode layer is formed by the second bridging wires, and electrical contact between the first bridging wires and the second bridging wires is isolated by the insulating pads.
Description
Technical field
The present invention is about a kind of Trackpad, espespecially a kind of bridging structure for touch panel of sputtering type.
Background technology
The touch-control input mode of the contact panel (Touch Panel) using in commercially available notebook computer, panel computer, intelligent mobile phone and various LCDs at present, includes resistance-type, condenser type, optical profile type, induction, sound wave induction type etc.; Wherein, resistance-type and condenser type are to touch with finger or induction pen counter plate surface by user, and in the inner variation that produces capacitance of the panel that is subject to touch position, detect according to this position that panel surface is accepted touching, to reach the object of touch-control sensing.
And current used capacitive contact panel includes a substrate, is formed with a plurality of the first sensor pads on this substrate, the second sensor pad, two layers of bridge formation line and insulation course.User, touch another when surface in this substrate, the finger of touch will be responded to by this first sensor pad and this second sensor pad, to reach the object of touch-control.
Due to a plurality of the first sensor pads on above-mentioned contact panel, the second sensor pad, two layers of bridge formation line and insulation course, utilize the fabrication techniques such as printing, exposure, development, etching, this first sensor pad and this second sensor pad can be produced on the same surface of substrate.But, while completing contact panel with technology such as printing, exposure, development, etchings, the man-hour, the operation that spend are more, and run into the section of housing of substrate or contact panel or the section of shell rim is stepped or when irregularly shaped, printing, the complete method of technology such as exposure, development, etching completes the making of a plurality of the first sensor pads, second sensor pad of contact panel, two layers of bridge formation line and insulation course.
Summary of the invention
Therefore, fundamental purpose of the present invention, be to solve traditional disappearance, the present invention utilizes sputter and some glue or coating method to complete the making of a plurality of the first sensor pads on contact panel, the second sensor pad, two layers of bridge formation line and insulation course, contact panel is made and be more prone to simple, and with sputter sputter and some glue or coating method can by a plurality of the first sensor pads on contact panel, the second sensor pad, two layers of bridge formation line and insulation course be made in the section of this substrate or housing or the section of shell rim is stepped, tabular or irregularly shaped place.
In order to achieve the above object, the invention provides a kind of bridging structure for touch panel method for making of sputtering type, comprising: have a substrate; With sputtering process for the first time, be formed with one first electrode layer on this substrate, this first electrode layer includes a plurality of the first sensor pads, the second sensor pad and the first bridge formation line, and these the first bridge formation lines are electrically connected these the first sensor pads; With gluing process, on these the first bridge formation lines, form a plurality of insulating mats, with these insulating mats, form an insulation course; And on these insulating mats, form a plurality of the second bridge formation lines with sputtering process for the second time, these the second bridge formation lines are electrically connected these the second sensor pads, and with these the second bridge formation lines, form a second electrode lay, and with these insulating mats to completely cut off the in electrical contact of these the first bridge formation lines and these the second bridge formation lines.
Wherein, this substrate is light-permeable or lighttight glass fibre, glass or plastic cement material, and the section of this substrate is stepped, tabular or irregular.
Wherein, these first sensor pads and the interlaced arrayed of these the second sensor pads.
Wherein, the anti oxidation layer that this first electrode layer is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Wherein, this insulation course is white hot plastic cement.
Wherein, this insulating mat semi-round ball or bending arc shape.
Wherein, the anti oxidation layer that this second electrode lay is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
In order to achieve the above object, the present invention separately provides a kind of bridging structure for touch panel of sputtering type, comprising:
One substrate; One first electrode layer, is located on this substrate, and this first electrode layer includes a plurality of the first sensor pads, the second sensor pad and the first bridge formation line, and this first bridge formation line is electrically connected these the first sensor pads; One insulation course, is comprised of a plurality of insulating mats, and these insulating mats are located on these the first bridge formation lines and are formed semi-round ball or bending arc shape; One the second electrode lay, is formed and is located on these insulating mats by a plurality of the second bridge formation lines, and this second bridge formation line is electrically connected these the second sensor pads, with these insulating mats to completely cut off the in electrical contact of these the first bridge formation lines and these the second bridge formation lines.
