CN104122418A - Integrated probe and test and measurement instrument with integrated probe - Google Patents
Integrated probe and test and measurement instrument with integrated probe Download PDFInfo
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- CN104122418A CN104122418A CN201310149432.4A CN201310149432A CN104122418A CN 104122418 A CN104122418 A CN 104122418A CN 201310149432 A CN201310149432 A CN 201310149432A CN 104122418 A CN104122418 A CN 104122418A
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- probe
- insulating plug
- injection moulding
- pcb board
- pilot hole
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Abstract
The invention discloses an integrated probe and a test and measurement instrument with an integrated probe and relates to the field of electrical variable testing. The integrated probe contains a front-end assembly, a cable core and a BNC connector. The front-end assembly contains a PCB, a probe and a fixation pin which are installed on the PCB, a compensating circuit mounted on the PCB, a front-end insulating layer covering the PCB and the compensating circuit, and a metallic shielding tube installed outside the front-end insulating layer. The BNC connector contains a BNC shell and a BNC core. The BNC shell contains a cable connecting part and a front-end assembly connecting part. One end of the BNC core is connected with the cable core, and the other end of the BNC core is connected with the fixation pin. The integrated probe also contains an integrated injection rubber-covered layer which is fixedly installed on the external surface of the front-end assembly connecting part of the BNC connector and on the external surface of the front-end assembly so as to fixedly connect the BNC connector and the front-end assembly. The front-end insulating layer also adopts the injection rubber-covered layer. Thus, during injection of the integrated injection rubber-covered layer, the metallic shielding tube doesn't deform, and equivalent capacitance at the front end of the probe is stable.
Description
Technical field
The present invention relates to electric variable field tests, be specifically related to the measuring probe of the device that shows electric variable or waveform.
Background technology
Probe is a kind of device for surveying instrument collection signal, and it is input to collection signal in instrument, instrument.Under normal circumstances, between probe and instrument, be designed to removable structure, so that the carrying of instrument, instrument, arrangement and use.Modal surveying instrument comprises oscillograph, spectrum analysis instrument and data collector.
With reference to Fig. 1, the probe of prior art comprises cable 1, BNC(coaxial cable connector) body 3, probe front end 5, probe interface 6.
With reference to Fig. 2, prior art probe front end 5 comprises: probe 14, probe interface 13, pcb board and compensating circuit 16, probe core housing 15, shielded-plate tube 12, shell 11.Wherein, probe 14 is installed on probe interface 13, and pcb board and compensating circuit 16 are fixed in probe core housing 15.Probe interface 13 is metal customization parts, and in a tubular form, its afterbody is welded on one end of pcb board and compensating circuit 16 to the front end of probe interface 13.Shielded-plate tube 12 is sleeved on the outside of probe core housing 15, and shell 11 is sleeved on the outside of shielded-plate tube 12.
With reference to Fig. 3; at BNC body 3 outer setting external threads 18, in conjunction with seeing figures.1.and.2, the correspondence position of shell 11 inner sides is also provided with screw thread; when installation; the BNC body 3 of this probe is threaded connection with shell 11, still, because need very high machine work precision at BNC body 3 external thread 18 of getting on the bus out; this has not only increased the cost of probe; and probe in use, often can, because of there is the loosening phenomenon that is threaded, cause the inconvenience in use.
In prior art probe, the connected mode of BNC body 3 and cable 1 has a variety of, and the Chinese utility model patent that the patent No. is ZL200820122594.3 discloses a kind of connected mode.With reference to Fig. 4, this probe comprises: probe interface 6, cable 1, BNC body 3, BNC contact pin 4, hold-down ring 2, probe front end 5.Wherein, BNC body 3, BNC contact pin 4, the common link that forms cable 1 and probe front end 5 of hold-down ring 2.Probe interface 6 comprises BNC male, tail cover and housing, for connecting probe and instrument.
With reference to Fig. 5, cable 1 is made up of crust 7, screen layer 8, insulation course 9, core 10.
In conjunction with reference to Fig. 6, the core 10 of cable 1 is welded on the welding hole 17 of BNC contact pin 4, and hold-down ring 2 is enclosed within on cable 1, and the screen layer 8 of cable 1 is evenly pressed on the afterbody outer wall of BNC body 3.BNC contact pin 4 is inserted in BNC insertion pipe (for connecting the metallic sheath of BNC contact pin and compensating circuit, do not indicate in figure), and BNC insertion pipe is welded on the other end of pcb board and compensating circuit 16.
The installation process of probe is as follows: first hold-down ring 2 is enclosed within on cable 1 in advance, cable 1 is successively pushed aside, then core 10 is welded in the welding hole 17 of BNC contact pin 4, BNC contact pin 4 is inserted to BNC body 3, again the screen layer of cable 18 is attached to the afterbody of BNC body 3, by hold-down ring 2 push-tights, allow hold-down ring 2 screen layer 8 of cable 1 is evenly pressed on the afterbody outer wall of BNC body 3, use crimper that hold-down ring 2 is pressed into hexagon, make it firmly be pressed on BNC body 3 afterbodys, docking BNC body 3 and BNC insertion pipe.
