CN104119679A - Silicone resin composite material as well as manufacturing method and application of silicone resin composite material and lighting device - Google Patents
Silicone resin composite material as well as manufacturing method and application of silicone resin composite material and lighting device Download PDFInfo
- Publication number
- CN104119679A CN104119679A CN201310155014.6A CN201310155014A CN104119679A CN 104119679 A CN104119679 A CN 104119679A CN 201310155014 A CN201310155014 A CN 201310155014A CN 104119679 A CN104119679 A CN 104119679A
- Authority
- CN
- China
- Prior art keywords
- silicone resin
- resin composite
- nano
- composite material
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention relates to a silicone resin composite material. The silicone resin composite material comprises nano-fluorescent powder, nano quantum dots and colorless and transparent silicone resin, wherein nano-fluorescent powder and nano quantum dots are uniformly dispersed in colorless and transparent silicone resin, the silicone resin composite material is in a cured structure, nano-fluorescent powder and nano quantum dots are the luminescent material and the silicone resin is a first packaging material. The invention also discloses a manufacturing method of the silicone resin composite material, a lighting device comprising the silicone resin composite material, and an application of the silicone resin composite material as the lighting device. The silicone resin composite material disclosed by the invention has the beneficial effects that by virtue of mixing the nanoscale fluorescent powder with nanoscale quantum dots, the silicone resin composite material prepared by the invention has an improved mixing uniformity and good luminescence property and is suitable for a photoelectric device or an LED solid lighting device and the packaging of the photoelectric device or LED solid lighting device.
Description
Technical field
The present invention relates to the manufacture method of a kind of silicone resin composite material, this silicone resin composite material, the illuminating device that contains this silicone resin composite material and this silicone resin composite material as the application of illuminating device, belong to luminous, lighting field.
Background technology
Along with the progressively enhancing of global energy crisis and people's energy-conserving and environment-protective consciousness, the green energy resource of a large amount of energy-conserving and environment-protective has been come into our life.The advantages such as photodiode (LED) is low because consuming energy, heat production is few, the life-span is long just progressively replace traditional an illuminating material, become lighting source of new generation.
But along with improving constantly of brightness and power, fluorescent material and packaged material become restriction LED and enter one of gordian technique of lighting field.Packaged material wherein mainly contains following effect:
Sealing and protection LED chip are normally worked, and avoid LED chip to be subject to the impact of humidity and temperature in surrounding environment;
Fix and support wire, preventing that electronic package is subject to mechanical vibration, impacts the variation that produces breakage and cause component parameter;
The gap that reduces specific refractory power between LED chip and air goes out with the hot type that increases light output and effectively inside is produced etc.
Therefore,, concerning packaged material, it will have good stopping property, light transmission, cohesiveness, specific refractory power, dielectric properties and mechanical property.Epoxy resin and organosilicon are the most frequently used LED encapsulation materials.At present, organosilicon encapsulating material has the required uvioresistant photosensitiveness of high-brightness LED and thermostability because of it, and its application and exploitation become mainstream technology gradually.
Traditional white light LEDs adopts the YAG fluorescein that is covered with Yellow light-emitting low temperature or orange red light on blue-ray LED.After gold-tinted and blue light, just can produce a kind of new photochromicly, its color approaches white at naked eyes very much.At present, light-emitting phosphor material has been widely applied in LED illumination and technique of display, but the light decay of fluorescent material is large, uniform particles degree is poor, work-ing life is short, is not still best LED luminescent material.Compare with natural light, lack red spectrum, and make illuminating LED light seem ice-cold and dazzling in this mixture colors, part luminescent lamp also has this disadvantage.Cast aside the factor that cost is high, in a sense, the soft not LED lamp that also hindered of light enters into family, extensive commercial process.On the other hand, at tens microns, there is problem pockety in packaging plastic in the particle diameter of the fluorescent material using at present; Its scattering of light effect meeting is accelerated the aging of potting resin material and the work-ing life of shortening LED.Meanwhile, the restriction of encapsulating structure also usually causes the inhomogeneous problem of LED space colourity.