Wherein, this substrate is light-permeable or lighttight glass fibre, glass or plastic cement material, and the section of this substrate is stepped, tabular or irregular.
Wherein, these first sensor pads and the interlaced arrayed of these the second sensor pads.
Wherein, the anti oxidation layer that this first electrode layer is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Wherein, this insulation course is white hot plastic cement.
Wherein, the anti oxidation layer that this second electrode lay is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
In order to achieve the above object, the present invention provides a kind of bridging structure for touch panel method for making of sputtering type again, comprising: have a substrate; With sputtering process for the first time, be formed with one first electrode layer on this substrate, this first electrode layer includes a plurality of the first sensor pads, the second sensor pad and the first bridge formation line, and these the first bridge formation lines are electrically connected these the first sensor pads; With coating process, on these first sensor pads and these the first bridge formation lines, form a plurality of insulation strip, with these insulation strip, form an insulation course; And in these insulation strip, form a plurality of the second bridge formation lines with sputtering process for the second time, these the second bridge formation lines are electrically connected these the second sensor pads, and with these the second bridge formation lines, form a second electrode lay, and with these insulation strip to completely cut off the in electrical contact of these the first bridge formation lines and these the second bridge formation lines.
Wherein, this substrate is light-permeable or lighttight glass fibre, glass or plastic cement material, and the section of this substrate is stepped, tabular or irregular.
Wherein, these first sensor pads and the interlaced arrayed of these the second sensor pads.
Wherein, the anti oxidation layer that this first electrode layer is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Wherein, this insulation course is white hot plastic cement.
Wherein, the anti oxidation layer that this second electrode lay is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
In order to achieve the above object, the present invention provides again a kind of bridging structure for touch panel of sputtering type, comprising:
One substrate; One first electrode layer, is located on this substrate, and this first electrode layer includes a plurality of the first sensor pads, the second sensor pad and the first bridge formation line, and this first bridge formation line is electrically connected these the first sensor pads; One insulation course, is comprised of a plurality of insulation strip, and these insulation strip are located on these first sensor pads and these the first bridge formation lines; One the second electrode lay, is formed and is located in these insulation strip by a plurality of the second bridge formation lines, and this second bridge formation line is electrically connected these the second sensor pads, with these insulating mats to completely cut off the in electrical contact of these the first bridge formation lines and these the second bridge formation lines.
Wherein, this substrate is light-permeable or lighttight glass fibre, glass or plastic cement material, and the section of this substrate is stepped, tabular or irregular.
Wherein, these first sensor pads and the interlaced arrayed of these the second sensor pads.
Wherein, the anti oxidation layer that this first electrode layer is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Wherein, this insulation course is white hot plastic cement.
Wherein, the anti oxidation layer that this second electrode lay is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Because the first electrode layer, the second electrode lay and insulation course are with on sputter and gluing process, make contact panel on making, be more prone to simple, allow cost of manufacture significantly reduce.Especially when the section of substrate or housing is stepped, utilize the technology such as printing, exposure, development, etching metal material cannot be made on this substrate or housing and form the first electrode layer, the second electrode lay and insulation course, must utilize sputter and gluing process to make.
Accompanying drawing explanation
Fig. 1 is that contact panel bridge formation of the present invention is made schematic flow sheet;
Fig. 2 is the bridging structure for touch panel schematic diagram of Fig. 1;
Fig. 3 is that Fig. 2 is in the section cross-sectional schematic of 3-3 position;
Fig. 4 is that another bridging structure for touch panel of the present invention is made schematic flow sheet;
Fig. 5 is the bridging structure for touch panel schematic diagram of Fig. 4;
Fig. 6 is that Fig. 5 is in the section cross-sectional schematic of 6-6 position.
