CN104093098A - High-strength MOLDING type headset base - Google Patents
High-strength MOLDING type headset base Download PDFInfo
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- CN104093098A CN104093098A CN201410272524.6A CN201410272524A CN104093098A CN 104093098 A CN104093098 A CN 104093098A CN 201410272524 A CN201410272524 A CN 201410272524A CN 104093098 A CN104093098 A CN 104093098A
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- pin
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Abstract
The invention discloses a high-strength MOLDING type headset base which comprises an insulator, a connecting piece body, a fixing piece and a PCB. The insulator is connected with the PCB. The connecting piece body is placed in a hollow inner cavity. A first insertion pin, a second insertion pin, a third insertion pin, a fourth insertion pin, a fifth insertion pin and a sixth insertion pin on the connecting piece body penetrate through a first insertion pin installation hole, a second insertion pin installation hole, a third insertion pin installation hole, a fourth insertion pin installation hole, a fifth insertion pin installation hole and a sixth insertion pin installation hole in the insulator respectively, and are matched with a first insertion hole, a second insertion hole, a third insertion hole, a fourth insertion hole, a fifth insertion hole and a sixth insertion hole in the PCB respectively. The fixing piece is connected with the top end of the insulator. The high-strength MOLDING type headset base is simple in structure, high in product strength and capable of reaching the strength of 10 KG during a 360-degree damage test.
Description
Technical field
The present invention relates to earphone technical field, relate in particular to a kind of high strength MOLDING formula earphone base.
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Background technology
The fast development of mobile communication, makes modern life rhythm more and more faster.At present, the function of mobile phone is no longer confined to call and note, and increasing functional mobile phone can double as online, listens song, the instrument of broadcast listening and/or photograph, and is exactly a kind of in numerous functional mobile phones with the mobile phone of earphone base.
In prior art, earphone base is generally connected with connector by insulator, although the connected mode between the two is very complicated, the product strength of earphone base is low, can not meet the market demand.
Summary of the invention
The technical problem to be solved in the present invention is, for prior art middle ear stand structure complexity and the above-mentioned defect such as product strength is low, provide a kind of simple in structure, product strength is high and can reach the high strength MOLDING formula earphone base of 10KG strength during 360 degree damage test.
The technical solution adopted for the present invention to solve the technical problems is as follows:
A high strength MOLDING formula earphone base, comprises insulator, connector body, stator and pcb board;
Insulator is provided with hollow cavity, the insulator head left and right sides is respectively equipped with the second pin installing hole and the first pin installing hole, its left and right sides, middle part is respectively equipped with four-limbed installing hole and the 3rd pin installing hole, and its afterbody left and right sides is respectively equipped with the 6th pin installing hole and the 5th pin installing hole;
Connector body interior is provided with the first contact chip, the second contact chip, the 3rd contact chip and the 4th contact chip; The connector body head left and right sides is respectively equipped with the second pin and the first pin, and its left and right sides, middle part is respectively equipped with four-limbed and the 3rd pin, and its afterbody left and right sides is respectively equipped with the 6th pin and the 5th pin;
Insulator is connected with described pcb board; Connector body is placed in described hollow cavity, and the first pin, the second pin, the 3rd pin, four-limbed, the 5th pin and the 6th pin also coordinate with the first jack, the second jack, the 3rd jack, the 4th jack, the 5th jack and the 6th jack on pcb board respectively through the first pin installing hole, the second pin installing hole, the 3rd pin installing hole, four-limbed installing hole, the 5th pin installing hole and the 6th pin installing hole respectively;
Stator is connected with insulator top.
Earphone base provided by the present invention comprises insulator, connector body, stator and pcb board, wherein, connector body is placed in the hollow cavity of insulator, the first pin on connector body, the second pin, the 3rd pin, four-limbed, the 5th pin and the 6th pin are respectively through the first pin installing hole, the second pin installing hole, the 3rd pin installing hole, four-limbed installing hole, the 5th pin installing hole and the 6th pin installing hole and respectively with pcb board on the first jack, the second jack, the 3rd jack, the 4th jack, the 5th jack and the 6th jack coordinate, being connected of connector body and insulator and pcb board not only simplified in such design, thereby the structure of described earphone base is simplified, and such design bonding strength of plate that also contributed to reinforced company's fitting body and insulator and PCB.