Quantum dot is higher than the luminous efficiency of fluorescent material, the purity of longer service life, color is better, becomes the study hotspot of current New LED luminescent material.Quanta point material is by changing the kind of quantum dot and the scope that size is controlled material emmission spectrum.Quantum dot LED lamp incorporates the design of quantum dot optics and cold white light LEDs, utilizes the photochromic controlling technology of quantum dot, is stimulated and exhaled varicolored combination by be allowed quantum dot, to produce coloury, very bright warm white by light.For example, CdSe is important a member of II-VI family semiconductor material, and the energy gap of its body phase is 1.72 eV, so CdSe quantum dot is along with the variation of particle diameter, and its radiative wavelength can cover from indigo plant to red almost whole visible region.The colour temperature of general red light quantum point is 2700 Kelvins, the same with traditional incandescent light, and its colour developing coefficient is 90, more lower slightly than the colour developing coefficient (95) of conventional incandescent, and far above the colour developing coefficient (75) of existing LED.In addition, the less energy-consumption characteristic of quantum dot is to eliminate a considerable advantage of high energy consumption light source comprehensively.The blue light that quantum dot can send LED light source is converted into white light completely, rather than can only absorb a part as YAG fluorescein, this means under same bulb brightness, the required blue light of quantum dot LED lamp still less, thereby the electric power needing in electric light transforms still less, it can loss-rate be 65 lm/W, all higher than the energy loss-rate of conventional incandescent (15 lm/W) and luminescent lamp efficiency, can save the energy and surpass 80%.
To sum up, quantum dot LED light fixture has two outstanding features: (1) has realized the controlled of light color, makes frosty LED light become softer; (2) the more important thing is, owing to the primary colours of LED 100% can being converted into white light, it is more efficient and energy-conservation that quantum dot LED lamp becomes.Thereby make quantum dot LED head light there is the warm colour of LED head light light efficiency and incandescent light simultaneously.
But quantum dot is at color, life-span, cost and quantize on a large scale all also have a lot of problems to break through and to improve aspect production.Meanwhile, the also inhomogeneous problem of space in urgent need to be improved colourity of fluorescent material.
Summary of the invention
The object of the present invention is to provide a kind of silicone resin composite material of better performances, the manufacture method of this silicone resin composite material, the illuminating device that contains this silicone resin composite material and this silicone resin composite material as the application of illuminating device.
For solving, realize above-mentioned purpose, the present invention adopts following technical scheme: a kind of silicone resin composite material, it comprises nano-phosphor, nano-quantum point and water white silicone resin, wherein said nano-phosphor and nano-quantum point are dispersed in this water white silicone resin, described silicone resin composite material is consolidated structures, described nano-phosphor and nano-quantum point are as luminescent material, and described silicone resin is as the first packaged material.
As further improved technical scheme of the present invention: the 1.0-20.0 % that the weight percent content of described nano-phosphor is described silicone resin.
As further improved technical scheme of the present invention: the particle diameter of described nano-phosphor is 1.0-400 nanometer.
As further improved technical scheme of the present invention: described nano-phosphor is following independent material or their combination:
Fluorescent RE powder, rare-earth garnet fluorescent material, sulfurized alkaline earth metal gallate, alkaline earth sulfide, zinc sulphide type, alkali earth metal aluminate, phosphoric acid salt, borate, silicate, fluorine arsenate, fluogermanate, rare-earth sulfide, rare earth oxide, vanadate, Nitride phosphor.
As further improved technical scheme of the present invention: described nano-phosphor is rare earth doped YAG yttrium aluminium garnet fluorescent powder.
As further improved technical scheme of the present invention: described nano-phosphor is the YAG yttrium aluminium garnet fluorescent powder of Ce doping.
As further improved technical scheme of the present invention: the 0.01-5.0 % that the weight percent content of described nano-quantum point is described silicone resin.
As further improved technical scheme of the present invention: the particle diameter of described nano-quantum point is 1.0-20 nanometer.
As further improved technical scheme of the present invention: described nano-quantum point Wei You II-VI Zu Huo III-V family elementary composition.
As further improved technical scheme of the present invention: described nano-quantum point is ZnSe or CdS or CdSe or CdSe.
As further improved technical scheme of the present invention: described nano-quantum point is gallium arsenic (GaAs) or indium phosphide (InP) or gan.
As further improved technical scheme of the present invention: described nano-quantum point is nucleocapsid structure.
As further improved technical scheme of the present invention: described nano-quantum point is CdSe/ZnS.
As further improved technical scheme of the present invention: described silicone resin is solvent-borne type silicone resin or no-solvent type silicone resin, and the transmittance of described silicone resin in visible region is 85%-100%.
As further improved technical scheme of the present invention: described silicone resin is solvent-borne type silicone resin or no-solvent type silicone resin, and the refractive index of described silicone resin is 1.40-1.60.