In prior art, because need between the shielded-plate tube 12 of probe and pcb board and compensating circuit 16 the probe core housing 15 for making compensating circuit 21 and shielded-plate tube 27 electrical isolations is installed, thereby make the volume of probe larger, use inconvenient.With reference to Fig. 7, show the structural representation of another small size probe front end 5A of prior art, small size probe front end 5A comprises pcb board 20, be arranged on the compensating circuit 21 on pcb board 20, be welded on the probe 22 of pcb board 20 one end, be welded on the locking pin 23 of pcb board 20 other ends, cover the thermoplastic tube 26 on pcb board 20 and compensating circuit 21, be arranged on the probe insulating plug 24 at the middle part of probe 22, be arranged on the locking pin insulating plug 25 at the middle part of locking pin 23, there is metallic shield pipe 27 in thermoplastic tube 26 and the outer cover of probe insulating plug 24 and locking pin insulating plug 25.Heat-shrink tube 26 is sleeve pipes that heating can be shunk, thermoplastic tube 26 is enclosed within on pcb board 20 and compensating circuit 21, need manual control heat gun to heat thermoplastic tube 26, thermoplastic tube 26 after heating can be shunk and be tightly placed on pcb board 20 and compensating circuit 21, for making compensating circuit 21 and shielded-plate tube 27 electrical isolations.But, owing to adopting in this way while making probe front end insulation course, different workmans use the angle of heat gun, highly different at every turn, cause the contraction situation difference of each manual manufacture thermoplastic tube 26, thereby the DIELECTRIC CONSTANT ε that the thermoplastic tube 26 of different probes is produced can not be consistent.The DIELECTRIC CONSTANT ε of the thermoplastic tube 26 on different probes inconsistent, the equivalent capacity of upper compensating circuit 21 of can making to pop one's head in produces difference, and then make the Frequency Response of different probes inconsistent, affect the performance index of probe, for factory's batch production probe has caused difficulty.
To sum up, there is following technical matters in prior art probe:
Problem 1: the BNC body 3 of probe adopts and is threaded with shell 11, and cost is high, and screw thread may become flexible.
Problem 2: in small size probe front end 5A, adopted thermoplastic tube as front end insulation course, caused the performance of different probes inconsistent.
Summary of the invention
Technical matters to be solved by this invention is: adopt and be threaded with shell for the BNC body of popping one's head in prior art, cost is high, and the problem that screw thread may be loosening provides a kind of integral type probe.
A kind of integral type probe provided by the invention, comprises front end assemblies, cable core, bnc connector,
Described front end assemblies comprises pcb board, be arranged on probe and locking pin on described pcb board, be arranged on the metallic shield pipe of described pcb board outside, described bnc connector comprises BNC shell and BNC core, and described BNC shell comprises cable connecting portion and front end assemblies connecting portion; One end of described BNC core is connected with described cable core, the other end of described BNC core is connected with described locking pin, also there is an integral type injection moulding encapsulate layer, be fixedly connected with the outside surface of front end assemblies connecting portion and the outside surface of described front end assemblies of described bnc connector.
Integral type disclosed by the invention probe, adopts integral type injection moulding encapsulate layer, and bnc connector and front end assemblies are fixedly connected with, and greatly reduces the cost of probe, and connects fasteningly, uses reliable.
Give an example as one, can also at least be provided with a BNC shell position limiting structure at the outside surface of the front end assemblies connecting portion of described bnc connector, on the metallic shield pipe of described front end assemblies, can also at least be provided with a shielded-plate tube position limiting structure.BNC shell position limiting structure can make the close and firm more that is connected between bnc connector and front end assemblies with shielded-plate tube position limiting structure, is difficult for loosening.
Give an example as one, the BNC shell position limiting structure of described bnc connector and the shielded-plate tube position limiting structure of described front end assemblies can be all annular boss.
Give an example as one, the external diameter of the shielded-plate tube position limiting structure of described front end assemblies can be less than the external diameter of the front end assemblies connecting portion of described bnc connector.This project organization front end entirety that makes to pop one's head in is tapered, has avoided probe front end to cross the thick excessive embarrassment of surveying between components and parts that is difficult to insert.
Give an example as one, the metallic shield pipe of described front end assemblies comprises front pipe and tail pipe, and the external diameter of described front pipe can be less than the external diameter of described tail pipe, and the external diameter of described tail pipe can be less than the external diameter of the shielded-plate tube position limiting structure of described front end assemblies.This project organization front end entirety that makes to pop one's head in is thinner, and convenient probe is surveyed closing between components and parts.
Give an example as one, one end that described BNC core is connected with described locking pin can adopt a claw type structure, and described locking pin is inserted in described claw type structure.The design of claw type structure, makes described BNC core be connected closely with described locking pin, difficult drop-off.
Another technical matters to be solved by this invention is: adopt and be threaded with shell for the BNC body of popping one's head in surveying instrument in prior art, cost is high, and the problem that screw thread may be loosening provides a kind of surveying instrument with integral type probe.
A kind of surveying instrument with integral type probe of the present invention, comprise probe, described probe comprises front end assemblies, cable core, bnc connector, described front end assemblies comprises pcb board, be arranged on probe and locking pin on described pcb board, be arranged on the metallic shield pipe of described pcb board outside, described bnc connector comprises BNC shell and BNC core, and described BNC shell comprises cable connecting portion and front end assemblies connecting portion; One end of described BNC core is connected with described cable core, the other end of described BNC core is connected with described locking pin, also there is an integral type injection moulding encapsulate layer, be fixedly connected with the outside surface of front end assemblies connecting portion and the outside surface of described front end assemblies of described bnc connector.
Give an example as one, can also at least be provided with a BNC shell position limiting structure at the outside surface of the front end assemblies connecting portion of described bnc connector, on the metallic shield pipe of described front end assemblies, can also at least be provided with a shielded-plate tube position limiting structure.
Give an example as one, the BNC shell position limiting structure of described bnc connector and the shielded-plate tube position limiting structure of described front end assemblies can be all annular boss.
Give an example as one, the external diameter of the shielded-plate tube position limiting structure of described front end assemblies can be less than the external diameter of the front end assemblies connecting portion of described bnc connector.
Give an example as one, the metallic shield pipe of described front end assemblies comprises front pipe and tail pipe, and the external diameter of described front pipe can be less than the external diameter of described tail pipe, and the external diameter of described tail pipe can be less than the external diameter of the shielded-plate tube position limiting structure of described front end assemblies.