In technical scheme of the present invention, stator is connected with insulator top, therefore such being designed with helps strengthen the product strength of described earphone base, and 360 degree reach 10KG strength during damage test.
As a kind of improvement to technical scheme of the present invention, the right side of stator is provided with the first buckle and the second buckle, and its left side is provided with the 3rd buckle and brace; The first buckle, the second buckle and the 3rd buckle coordinate with the first buckle installing hole, the second buckle installing hole and the 3rd buckle installing hole of insulator head respectively, and brace is connected with insulator top.The first buckle, the second buckle and the 3rd buckle have not only been simplified the installation of stator and insulator with cooperation and the brace of the first buckle installing hole, the second buckle installing hole and the 3rd buckle installing hole of insulator head with being connected of insulator top respectively, but also contribute to strengthen the bonding strength between the two.
As a kind of improvement to technical scheme of the present invention, pcb board is connected with insulator top.
As a kind of improvement to technical scheme of the present invention, pcb board is connected with insulator middle part.
As a kind of improvement to technical scheme of the present invention, pcb board is connected with insulator bottom, and the first pin, the second pin, the 3rd pin, four-limbed, the 5th pin and the 6th pin are located in respectively in the first jack, the second jack, the 3rd jack, the 4th jack, the 5th jack and the 6th jack.
In technical scheme of the present invention, PCB can be connected with insulator upper, middle and lower, and in actual production process, the link position of pcb board and insulator can be determined on a case-by-case basis.
In addition, in the technical scheme of the present invention, all being not specifically noted, all can be by adopting the conventional means in this area realize the technical program.
Therefore, the invention has the beneficial effects as follows a kind of high strength MOLDING formula earphone base is provided, this earphone base is simple in structure, and product strength is high, and 360 degree can reach 10KG strength during damage test.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the structural representation of high strength MOLDING formula earphone base in the embodiment of the present invention one;
Fig. 2 is the explosive view of Fig. 1;
Fig. 3 is the structural representation of high strength MOLDING formula earphone base in the embodiment of the present invention two;
Fig. 4 is the explosive view of Fig. 1;
Fig. 5 is the structural representation of high strength MOLDING formula earphone base in the embodiment of the present invention three;
Fig. 6 is the vertical view of Fig. 5;
Fig. 7 is the right view of Fig. 5;
Fig. 8 is the explosive view of insulator and stator;
Now that the label declaration in accompanying drawing is as follows: 1 is insulator, 2 is connector body, 3 is stator, 4 is pcb board, 5 is the first pin installing hole, 6 is the second pin installing hole, 7 is the 3rd pin installing hole, 8 is four-limbed installing hole, 9 is the 5th pin installing hole, 10 is the 6th pin installing hole, 11 is the first contact chip, 12 is the second contact chip, 13 is the 3rd contact chip, 14 is the 4th contact chip, 15 is the first pin, 16 is the second pin, 17 is the 3rd pin, 18 is four-limbed, 19 is the 5th pin, 20 is the 6th pin, 21 is the first jack, 22 is the second jack, 23 is the 3rd jack, 24 is the 4th jack, 25 is the 5th jack, 26 is the 6th jack, 27 is brace, 28 is the first buckle, 29 is the second buckle, 30 is the 3rd buckle, 31 is arc indent, 32 is arc convex.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Embodiment mono-:
A kind of high strength MOLDING formula earphone base, comprise insulator 1, connector body 2, stator 3 and pcb board 4, as shown in Figure 2, above-mentioned insulator 1 is provided with hollow cavity, the above-mentioned insulator 1 head left and right sides is respectively equipped with the second pin installing hole 6 and the first pin installing hole 5, its left and right sides, middle part is respectively equipped with four-limbed installing hole and 8 the 3rd pin installing holes 7, and its afterbody left and right sides is respectively equipped with the 6th pin installing hole 10 and the 5th pin installing hole 9; Above-mentioned connector body 2 inside are provided with the first contact chip 11, the second contact chip 12, the 3rd contact chip 13 and the 4th contact chip 14, these connector body 2 head left and right sides are respectively equipped with the second pin 16 and the first pin 15, its left and right sides, middle part is respectively equipped with four-limbed 18 and the 3rd pin 17, and its afterbody left and right sides is respectively equipped with the 6th pin 20 and the 5th pin 19.