As further improved technical scheme of the present invention: described silicone resin composite material also comprises the second packaged material, and the weight percent content of described the second packaged material accounts for the 1-80 % of whole described silicone resin composite material.
As further improved technical scheme of the present invention: described the second packaged material is epoxy resin.
The present invention also adopts following technical scheme: a kind of manufacture method of silicone resin composite material, it comprises the steps:
S1, provides the first mixed solution that contains nano-phosphor and the first organic solvent;
S2, provides the second mixed solution that contains nano-quantum point and the second organic solvent;
S3, provides water white silicon resin solution;
S4, mixes described the first mixed solution, the second mixed solution and silicon resin solution stir;
S5 makes the first organic solvent and the volatilization of the second organic solvent under vacuum, obtains aforesaid silicone resin composite material after curing molding.
As further improved technical scheme of the present invention: described the first organic solvent is following independent material or their combination: normal hexane, toluene, chloroform or methylene dichloride;
Described the second organic solvent is following independent material or their combination: normal hexane, toluene, chloroform or methylene dichloride;
Described silicon resin solution comprises the 3rd organic solvent, and described the 3rd organic solvent is following independent material or their combination: ethanol, acetone or toluene.
As further improved technical scheme of the present invention: in step S1, described the first mixed solution is scattered in nano-phosphor in described the first organic solvent and obtains;
In step S2, described the second mixed solution is dissolved in nano-quantum point particle in described the second organic solvent and obtains;
In step S3, described silicon resin solution is dissolved in water white silicone resin in described the 3rd organic solvent and obtains;
In step S5, described the first organic solvent, the second organic solvent and the 3rd organic solvent are volatilized completely, are placed in afterwards baking oven and are cured moulding, finally obtain described silicone resin composite material.
As further improved technical scheme of the present invention: silicone resin when described silicon resin solution can be less than 100,000 centipoise with viscosity is replaced.
The present invention also adopts following technical scheme: a kind of illuminating device, it comprises aforesaid silicone resin composite material.
As further improved technical scheme of the present invention: described illuminating device is photoelectric device or packaging of photoelectric device or LED solid state lighting device or LED solid state lighting device package.
The present invention also adopts following technical scheme: a kind of silicone resin composite material is as the application of illuminating device, and described silicone resin composite material is aforesaid silicone resin composite material.
As further improved technical scheme of the present invention: described illuminating device is photoelectric device or packaging of photoelectric device or LED solid state lighting device or LED solid state lighting device package.
Compared with prior art, fluorescent material and nano level quantum dot by hybrid nanoscale make silicone resin composite material of the present invention have improved mixing uniformity and good luminescent properties, are applicable to photoelectric device or LED solid state lighting device and encapsulation thereof.
Accompanying drawing explanation
Fig. 1 is the manufacturing process schematic diagram of silicone resin composite material of the present invention.
Fig. 2 is the fluorescence emission spectrogram of CdSe nano-quantum point, and wherein excitation wavelength is 520nm, and emission wavelength is 570nm.
Fig. 3 is transmission electron microscope (TEM) photo of CdSe nano-quantum point.
Embodiment
The present invention has disclosed a kind of silicone resin composite material, it comprises nano-phosphor, nano-quantum point and water white silicone resin, wherein said nano-phosphor and nano-quantum point are dispersed in this water white silicone resin, described silicone resin composite material is consolidated structures, described nano-phosphor and nano-quantum point are as luminescent material, and described silicone resin is as the first packaged material.
Preferably, the 1.0-20.0 % that the weight percent content of described nano-phosphor is described silicone resin.
Preferably, the particle diameter of described nano-phosphor is 1.0-400 nanometer.
Preferably, described nano-phosphor is following independent material or their combination:
Fluorescent RE powder, rare-earth garnet fluorescent material, sulfurized alkaline earth metal gallate, alkaline earth sulfide, zinc sulphide type, alkali earth metal aluminate, phosphoric acid salt, borate, silicate, fluorine arsenate, fluogermanate, rare-earth sulfide, rare earth oxide, vanadate, Nitride phosphor.
Preferably, described nano-phosphor is rare earth doped YAG yttrium aluminium garnet fluorescent powder.
Preferably, described nano-phosphor is the YAG yttrium aluminium garnet fluorescent powder of Ce doping.
Preferably, the 0.01-5.0 % that the weight percent content of described nano-quantum point is described silicone resin.