Give an example as one, one end that described BNC core is connected with described locking pin can adopt a claw type structure, and described locking pin is inserted in described claw type structure.
Another technical matters to be solved by this invention is: in probe front end, adopted thermoplastic tube as front end insulation course, easily caused the inconsistent problem of performance of different probes, a kind of integral type probe is provided.
A kind of integral type probe of the present invention, comprise pcb board, be arranged on the compensating circuit on described pcb board, be arranged on the probe of described pcb board one end, be arranged on the locking pin of the described pcb board other end, cover the front end insulation course on described pcb board and described compensating circuit, be arranged on the probe insulating plug at the middle part of described probe, be arranged on the locking pin insulating plug at the middle part of described locking pin, outer cover at described front end insulation course and described probe insulating plug and described locking pin insulating plug has metallic shield pipe, described front end insulation course is closely connected with described probe insulating plug and described locking pin insulating plug, described front end insulation course is injection moulding encapsulate layer.
Integral type probe disclosed by the invention, adopts injection moulding encapsulate layer as front end insulation course, and the value of the equivalent capacity parameter of probe front end is stable, does not need constantly to change the correct compensation that regulates tunable capacitor just can realize probe; Also avoided front end insulation course in prior art to adopt in the situation of the materials such as thermoplastic tube simultaneously, on the outside surface of front end assemblies connecting portion of bnc connector and the outside surface of front end assemblies when Integral injection molding injection moulding encapsulate layer, the defect of metallic shield pipe gross distortion.
Give an example as one, described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer can be the cylindrical structurals that diameter is identical, the inwall of described metallic shield pipe can be cylindrical structural, and the inwall of described metallic shield pipe contacts with described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer.
Give an example as one, described metallic shield pipe can also comprise front pipe and tail pipe two parts, and needle point one side of the close probe of described probe insulating plug can also be connected to cylindrical the second insulator that a diameter is less than the diameter of described probe insulating plug; The inwall of the tail pipe of described metallic shield pipe contacts with described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer, and the inwall of the front pipe of described metallic shield pipe contacts with described the second insulator.When this project organization makes on the outside surface of front end assemblies connecting portion of bnc connector and the outside surface of front end assemblies Integral injection molding injection moulding encapsulate layer, can reach good injection moulding effect, can not make metallic shield pipe produce deformation compared with large space because of having between metallic shield pipe and front end insulation course.
Give an example as one, the length of the front pipe of described metallic shield pipe can be identical with the length of described the second insulator.
Give an example as one, described injection moulding encapsulate layer can at least have a pilot hole, and described pilot hole can be hollow structure, is extended perpendicularly on a surface of described pcb board by the outside surface of described injection moulding encapsulate layer.
Give an example as one, described injection moulding encapsulate layer can at least have a upper pilot hole and a lower pilot hole, described upper pilot hole and described lower pilot hole can be hollow structure, described upper pilot hole is extended perpendicularly on a surface of described pcb board by the outside surface of described injection moulding encapsulate layer, and described lower pilot hole is extended perpendicularly on another surface of described pcb board by the outside surface of described injection moulding encapsulate layer.Due to the existence of pilot hole, in the time that pcb board is carried out to injection moulding encapsulate, can ensure that pcb board is not bending, reach better injection moulding effect.
To be solved by this invention have a technical matters to be: in prior art surveying instrument probe front end, adopt thermoplastic tube as front end insulation course, easily cause the inconsistent problem of performance of different probes, a kind of surveying instrument with integral type probe is provided.
A kind of surveying instrument with integral type probe of the present invention, comprise probe, described probe comprises pcb board, be arranged on the compensating circuit on described pcb board, be arranged on the probe of described pcb board one end, be arranged on the locking pin of the described pcb board other end, cover the front end insulation course on described pcb board and described compensating circuit, be arranged on the probe insulating plug at the middle part of described probe, be arranged on the locking pin insulating plug at the middle part of described locking pin, outer cover at described front end insulation course and described probe insulating plug and described locking pin insulating plug has metallic shield pipe, described front end insulation course is closely connected with described probe insulating plug and described locking pin insulating plug, described front end insulation course is injection moulding encapsulate layer.
Give an example as one, described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer can be the cylindrical structurals that diameter is identical, the inwall of described metallic shield pipe can be cylindrical structural, and the inwall of described metallic shield pipe contacts with described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer.
Give an example as one, described metallic shield pipe can also comprise front pipe and tail pipe two parts, and needle point one side of the close probe of described probe insulating plug can also be connected to cylindrical the second insulator that a diameter is less than the diameter of described probe insulating plug; The inwall of the tail pipe of described metallic shield pipe contacts with described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer, and the inwall of the front pipe of described metallic shield pipe contacts with described the second insulator.When this project organization makes on the outside surface of front end assemblies connecting portion of bnc connector and the outside surface of front end assemblies Integral injection molding injection moulding encapsulate layer, can reach good injection moulding effect, can not make metallic shield pipe produce deformation compared with large space because of having between metallic shield pipe and front end insulation course.
Give an example as one, the length of the front pipe of described metallic shield pipe can be identical with the length of described the second insulator.
Give an example as one, described injection moulding encapsulate layer can at least have a pilot hole, and described pilot hole can be hollow structure, is extended perpendicularly on a surface of described pcb board by the outside surface of described injection moulding encapsulate layer.
Give an example as one, described injection moulding encapsulate layer can at least have a upper pilot hole and a lower pilot hole, described upper pilot hole and described lower pilot hole can be hollow structure, described upper pilot hole is extended perpendicularly on a surface of described pcb board by the outside surface of described injection moulding encapsulate layer, and described lower pilot hole is extended perpendicularly on another surface of described pcb board by the outside surface of described injection moulding encapsulate layer.