Wherein, Reference numeral:
Step 200～206, step 100～106
Substrate 1 first electrode layer 2
The first sensor pad 21 second sensor pads 22
The first bridge formation line 23 insulation courses 3,3a
Insulating mat 31 insulation strip 31a
The second electrode lay 4 second bridge formation lines 41
Embodiment
Hereby, about the technical content and a detailed description, now coordinate accompanying drawing to be described as follows:
Refer to Fig. 1, Fig. 2, Fig. 1 is that bridging structure for touch panel of the present invention is made flow process, the structural representation that the contact panel that Fig. 2 is Fig. 1 is built bridge.As shown in the figure: the bridging structure for touch panel method for making of sputtering type of the present invention, first, step 100, have a substrate 1, this substrate 1 is the made substrate 1 of light-permeable or lighttight glass fibre, glass or plastic cement material, and the section of this substrate 1 or housing is stepped, tabular or irregular.
Step 102, with sputtering process for the first time by metal material sputter on this substrate 1, after sputter, be formed with one first electrode layer 2 for the first time, this first electrode layer 2 includes a plurality of the first sensor pads 21, the second sensor pad 22 and the first bridge formation line 23.These the first sensor pad 21 and the interlaced arrayed of these the second sensor pads 22, and along X axis, be electrically connected these the first sensor pads 21 with these the first bridge formation lines 23.The anti oxidation layer that this first electrode layer 2 is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Step 104, after the first above-mentioned electrode layer 2 sputters complete, puts white hot plastic cement in these the first bridge formation lines 23 and forms a plurality of insulating mats 31 with gluing process, with these insulating mats 31, forms an insulation course 3.In this accompanying drawing, this insulating mat 31 semi-round balls or bending arc shape.
Step 106, after gluing process completes, sputtering process forms metal material sputter a plurality of the second bridge formation lines 41 on these insulating mats 31 for the second time, these the second bridge formation lines 41 are electrically connected these the second sensor pads 22 along Y-axis, and with these the second bridge formation lines 41, form the second electrode lays 4, and with these insulating mats 31 to completely cut off the in electrical contact of these the first bridge formation lines 23 and these the second bridge formation lines 41.The anti oxidation layer that this second electrode lay 4 is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Referring to Fig. 2, Fig. 3, is bridging structure for touch panel of the present invention and Fig. 2 section cross-sectional schematic in 3-3 position.As shown in the figure: the bridging structure for touch panel of sputtering type of the present invention, comprising: a substrate 1, one first electrode layer 2, an insulation course 3 and a second electrode lay 4.
This substrate 1 be light-permeable or the made substrate 1 of lighttight glass fibre, glass or plastic cement material, and the section of this substrate 1 or housing is stepped, tabular or irregular.
This first electrode layer 2, with sputtering process by metal material sputter on this substrate 1, the first electrode layer 2 after sputter includes a plurality of the first sensor pads 21, the second sensor pad 22 and the first bridge formation line 23.These the first sensor pad 21 and the interlaced arrayed of these the second sensor pads 22, and along X axis, be electrically connected these the first sensor pads 21 with these the first bridge formation lines 23.
This insulation course 3, sees through gluing process and white hot plastic cement is put to the insulating mat 31 that is formed with a plurality of semi-round balls or bending arc shape on these the first bridge formation lines 23.
This second electrode lay 4, with sputtering process by metal material sputter on these insulating mats 31 to form the second bridge formation line 41, this the second bridge formation line 41 is electrically connected these the second sensor pads 22 along Y-axis, and these insulating mats 31 are to completely cut off the in electrical contact of these the first bridge formation lines 23 and these the second bridge formation lines 41.
Because this first electrode layer 2, the second electrode lay 4 and insulation course 3 are with on sputter and gluing process, make contact panel on making, be more prone to simple, allow cost of manufacture significantly reduce.Especially when the section of substrate 1 or housing is stepped, utilize the technology such as printing, exposure, development, etching metal material and colloid cannot be made on this substrate 1 or housing and form the first electrode layer 2, the second electrode lay 4 and insulation course 3, must utilize sputter and gluing process to make.
