CN104140767B - The photovoltaic encapsulation preparation method of EVA heat conduction compound cutan - Google Patents
The photovoltaic encapsulation preparation method of EVA heat conduction compound cutan Download PDFInfo
- Publication number
- CN104140767B CN104140767B CN201410382044.5A CN201410382044A CN104140767B CN 104140767 B CN104140767 B CN 104140767B CN 201410382044 A CN201410382044 A CN 201410382044A CN 104140767 B CN104140767 B CN 104140767B
- Authority
- CN
- China
- Prior art keywords
- compound
- dioxide
- silicon
- heat conduction
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to the preparation method of photovoltaic encapsulation EVA heat conduction compound cutan, following raw material is mixed in proportion, subsequently mixture is poured into forcing machine and carry out blending extrusion, extrudate is through curtain coating, cooling, baking oven is shaped, traction, coiling process, obtain described EVA packaging adhesive film, raw material consists of: the copolymer 1 of ethylene-vinyl acetate 00 part, crosslinking and curing agent 0.6-0.8 part, antioxidant 0.3-0.4 part, at least one is selected from compound 0.5-1 part of hydroxy benzophenone, and silicon-dioxide, wherein, silicon-dioxide and at least one are selected from the ratio of quality and the number of copies of the compound of hydroxy benzophenone for (3-5): 1.The method technique is simple, and with low cost, the packaging adhesive film of acquisition has good adhesive property, shock resistance, and has excellent PID effect.
Description
Technical field
The present invention relates to the preparation method of photovoltaic encapsulation EVA heat conduction compound cutan.
Background technology
In recent years, the photovoltaic cell caused due to PID effect (potentialinduceddegradation) and the integrity problem of assembly obtain pay attention to day by day.Each company is all devoted to battery and the photovoltaic module of developing PID-free (by PID effects).Substantially all there is the problem of PID inefficacy in the P type photovoltaic module of traditional technology.In order to effectively prevent PID effect, can solve from battery, assembly and system three aspects.Wherein packaged material is an important factor.Therefore research and development the packaged material of anti-PID effect can become the important research direction of of this field.
Application number is the photovoltaic module polyolefine packaging adhesive film containing trimeric cyanamide that application discloses the anti-pid effect of a kind of energy of 201310689585, and this packaging adhesive film not only has excellent adhesive property, shock resistance, transmittance, also has anti-pid performance.
The solar battery sheet that application discloses a kind of anti-pid effect of application number 201310201143 and manufacture method thereof.Its cell piece includes crystalline silicon substrate, and the SiNx passivation layer be deposited on successively in crystalline silicon substrate and SiNx photic zone; Described photic zone also deposits the anti-pid effect layer of layer of sin x.The anti-pid of its product is effective and can carry out producing on conventional silicon nitride filming equipment basis, equipment investment is little, production cost.
Summary of the invention
The object of this invention is to provide a kind of preparation method of photovoltaic encapsulation EVA heat conduction compound cutan, technique is simple, and with low cost, the packaging adhesive film of acquisition has good adhesive property, shock resistance, and has excellent PID effect.
The present invention adopts following technical scheme, the photovoltaic encapsulation preparation method of EVA heat conduction compound cutan, following raw material is mixed in proportion, subsequently mixture is poured into forcing machine and carry out blending extrusion, extrudate is through curtain coating, cooling, baking oven sizing, traction, coiling process, obtain described EVA packaging adhesive film, raw material consists of:
The copolymer 1 of ethylene-vinyl acetate 00 part,
Crosslinking and curing agent 0.6-0.8 part,
Antioxidant 0.3-0.4 part,
At least one is selected from compound 0.5-1 part of hydroxy benzophenone,
And silicon-dioxide,
Wherein, silicon-dioxide and at least one are selected from the ratio of quality and the number of copies of the compound of hydroxy benzophenone for (3-5): 1.
In the multipolymer of described ethylene-vinyl acetate, vinyl acetate between to for plastic mass content is 28 ~ 37%, and melt index values is 30-50g/10min.
Described crosslinking and curing agent is tert-butyl hydroperoxide 2-ethylhexyl carbonate or two (t-butyl peroxy) hexane of 2,5-dimethyl-2,5-;
Described oxidation inhibitor is two (2,4-dicumylphenyl) pentaerythritol diphosphites or three (2,4-di-tert-butyl-phenyl) phosphorous acid ester;
The compound of described hydroxy benzophenone is preferably Octabenzone.
Described silicon-dioxide is aerosil.