Brief description of the drawings
Fig. 1 is the structural drawing of a kind of conventional probe in prior art;
Fig. 2 is the three-dimensional exploded view of prior art probe front end 5;
Fig. 3 is the screw position schematic diagram of the BNC body 3 of prior art probe;
Fig. 4 is the structural drawing of the another kind of probe of prior art;
Fig. 5 is the structural drawing of prior art cable 1;
Fig. 6 is the decomposing schematic representation of the installation process of the another kind of probe of prior art;
Fig. 7 is the three-dimensional exploded view of prior art probe front end 5A;
Fig. 8 is the structural drawing of a kind of integral type probe of the preferred embodiment of the present invention;
Fig. 9 is the partial cutaway schematic of the probe front end 100 of the preferred embodiment of the present invention;
Figure 10 is the partial cutaway schematic that the probe front end 100 of the preferred embodiment of the present invention is removed integral type injection moulding encapsulate layer 103;
Figure 11 is the structural representation of the metallic shield pipe 1014 of the preferred embodiment of the present invention;
Figure 12 is the structural representation that the front end assemblies 101 of the preferred embodiment of the present invention is removed metallic shield pipe 1014;
Figure 13 is the schematic equivalent circuit of probe in the time of connecting test surveying instrument;
Figure 14 is the pilot hole structural representation of the preferred embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are further described in detail.With reference to Fig. 8, in figure, part same as the prior art has adopted identical label.This integral type probe comprises probe interface 6, cable 1, probe front end 100, and in conjunction with reference to Fig. 9 and Figure 12, the front end 100 of popping one's head in comprises front end assemblies 101, bnc connector 102; Front end assemblies 101 comprises pcb board 1011, be welded on probe 1012 and locking pin 1013 on pcb board 1011, be arranged on the compensating circuit 1030 on pcb board 1011, be arranged on the metallic shield pipe 1014 of pcb board 1011 outsides, between pcb board 1011 and metallic shield pipe 1014, also have one deck front end insulation course 1015; The front end insulation course 1015 of this preferred embodiment can adopt injection moulding encapsulate mode to form; As other giving an example, probe 1012 can not be welded on pcb board 1011, and adopts the connected mode in background technology.Bnc connector 102 comprises BNC shell 1021 and BNC core 1022, and BNC shell 1021 comprises cable connecting portion 10211 and front end assemblies connecting portion 10212; Bnc connector 102 is as follows with the connection procedure of cable 1: card line plug 1023 is enclosed within on cable 1 in advance, cable 1 is successively pushed aside, then core 10 is welded in the welding hole of BNC core 1022, BNC core 1022 is inserted in bnc connector 102, again the screen layer of cable 18 is attached to the outside of card line plug 1023, to block line plug 1023 to bnc connector 102 push-tights, and allow card line plug 1023 that the screen layer 8 of cable 1 is evenly pressed between the afterbody inwall of cable connecting portion 10211 and the outer wall of card line plug 1023; As other giving an example, bnc connector 102 also can adopt the connected mode in background technology with cable 1.The other end of BNC core 1022 has a claw type structure 10221, locking pin 1013 inserts in claw type structure 10221, make locking pin 1013 tightr with being connected of BNC core 1022, as other giving an example, the other end of BNC core 1022 also can only adopt a tubular structure and locking pin 1013 to peg graft; Between BNC core 1022 and BNC shell 1021, also there is BNC insulation course 1024; On the outside surface of front end assemblies connecting portion 10212 and the outside surface of front end assemblies 101 of bnc connector 102, also there is an integral type injection moulding encapsulate layer 103, bnc connector 102 is closely connected with front end assemblies 101; Integral type injection moulding encapsulate layer 103 mode by injection moulding encapsulate form at bnc connector 102 and the outside surface of front end assemblies 101, the integral type injection moulding encapsulate layer 103 that injection moulding encapsulate mode forms is fixedly connected with bnc connector 102 with front end assemblies 101, having solved is threaded in prior art may there is loosening problem, and has reduced cost.Part outside surface at the outside surface of the cable connecting portion 10211 of bnc connector 102 and the cable 1 that is attached thereto also wraps one deck flexible glue insulation course 104, and flexible glue insulation course 104 plays the effect of protection to cable 1 and the coupling part of bnc connector 102.
Illustrate as one, with reference to Figure 10, in conjunction with reference to Fig. 9, in order to make integral type injection moulding encapsulate layer 103 close and firm bnc connector 102 is fixedly connected with front end assemblies 101 more, outside surface at the front end assemblies connecting portion 10212 of bnc connector 102 can also be provided with BNC shell position limiting structure 105, on the metallic shield pipe 1014 of front end assemblies 101, is provided with shielded-plate tube position limiting structure 106; Originally in illustrating, the shape of BNC shell position limiting structure 105 and the shape of shielded-plate tube position limiting structure 106 can be all annular boss, as required, BNC shell position limiting structure 105 can be made up of multiple annular boss, such as 4 annular boss, shielded-plate tube position limiting structure 106 can be that 1 annular boss can be also multiple annular boss; As other illustrating, the shape of BNC shell position limiting structure 105 and the shape of shielded-plate tube position limiting structure 106 are not limited to annular boss, also in the middle of can being, tool annular boss jaggy, can be also the protuberance structure that is distributed in front end assemblies connecting portion 10212 outside surfaces of bnc connector 102; The quantity of BNC shell position limiting structure 105 can be one, can be also multiple.