Referring to Fig. 4, Fig. 5, is the bridging structure for touch panel schematic diagram of another bridging structure for touch panel making flow process of the present invention and Fig. 4.As shown in the figure: the bridging structure for touch panel method for making of sputtering type of the present invention, first, step 200, have a substrate 1, this substrate 1, for light-permeable or the made substrate 1 of lighttight glass fibre, glass or plastic cement material, and the section of this substrate 1 or housing is stepped, tabular or irregular.
Step 202, with sputtering process for the first time by metal material sputter on this substrate 1, after sputter, be formed with one first electrode layer 2 for the first time, this first electrode layer 2 includes a plurality of the first sensor pads 21, the second sensor pad 22 and the first bridge formation line 23.These the first sensor pad 21 and the interlaced arrayed of these the second sensor pads 22, and along X axis, be electrically connected these the first sensor pads 21 with these the first bridge formation lines 23.The anti oxidation layer that this first electrode layer 2 is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Step 204, after the first above-mentioned electrode layer 2 sputters complete, what with coating technique, white thermoplastic is pulled into strip forms a plurality of insulation strip 31a across these first sensor pads 21 and these the first bridge formation lines 23, with these insulation strip 31a, forms an insulation course 3a.
Step 206, after coating process completes, sputtering process above forms a plurality of the second bridge formation lines 41 by metal material sputter in these insulation strip 31a for the second time, these the second bridge formation lines 41 are electrically connected these the second sensor pads 22 along Y-axis, and with these the second bridge formation lines 41, form the second electrode lays 4, and with these insulating mats 31 to completely cut off the in electrical contact of these the first bridge formation lines 23 and these the second bridge formation lines 41.The anti oxidation layer that this second electrode lay 4 is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Referring to Fig. 5, Fig. 6, is bridging structure for touch panel of the present invention and Fig. 5 section cross-sectional schematic in 6-6 position.As shown in the figure: the bridging structure for touch panel of sputtering type of the present invention, comprising: a substrate 1, one first electrode layer 2, an insulation course 3 and a second electrode lay 4.
This substrate 1 be light-permeable or the made substrate 1 of lighttight glass fibre, glass or plastic cement material, and the section of this substrate 1 or housing is stepped, tabular or irregular.
This first electrode layer 2, with sputtering process by metal material sputter on this substrate 1, the first electrode layer 2 after sputter includes a plurality of the first sensor pads 21, the second sensor pad 22 and the first bridge formation line 23.These the first sensor pad 21 and the interlaced arrayed of these the second sensor pads 22, and along X axis, be electrically connected these the first sensor pads 21 with these the first bridge formation lines 23.
This insulation course 3, is comprised of a plurality of insulation strip 31a, with these insulation strip 31a, is located on these first sensor pads 21 and these the first bridge formation lines 23.
This second electrode lay 4, with sputtering process, metal material sputter is upper to form the second bridge formation line 41 in these insulation strip 31a, this the second bridge formation line 41 is electrically connected these the second sensor pads 22 along Y-axis, and these insulating mats 31 are to completely cut off the in electrical contact of these the first bridge formation lines 23 and these the second bridge formation lines 41.
Because this first electrode layer 2, the second electrode lay 4 and insulation course 3 are with on sputter and gluing process, make contact panel on making, be more prone to simple, allow cost of manufacture significantly reduce.Especially when the section of substrate 1 or housing is stepped, utilize the technology such as printing, exposure, development, etching metal material cannot be made on this substrate 1 or housing and form the first electrode layer 2, the second electrode lay 4 and insulation course 3, must utilize sputter and gluing process to make.
Above are only preferred embodiment of the present invention, be not used for limiting scope of the invention process.Be that all equalizations of doing according to the present patent application the scope of the claims change and modify, be all the scope of the claims of the present invention and contain.