Preferably, the particle diameter of described nano-quantum point is 1.0-20 nanometer.
Preferably, described nano-quantum point Wei You II-VI Zu Huo III-V family is elementary composition.
Preferably, described nano-quantum point is ZnSe or CdS or CdSe or CdSe.
Certainly, described nano-quantum point can be also gallium arsenic (GaAs) or indium phosphide (InP) or gan.
Preferably, described nano-quantum point is nucleocapsid structure.
Preferably, described nano-quantum point is CdSe/ZnS.
Preferably, described silicone resin is solvent-borne type silicone resin or no-solvent type silicone resin, and the transmittance of described silicone resin in visible region is 85%-100%.
Preferably, described silicone resin is solvent-borne type silicone resin or no-solvent type silicone resin, and the refractive index of described silicone resin is 1.40-1.60.
Preferably, described silicone resin composite material also comprises the second packaged material, and the weight percent content of described the second packaged material accounts for the 1-80 % of whole described silicone resin composite material.
Preferably, described the second packaged material is epoxy resin.
Shown in please refer to the drawing 1, the present invention has also disclosed a kind of manufacture method of silicone resin composite material, and it comprises the steps:
S1, provides the first mixed solution that contains nano-phosphor and the first organic solvent;
S2, provides the second mixed solution that contains nano-quantum point and the second organic solvent;
S3, provides water white silicon resin solution;
S4, mixes described the first mixed solution, the second mixed solution and silicon resin solution stir;
S5 makes the first organic solvent and the volatilization of the second organic solvent under vacuum, obtains aforesaid silicone resin composite material after curing molding.
Preferably, described the first organic solvent is following independent material or their combination: normal hexane, toluene, chloroform or methylene dichloride;
Described the second organic solvent is following independent material or their combination: normal hexane, toluene, chloroform or methylene dichloride;
Described silicon resin solution comprises the 3rd organic solvent, and described the 3rd organic solvent is following independent material or their combination: ethanol, acetone or toluene.
Preferably, in step S1, described the first mixed solution is scattered in nano-phosphor in described the first organic solvent and obtains;
In step S2, described the second mixed solution is dissolved in nano-quantum point particle in described the second organic solvent and obtains;
In step S2, described silicon resin solution is dissolved in water white silicone resin in described the 3rd organic solvent and obtains;
In step S5, described the first organic solvent, the second organic solvent and the 3rd organic solvent are volatilized completely, are placed in afterwards baking oven and are cured moulding, finally obtain described silicone resin composite material.
Silicone resin when described silicon resin solution can be less than 100,000 centipoise with viscosity is replaced.
Below with regard to the preparation of the nano-phosphor that uses in step S1, and the preparation of the nano-quantum point using in step S2 illustrates.
Preparation one: the preparation of nano-phosphor
By 25.0g particle diameter be 15 microns (size distribution D50=15 ± 2 μ m) yellow YAG fluorescent material (for example, the SDY558-15 of Yantai Anthony Heald novel material company limited) and 100.0g transmittance be 99% no-solvent type silicone resin (for example, DOW CORNING OE-6550A) is scattered in 100.0g toluene.After mixture is fully uniformly mixed, add ball mill to carry out ball milling.Final product is through gravimetric determination approximately containing 13.5%YAG fluorescent material, and approximately containing 53.8% silicone resin, approximately containing 32.7% toluene, this product is for the preparation of following matrix material.According to theoretical calculation, YAG fluorescent material particle diameter is approximately 200 nanometers.
Preparation two: the preparation of nano-quantum point
By 0.05g CdO, 2g TOPO (trioctylphosphine oxide), 2.88g DDA (dodecylamine) and 0.3g TDPA (tetradecylphosphonic acid) are mixed in there-necked flask, heated and stirred is also converted to rare gas element argon gas by reaction atmosphere, be heated to afterwards 300 degrees Celsius, constant temperature, question response thing become colorless or light yellow transparent liquid after, inject the Top-Se 5mL of 0.0058g/mL, question response thing color becomes red rear stopped reaction, be cooled to room temperature, in reactant, add methyl alcohol centrifugation, obtaining redness sinks to the bottom and is CdSe quantum dot nano crystal, precipitation is dispersed in normal hexane standby again.The content of quantum dot in normal hexane is approximately 0.3 wt %.Fig. 2 is the fluorescence emission spectrogram of CdSe nano-quantum point, is its fluorescence emission spectrum measuring after the normal hexane dispersion liquid of quantum dot nano crystalline substance is diluted to 5 times with normal hexane, and excitation wavelength is 520nm, and emission wavelength is 570nm.Fig. 3 is transmission electron microscope (TEM) photo of CdSe nano-quantum point, adopt dip coating that quantum dot nano is crystalline dispersion in ultrathin carbon films, after dry, with TEM, the size of quantum dot nano crystal in sample is measured to statistics, the mean sizes that obtains quantum dot nano crystal is about 3.75nm.