Illustrate as one, the external diameter of shielded-plate tube position limiting structure 106 is less than the external diameter of BNC shell position limiting structure 105, this project organization makes the integral type injection moulding encapsulate layer 103 that the mode by injection moulding encapsulate forms at bnc connector 102 and the outside surface of front end assemblies 101 can tapered structure, and then front end 100 entirety that make to pop one's head in are tapered, avoid probe front end 100 to cross the thick excessive embarrassment of surveying between components and parts that is difficult to insert.As other giving an example, the quantity of shielded-plate tube position limiting structure 106 can be 1, can be also multiple.When the quantity of shielded-plate tube position limiting structure 106 is while being multiple, in order to reach the overall tapered structure of probe front end 100, should reduce successively near the height of the shielded-plate tube position limiting structure 106 of probe 1012.Shielded-plate tube position limiting structure 106 can not only make integral type injection moulding encapsulate layer 103 more close and firm connect bnc connector 102 and front end assemblies 101, make integral type injection moulding encapsulate layer 103 there will not be transverse shakiness, and when mounted, front end assemblies connecting portion 10212 front portions by its apical grafting at connector 102, the degree of depth that locking pin 1013 is inserted to BNC core 1022 is carried out spacing, makes locking pin 1013 more stable with being connected of BNC core 1022.
Illustrate as one, with reference to Figure 11, metallic shield pipe 1014 can comprise front pipe 10141 and tail pipe 10142, and the external diameter of front pipe 10141 is less than the external diameter of tail pipe 10142, and the external diameter of tail pipe 10142 is less than the external diameter of the shielded-plate tube position limiting structure 106 of front end assemblies 101.This project organization make the to pop one's head in tapered structure of front end 100, entirety is thinner, and convenient probe is surveyed in the narrow location of closing between components and parts.As other giving an example, front pipe 10141 and tail pipe 10142 also can be made identical external diameter.
With reference to Figure 12, be provided with probe insulating plug 1016 at the middle part of probe 1012, be provided with locking pin insulating plug 1017 at the middle part of locking pin 1013, front end insulation course 1015 is closely connected with probe insulating plug 1016 and locking pin insulating plug 1017, and front end insulation course 1015 is the injection moulding encapsulate layers that adopt injection moulding encapsulate mode to form.Because front end insulation course 1015 adopts the technical scheme of injection moulding encapsulate layer, avoid front end insulation course 1015 to adopt in the situation of the materials such as thermoplastic tube, due to the pressure reason producing when Integral injection molding injection moulding encapsulate layer 103 on the outside surface of front end assemblies connecting portion 10212 of bnc connector 102 and the outside surface of front end assemblies 101, make metallic shield pipe 1014 produce the defect of gross distortion.Here also it should be noted that, in the time of metallic shield pipe 1014 gross distortion, as easy as rolling off a logly produce pressure because of its front end insulation course 1015 to inner employing thermoplastic tube, make the breakage of front end insulation course 1015, cause between the compensating circuit 1030 on metallic shield pipe 1014 and pcb board 1011 and form short circuit.
Front end insulation course 1015 adopt injection moulding encapsulate layer compared to existing technology front end insulation course 1015 adopt thermoplastic tube also to there is following technique effect:
With reference to Figure 13, the probe equivalent input resistance R of front end 100 and the input resistance Rscope of equivalent input capacitance C and surveying instrument and a proportion divider circuit of input capacitance Cscope formation, in figure, capacitor C 2, C3 and C4 are the equivalent capacity of popping one's head between pcb board 1011 and components and parts and the metallic shield pipe 1014 of front end 100.Cwire is the stray capacitance that probe cable 1 brings, in actual application, in order to realize the coupling to different surveying instrument input capacitance parameters, in the design of probe, need to add tunable capacitor Ccomp, use before probe, by regulating tunable capacitor Ccomp, realize the correct compensation of probe, in probe bandwidth range, the smooth condition of frequency response need to meet R × (C+C3)=Rscope × (C4+Cwire+Ccomp+Cscope), what mainly consider due to parameter matching is the equivalent parameters on bleeder circuit, capacitor C 2 is that input node is to ground, so do not participate in the calculating of dividing potential drop ratio circuit.
Due to capacitor C 2, C3 and C4 be probe fore-end pcb board 1011 and components and parts and metallic shield pipe 1014 between equivalent capacity, the specific inductive capacity of the medium between the components and parts on distance, the pcb board 1011 of the size of capacitance and pcb board 1011 and metallic shield pipe 1014 and distance, pcb board 1011 and the metallic shield pipe 1014 of metallic shield pipe 1014, and the specific inductive capacity of medium between components and parts and metallic shield pipe 1014 on pcb board 1011 is relevant.The capacitance principle that the value of capacitor C 2, C3 and C4 can be applied parallel-plate calculates, and the computing formula of parallel plate capacitor is as follows:
For probe front end 100, because its structure is fixed, be DIELECTRIC CONSTANT ε so affect the factor of equivalent capacity parameter main, different medium DIELECTRIC CONSTANT ε differences, the equivalent capacitance value forming is not identical yet.Medium between medium between pcb board 1011 and the metallic shield pipe 1014 of aforementioned probe front end 100 and components and parts and the metallic shield pipe 1014 on pcb board 1011 mainly contains two, one is heat-shrink tube, another one is the air between thermoplastic tube and metallic shield pipe 1014, calculates total specific inductive capacity and need to consider the factor of two aspects.Because heat-shrink tube is the sleeve pipe that heating can be shunk, thermoplastic tube is enclosed within on pcb board 1011 and compensating circuit 1030, need manual operation heat gun to heat thermoplastic tube, thermoplastic tube after heating is tightly placed on pcb board 1011 and compensating circuit 1030, because everyone uses the difference such as angle, height of heat gun at every turn, after causing each manual operation, the DIELECTRIC CONSTANT ε of thermoplastic tube can not be consistent, and can bring thus the equivalent capacity of probe front end 100 to have certain deviation.This equivalent capacity by the probe front end 100 that causes different probes also changes accordingly, and this just needs constantly to change and regulate tunable capacitor Ccomp, could realize the correct compensation of probe, and this batch production to probe has brought huge inconvenience.