Claims (25)
1. a bridging structure for touch panel method for making for sputtering type, is characterized in that, comprising:
A) have a substrate;
B) with sputtering process for the first time, be formed with one first electrode layer on this substrate, this first electrode layer includes a plurality of the first sensor pads, the second sensor pad and the first bridge formation line, and these the first bridge formation lines are electrically connected these the first sensor pads;
C) with gluing process, on these the first bridge formation lines, form a plurality of insulating mats, with these insulating mats, form an insulation course; And,
D) with sputtering process for the second time, on these insulating mats, form a plurality of the second bridge formation lines, these the second bridge formation lines are electrically connected these the second sensor pads, and with these the second bridge formation lines, form a second electrode lay, and with these insulating mats to completely cut off the in electrical contact of these the first bridge formation lines and these the second bridge formation lines.
2. bridging structure for touch panel method for making as claimed in claim 1, is characterized in that, this substrate is light-permeable or lighttight glass fibre, glass or plastic cement material, and the section of this substrate is stepped, tabular or irregular.
3. bridging structure for touch panel method for making as claimed in claim 2, is characterized in that, these first sensor pads and the interlaced arrayed of these the second sensor pads.
4. bridging structure for touch panel method for making as claimed in claim 3, is characterized in that, the anti oxidation layer that this first electrode layer is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
5. bridging structure for touch panel method for making as claimed in claim 4, is characterized in that, this insulation course is white hot plastic cement.
6. bridging structure for touch panel method for making as claimed in claim 5, is characterized in that, this insulating mat semi-round ball or bending arc shape.
7. bridging structure for touch panel method for making as claimed in claim 6, is characterized in that, the anti oxidation layer that this second electrode lay is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
8. a bridging structure for touch panel for sputtering type, is characterized in that, comprising:
One substrate;
One first electrode layer, is located on this substrate, and this first electrode layer includes a plurality of the first sensor pads, the second sensor pad and the first bridge formation line, and this first bridge formation line is electrically connected these the first sensor pads;
One insulation course, is comprised of a plurality of insulating mats, and these insulating mats are located on these the first bridge formation lines and are formed semi-round ball or bending arc shape;
One the second electrode lay, is formed and is located on these insulating mats by a plurality of the second bridge formation lines, and this second bridge formation line is electrically connected these the second sensor pads, with these insulating mats to completely cut off the in electrical contact of these the first bridge formation lines and these the second bridge formation lines.
9. bridging structure for touch panel as claimed in claim 8, is characterized in that, this substrate is light-permeable or lighttight glass fibre, glass or plastic cement material, and the section of this substrate is stepped, tabular or irregular.
10. bridging structure for touch panel as claimed in claim 9, is characterized in that, these first sensor pads and the interlaced arrayed of these the second sensor pads.
11. bridging structure for touch panels as claimed in claim 10, is characterized in that, the anti oxidation layer that this first electrode layer is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
12. bridging structure for touch panels as claimed in claim 11, is characterized in that, this insulation course is white hot plastic cement.
13. bridging structure for touch panels as claimed in claim 12, is characterized in that, the anti oxidation layer that this second electrode lay is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
The bridging structure for touch panel method for making of 14. 1 kinds of sputtering types, is characterized in that, comprising:
A) have a substrate;
B) with sputtering process for the first time, be formed with one first electrode layer on this substrate, this first electrode layer includes a plurality of the first sensor pads, the second sensor pad and the first bridge formation line, and these the first bridge formation lines are electrically connected these the first sensor pads;
C) with coating process, across these first sensor pads and these the first bridge formation lines, form a plurality of insulation strip, with these insulation strip, form an insulation course; And,
D) with sputtering process for the second time, in these insulation strip, form a plurality of the second bridge formation lines, these the second bridge formation lines are electrically connected these the second sensor pads, and with these the second bridge formation lines, form a second electrode lay, and with these insulation strip to completely cut off the in electrical contact of these the first bridge formation lines and these the second bridge formation lines.