Preparation three: contain the preparation of the silicon resin base composite material of nano-phosphor
Prepared by 7.43g to one mixture, 1.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550A, lower abbreviation " silicone resin A "), 5.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550B, lower abbreviation " silicone resin B ") mix, thereby reach silicone resin A component: silicone resin B component: nano-phosphor=50:50:10.
After said mixture is mixed, film, until solvent evaporates completely after, dry 1 hour at 150 ℃, obtain the silicone resin composite material containing nano-phosphor.Naked-eye observation is evenly dispersed in silicone matrix to fluorescent material.The above-mentioned silicone resin composite material containing nano-phosphor is injected to LED die and can encapsulate the blue led chips based on InGaN, dry after 1 hour at 150 ℃, by the photodiode that obtains emitting white light.
Preparation four: contain the preparation of the silicon resin base composite material of nano-phosphor and nanocrystal CdSe quantum dot, this silicon resin base composite material is an embodiment of silicon resin base composite material of the present invention.
Prepared by 7.43g to one mixture, 1.50g prepares two CdSe normal hexane solution, 1.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550A, lower abbreviation " silicone resin A "), 5.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550B, lower abbreviation " silicone resin B ") mix, thereby reach silicone resin A component: silicone resin B component: nano-phosphor: nanocrystal CdSe quantum dot=50:50:10:0.045.
After said mixture is mixed, film, until solvent evaporates completely after, dry 1 hour at 150 ℃, obtain the silicone resin composite material containing nano-phosphor and nanocrystal CdSe quantum dot.Naked-eye observation is evenly dispersed in silicone matrix to fluorescent material and CdSe quantum dot.The above-mentioned silicone resin composite material containing nano-phosphor and nanocrystal CdSe quantum dot is injected to LED die and can encapsulate the blue led chips based on InGaN, dry after 1 hour at 150 ℃, by the photodiode that obtains emitting white light.
Comparative example one: contain the preparation of the silicon resin base composite material of fluorescent material
By 1.0g particle diameter, be the yellow YAG fluorescent material (SDY558-15 of Yantai Anthony Heald novel material company limited) of 15 microns (size distribution D50=15 ± 2 μ m), 5.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550A, lower abbreviation " silicone resin A "), 5.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550B, lower abbreviation " silicone resin B ") mix, thereby reach silicone resin A component: silicone resin B component: fluorescent material=50:50:10.
After said mixture is mixed, film, until solvent evaporates completely after, dry 1 hour at 150 ℃, obtain the silicone resin composite material containing fluorescent material.Naked-eye observation is dispersed in silicone matrix unevenly to fluorescent material, can clearly see the dispersion of particle.
Comparative example two: contain the preparation of the silicon resin base composite material of nanocrystal CdSe quantum dot
Prepared by 1.50g to two CdSe normal hexane solution, 5.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550A, lower abbreviation " silicone resin A "), 5.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550B, lower abbreviation " silicone resin B ") mix, thereby reach silicone resin A component: A component: CdSe quantum dot=50:50:0.045.
After said mixture is mixed, film, until solvent evaporates completely after, dry 1 hour at 150 ℃, obtain the silicone resin composite material containing nanocrystal CdSe quantum dot.Naked-eye observation is evenly dispersed in silicone matrix to nanocrystal CdSe quantum dot, but color is extremely light, is light salmon.
Comparative example three: contain the preparation of the silicon resin base composite material of fluorescent material and nanocrystal CdSe quantum dot
By 1.0g particle diameter, be the yellow YAG fluorescent material (SDY558-15 of Yantai Anthony Heald novel material company limited) of 15 microns (size distribution D50=15 ± 2 μ m), the CdSe normal hexane solution of 1.50g embodiment 2,5.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550A, lower abbreviation " silicone resin A "), 5.0g transmittance is 99% no-solvent type silicone resin (DOW CORNING OE-6550B, lower abbreviation " silicone resin B ") mix, thereby reach silicone resin A component: silicone resin B component: fluorescent material: nanocrystal CdSe quantum dot=50:50:10:0.045.