As shown in Figure 1, above-mentioned pcb board 4 is connected with insulator 1 top, above-mentioned connector body 2 is placed in above-mentioned hollow cavity, above-mentioned the first pin 15, the second pin 16, the 3rd pin 17, four-limbed 18, the 5th pin 19 and the 6th pin 20 are respectively through above-mentioned the first pin installing hole 5, the second pin installing hole 6, the 3rd pin installing hole 7, four-limbed installing hole 8, the 5th pin installing hole 9 and the 6th pin installing hole 10 and respectively with above-mentioned pcb board 4 on the first jack 21, the second jack 22, the 3rd jack 23, the 4th jack 24, the 5th jack 25 and the 6th jack 26 coordinate, above-mentioned stator 3 is connected with insulator 1 top.
In the present embodiment, again as shown in Figure 2 and Figure 8, the right side of stator 3 is provided with the first buckle 28 and the second buckle 29, and its left side is provided with the 3rd buckle 30 and brace 27; Above-mentioned the first buckle 28, the second buckle 29 and the 3rd buckle 30 coordinate with the first buckle installing hole, the second buckle installing hole and the 3rd buckle installing hole at insulator 1 top respectively, and brace 27 is connected with insulator 1 top.
In addition, stator 3 bottoms are arc indent 31, and insulator 1 top is arc convex 32, and this arc indent 31 coordinates with arc convex 32, have further strengthened the bonding strength of insulator 1 with stator 3, have also facilitated the installation of insulator 1 with stator 3.
Embodiment bis-:
The present embodiment and embodiment mono-are basic identical, and unique difference is, as shown in Figure 3 and Figure 4, the above-mentioned pcb board 4 of stating is connected with insulator 1 middle part.
Embodiment tri-:
The present embodiment and embodiment mono-are basic identical, unique difference is, as shown in Figure 5 and Figure 6, above-mentioned pcb board 4 is connected with insulator 1 bottom, and above-mentioned the first pin 15, the second pin 16, the 3rd pin 17, four-limbed 18, the 5th pin 19 and the 6th pin 20 are located in respectively in the first jack 21, the second jack 22, the 3rd jack 23, the 4th jack 24, the 5th jack 25 and the 6th jack 26.
In addition, in the present embodiment, as shown in Figure 7, the height H of insulator 1 is 3.60mm, and insulator 1 keep away position length L be 3.90mm, such being designed with helps increase the inner space of insulator 1, and more assembly can be installed.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection range of claims of the present invention.
Claims (5)
1. a high strength MOLDING formula earphone base, is characterized in that, comprises insulator (1), connector body (2), stator (3) and pcb board (4);
Described insulator (1) is provided with hollow cavity, described insulator (1) the head left and right sides is respectively equipped with the second pin installing hole (6) and the first pin installing hole (5), its left and right sides, middle part is respectively equipped with four-limbed installing hole (8) and the 3rd pin installing hole (7), and its afterbody left and right sides is respectively equipped with the 6th pin installing hole (10) and the 5th pin installing hole (9);
Described connector body (2) inside is provided with the first contact chip (11), the second contact chip (12), the 3rd contact chip (13) and the 4th contact chip (14); Described connector body (2) the head left and right sides is respectively equipped with the second pin (16) and the first pin (15), its left and right sides, middle part is respectively equipped with four-limbed (18) and the 3rd pin (17), and its afterbody left and right sides is respectively equipped with the 6th pin (20) and the 5th pin (19);
Described insulator (1) is connected with described pcb board (4), described connector body (2) is placed in described hollow cavity, described the first pin (15), the second pin (16), the 3rd pin (17), four-limbed (18), the 5th pin (19) and the 6th pin (20) are respectively through described the first pin installing hole (5), the second pin installing hole (6), the 3rd pin installing hole (7), four-limbed installing hole (8), the 5th pin installing hole (9) and the 6th pin installing hole (10) and respectively with described pcb board (4) on the first jack (21), the second jack (22), the 3rd jack (23), the 4th jack (24), the 5th jack (25) and the 6th jack (26) coordinate,
Described stator (3) is connected with described insulator (1) top.