15. bridging structure for touch panel method for makings as claimed in claim 14, is characterized in that, this substrate is light-permeable or lighttight glass fibre, glass or plastic cement material, and the section of this substrate is stepped, tabular or irregular.
16. bridging structure for touch panel method for makings as claimed in claim 15, is characterized in that, these first sensor pads and the interlaced arrayed of these the second sensor pads.
17. bridging structure for touch panel method for makings as claimed in claim 16, is characterized in that, the anti oxidation layer that this first electrode layer is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
18. bridging structure for touch panel method for makings as claimed in claim 17, is characterized in that, this insulation course is white hot plastic cement.
19. bridging structure for touch panel method for makings as claimed in claim 18, is characterized in that, the anti oxidation layer that this second electrode lay is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
The bridging structure for touch panel of 20. 1 kinds of sputtering types, is characterized in that, comprising:
One substrate;
One first electrode layer, is located on this substrate, and this first electrode layer includes a plurality of the first sensor pads, the second sensor pad and the first bridge formation line, and this first bridge formation line is electrically connected these the first sensor pads;
One insulation course, is comprised of a plurality of insulation strip, and these insulation strip are located on these first sensor pads and these the first bridge formation lines;
One the second electrode lay, is formed and is located in these insulation strip by a plurality of the second bridge formation lines, and this second bridge formation line is electrically connected these the second sensor pads, with these insulating mats to completely cut off the in electrical contact of these the first bridge formation lines and these the second bridge formation lines.
21. bridging structure for touch panels as claimed in claim 20, is characterized in that, this substrate is light-permeable or lighttight glass fibre, glass or plastic cement material, and the section of this substrate is stepped, tabular or irregular.
22. bridging structure for touch panels as claimed in claim 21, is characterized in that, these first sensor pads and the interlaced arrayed of these the second sensor pads.
23. bridging structure for touch panels as claimed in claim 22, is characterized in that, the anti oxidation layer that this first electrode layer is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
24. bridging structure for touch panels as claimed in claim 23, is characterized in that, this insulation course is white hot plastic cement.
25. bridging structure for touch panels as claimed in claim 24, is characterized in that, the anti oxidation layer that this second electrode lay is covered on copper metal layer by a copper metal layer and forms, and this anti oxidation layer is stainless steel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310173142.3A CN104142747A (en) | 2013-05-10 | 2013-05-10 | Sputtering type touch panel bridging structure and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310173142.3A CN104142747A (en) | 2013-05-10 | 2013-05-10 | Sputtering type touch panel bridging structure and manufacturing method thereof |
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| CN103064545A (en) * | 2011-10-18 | 2013-04-24 | 台达电子工业股份有限公司 | Touchpad |
| US20130105852A1 (en) * | 2011-11-01 | 2013-05-02 | Walsin Lihwa Corporation | Package structure and manufacturing method for the same |
| CN203276220U (en) * | 2013-05-10 | 2013-11-06 | 柏腾科技股份有限公司 | Sputtering coating type touch panel bridging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101109094A (en) * | 2006-07-18 | 2008-01-23 | 廖彦珍 | Method of horizontally plating, electrodepositing or electrodeless plating processing on substrate |
| CN101776967A (en) * | 2009-01-08 | 2010-07-14 | 精工爱普生株式会社 | Method for manufacturing touch panel, touch panel, display device, and electronic apparatus |
| CN103064545A (en) * | 2011-10-18 | 2013-04-24 | 台达电子工业股份有限公司 | Touchpad |
| US20130105852A1 (en) * | 2011-11-01 | 2013-05-02 | Walsin Lihwa Corporation | Package structure and manufacturing method for the same |
| CN203276220U (en) * | 2013-05-10 | 2013-11-06 | 柏腾科技股份有限公司 | Sputtering coating type touch panel bridging structure |
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Application publication date: 20141112 |
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