After said mixture is mixed, film, until solvent evaporates completely after, dry 1 hour at 150 ℃, obtain the silicone resin composite material containing fluorescent material.Naked-eye observation is dispersed in silicone matrix unevenly to fluorescent material, can clearly see that fluorescent material separates from mixture.
Above experimental result is summarized in table 1.These experimental results fully reflect that nano-phosphor and nanocrystal CdSe quantum dot can improve the compatibility of matrix material effectively, greatly improve the homogeneity of final matrix material.Meanwhile, the transmittance that transmittance (instrument is Perkin Elmer Lambda 650 ultraviolets/visible/near infrared spectrophotometer) experimental result shows to prepare three (containing nano-phosphor) is the twice of comparative example one (containing nano-phosphor) transmittance, further illustrates light transmission and light energy conversion efficiency that nano composite material in the present invention can improve LED.
In addition, the present invention has also disclosed a kind of illuminating device, and described illuminating device comprises aforesaid silicone resin composite material.
Described illuminating device is photoelectric device or packaging of photoelectric device or LED solid state lighting device or LED solid state lighting device package.
In addition, the present invention has also disclosed a kind of silicone resin composite material as the application of illuminating device, and described silicone resin composite material is aforesaid silicone resin composite material.
Described illuminating device is photoelectric device or packaging of photoelectric device or LED solid state lighting device or LED solid state lighting device package.
Compared to prior art, silicone resin composite material of the present invention and manufacture method thereof, the silicone resin composite material that contains nano-phosphor and nano-quantum point by preparation, has realized the photoluminescence of material.In addition, by the resulting silicone resin composite material of the manufacture method of silicone resin composite material of the present invention, have certain transparency in visible region, compare with conventional fluorescent powder, silicone resin composite material of the present invention has better matching and homogeneity.And the present invention's preparation is simple, easy to operate containing the method for the silicone resin composite material of nano-phosphor and nano-quantum point.Moreover, when silicone resin composite material of the present invention is used for the encapsulation of LED, can avoid the caused scattering of light effect of conventional fluorescent powder, extend the work-ing life of LED, improve the homogeneity of space colourity simultaneously.
It should be noted that: above embodiment is only for illustrating the present invention and unrestricted technical scheme described in the invention, although this specification sheets has been described in detail the present invention with reference to the above embodiments, but, those of ordinary skill in the art is to be understood that, person of ordinary skill in the field still can modify or be equal to replacement the present invention, and all do not depart from technical scheme and the improvement thereof of the spirit and scope of the present invention, all should be encompassed within the scope of claim of the present invention.
Claims (25)
1. a silicone resin composite material, it comprises nano-phosphor, nano-quantum point and water white silicone resin, wherein said nano-phosphor and nano-quantum point are dispersed in this water white silicone resin, described silicone resin composite material is consolidated structures, described nano-phosphor and nano-quantum point are as luminescent material, and described silicone resin is as the first packaged material.
2. silicone resin composite material as claimed in claim 1, is characterized in that: the 1.0-20.0% that the weight percent content of described nano-phosphor is described silicone resin.
3. silicone resin composite material as claimed in claim 1, is characterized in that: the particle diameter of described nano-phosphor is 1.0-400 nanometer.
4. silicone resin composite material as claimed in claim 1, is characterized in that: described nano-phosphor is following independent material or their combination:
Fluorescent RE powder, rare-earth garnet fluorescent material, sulfurized alkaline earth metal gallate, alkaline earth sulfide, zinc sulphide type, alkali earth metal aluminate, phosphoric acid salt, borate, silicate, fluorine arsenate, fluogermanate, rare-earth sulfide, rare earth oxide, vanadate, Nitride phosphor.
5. silicone resin composite material as claimed in claim 1, is characterized in that: described nano-phosphor is rare earth doped YAG yttrium aluminium garnet fluorescent powder.
6. silicone resin composite material as claimed in claim 5, is characterized in that: described nano-phosphor is the YAG yttrium aluminium garnet fluorescent powder of Ce doping.
7. silicone resin composite material as claimed in claim 1, is characterized in that: the 0.01-5.0% that the weight percent content of described nano-quantum point is described silicone resin.
8. silicone resin composite material as claimed in claim 1, is characterized in that: the particle diameter of described nano-quantum point is 1.0-20 nanometer.