And the specific inductive capacity of injection moulding encapsulate layer is metastable, so the value of the equivalent capacity parameter of probe front end is stable, do not need constantly to change the correct compensation that regulates tunable capacitor Ccomp just can realize probe.
Part can be used for the specific inductive capacity of insulating material of injection moulding encapsulate as following table:
| Title | Specific inductive capacity |
| PVC | 1.4 |
| POLYPROPYLENE | 1.5 |
| TEFLON | 2 |
For the specific inductive capacity to insulating material, considering of several factors such as manufacturability and material cost, in the preferred embodiment of the present invention, the injection moulding encapsulate layer of pcb board 1011 and compensating circuit 1030 outsides is selected PP(polypropylene) material, due to PP(polypropylene) plasticity of material is better, on the outside surface of front end assemblies connecting portion 10212 of bnc connector 102 and the outside surface of front end assemblies 101 when Integral injection molding injection moulding encapsulate layer 103, PP(polypropylene) external pressure of material can support metal shielded-plate tube 1014 outer injection encapsulate time, prevent that metallic shield pipe 1014 is out of shape.
In addition, the specific inductive capacity of the injection moulding encapsulate layer selected materials of pcb board 1011 and compensating circuit 1030 outsides will directly affect the equivalent capacity parameter of probe front end 100, for probe front end 100, equivalent capacity is less, and also just less on the impact of front-end circuit, equivalent capacity is bigger than normal, can make the rise time of the characterisitic parameter of probe decline, Bandwidth Reduction, this deviation can cause the consistance of probe performance poor, and particularly the high resistant of the above high bandwidth of 300MHz bandwidth probe is particularly evident.PP(polypropylene) specific inductive capacity of material is 1.5, equivalent capacity parameter is more satisfactory.
As other for example, the injection moulding encapsulate layer of pcb board 1011 and compensating circuit 1030 outsides can also be selected the Polyvinylchloride as PVC() material or TEFLON(polyflon, Teflon) other material such as material.
As other giving an example, by the different selections to injection moulding encapsulate layer, realize amendment and the adjusting of probe front end 100 tunable capacitor Ccomp parameters, can make the making of probe relatively flexible, be convenient to control.
As other giving an example, with reference to Figure 12, in conjunction with reference to Figure 11, in the time that metallic shield pipe 1014 comprises front pipe 10141 and tail pipe 10142, needle point one side of the close probe 1012 of probe insulating plug 1016 can also be connected to cylindrical the second insulator 1018 that a diameter is less than the diameter of probe insulating plug 1016, the diameter of the inwall of the tail pipe of metallic shield pipe 1,014 10142 is made to identical nominal size with the diameter of front end insulation course 1015, the diameter of the inwall of the tail pipe 10142 of metallic shield pipe 1014 is got the positive difference size of described nominal size, the diameter of front end insulation course 1015 is got the minus tolerance size of described nominal size, when installation, by front end assemblies 101 according to probe 1012 front, the posterior direction of locking pin 1013 is inserted metallic shield pipe 1014 along the afterbody of metallic shield pipe 1014, make inwall and front end insulation course 1015 close contacts of the tail pipe 10142 of metallic shield pipe 1014, when this makes on the outside surface of the front end assemblies connecting portion 10212 of bnc connector 102 and the outside surface of front end assemblies 101 Integral injection molding injection moulding encapsulate layer 103, can reach good injection moulding effect, can be because of having compared with large space and make metallic shield pipe 1014 produce deformation between metallic shield pipe 1014 and front end insulation course 1015.In originally illustrating, probe insulating plug 1016 and cylindrical the second insulator 1018 are to adopt the mode of injection moulding encapsulate to form on probe 1012.
As other giving an example, when probe insulating plug 1016, when locking pin insulating plug 1017 and front end insulation course 1015 all adopt the identical cylindrical structural of diameter, metallic shield pipe 1014 is inserted into probe insulating plug 1016, when in the outside of front end insulation course 1015 and locking pin insulating plug 1017, the inwall of the tail pipe 10142 of metallic shield pipe 1014 and probe insulating plug 1016, locking pin insulating plug 1017 and the equal close contact of front end insulation course 1015, while making on the outside surface of front end assemblies connecting portion 10212 of bnc connector 102 and the outside surface of front end assemblies 101 Integral injection molding injection moulding encapsulate layer 103, can reach better injection moulding effect.
In originally illustrating, because the diameter of cylindrical the second insulator 1018 is less than the diameter of probe insulating plug 1016, the diameter of the inwall of the front pipe 10141 of metallic shield pipe 1014 is made to identical nominal size with the diameter of cylindrical the second insulator 1018, the diameter of the inwall of the front pipe 10141 of metallic shield pipe 1014 is got the positive difference size of described nominal size, the diameter of cylindrical the second insulator 1018 is got the minus tolerance size of described nominal size, make metallic shield pipe 1014 be inserted into cylindrical the second insulator 1018, probe insulating plug 1016, when in the outside of front end insulation course 1015 and locking pin insulating plug 1017, make inwall and second insulator 1018 close contacts of the front pipe 10141 of metallic shield pipe 1014.In originally illustrating, the length of the front pipe 10141 of metallic shield pipe 1014 is identical with the length of cylindrical the second insulator 1018.
As other giving an example, the length of the front pipe 10141 of metallic shield pipe 1014 also can be slightly less than the length of cylindrical the second insulator 1018.
As other giving an example, probe insulating plug 1016 can not established cylindrical the second insulator 1018, and corresponding, front pipe 10141 and the tail pipe 10142 of metallic shield pipe 1014 can be made identical external diameter.
As other giving an example, also be connected near probe 1012 needle point one sides cylindrical the 3rd insulator 1019 that a diameter is less than cylindrical the second insulator 1018 at cylindrical the second insulator 1018, the diameter of cylindrical the 3rd insulator 1019 is corresponding with ground spring, conveniently ground connection in the time of probe test.
