CN104113988A - Bending device used for flexible circuit board - Google Patents
Bending device used for flexible circuit board Download PDFInfo
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- CN104113988A CN104113988A CN201410348346.0A CN201410348346A CN104113988A CN 104113988 A CN104113988 A CN 104113988A CN 201410348346 A CN201410348346 A CN 201410348346A CN 104113988 A CN104113988 A CN 104113988A
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- die cavity
- cylinder
- printed circuit
- flexible printed
- bending
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Abstract
The invention discloses a bending device used for a flexible circuit board and relates to the technical field of circuit board processing equipment. The bending device used for the flexible circuit board comprises a cavity, wherein a bending mechanism is arranged in the cavity; a stretching cylinder is connected to the bottom end of the bending mechanism and located below the cavity; slide blocks and slide rails are arranged on the side parts of the cavity; the bending mechanism comprises a base and a support rod; a bending head is connected to the top end of the support rod; the bending device further comprises a cavity connecting block which is connected with the side parts of the cavity; a transverse cylinder is arranged on the left side of the cavity connecting block; a cylinder fixing plate is arranged on the front end of the transverse cylinder; a piston rod of the transverse cylinder penetrates the cavity connecting block and is connected with the cylinder fixing plate; through the driving of the stretching cylinder and the transverse cylinder, the flexible circuit board is contacted with different positions of the bending head to realize 180-degree bending molding for one time. The bending device used for the flexible circuit board is not only high in efficiency, but is also strong in stability.
Description
Technical field
The present invention relates to wiring board technical field of processing equipment, be specifically related to a kind of warpage mechanism, it can carry out 180 ° of warpages to it for processing Flexible Printed Circuit.
Background technology
Along with the develop rapidly of China's industrialized level, there is revolutionary variation in electron trade, and Flexible Printed Circuit is as a kind of electric elements, and it is widely used in the every profession and trades such as instrument board, phone, computer, medical treatment.
Flexible Printed Circuit is a kind of circuit board consisting of Copper Foil, acrylic and epoxy resin hot-setting adhesive, poly-imines film, there is height flexibility, can meet three-dimensional wiring demand, user can change its shape according to space structure, after folding, can not affect its signal transfer function, but also there is antistatic interference, the speciality of high-low temperature resistant, exactly because its safety and stability, flexibility, therefore received application widely.
In prior art, the general manual mode that adopts is carried out warpage, Flexible Printed Circuit is carried out respectively to pre-warpage and secondary warpage by handpress or motor, pre-warpage is mainly in order to produce broken curve, secondary warpage puts in place by warpage energetically, yet, because Flexible Printed Circuit has height flexibility, in warpage process, there will be resilience largely, occur deviation with the warpage angle of expection; On the other hand, well-known, the lighter weight of Flexible Printed Circuit self, broken curve can, because excessive causing of the strength of warpage equipment is offset, cause product to occur high scrappage.
Patent CN 202374570 U disclose top side on a kind of adagio and have pushed away bending mechanism, by fuse is set in module, to utilize cylinder to promote fuse and move up and down and move horizontally, its weak point is, restriction due to its core structures, cannot once realize 180 of Flexible Printed Circuit ° of warpages, only can realize the function of pre-warpage, and most of parts of this mechanism be concealed in inside modules, not only take up space large, and parts are more, cause installation difficulty larger, cost is higher.
In sum, existing equipment cannot be realized once 180 of Flexible Printed Circuit ° of warpages, needs phase in, not only efficiency is low, and fraction defective is higher, therefore, how to realize Flexible Printed Circuit bending and molding, become the problem that the present invention need to solve.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of foldable device for Flexible Printed Circuit, by adopting the warpage mechanism of special entity, the combining structure of slide block and slide rail is set simultaneously between warpage mechanism and lateral cylinder, realize 180 of Flexible Printed Circuit ° of disposable warpages.
Technical scheme of the present invention is as follows:
A kind of foldable device for Flexible Printed Circuit, comprise die cavity, in described die cavity, be provided with warpage mechanism, the bottom of described warpage mechanism is connected with draft cylinder, described draft cylinder is positioned at the below of described die cavity, at the sidepiece of described die cavity, is provided with chute, and slide block is installed in chute, slide rail is equipped with in the centre of described slide block, and described slide block can carry out traveling priority on described slide rail, described warpage mechanism comprises base, and with the support bar that described base one is joined, on the top of described support bar, be connected with bending head, the upper surface of described bending head and junction, side end face are globoidal structure, the junction of side end face and lower surface is provided with chamfering, also comprise die cavity contiguous block, the sidepiece of described die cavity contiguous block and described die cavity joins, left side at described die cavity contiguous block is provided with lateral cylinder, front end at described lateral cylinder is provided with air cylinder fixed plate, the piston cylinder of lateral cylinder is through described die cavity contiguous block, be connected with described air cylinder fixed plate, by draft cylinder, drive warpage mechanism to rise, the upper surface of bending head and side end face contact with Flexible Printed Circuit successively, realization is converted into right angle from horizontal angle, lateral cylinder moves, the lower surface of Neng Jiang warpage mechanism contacts with described Flexible Printed Circuit, now draft cylinder drives warpage mechanism to reset, the lower surface of bending head can be pressure bonded to Flexible Printed Circuit 180 °, thereby realize one-shot forming.