2. high strength MOLDING formula earphone base according to claim 1, is characterized in that, the right side of described stator (3) is provided with the first buckle (28) and the second buckle (29), and its left side is provided with the 3rd buckle (30) and brace (27); Described the first buckle (28), the second buckle (29) and the 3rd buckle (30) coordinate with the first buckle installing hole, the second buckle installing hole and the 3rd buckle installing hole at described insulator (1) top respectively, and described brace (27) is connected with described insulator (1) top.
3. high strength MOLDING formula earphone base according to claim 1, is characterized in that, described pcb board (4) is connected with described insulator (1) top.
4. high strength MOLDING formula earphone base according to claim 1, is characterized in that, described pcb board (4) is connected with described insulator (1) middle part.
5. high strength MOLDING formula earphone base according to claim 1, it is characterized in that, described pcb board (4) is connected with described insulator (1) bottom, and described the first pin (15), the second pin (16), the 3rd pin (17), four-limbed (18), the 5th pin (19) and the 6th pin (20) are located in respectively in the first jack (21), the second jack (22), the 3rd jack (23), the 4th jack (24), the 5th jack (25) and the 6th jack (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410272524.6A CN104093098A (en) | 2014-06-18 | 2014-06-18 | High-strength MOLDING type headset base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410272524.6A CN104093098A (en) | 2014-06-18 | 2014-06-18 | High-strength MOLDING type headset base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104093098A true CN104093098A (en) | 2014-10-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410272524.6A Pending CN104093098A (en) | 2014-06-18 | 2014-06-18 | High-strength MOLDING type headset base |
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| Country | Link |
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| CN (1) | CN104093098A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201365044Y (en) * | 2008-12-08 | 2009-12-16 | 东莞市桂氏咏华实业有限公司 | Two-channel earphone socket |
| CN103022789A (en) * | 2011-09-23 | 2013-04-03 | 昆山长盈精密技术有限公司 | Headphone jack connector |
| CN203205596U (en) * | 2012-12-11 | 2013-09-18 | 昆山鸿日达电子科技有限公司 | Earphone socket |
| CN103702251A (en) * | 2013-12-04 | 2014-04-02 | 昆山澳鸿电子科技有限公司 | Earphone seat |
| CN204031401U (en) * | 2014-06-18 | 2014-12-17 | 昆山鸿日达电子科技有限公司 | A kind of high strength MOLDING formula earphone base |
-
2014
- 2014-06-18 CN CN201410272524.6A patent/CN104093098A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201365044Y (en) * | 2008-12-08 | 2009-12-16 | 东莞市桂氏咏华实业有限公司 | Two-channel earphone socket |
| CN103022789A (en) * | 2011-09-23 | 2013-04-03 | 昆山长盈精密技术有限公司 | Headphone jack connector |
| CN203205596U (en) * | 2012-12-11 | 2013-09-18 | 昆山鸿日达电子科技有限公司 | Earphone socket |
| CN103702251A (en) * | 2013-12-04 | 2014-04-02 | 昆山澳鸿电子科技有限公司 | Earphone seat |
| CN204031401U (en) * | 2014-06-18 | 2014-12-17 | 昆山鸿日达电子科技有限公司 | A kind of high strength MOLDING formula earphone base |
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Owner name: KUNSHAN JIEHUANG ELECTRONIC PRECISION TECHNOLOGY C Free format text: FORMER OWNER: KUNSHAN HRD ELECTRONIC TECHNOLOGY CO., LTD. Effective date: 20150629 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20150629 Address after: Green song road Yushan town Kunshan City, Suzhou City, Jiangsu Province on the west side of 215316 Applicant after: KUNSHAN JIEHUANG ELECTRONIC PRECISION TECHNOLOGY CO., LTD. Address before: 215300, Tongxin Road 1888, Chengbei, Suzhou, Jiangsu, Kunshan Applicant before: Kunshan Hrdconn Electronic Technology Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20141008 |