The present invention has following beneficial effect:
The EVA heat conduction compound cutan that the present invention prepares, guaranteeing EVA adhesive film and glass, under the cohesive strength of TPT meets the requirements of prerequisite, through the practical studies that applicant is long-term, by the compound of hydroxy benzophenone and aerosil with the use of, the EVA packaging adhesive film obtained not only has excellent anti-stick property and shock resistance, also has excellent pid performance.Preparation technology is simple, and raw material is easy to get.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment 1
Preparation EVA heat conduction compound cutan A, is made up of the raw material of following mass fraction:
The copolymer 1 of ethylene-vinyl acetate 00 part,
Tert-butyl hydroperoxide 2-ethylhexyl carbonate 0.8 part,
Three (2,4-di-tert-butyl-phenyl) phosphorous acid ester 0.4 part,
2-hydroxyl-4-n-octyloxy hexichol first 1 part,
Aerosil 4 parts.
Mixed in proportion by above-mentioned raw materials, subsequently mixture is poured into forcing machine and carry out blending extrusion, extrudate, through curtain coating, cooling, baking oven sizing, traction, coiling process, obtains described EVA packaging adhesive film A.
Embodiment 2
Preparation EVA heat conduction compound cutan B, is made up of the raw material of following mass fraction:
The copolymer 1 of ethylene-vinyl acetate 00 part,
Two (t-butyl peroxy) hexane 0.6 part of 2,5-dimethyl-2,5-,
Three (2,4-di-tert-butyl-phenyl) phosphorous acid ester 0.3 part,
2-hydroxyl-4-n-octyloxy hexichol first 1 part,
Aerosil 3 parts.
Mixed in proportion by above-mentioned raw materials, subsequently mixture is poured into forcing machine and carry out blending extrusion, extrudate, through curtain coating, cooling, baking oven sizing, traction, coiling process, obtains described EVA packaging adhesive film B.
Embodiment 3
The EVA heat conduction compound cutan obtained to embodiment 1 and 2 carries out adhesive property, shock resistance, and result is as shown in table 1.Adhesive property is tested according to standard GB/T/T2790 " tackiness agent 180 DEG C of stripping strength experimental techniques detour material to rigid material "; The shock resistance Examination on experimental operation that shock resistance specifies according to " toughened glass " GB/T9963-1998 and national standard " building curtain wall " GB/T21086-2007 is tested.
To embodiment and 2 packaging adhesive film encapsulation same components carry out pid test, the results are shown in Table shown in 1.
Select testing method: 80% humidity, at 75 DEG C, cover Copper Foil at assembly surface and connect the positive pole of 200V, battery connects negative pole, test battery efficiency after 72 hours.
Table 1
As can be seen here, the EVA heat conduction compound cutan that prepared by above-described embodiment has good adhesive property, shock resistance and anti-pid performance.
Above embodiment display and describe ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification sheets just illustrates principle of the present invention; instead of limit the scope of the invention by any way; without departing from the scope of the invention; the present invention also has various changes and modifications, and these changes and improvements all fall in claimed scope.
Claims (1)
1. the photovoltaic encapsulation preparation method of EVA heat conduction compound cutan, mixed in proportion by following raw material, subsequently mixture is poured into forcing machine and carry out blending extrusion, extrudate is through curtain coating, cooling, baking oven sizing, traction, coiling process, obtain described EVA packaging adhesive film, raw material consists of:
The copolymer 1 of ethylene-vinyl acetate 00 part,
Crosslinking and curing agent 0.6-0.8 part,
Antioxidant 0.3-0.4 part,
At least one is selected from compound 0.5-1 part of hydroxy benzophenone,
And silicon-dioxide,
Wherein, silicon-dioxide and at least one are selected from the ratio of quality and the number of copies of the compound of hydroxy benzophenone for (3-5): 1;
In the multipolymer of described ethylene-vinyl acetate, vinyl acetate between to for plastic mass content is 28 ~ 37%, and melt index values is 30-50g/10min;
Described crosslinking and curing agent is tert-butyl hydroperoxide 2-ethylhexyl carbonate or two (t-butyl peroxy) hexane of 2,5-dimethyl-2,5-;
Described oxidation inhibitor is two (2,4-dicumylphenyl) pentaerythritol diphosphites or three (2,4-di-tert-butyl-phenyl) phosphorous acid ester;
The compound of described hydroxy benzophenone is Octabenzone;