As other giving an example, also be connected near a side of BNC core 1022 the 4th insulator 1020 that a diameter is less than locking pin insulating plug 1017 at locking pin insulating plug 1017, the shape of the 4th insulator 1020 does not have fixed constraints, can be cylindrical, can be square, also can be prismatic, the effect of the 4th insulator 1020 is: locking pin 1013 inserts BNC core 1022, locking pin 1013 main bodys exposed between BNC core 1022 and locking pin insulating plug 1017 are wrapped, to reach better insulation effect.
As other giving an example, because front end insulation course 1015 is the injection moulding encapsulate layers that adopt injection moulding encapsulate mode to form, in injection moulding encapsulation process, deform or damage for fear of pcb board 1011 and compensating circuit 1030, in injection moulding encapsulation die, also comprise the pilot pin with the design of injection mold integral type, pilot pin can be one, also can be multiple, pilot pin extends to the diverse location of pcb board 1011 from injection moulding encapsulation die, give the anchorage force of pcb board 1011 different directions, make pcb board 1011 in the process of injection moulding encapsulate, not bend or be out of shape, after injection moulding completes, remove injection moulding encapsulation die and the pilot pin with the design of injection moulding encapsulation die integral type, on the front end insulation course 1015 of injection formed, just there will be pilot hole.In originally illustrating, described pilot pin can be tightly to withstand pcb board 1011, also can be to be built up in the position that approaches pcb board 1011, for making pcb board 1011, in the process of injection moulding encapsulate, excessive bending or distortion not occur, remove injection moulding encapsulation die and during with the pilot pin of injection moulding encapsulation die integral type design, on the front end insulation course 1015 of injection formed, also can retain the pilot hole that pilot pin forms.
With reference to Figure 14, as other giving an example, if when injection moulding encapsulation die has two pilot pins up and down that design with injection mold integral type, remove injection moulding encapsulation die and during with the pilot pin of injection moulding encapsulation die integral type design, can make front end insulation course 1015 leave a upper pilot hole 1031 and a lower pilot hole 1032, upper pilot hole 1031 is extended perpendicularly to the upper surface of pcb board 1011 by the outside surface of front end insulation course 1015, lower pilot hole 1032 is extended perpendicularly to the lower surface of pcb board 1011 by the outside surface of front end insulation course 1015.It should be noted that, the upper surface of pcb board 1011 and lower surface are comparatively speaking, choose on pcb board 1011, and one of them surface of laying front-end circuit is upper surface, and another relative surface is lower surface.Here also it should be noted that in addition, because the pilot pin on injection moulding encapsulation die can be tightly to withstand pcb board 1011, also can be to be built up in the position that approaches pcb board 1011, therefore, in originally illustrating, described upper pilot hole 1031 or lower pilot hole 1032 are extended perpendicularly to the surface of pcb board 1011 by the outside surface of front end insulation course 1015, can be the surface of direct sensible pcb board 1011, can be also only to lead to a lip-deep position that approaches pcb board 1011.
As other giving an example, in originally illustrating, the aperture of upper pilot hole 1031 and lower pilot hole 1032 is 1mm.
As other giving an example, when the components and parts on pcb board 1011 are when all cloth is in the same side, or when pcb board 1011 under pressure, only can be to curving time, on front end insulation course 1015, also can only be provided with a pilot hole, the pcb board 1011 when preventing injection moulding encapsulate deforms.
As other giving an example, in originally illustrating, in injection moulding encapsulation die, also comprise the one or more pilot pins with injection mold one, thereby make front end insulation course 1015 have pilot hole 1031 on one or more, on one of them, pilot hole 1031 is located at pcb board 1011 centre position along its length.As another example, in originally illustrating, front end insulation course 1015 has one or more lower pilot hole 1032, and one of them lower pilot hole 1032 is located at pcb board 1011 centre position along its length.Pilot hole 1031 and/or lower pilot hole 1032 are set in the centre position of pcb board 1011, can in the time of injection moulding encapsulate, control to greatest extent pcb board 1011, it is not deformed.
In originally illustrating, the number of upper pilot hole 1031 and lower pilot hole 1032 can be identical, also can be different.As one for example, in originally illustrating, the upper surface that is distributed in pcb board 1011 and lower surface both sides that upper pilot hole 1031 and lower pilot hole 1032 can be symmetrical one by one.As other giving an example, in originally illustrating, upper pilot hole 1031 and lower pilot hole 1032 can intersect the upper surface and the lower surface both sides that are dislocatedly distributed in pcb board 1011 mutually,, position on adjacent two between pilot hole 1031 is to there being a lower pilot hole 1032, and the position between adjacent two lower pilot holes 1032 is to there being pilot hole 1031 on.
In above-mentioned each example, the compensating circuit 1030 on pcb board 1011 has all been avoided in the position of offering of upper pilot hole 1031 and lower pilot hole 1032.
As an instantiation, in above-mentioned each example, upper pilot hole 1031 and lower pilot hole 1032 are cylindrical.As another instantiation, in above-mentioned each example, upper pilot hole 1031 and lower pilot hole 1032 are circular cone or truncated cone-shaped.
Due to the existence of pilot pin, in the time that pcb board 1011 and compensating circuit 1030 are carried out to injection moulding encapsulate, can ensure that pcb board 1011 is not bending, reach better injection moulding effect.
Above-described is only the preferred embodiments of the present invention; institute is understood that; the explanation of above preferred embodiment is just for helping to understand method of the present invention and core concept thereof; the protection domain being not intended to limit the present invention; all any amendments of making, be equal to replacement etc., within protection scope of the present invention all should be included within thought of the present invention and principle.