9. silicone resin composite material as claimed in claim 1, is characterized in that: described nano-quantum point Wei You II-VI Zu Huo III-V family elementary composition.
10. silicone resin composite material as claimed in claim 9, is characterized in that: described nano-quantum point is ZnSe or CdS or CdSe or CdSe.
11. silicone resin composite materials as claimed in claim 9, is characterized in that: described nano-quantum point is gallium arsenic (GaAs) or indium phosphide (InP) or gan.
12. silicone resin composite materials as claimed in claim 1, is characterized in that: described nano-quantum point is nucleocapsid structure.
13. silicone resin composite materials as claimed in claim 12, is characterized in that: described nano-quantum point is CdSe/ZnS.
14. silicone resin composite materials as claimed in claim 1, is characterized in that: described silicone resin is solvent-borne type silicone resin or no-solvent type silicone resin, and the transmittance of described silicone resin in visible region is 85%-100%.
15. silicone resin composite materials as claimed in claim 1, is characterized in that: described silicone resin is solvent-borne type silicone resin or no-solvent type silicone resin, and the refractive index of described silicone resin is 1.40-1.60.
16. silicone resin composite materials as claimed in claim 1, is characterized in that: described silicone resin composite material also comprises the second packaged material, and the weight percent content of described the second packaged material accounts for the 1-80% of whole described silicone resin composite material.
17. silicone resin composite materials as claimed in claim 16, is characterized in that: described the second packaged material is epoxy resin.
The manufacture method of 18. 1 kinds of silicone resin composite materials, it comprises the steps:
S1, provides the first mixed solution that contains nano-phosphor and the first organic solvent;
S2, provides the second mixed solution that contains nano-quantum point and the second organic solvent;
S3, provides water white silicon resin solution;
S4, mixes described the first mixed solution, the second mixed solution and silicon resin solution stir;
S5 makes the volatilization of the first organic solvent and the second organic solvent under vacuum, obtains the silicone resin composite material as described in any one in claim 1 to 16 after curing molding.
19. manufacture method as claimed in claim 18, is characterized in that:
Described the first organic solvent is following independent material or their combination: normal hexane, toluene, chloroform or methylene dichloride;
Described the second organic solvent is following independent material or their combination: normal hexane, toluene, chloroform or methylene dichloride;
Described silicon resin solution comprises the 3rd organic solvent, and described the 3rd organic solvent is following independent material or their combination: ethanol, acetone or toluene.
20. manufacture method as claimed in claim 19, is characterized in that:
In step S1, described the first mixed solution is scattered in nano-phosphor in described the first organic solvent and obtains;
In step S2, described the second mixed solution is dissolved in nano-quantum point particle in described the second organic solvent and obtains;
In step S3, described silicon resin solution is dissolved in water white silicone resin in described the 3rd organic solvent and obtains;
In step S5, described the first organic solvent, the second organic solvent and the 3rd organic solvent are volatilized completely, are placed in afterwards baking oven and are cured moulding, finally obtain described silicone resin composite material.
21. manufacture method as claimed in claim 18, is characterized in that: silicone resin when described silicon resin solution can be less than 100,000 centipoise with viscosity is replaced.
22. 1 kinds of illuminating devices, is characterized in that: described illuminating device comprises the silicone resin composite material as described in any one in claim 1 to 16.
23. illuminating devices as claimed in claim 22, is characterized in that: described illuminating device is photoelectric device or packaging of photoelectric device or LED solid state lighting device or LED solid state lighting device package.
24. 1 kinds of silicone resin composite materials, as the application of illuminating device, is characterized in that: described silicone resin composite material is the silicone resin composite material as described in any one in claim 1 to 17.