As preferably, on the bottom surface of described base, offer T-shaped groove, top axle at described draft cylinder is connected to one T-shaped, the top of described T-shaped is placed in described T-shaped groove, described T-shaped groove can provide certain activity space for T-shaped, avoids described draft cylinder in motion process, to occur stuck phenomenon.
Further, the bottom of described base, lower than the bottom surface of described die cavity, is also provided with limited step in the bottom side of described base, can carry out spacing to the adjustable height of described warpage mechanism.
Beneficial effect: the present invention, by above technical scheme, not only realized Flexible Printed Circuit bending and molding, and this structure is ingenious meticulous, and stability is strong.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is a kind of perspective view of the disclosed a kind of foldable device for Flexible Printed Circuit of the embodiment of the present invention;
Fig. 2 is the another kind of perspective view of the disclosed a kind of foldable device for Flexible Printed Circuit of the embodiment of the present invention;
Fig. 3 is the warpage structural representation of the disclosed a kind of foldable device for Flexible Printed Circuit of the embodiment of the present invention.
Numeral and the represented corresponding component title of letter in figure:
1, die cavity; 2, draft cylinder; 3, lateral cylinder; 4, die cavity contiguous block; 5, air cylinder fixed plate; 6, slide block; 7, slide rail; 8, lower surface; 9, side end face; 10, upper surface; 11, support bar; 12, T-shaped; 13, T-shaped groove; 14, chute.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment
For a foldable device for Flexible Printed Circuit, comprise die cavity 1, in described die cavity 1, be provided with warpage mechanism, the bottom of described warpage mechanism is connected with draft cylinder 2, described draft cylinder 2 is positioned at the below of described die cavity 1, and draft cylinder 2 runnings, can drive warpage mechanism to carry out lifting.
Sidepiece at described die cavity 1 is provided with chute 14, in described chute 14, slide block and slide rail are housed, centre at described slide block 6 is provided with groove, described slide rail 7 is placed in described groove, the bottom of described slide rail 7 and the inwall of described groove fasten and join, like this, described slide block 6 not only can carry out relative traveling priority on described slide rail 7, and described slide block 6 is tightr with the combination of described slide rail 7, and saving space, in practice, according to actual needs, many parallel grooves can also be set on described slide block 6, place two and above slide rail 7.
Described foldable device also comprises die cavity contiguous block 4, described die cavity contiguous block 4 joins with the sidepiece of described die cavity 1, in the left side of described die cavity contiguous block 4, be provided with lateral cylinder 3, at described lateral cylinder 3 front ends, be provided with air cylinder fixed plate 5, the piston rod of lateral cylinder 3 is passed to described die cavity contiguous block 4, be connected with described air cylinder fixed plate 5, lateral cylinder 3 motions, can promote described slide block 6 and move horizontally on slide rail 7, and the movement of described slide block 6 means that coupled warpage mechanism can carry out horizontal displacement.
Described warpage mechanism comprises base, and the support bar 11 joining with described base one, on the top of described support bar 11, be connected with bending head, 9 junctions, 10He side end face, upper surface of described bending head are globoidal structure, side end face 9 is provided with chamfering with the junction of lower surface 8, chamfering and globoidal structure are conducive to, in warpage mechanism rises, Flexible Printed Circuit is converted into right angle from horizontal angle.
In use, upper surface at described die cavity 1 is laid fixed head (not shown), fixed head can be used for fixing Flexible Printed Circuit, Flexible Printed Circuit is fixed near warpage structure, in described slide rail 7 and described air cylinder fixed plate 5, wear bolt, with fixed head Joint, now, start draft cylinder 2, draft cylinder 2 upwards promotes warpage mechanism, Flexible Printed Circuit can contact with described bending head at first, because the junction of the 10He side end face, upper surface 9 of described bending head is globoidal structure, therefore, in the process that warpage mechanism rises, Flexible Printed Circuit can be converted into obtuse angle by horizontal direction, along with the continuous rising of warpage mechanism, Flexible Printed Circuit departs from the upper surface 10 of described bending head, and when Flexible Printed Circuit contacts with the side end face 9 of described bending head, now Flexible Printed Circuit is converted into right angle, and draft cylinder 2 shuts down.
Start lateral cylinder 3, lateral cylinder 3 moves, can drive described slide block 6 to move, because described slide block 6 is connected with described warpage mechanism, be connected with described die cavity simultaneously, the meeting occurred level displacement of warpage mechanism, now, Flexible Printed Circuit starts to contact with the lower surface 8 of bending head, can further dwindle warpage angle, and air cylinder fixed plate 5 can be carried out spacing to the displacement of cylinder, when lateral cylinder 3 moves to assigned address, now, Flexible Printed Circuit can contact with the front end face of lower surface 8 and support bar 11, then stops mobile lateral cylinder 3; Restart draft cylinder 2, described draft cylinder 2 pulls joggler structure downwards, and 180 ° of warpages can be realized by the bending part pressing of Flexible Printed Circuit in the lower surface 8 on described bending head, and after warpage has moved, warpage mechanism resets successively along opposite action.