Claims (12)
1. an integral type probe, comprise pcb board, be arranged on the compensating circuit on described pcb board, be arranged on the probe of described pcb board one end, be arranged on the locking pin of the described pcb board other end, cover the front end insulation course on described pcb board and described compensating circuit, be arranged on the probe insulating plug at the middle part of described probe, be arranged on the locking pin insulating plug at the middle part of described locking pin, outer cover at described front end insulation course and described probe insulating plug and described locking pin insulating plug has metallic shield pipe, it is characterized in that, described front end insulation course is closely connected with described probe insulating plug and described locking pin insulating plug, described front end insulation course is injection moulding encapsulate layer.
2. probe according to claim 1, it is characterized in that, described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer are the cylindrical structurals that diameter is identical, the inwall of described metallic shield pipe is cylindrical structural, and the inwall of described metallic shield pipe contacts with described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer.
3. probe according to claim 2, it is characterized in that, described metallic shield pipe comprises front pipe and tail pipe two parts, and needle point one side of the close probe of described probe insulating plug is also connected to cylindrical the second insulator that a diameter is less than the diameter of described probe insulating plug; The inwall of the tail pipe of described metallic shield pipe contacts with described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer, and the inwall of the front pipe of described metallic shield pipe contacts with described the second insulator.
4. probe according to claim 3, is characterized in that, the length of the front pipe of described metallic shield pipe is identical with the length of described the second insulator.
5. according to the probe described in claim 1,2,3 or 4, it is characterized in that, described injection moulding encapsulate layer at least has a pilot hole, and described pilot hole is hollow structure, is extended perpendicularly on a surface of described pcb board by the outside surface of described injection moulding encapsulate layer.
6. according to the probe described in claim 1,2,3 or 4, it is characterized in that, described injection moulding encapsulate layer at least has a upper pilot hole and a lower pilot hole, described upper pilot hole and described lower pilot hole are hollow structure, described upper pilot hole is extended perpendicularly on a surface of described pcb board by the outside surface of described injection moulding encapsulate layer, and described lower pilot hole is extended perpendicularly on another surface of described pcb board by the outside surface of described injection moulding encapsulate layer.
7. one kind has the surveying instrument of integral type probe, comprise probe, described probe comprises pcb board, be arranged on the compensating circuit on described pcb board, be arranged on the probe of described pcb board one end, be arranged on the locking pin of the described pcb board other end, cover the front end insulation course on described pcb board and described compensating circuit, be arranged on the probe insulating plug at the middle part of described probe, be arranged on the locking pin insulating plug at the middle part of described locking pin, outer cover at described front end insulation course and described probe insulating plug and described locking pin insulating plug has metallic shield pipe, it is characterized in that, described front end insulation course is closely connected with described probe insulating plug and described locking pin insulating plug, described front end insulation course is injection moulding encapsulate layer.
8. surveying instrument according to claim 7, it is characterized in that, described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer are the cylindrical structurals that diameter is identical, the inwall of described metallic shield pipe is cylindrical structural, and the inwall of described metallic shield pipe contacts with described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer.
9. surveying instrument according to claim 8, it is characterized in that, described metallic shield pipe comprises front pipe and tail pipe two parts, and needle point one side of the close probe of described probe insulating plug is also connected to cylindrical the second insulator that a diameter is less than the diameter of described probe insulating plug; The inwall of the tail pipe of described metallic shield pipe contacts with described probe insulating plug, described locking pin insulating plug and described injection moulding encapsulate layer, and the inwall of the front pipe of described metallic shield pipe contacts with described the second insulator.
10. surveying instrument according to claim 9, is characterized in that, the length of the front pipe of described metallic shield pipe is identical with the length of described the second insulator.
11. according to the surveying instrument described in claim 7,8,9 or 10, it is characterized in that, described injection moulding encapsulate layer at least has a pilot hole, and described pilot hole is hollow structure, is extended perpendicularly on a surface of described pcb board by the outside surface of described injection moulding encapsulate layer.
12. according to the surveying instrument described in claim 7,8,9 or 10, it is characterized in that, described injection moulding encapsulate layer at least has a upper pilot hole and a lower pilot hole, described upper pilot hole and described lower pilot hole are hollow structure, described upper pilot hole is extended perpendicularly on a surface of described pcb board by the outside surface of described injection moulding encapsulate layer, and described lower pilot hole is extended perpendicularly on another surface of described pcb board by the outside surface of described injection moulding encapsulate layer.
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| CN201310149432.4A CN104122418B (en) | 2013-04-26 | 2013-04-26 | A kind of integral type probe and the surveying instrument with integral type probe |
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| CN201310149432.4A CN104122418B (en) | 2013-04-26 | 2013-04-26 | A kind of integral type probe and the surveying instrument with integral type probe |
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| CN104122418B CN104122418B (en) | 2018-07-13 |
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| FR2596530A1 (en) * | 1986-03-27 | 1987-10-02 | Commissariat Energie Atomique | Fibre-optic optical sensor and process for manufacturing the said sensor |
| JPH04323564A (en) * | 1991-04-23 | 1992-11-12 | Hitachi Ltd | Sensor-integrated probe |
| CN1340713A (en) * | 2000-08-21 | 2002-03-20 | 特克特朗尼克公司 | Probe head adapter for measuring probe |
| WO2002062242A1 (en) * | 2000-11-17 | 2002-08-15 | The Regents Of The University Of California | Epidermal abrasion device mold, and method of fabricating same |
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| CN104122418B (en) | 2018-07-13 |
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Address after: Kolding road high tech Zone of Suzhou City, Jiangsu Province, No. 8 215163 Patentee after: Puyuan Jingdian Technology Co., Ltd Address before: Kolding road high tech Zone of Suzhou City, Jiangsu Province, No. 8 215163 Patentee before: SUZHOU RIGOL PRECISION ELECTRIC TECHNOLOGIES Co.,Ltd. |