Described silicon-dioxide is aerosil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410382044.5A CN104140767B (en) | 2014-08-06 | 2014-08-06 | The photovoltaic encapsulation preparation method of EVA heat conduction compound cutan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410382044.5A CN104140767B (en) | 2014-08-06 | 2014-08-06 | The photovoltaic encapsulation preparation method of EVA heat conduction compound cutan |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104140767A CN104140767A (en) | 2014-11-12 |
| CN104140767B true CN104140767B (en) | 2016-01-27 |
Family
ID=51850111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410382044.5A Expired - Fee Related CN104140767B (en) | 2014-08-06 | 2014-08-06 | The photovoltaic encapsulation preparation method of EVA heat conduction compound cutan |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104140767B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104152066A (en) * | 2014-08-11 | 2014-11-19 | 宁波华丰包装有限公司 | Potential induced degradation (PID) effect-resistant ethylene vinyl acetate (EVA) encapsulated gel film |
| CN109337596A (en) * | 2018-08-17 | 2019-02-15 | 佛山市森昂生物科技有限公司 | A kind of preparation method of the thermally conductive compound cutan of EVA |
| CN111732902A (en) * | 2020-07-02 | 2020-10-02 | 常州斯威克光伏新材料有限公司 | Anti-polarization packaging adhesive film for double-sided battery and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1150357A1 (en) * | 1998-12-07 | 2001-10-31 | Bridgestone Corporation | Cover material for solar cell, sealing film and solar cell |
| CN103374313A (en) * | 2012-04-23 | 2013-10-30 | 上海杰事杰新材料(集团)股份有限公司 | Ethylene-vinyl acetate copolymer (EVA) adhesive film and preparation method thereof |
-
2014
- 2014-08-06 CN CN201410382044.5A patent/CN104140767B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1150357A1 (en) * | 1998-12-07 | 2001-10-31 | Bridgestone Corporation | Cover material for solar cell, sealing film and solar cell |
| CN103374313A (en) * | 2012-04-23 | 2013-10-30 | 上海杰事杰新材料(集团)股份有限公司 | Ethylene-vinyl acetate copolymer (EVA) adhesive film and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104140767A (en) | 2014-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101901844B (en) | Solar cell conductive slurry and preparation method thereof | |
| CN104112785B (en) | A kind of solar cell backboard film and preparation method thereof | |
| CN103421443B (en) | A kind of solar module packaging adhesive film | |
| CN102863914B (en) | Solar cell packaging rubber film and preparation method thereof | |
| DE112009001580B4 (en) | Ethylene copolymer composition, film for sealing a solar cell element and their use | |
| CN102127301B (en) | Light ageing resistant blend for composite insulator and preparation method thereof | |
| CN104140767B (en) | The photovoltaic encapsulation preparation method of EVA heat conduction compound cutan | |
| CN102433077A (en) | Ethylene vinyl acetate (EVA) adhesive film for solar cell and preparation method thereof | |
| CN105111950A (en) | EVA adhesive film and preparation method thereof | |
| CN102115643A (en) | Novel solar cell packaging adhesive film | |
| CN102134450A (en) | High-adhesive-strength ethylene vinyl acetate adhesive film for packaging solar cells and preparation method thereof | |
| CN103687907A (en) | Vinylidene fluoride resin composition, resin film, back sheet for solar cells, and solar cell module | |
| CN103555214B (en) | Non-crosslinked EVA (ethylene-vinyl-acetate) rubber film for packaging thin-film solar cells and manufacturing method thereof | |
| CN104152066A (en) | Potential induced degradation (PID) effect-resistant ethylene vinyl acetate (EVA) encapsulated gel film | |
| CN106366540A (en) | Heat-sealable insulating material as well as preparation method and application thereof | |
| CN103681920B (en) | A kind of solar cell backboard and manufacture method thereof | |
| CN102504711B (en) | Ethylene-vinyl acetate copolymer adhesive film for packaging solar batteries and preparation method thereof | |
| CN103818079A (en) | PET/POE composite membrane for photovoltaic module encapsulating and preparing method thereof | |
| CN102368511B (en) | Preparation method of solar cell back film | |
| CN104152065B (en) | A kind of have the EVA packaging adhesive film turning photoeffect | |
| CN105969250A (en) | Production technique of transparent EVA (ethylene-vinyl acetate) packaging adhesive film for double-glazed solar photovoltaic modules | |
| CN111484807B (en) | Water-blocking adhesive tape for photovoltaic module frame and preparation method thereof | |
| CN103694910B (en) | The photovoltaic module polyolefine packaging adhesive film of the anti-pid effect of a kind of energy | |
| CN103725209B (en) | EVA film and preparation method thereof | |
| CN111534237B (en) | Photo-thermal dual-curing polyolefin packaging adhesive film and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160127 Termination date: 20180806 |