Further, on the bottom surface of described base, offer T-shaped groove 13, top axle at described draft cylinder 2 is connected to one T-shaped 12, the top of described T-shaped 12 is placed in described T-shaped groove 13, the volume of T-shaped groove 13 is greater than described T-shaped 12, can in T-shaped groove 13, carry out the activity of certain limit, can avoid draft cylinder 2 in drawing process, to occur stuck phenomenon for T-shaped 12.
Further, the bottom position of described base, lower than the bottom of described die cavity, is also provided with limited step in the bottom side of described base, and limited step can highly limit the flexible of draft cylinder 2.
In use, a plurality of warpage mechanism can be set on same die cavity 1, warpage mechanism can share a draft cylinder 2 or lateral cylinder 3, also can use a plurality of draft cylinders 2 or lateral cylinder 3 simultaneously, at this, does not do special restriction.
Above-described is only the preferred implementation of a kind of foldable device for Flexible Printed Circuit of the present invention; should be understood that; for the person of ordinary skill of the art; without departing from the concept of the premise of the invention; can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (4)
1. the foldable device for Flexible Printed Circuit, comprise die cavity, in described die cavity, be provided with warpage mechanism, the bottom of described warpage mechanism is connected with draft cylinder, and described draft cylinder is positioned at the below of described die cavity, it is characterized in that, sidepiece at described die cavity is provided with chute, slide block is installed in chute, in the centre of described slide block, slide rail is housed, described slide block can move on described slide rail; Described warpage mechanism comprises base, and with the support bar that described base one is joined, on the top of described support bar, be connected with bending head, the upper surface of described bending head and junction, side end face are globoidal structure, the junction of side end face and lower surface is provided with chamfering; Also comprise die cavity contiguous block, the sidepiece of described die cavity contiguous block and described die cavity joins, left side at described die cavity contiguous block is provided with lateral cylinder, described lateral cylinder is connected with described die cavity by described die cavity contiguous block, front end at described lateral cylinder is provided with air cylinder fixed plate, the piston rod of lateral cylinder, through described die cavity contiguous block, is connected with described air cylinder fixed plate.
2. a kind of foldable device for Flexible Printed Circuit according to claim 1, is characterized in that, offers T-shaped groove on the bottom surface of described base, in the top axle of described draft cylinder, is connected to one T-shaped, and described T-shaped is placed in described T-shaped groove.
3. a kind of foldable device for Flexible Printed Circuit according to claim 1 and 2, is characterized in that, the bottom of described base, lower than the bottom surface of described die cavity, is also provided with limited step in the bottom side of described base.
4. a kind of foldable device for Flexible Printed Circuit according to claim 1, is characterized in that, at described mold cavity surface, is provided with fixed head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410348346.0A CN104113988A (en) | 2014-07-18 | 2014-07-18 | Bending device used for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410348346.0A CN104113988A (en) | 2014-07-18 | 2014-07-18 | Bending device used for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104113988A true CN104113988A (en) | 2014-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410348346.0A Pending CN104113988A (en) | 2014-07-18 | 2014-07-18 | Bending device used for flexible circuit board |
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| CN (1) | CN104113988A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106922085A (en) * | 2017-04-21 | 2017-07-04 | 高德(苏州)电子有限公司 | A kind of automatic bending device of semi-flexible wiring board |
| TWI625088B (en) * | 2014-11-24 | 2018-05-21 | 鴻海精密工業股份有限公司 | Locking apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186415A (en) * | 2002-12-03 | 2004-07-02 | Mitsubishi Electric Corp | Method of connecting flexible printed circuit board |
| CN202374571U (en) * | 2011-11-23 | 2012-08-08 | 南通力德尔机电科技有限公司 | Heating bending mechanism for flexible circuit board |
| CN204069506U (en) * | 2014-07-18 | 2014-12-31 | 昆山星连达电子有限公司 | A kind of foldable device for Flexible Printed Circuit |
-
2014
- 2014-07-18 CN CN201410348346.0A patent/CN104113988A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186415A (en) * | 2002-12-03 | 2004-07-02 | Mitsubishi Electric Corp | Method of connecting flexible printed circuit board |
| CN202374571U (en) * | 2011-11-23 | 2012-08-08 | 南通力德尔机电科技有限公司 | Heating bending mechanism for flexible circuit board |
| CN204069506U (en) * | 2014-07-18 | 2014-12-31 | 昆山星连达电子有限公司 | A kind of foldable device for Flexible Printed Circuit |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI625088B (en) * | 2014-11-24 | 2018-05-21 | 鴻海精密工業股份有限公司 | Locking apparatus |
| CN106922085A (en) * | 2017-04-21 | 2017-07-04 | 高德(苏州)电子有限公司 | A kind of automatic bending device of semi-flexible wiring board |
| CN106922085B (en) * | 2017-04-21 | 2023-08-25 | 高德(苏州)电子有限公司 | Automatic equipment of buckling of semi-flexible line way board |
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Application publication date: 20141022 |