CN104091625A - Electronic component lead - Google Patents
Electronic component lead Download PDFInfo
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- CN104091625A CN104091625A CN201410270103.XA CN201410270103A CN104091625A CN 104091625 A CN104091625 A CN 104091625A CN 201410270103 A CN201410270103 A CN 201410270103A CN 104091625 A CN104091625 A CN 104091625A
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- electronic component
- conductor
- insulating barrier
- deck
- watertight composition
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Abstract
The invention relates to the technical field of wires and discloses an electronic component lead which comprises a plurality of conductors. A conductor outer layer is provided with an insulating layer. The electronic component lead is characterized in that the conductors are arranged side by side and are made of tinned copper, a covering layer formed by overlapped wrapping of a 1,3,5-tris(2-hydroxyethyl)cyanuric acid strip is arranged between the conductor and the insulating layer, and waterproof layers are arranged outside the insulating layers and connected with each other. The conductors are made of tinned copper and are good in conductive effect and long in service life; the covering layer formed by overlapped wrapping of the 1,3,5-tris(2-hydroxyethyl)cyanuric acid strip is arranged, the conductors are protected, corrosion is avoided; the waterproof layers are arranged outside the insulating layers, a wire is effectively protected, the damage to the insulating layer is avoided, and the electronic component lead is safe and reliable.
Description
Technical field
The present invention relates to Power-line technology field, refer more particularly to a kind of electronic component down-lead.
Background technology
At present, most of fixture wires are all copper cash or other conducting metal outsourcing one deck insulating material, common wiring is in installation process or work progress, tend to produce a lot of frictions, cause insulating barrier to damage, outside copper core is exposed to, cause potential safety hazard, if can not find in time and change, easily leaking electricity, catch fire even causes fire.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of resistance to chemical attack, lightweight and firm, good insulating, the electronic component down-lead that thermal conductivity is low.
For solving the problems of the technologies described above, the present invention by the following technical solutions:
A kind of electronic component down-lead, comprise several conductors, described conductor skin is provided with a layer insulating, it is characterized in that, described several conductors are arranged side by side, and described conductor adopts tin-coated copper material, are provided with the match gram cover layer with overlapping wrapped formation for one deck between described conductor and described insulating barrier, described insulating barrier is provided with one deck watertight composition outward, between described watertight composition, is connected.
Preferably, described insulating barrier adopts polyvinyl chloride insulation layer.
Preferably, the thickness of described insulating barrier is 0.33-0.38mm.
Preferably, described watertight composition is added with 8%-12% fire proofing, and its thickness is 0.05-0.2mm.
Preferably, described tectal thickness is 0.5-0.8mm.
Preferably, the number of described conductor is four.
The present invention compared with prior art; have the following advantages: conductor of the present invention adopts tin-coated copper material; conductive effect is good, long service life, and be provided with one deck match gram cover layer with overlapping wrapped formation; protection conductor; prevent corrosion, at insulating barrier, be also provided with one deck watertight composition outward, effectively protected electric wire; avoid insulating barrier to damage, safe and reliable.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, technical scheme of the present invention is further described in detail.
Fig. 1 is structural representation of the present invention;
In figure, 1-conductor, 2-cover layer, 3-insulating barrier, 4-watertight composition.
Embodiment
Below in conjunction with the drawings and specific embodiments, technical scheme of the present invention is further described in detail.
Embodiment mono-:
In conjunction with a kind of electronic component down-lead shown in Fig. 1, comprise four conductors 1, conductor 1 is arranged side by side, conductor 1 skin is provided with one deck polyvinyl chloride insulation layer 3, polyvinyl chloride insulation layer 3 thickness are 0.38mm, conductor 1 adopts tin-coated copper material, between conductor 1 and insulating barrier 3, be provided with the match gram cover layer 2 with overlapping wrapped formation for one deck, the thickness of cover layer 2 is 0.8mm, the outer one deck watertight composition 4 that is provided with of insulating barrier 3, watertight composition 4 is added with 12% fire proofing, between watertight composition 4, is connected, and its thickness is 0.2mm.
Embodiment bis-:
In conjunction with a kind of electronic component down-lead shown in Fig. 1, comprise four conductors 1, conductor 1 is arranged side by side, conductor 1 skin is provided with one deck polyvinyl chloride insulation layer 3, polyvinyl chloride insulation layer 3 thickness are 0.33mm, conductor 1 adopts tin-coated copper material, between conductor 1 and insulating barrier 3, be provided with the match gram cover layer 2 with overlapping wrapped formation for one deck, the thickness of cover layer 2 is 0.5mm, insulating barrier is provided with one deck watertight composition 4 outward, watertight composition 4 is added with 8% fire proofing, between watertight composition 4, is connected, and its thickness is 0.05mm.
Embodiment tri-:
In conjunction with a kind of electronic component down-lead shown in Fig. 1, comprise four conductors 1, conductor 1 is arranged side by side, conductor 1 skin is provided with one deck polyvinyl chloride insulation layer 3, polyvinyl chloride insulation layer 3 thickness are 0.35mm, conductor 1 adopts tin-coated copper material, between conductor 1 and insulating barrier 3, be provided with the match gram cover layer 2 with overlapping wrapped formation for one deck, the thickness of cover layer 2 is 0.6mm, the outer one deck watertight composition that is provided with of insulating barrier 3, watertight composition 4 is added with 9% fire proofing, between watertight composition 4, is connected, and its thickness is 0.12mm.
Embodiment tetra-:
In conjunction with a kind of electronic component down-lead shown in Fig. 1, comprise four conductors 1, conductor 1 is arranged side by side, conductor 1 skin is provided with one deck polyvinyl chloride insulation layer 3, polyvinyl chloride insulation layer 3 thickness are 0.37mm, conductor adopts tin-coated copper material, between conductor 1 and insulating barrier 3, be provided with the match gram cover layer 2 with overlapping wrapped formation for one deck, the thickness of cover layer 2 is 0.7mm, the outer one deck watertight composition 4 that is provided with of insulating barrier 3, watertight composition 4 is added with 10% fire proofing, between watertight composition 4, is connected, and its thickness is 0.1mm.
Embodiment five:
In conjunction with a kind of electronic component down-lead shown in Fig. 1, comprise four conductors 1, conductor 1 is arranged side by side, conductor 1 skin is provided with one deck polyvinyl chloride insulation layer 3, polyvinyl chloride insulation layer 3 thickness are 0.34mm, conductor 1 adopts tin-coated copper material, between conductor 1 and insulating barrier 3, be provided with the match gram cover layer 2 with overlapping wrapped formation for one deck, the thickness of cover layer 2 is 0.55mm, the outer one deck watertight composition 4 that is provided with of insulating barrier 3, watertight composition 4 is added with 8%-12% fire proofing, between watertight composition 4, is connected, and its thickness is 0.18mm.
The present invention compared with prior art; have the following advantages: conductor of the present invention adopts tin-coated copper material; conductive effect is good, long service life, and be provided with one deck match gram cover layer with overlapping wrapped formation; protection conductor; prevent corrosion, at insulating barrier, be also provided with one deck watertight composition outward, effectively protected electric wire; avoid insulating barrier to damage, safe and reliable.
It should be noted last that, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can modify or be equal to replacement technical scheme of the present invention, and not departing from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of claim scope of the present invention.
Claims (6)
1. an electronic component down-lead, comprise several conductors, described conductor skin is provided with a layer insulating, it is characterized in that, described several conductors are arranged side by side, and described conductor adopts tin-coated copper material, are provided with the match gram cover layer with overlapping wrapped formation for one deck between described conductor and described insulating barrier, described insulating barrier is provided with one deck watertight composition outward, between described watertight composition, is connected.
2. electronic component down-lead according to claim 1, is characterized in that, described insulating barrier adopts polyvinyl chloride insulation layer.
3. electronic component down-lead according to claim 1, is characterized in that, the thickness of described insulating barrier is 0.33-0.38mm.
4. electronic component down-lead according to claim 1, is characterized in that, described watertight composition is added with 8%-12% fire proofing, and its thickness is 0.05-0.2mm.
5. electronic component down-lead according to claim 1, is characterized in that, described tectal thickness is 0.5-0.8mm.
6. electronic component down-lead according to claim 1, is characterized in that, the number of described conductor is four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410270103.XA CN104091625A (en) | 2014-06-17 | 2014-06-17 | Electronic component lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410270103.XA CN104091625A (en) | 2014-06-17 | 2014-06-17 | Electronic component lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104091625A true CN104091625A (en) | 2014-10-08 |
Family
ID=51639335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410270103.XA Pending CN104091625A (en) | 2014-06-17 | 2014-06-17 | Electronic component lead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104091625A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201210416Y (en) * | 2008-06-20 | 2009-03-18 | 深圳琦富瑞电子有限公司 | Electric wire |
| CN201336161Y (en) * | 2008-11-10 | 2009-10-28 | 富士康(昆山)电脑接插件有限公司 | Electronic wire |
| JP2010108627A (en) * | 2008-10-28 | 2010-05-13 | Sumitomo Electric Ind Ltd | Halogen-free flame-retardant insulating electric wire |
| CN202434226U (en) * | 2012-07-05 | 2012-09-12 | 上海福尔欣线缆有限公司 | Abrasion-proof thin-wall polrvinyl chloride insulated automotive wire |
| CN202749115U (en) * | 2012-07-17 | 2013-02-20 | 江苏大通机电有限公司 | Composite enameled wire |
| CN202749133U (en) * | 2012-07-17 | 2013-02-20 | 江苏大通机电有限公司 | Salt-mist-resistant enameled wire |
| CN103632765A (en) * | 2013-11-18 | 2014-03-12 | 娄底市中凯机电设备有限公司 | High-temperature resistant electronic wire |
-
2014
- 2014-06-17 CN CN201410270103.XA patent/CN104091625A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201210416Y (en) * | 2008-06-20 | 2009-03-18 | 深圳琦富瑞电子有限公司 | Electric wire |
| JP2010108627A (en) * | 2008-10-28 | 2010-05-13 | Sumitomo Electric Ind Ltd | Halogen-free flame-retardant insulating electric wire |
| CN201336161Y (en) * | 2008-11-10 | 2009-10-28 | 富士康(昆山)电脑接插件有限公司 | Electronic wire |
| CN202434226U (en) * | 2012-07-05 | 2012-09-12 | 上海福尔欣线缆有限公司 | Abrasion-proof thin-wall polrvinyl chloride insulated automotive wire |
| CN202749115U (en) * | 2012-07-17 | 2013-02-20 | 江苏大通机电有限公司 | Composite enameled wire |
| CN202749133U (en) * | 2012-07-17 | 2013-02-20 | 江苏大通机电有限公司 | Salt-mist-resistant enameled wire |
| CN103632765A (en) * | 2013-11-18 | 2014-03-12 | 娄底市中凯机电设备有限公司 | High-temperature resistant electronic wire |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141008 |