25. application as claimed in claim 24, is characterized in that: described illuminating device is photoelectric device or packaging of photoelectric device or LED solid state lighting device or LED solid state lighting device package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310155014.6A CN104119679B (en) | 2013-04-28 | 2013-04-28 | Silicone resin composite material and its manufacture method, illuminating device, application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310155014.6A CN104119679B (en) | 2013-04-28 | 2013-04-28 | Silicone resin composite material and its manufacture method, illuminating device, application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104119679A true CN104119679A (en) | 2014-10-29 |
| CN104119679B CN104119679B (en) | 2017-09-01 |
Family
ID=51765326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310155014.6A Expired - Fee Related CN104119679B (en) | 2013-04-28 | 2013-04-28 | Silicone resin composite material and its manufacture method, illuminating device, application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104119679B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870302A (en) * | 2016-03-30 | 2016-08-17 | 深圳市聚飞光电股份有限公司 | Package method for high-gamut white-light quantum-dot light emitting diode (LED) |
| WO2019177969A1 (en) | 2018-03-12 | 2019-09-19 | Dow Silicones Corporation | Curable silicone composition and cured product thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103030822A (en) * | 2012-12-20 | 2013-04-10 | 杭州纳晶科技有限公司 | Quantum dots powder and preparation method thereof, silicone lens and manufacture method thereof and LED lamp |
-
2013
- 2013-04-28 CN CN201310155014.6A patent/CN104119679B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103030822A (en) * | 2012-12-20 | 2013-04-10 | 杭州纳晶科技有限公司 | Quantum dots powder and preparation method thereof, silicone lens and manufacture method thereof and LED lamp |
Non-Patent Citations (1)
| Title |
|---|
| 李志强等: "水热法制备YAG：Ce纳米荧光粉", 《河北大学学报（自然科学版）》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870302A (en) * | 2016-03-30 | 2016-08-17 | 深圳市聚飞光电股份有限公司 | Package method for high-gamut white-light quantum-dot light emitting diode (LED) |
| CN105870302B (en) * | 2016-03-30 | 2019-01-29 | 深圳市聚飞光电股份有限公司 | A kind of packaging method of high colour gamut white light quanta point LED |
| WO2019177969A1 (en) | 2018-03-12 | 2019-09-19 | Dow Silicones Corporation | Curable silicone composition and cured product thereof |
| US20210054265A1 (en) * | 2018-03-12 | 2021-02-25 | Dow Silicones Corporation | Curable silicone composition and cured product thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104119679B (en) | 2017-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Tang et al. | Enhancement of luminous efficiency and uniformity of CCT for quantum dot-converted LEDs by incorporating with ZnO nanoparticles | |
| Aboulaich et al. | Ce-doped YAG nanophosphor and red emitting CuInS2/ZnS core/shell quantum dots for warm white light-emitting diode with high color rendering index | |
| JP6971972B2 (en) | Light conversion material | |
| CN103124779B (en) | Silicophosphate luminescent material | |
| US9082941B2 (en) | Semiconductor nanoparticle-based materials for use in light emitting diodes, optoelectronic displays and the like | |
| JP5535548B2 (en) | Blue-green and green phosphors for illumination | |
| Lita et al. | Stable efficient solid-state white-light-emitting phosphor with a high scotopic/photopic ratio fabricated from fused CdSe-silica nanocomposites | |
| TWI547545B (en) | Phosphors | |
| US20070012928A1 (en) | Light emitting diode comprising semiconductor nanocrystal complexes and powdered phosphors | |
| Woo et al. | Thermal behavior of a quantum dot nanocomposite as a color converting material and its application to white LED | |
| EP2129741B1 (en) | METHOD FOR PRODUCING PHOSPHORS CONSISTING OF ORTHOSILICATES FOR pcLEDs | |
| JP6138914B2 (en) | Silicate phosphor | |
| US10879433B2 (en) | Stabilized quantum dot composite and method of making a stabilized quantum dot composite | |
| Xie et al. | White light-emitting diodes with enhanced efficiency and thermal stability optimized by quantum dots-silica nanoparticles | |
| US8044410B2 (en) | White light-emitting diode and its light conversion layer | |
| DE102007016228A1 (en) | Process for the production of phosphors based on orthosilicates for pcLEDs | |
| CN103236487B (en) | Light-emitting component | |
| CN108091752B (en) | white light LED and preparation method thereof | |
| Yin et al. | The thermal stability performances of the color rendering index of white light emitting diodes with the red quantum dots encapsulation | |
| Boonsin et al. | Optical properties and reliability studies of gradient alloyed green emitting (CdSe) x (ZnS) 1–x and red emitting (CuInS2) x (ZnS) 1–x quantum dots for white light-emitting diodes | |
| KR101593582B1 (en) | Quantum dot formed glass composite for color converter, preparation method thereof and white light emitting diode | |
| CN104119679B (en) | Silicone resin composite material and its manufacture method, illuminating device, application | |
| TWI551667B (en) | Carbodiimide phosphors | |
| JP5544404B2 (en) | Fluorescent material and light emitting device using the same | |
| KR101413660B1 (en) | Quantum dot-polymer composite plate for light emitting diode and method for producing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170901 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |