CN104089585A - Macro-micro three-dimensional deformation measurement method based on single-width orthogonal grid lines - Google Patents
Macro-micro three-dimensional deformation measurement method based on single-width orthogonal grid lines Download PDFInfo
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Abstract
The invention discloses a macro-micro three-dimensional deformation measurement method based on single-width orthogonal grid lines, and belongs to the field of optical measurement mechanics. The method comprises the steps of selecting the orthogonal grid lines with a proper frequency and an image collector according to the size of an object to be measured and the range of the three-dimensional deformation of the object to be measured, collecting a clear orthogonal grid line image after rotating the object to be measured by an angle, obtaining a single-direction grid line image in a coupling mode through Fourier transformation and inverse Fourier transformation, calculating a displacement field of the one-way grid line image, and determining the three-dimensional deformation of the object to be measured according to the displacement field. According to the method, the measurement range is wide, the sensitivity is high, operation is simple, measurement of the three-dimensional deformation of the object to be measured is achieved, and for any object with both the structure and the deformation centrosymmetric, static or dynamic measurement of the three-dimensional deformation can be well achieved.
Description
Technical field
The application relates to optical measurement mechanics field, specifically, relates to a kind of method that grand microcosmic 3 D deformation based on single width quadrature grid line is measured.
Background technology
Binocular vision is apish eyes, use two cameras to obtain the picture of the same area synchronization different angles, then by the displacement information of two width pictures, obtain the 3 D deformation field of measured zone, binocular vision method is widely used in macroscopical 3 D deformation field measurement field.Because use two cameras, first the same area to be adjusted to in the visual field of two cameras, when taking, also to accomplish synchronously, this just makes whole system equipment more, operate cumbersome, easily because generation error is not mated in time or region.
Along with deepening continuously of nanometer technique research, MEMS (micro electro mechanical system) (MEMS, Microelectromechanical Systems) or the application of microstructure also more and more extensive, micro nano structure mechanical property is measured and characterized also becomes the problem that people pay close attention to, and the experimental technique that the applicable micro-nano-scale mechanical property of development is measured and characterized becomes a kind of inevitable trend.Using the sweep trace of Electronic Speculum as the SEM Moire method forming with reference to grid line stack on grid and test specimen, because its highly sensitive whole audience displacement and strain measurement are being widely used aspect in-plane deformation measurement.But these measuring techniques are all for the displacement field in face and strain field, can not realize the measurement of object dimensional distortion.
Chinese Patent Application No. 201310232350.6 (publication number CN103424085, open day on Dec 4th, 2013) invention and created name is: a kind of measuring method of body surface three-dimensional pattern, this application discloses utilizes scanning moire method to combine and obtain the surface topography of testee with stereoscopic analysis model formation in scanning electron microscope.Its weak point is the moire pattern that this measuring method needs to use two width different angles in implementation procedure, and this just requires the same measured zone of two width Image Displays, operates more complicated and easily because introduction error is not mated in region.
Equally, < < Mapan > > magazine within 2011, in the interim Micro 3D measurement of 26 volumes the 1st method using SEM mono-literary composition, introduced a kind of in scanning electron microscope the measuring method of three-dimensional appearance.Its weak point is, the method need to be manufactured microgratings, makes electronics on test specimen surface, form shadow moire by grating, and then obtains the three-dimensional appearance of test specimen, and complicated operation, because needs manufacture can see through the transmission grating of electron beam, can increase measurement cost.
Therefore, 3 D deformation research for a structure and 3 D deformation symmetrical type objects centered by all, in reality, for this class situation, have a lot, such as the pit of bullet impact, the 3 D deformation of bubbling, in centrosymmetric structure, be full of liquid, 3 D deformation after gas or thermally equivalent, blast, ripples etc. impact sheet metal and form structure three-dimensional distortion etc. in certain scope, how setting up a static state or dynamic three-dimensional deformation measures, make measurement range wide, and simple to operate, be easy to the grand microcosmic 3 D deformation metering system of realizing, just become technical matters urgently to be resolved hurrily.
Summary of the invention
The application's technical matters to be solved is to provide a kind of grand microcosmic 3 D deformation measuring method based on single width quadrature grid line, to solve the 3 D deformation research of a structure and 3 D deformation symmetrical type objects centered by all, setting up a static state or dynamic three-dimensional deformation measures, make measurement range wide, and problem simple to operate, the grand microcosmic 3 D deformation that is easy to realize is measured.
For solving the problems of the technologies described above, the application provides a kind of grand microcosmic 3 D deformation measuring method based on single width quadrature grid line, it is characterized in that, the method comprises:
(1) on the surface of object under test, make the quadrature grid line with characteristic frequency and form described object under test surface, according to the size of the size of object under test and the three-dimension deformation-quantity pre-estimated, select image acquisition instrument, by adjusting the parameter of image acquisition instrument to described object under test surface, make the quadrature grid line in region to be measured, described object under test surface in image acquisition instrument focal range;
(2) facing upward of described sample bench of rotation adjustment bowed, principle that must be parallel with a certain grid line direction in quadrature grid line according to turning axle, make an angle beta of sample bench inclination, and adjust the parameter of described image acquisition instrument to described object under test surface, make the quadrature grid line in region to be measured, described object under test surface in image acquisition instrument focal range, draw the quadrature grid line of at least two width before and after the distortion in region to be measured, described object under test surface;
(3) to each the width quadrature grid line before and after the distortion obtaining in (2), through Fourier transform and inverse Fourier transform, carry out decoupling zero, obtain the grid line direction unidirectional grid line parallel with turning axle, draw the unidirectional grid line that grid line direction is vertical with turning axle simultaneously;
(4) the unidirectional grid line of the different directions obtaining after decoupling zero described in (3) is carried out to displacement calculating, draw and be out of shape displacement field A front and the unidirectional grid line that described grid line direction is vertical with turning axle, the described grid line direction unidirectional grid line displacement field B vertical with turning axle after distortion, and the described grid line direction unidirectional grid line displacement field C parallel with turning axle after distortion;
(5), according to the displacement field A and B, the C that obtain described in (4), utilize
Obtain the height h of testee
(x, y)with logarithmic strain value ε in face
(x, y).
Further, wherein, the quadrature grid line of described characteristic frequency, be further to estimate that according to the distortion of described object under test and this object under test size is definite, when being out of shape at micro-meter scale, selected frequency is the quadrature grid line that is more than or equal to 10 lines per millimeters, and when being out of shape at nanoscale, selected frequency is the quadrature grid line that is more than or equal to 1000 lines per millimeters.
Further, wherein, described image acquisition instrument, further, for being macroscopic view, microcosmic according to the size of the size of object under test and the three-dimension deformation-quantity pre-estimated or receiving and see yardstick and determine, the described image capture instrument that correspondence is taked is charge-coupled device camera and optical microscope or electron microscope to the insensitive object space of the surface deformation heart far away/bis-telecentric lens, super depth of field camera lens.
Further, wherein, the parameter on described object under test surface, is further that the focal length of the object space heart far away/bis-telecentric lens is, the focal length of optical microscope of super depth of field camera lens and the operating distance of electron microscope.
Further, wherein, described unidirectional grid line displacement field C, is further the elevation information on described object under test surface and the displacement field of in-plane deformation coupling.
Compared with prior art, a kind of grand microcosmic 3 D deformation measuring method based on single width quadrature grid line described in the application, has reached following effect:
1) the application makes the quadrature grid line of characteristic frequency according to the size of object and the three-dimension deformation-quantity pre-estimated.Select suitable image acquisition instrument, when dimension of object and three-dimension deformation-quantity are respectively macroscopic view, microcosmic and receive while seeing yardstick, the corresponding image acquisition instrument that can select is successively respectively CCD camera and optical microscope or electron microscope to the insensitive object space of the surface deformation heart far away/bis-telecentric lens, super depth of field camera lens.Add the sample bench that can adjust the elevation angle, as long as obtain region to be measured, object under test surface quadrature grid line clearly, just can realize the measurement of 3 D deformation.So can use to the distortion of micro-or nano size macro-size, measurement range is wide, and measures highly sensitive.
2) the application for meet structure and 3 D deformation all centered by the symmetrical static state of object or the experiment measuring of dynamic three-dimensional deformation can realize, static three-dimensional deformation measurement only need gather two width quadrature grid lines before and after the distortion in region to be measured, described object under test surface, and dynamic three-dimensional deformation is measured needs to use high speed camera to obtain some i.e. quadrature grid line more than two width of quadrature grid line clearly constantly of dynamic three-dimensional deformation of object.The measurement of static state or dynamic three-dimensional deformation, according to operation steps of the present invention, is processed all pictures, and dynamic experiment result of calculation is arranged in chronological order, just can realize the kinetic measurement of 3 D deformation.
3) the application is when carrying out image acquisition, only need to judge sample bench is clear along the postrotational image of turning axle, the region that does not need to adjust image acquisition makes two pictures take the same areas, simplifies experimental implementation, and is difficult for introducing and does not mate because of time or region the error causing.
4) equipment used in this application is simple, greatly reduces the cost of experiment.Aftertreatment by computing machine to measurement data, is easy to realize the mass of data processing.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide further understanding of the present application, forms the application's a part, and the application's schematic description and description is used for explaining the application, does not form the improper restriction to the application.In the accompanying drawings:
Fig. 1 is the process flow diagram of a kind of grand microcosmic 3 D deformation measuring method based on single width quadrature grid line described in the embodiment of the present application one.
Fig. 2 is the concrete Application Example of the application's method of adopting embodiment mono-, behind Objects around A X-axis rotation β=10 °, under scanning electron microscope, obtain picture body surface quadrature grid line (a), the grid line direction vertical rotating shaft after decoupling zero without the unidirectional grid line (d) after the distortion of the unidirectional grid line (b) of distortion, the unidirectional grid line (c) after the distortion of grid line direction vertical rotating shaft and grid line direction parallel rotary axes.
Fig. 3 is the object dimensional shape appearance figure of the concrete Application Example of the application's method of adopting embodiment mono-.
Fig. 4 is the strain figure of body surface vertical rotary direction of principal axis of the concrete Application Example of the application's method of adopting embodiment mono-.
Embodiment
As used some vocabulary in the middle of instructions and claim, censure specific components.Those skilled in the art should understand, and hardware manufacturer may be called same assembly with different nouns.This specification and claims are not used as distinguishing the mode of assembly with the difference of title, but the difference in function is used as the criterion of distinguishing with assembly.Instructions subsequent descriptions is for implementing the application's better embodiment, and right described description is to illustrate that the application's rule is object, not in order to limit the application's scope.The application's protection domain is when being as the criterion depending on the claims person of defining.
Below in conjunction with accompanying drawing, the application is described in further detail, but not as the restriction to the application.
Embodiment mono-
As shown in Figure 1, be a kind of grand microcosmic 3 D deformation measuring method based on single width quadrature grid line described in the embodiment of the present application one, concrete operation step is:
Step 101, the quadrature grid line in the making of the surface of object under test with characteristic frequency forms described object under test surface, according to the magnitude range of the size of object under test and the three-dimension deformation-quantity pre-estimated, select suitable image acquisition instrument, by adjusting image acquisition instrument at the parameter on described object under test surface, make the quadrature grid line in region to be measured, described object under test surface in image acquisition instrument focal range;
Step 102, rotation is adjusted facing upward of described sample bench and is bowed, principle that must be parallel with a certain grid line direction in quadrature grid line according to turning axle, it is an angle beta that sample bench is tilted, and adjust the parameter of described image acquisition instrument to described object under test surface, make the quadrature grid line in region to be measured, described object under test surface in image acquisition instrument focal range, draw the quadrature grid line of at least two width before and after the distortion in region to be measured, described object under test surface;
Wherein, described in make the sample bench angle beta that tilts, be further: the present embodiment is that the sample bench with angle beta=10 ° operates enforcement, but the angle that the present invention bows to adjusting facing upward of described sample bench is not done concrete restriction.
Step 103, to each the width quadrature grid line before and after the distortion obtaining in step 102, through Fourier transform and inverse Fourier transform, carry out decoupling zero, obtain the grid line direction unidirectional grid line parallel with turning axle, draw the unidirectional grid line that grid line direction is vertical with turning axle simultaneously;
Step 104, the unidirectional grid line of the different directions obtaining after decoupling zero described in step 103 is carried out to the calculating of displacement field, draw and be out of shape displacement field A front and the unidirectional grid line that described grid line direction is vertical with turning axle, the described grid line direction unidirectional grid line displacement field B vertical with turning axle after distortion, and the described grid line direction unidirectional grid line displacement field C parallel with turning axle after distortion;
Step 105, according to the displacement field A obtaining described in step 104 and B, C, utilizes
Obtain the height h of testee
(x, y)with logarithmic strain value ε in face
(x, y).
Wherein, described in said method, treat the quadrature grid line of characteristic frequency, be further: according to the concrete size of the distortion of described object under test and this object under test, determine, when being out of shape at micro-meter scale, the quadrature grid line of selected frequency (also can be called higher than) 10 lines per millimeters for being more than or equal to, when distortion is during at nanoscale, the quadrature grid line of selected frequency (also can be called higher than) 1000 lines per millimeters for being more than or equal to.
Wherein, the described image acquisition instrument in above-mentioned steps 101, is further:
According to the size of the size of object under test and the three-dimension deformation-quantity pre-estimated, be macroscopic view, microcosmic or receive and see yardstick and determine, the described image capture instrument that correspondence is taked is charge-coupled device camera and to the insensitive object space of the surface deformation heart far away/bis-telecentric lens, optical microscope or electron microscope, and this method is not done concrete restriction to this certainly.
In step 102, quadrature grid line before and after the distortion relating to, is the grid line of quadrature clearly to the formation in region to be measured, described object under test surface, the quadrature grating figure gathering by image acquisition instrument.
Concrete Application Example:
First, on the surface of object under test, make the quadrature grid line with characteristic frequency and form described object under test surface;
Wherein, in the present embodiment, the frequency of quadrature grid line will be measured object and the size of the three-dimension deformation-quantity pre-estimated is determined according to need, the grid line frequency on this test object surface is 1200 lines per millimeters, because standing time is longer, body surface has dust, and result of calculation is had to impact to a certain extent.
Secondly, described object under test is put on the observation chamber objective table (being sample bench described in previous embodiment) of scanning electron microscope (being image capture instrument described in previous embodiment), the scanning electron microscope model that this experiment is used is FEI Quanta FEG450, adjusts enlargement factor and the operating distance of scanning electron microscope: 3500 times and 11.6mm; Find described object under test surface to need zoning quadrature grid line clearly, then adjusting the direction of object, make a direction grid line of quadrature grid line on object parallel with X-axis, then test specimen is rotated to β=10 ° around X-axis, adjust the position of test specimen, again draw after the surperficial grid line of quadrature clearly needing of described object under test, record image now, as shown in Figure 2.
The 3rd, by the deformation monitoring to described object under test surface, draw the quadrature grid line of at least two width before and after the distortion in region to be measured, described object under test surface; Quadrature grid line to described at least two width, carries out decoupling zero through Fourier transform and inverse Fourier transform, obtains the grid line direction unidirectional grid line parallel with turning axle, draws the unidirectional grid line that grid line direction is vertical with turning axle simultaneously; The unidirectional grid line of the different directions obtaining after described decoupling zero is carried out to the calculating of displacement field, calculate displacement field A, B and C, and displacement field C is carried out to the matrix that interpolation forms three 748 pixel * 748 rubber elements, by data substitution computing formula:
Obtain the height h of testee
(x, y)with logarithmic strain value ε in face
(x, y).
The 4th, obtain the whole pattern of bubbling as shown in Figure 3, peak from face height, be 5.884 μ m, with published document Chuanwei Li, Zhanwei Liu, Huimin Xie et a1.Novel 3D SEM Moir é method for micro height Measurement[J] .OPTICS EXPRESS, 2013,21 (13): in 15724-15746, measurement result is 5.637 μ m, and relative error is 4.38%.Can also obtain the logarithmic strain value of vertical rotary direction of principal axis as shown in Figure 4, in the result of logarithmic strain, the strain at edge is larger, then to centre, reduce gradually, at edge, there is an areal strain very large, main cause is in scanning electron microscope picture, in bubbling marginal portion, to have the impact of a pocket impurity, can omit and disregard, whole strain result conforms to actual conditions, and these have all illustrated applicability of the present invention.
Compared with prior art, a kind of grand microcosmic 3 D deformation measuring method based on single width quadrature grid line described in the application, has reached following effect:
1) the application makes the quadrature grid line of characteristic frequency according to the size of object and the three-dimension deformation-quantity pre-estimated.Select suitable image acquisition instrument, when dimension of object and three-dimension deformation-quantity are respectively macroscopic view, microcosmic and receive while seeing yardstick, the corresponding image acquisition instrument that can select is successively respectively CCD camera and optical microscope or electron microscope to the insensitive object space of the surface deformation heart far away/bis-telecentric lens, super depth of field camera lens.Add the sample bench that can adjust the elevation angle, as long as obtain region to be measured, object under test surface quadrature grid line clearly, just can realize the measurement of 3 D deformation.So can use to the distortion of micro-or nano size macro-size, measurement range is wide, and measures highly sensitive.
2) the application for meet structure and 3 D deformation all centered by the symmetrical static state of object or the experiment measuring of dynamic three-dimensional deformation can realize, static three-dimensional deformation measurement only need gather two width quadrature grid lines before and after the distortion in region to be measured, described object under test surface, and dynamic three-dimensional deformation is measured needs to use high speed camera to obtain some i.e. quadrature grid line more than two width of quadrature grid line clearly constantly of dynamic three-dimensional deformation of object.The measurement of static state or dynamic three-dimensional deformation, according to operation steps of the present invention, is processed all pictures, and dynamic test result of calculation is arranged in chronological order, just can realize the kinetic measurement of 3 D deformation.
3) the application is when carrying out image acquisition, only need to judge sample bench is clear along the postrotational image of turning axle, the region that does not need to adjust image acquisition makes two pictures take the same areas, simplifies experimental implementation, and is difficult for introducing and does not mate because of time or region the error causing.
4) equipment used in this application is simple, greatly reduces the cost of experiment.Aftertreatment by computing machine to measurement data, is easy to realize the mass of data processing.
Above-mentioned explanation has illustrated and has described some preferred embodiments of the application, but as previously mentioned, be to be understood that the application is not limited to disclosed form herein, should not regard the eliminating to other embodiment as, and can be used for various other combinations, modification and environment, and can, in application contemplated scope described herein, by technology or the knowledge of above-mentioned instruction or association area, change.And the spirit and scope that the change that those skilled in the art carry out and variation do not depart from the application, all should be in the protection domain of the application's claims.
Claims (5)
1. the grand microcosmic 3 D deformation measuring method based on single width quadrature grid line, is characterized in that, the method comprises:
(1) on the surface of object under test, make the quadrature grid line with characteristic frequency and form described object under test surface, according to the magnitude range of the size of object under test and three-dimension deformation-quantity, select image acquisition instrument, by adjusting the parameter of image acquisition instrument to described object under test surface, make the quadrature grid line in region to be measured, described object under test surface in image acquisition instrument focal range;
(2) facing upward of sample bench of rotation adjustment bowed, principle that must be parallel with a certain grid line direction in quadrature grid line according to turning axle, make an angle beta of sample bench inclination, and adjust the parameter of described image acquisition instrument to described object under test surface, make the quadrature grid line in region to be measured, described object under test surface in image acquisition instrument focal range, draw the quadrature grid line of the distortion front and back in region to be measured, described object under test surface;
(3) to each the width quadrature grid line before and after the distortion obtaining in (2), through Fourier transform and inverse Fourier transform, carry out decoupling zero, obtain the grid line direction unidirectional grid line parallel with turning axle, draw the unidirectional grid line that grid line direction is vertical with turning axle simultaneously;
(4) the unidirectional grid line of the different directions obtaining after decoupling zero described in (3) is carried out to displacement calculating, draw and be out of shape displacement field A front and the unidirectional grid line that described grid line direction is vertical with turning axle, the described grid line direction unidirectional grid line displacement field B vertical with turning axle after distortion, and the described grid line direction unidirectional grid line displacement field C parallel with turning axle after distortion;
(5), according to the displacement field A and B, the C that obtain described in (4), utilize
Obtain the height h of testee
(x, y)with logarithmic strain value ε in face
(x, y).
2. the grand microcosmic 3 D deformation measuring method based on single width quadrature grid line according to claim 1, it is characterized in that, the quadrature grid line of described characteristic frequency, be further: according to the distortion range of size of described object under test and this object under test, determine, when being out of shape at micro-meter scale, selected frequency is the quadrature grid line that is more than or equal to 10 lines per millimeters, and when being out of shape at nanoscale, selected frequency is the quadrature grid line that is more than or equal to 1000 lines per millimeters.
3. the grand microcosmic 3 D deformation measuring method based on single width quadrature grid line according to claim 1, is characterized in that, described image acquisition instrument, is further:
According to the magnitude range of the size of object under test and three-dimension deformation-quantity, be macroscopic view, microcosmic or receive and see yardstick decision, the described image capture instrument that correspondence is taked is charge-coupled device camera and optical microscope or electron microscope to the insensitive object space of the surface deformation heart far away/bis-telecentric lens, super depth of field camera lens.
4. the grand microcosmic 3 D deformation measuring method based on single width quadrature grid line according to claim 1, it is characterized in that, the parameter on described object under test surface, is further: the focal length of the object space heart far away/bis-telecentric lens, the focal length of optical microscope of super depth of field camera lens and the operating distance of electron microscope.
5. the grand microcosmic 3 D deformation measuring method based on single width quadrature grid line according to claim 1, is characterized in that, described unidirectional grid line displacement field C, is further: the displacement field of the elevation information on described object under test surface and in-plane deformation coupling.
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