CN104086750B - Application of curing agent 1,2-bi(2,6-dioxo-4-morpholinyl) ethane in epoxy resin system - Google Patents
Application of curing agent 1,2-bi(2,6-dioxo-4-morpholinyl) ethane in epoxy resin system Download PDFInfo
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- CN104086750B CN104086750B CN201410362564.XA CN201410362564A CN104086750B CN 104086750 B CN104086750 B CN 104086750B CN 201410362564 A CN201410362564 A CN 201410362564A CN 104086750 B CN104086750 B CN 104086750B
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- ethane
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- morpholinyls
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Abstract
Description
Claims (8)
- Double (2,6- dioxy -4- morpholinyls) ethane of 1.1,2- as curing agent epoxy-resin systems application.
- 2. double (2,6- dioxy -4- morpholinyls) ethane of curing agent 1,2- according to claim 1 are in epoxy-resin systems Application process, it is characterised in that comprise the following steps:(1) it is the 30%~60% of epoxy resin quality according to double (2,6- dioxy -4- morpholinyls) the ethane consumptions of 1,2-, by epoxy After resin is previously heated to 80 DEG C, double (2, the 6- dioxy -4- morpholinyls) ethane of 1,2- are added, be uniformly mixed, by gained tree Lipoprotein mixture is heated to 100 DEG C of 2~4h of solidification, is continuously heating to 140~150 DEG C of 13~18h of solidification, obtains molding for epoxy resin Solidfied material;(2) solidify afterwards:By step (1) products therefrom prior to 150~160 DEG C of 2~3h of solidification, 170~200 DEG C are then heated to admittedly Change 3~5h, epoxy resin cubical contraction in the curing process is reduced to 0~0.5%.
- 3. double (2,6- dioxy -4- morpholinyls) ethane of curing agent 1,2- according to claim 1 are in epoxy-resin systems Application process, it is characterised in that comprise the following steps:On the basis of the quality of epoxy resin, according to curing agent 1, the consumption of double (2, the 6- dioxy -4- morpholinyls) ethane of 2- is ring The 40~60% of oxygen resin quality, by curing agent 1, double (2, the 6- dioxy -4- morpholinyls) ethane of 2- and epoxy resin are well mixed Afterwards, filler is added, is uniformly mixed, gained resin compound is heated to into 100 DEG C of 2~4h of solidification, it is continuously heating to 150~ 160 DEG C of solidification 13~18h shapings, continue to be warmed up to 160~170 DEG C of 2~4h of solidification, and 10~15h, ring are then solidified at room temperature Oxygen tree fat cubical contraction in the curing process is less than 0.5%.
- 4. double (2,6- dioxy -4- morpholinyls) ethane of curing agent 1,2- according to claim 3 are in epoxy-resin systems Application process, it is characterised in that described filler be precipitated calcium carbonate, diatomite, talcum powder in one or more in any proportion Mixture, amount of filler for epoxy resin mass fraction 2~4%.
- 5. double (2,6- dioxy -4- morpholinyls) ethane of curing agent 1,2- according to claim 1 are in epoxy-resin systems Application process, it is characterised in that comprise the following steps:It is the 0.3~3% of epoxy resin quality according to the consumption of accelerator on the basis of the quality of epoxy resin, curing agent 1, The consumption of double (2, the 6- dioxy -4- morpholinyls) ethane of 2- is the 40~60% of epoxy resin quality, by curing agent 1,2- double (2,6- Dioxy -4- morpholinyls) after ethane and epoxy resin is well mixed, accelerator is added, it is uniformly mixed, by gained mixed with resin Thing is heated to 100 DEG C of 2~4h of solidification, and 8~12h shapings are solidified at 120 DEG C, solidifies 3~4h at 130~140 DEG C then, then exists Room temperature condition solidifies 10-15h, and in the curing process shrinkage factor is reduced to 0~0.5% to epoxy resin.
- 6. double (2,6- dioxy -4- morpholinyls) ethane of curing agent 1,2- according to claim 5 are in epoxy-resin systems Application process, it is characterised in that the accelerator is in triethylene diamine, TEPA, polyethylene polyamine, DMP-30 Plant or several mixtures in any proportion.
- 7. double (2,6- dioxy -4- morpholinyls) ethane of curing agent 1,2- according to one of claim 2-4 are in epoxy resin The application process of system, it is characterised in that it is described be shaped to compression molding, moulding by casting, hand pasting forming, it is Wrapping formed in appoint Meaning is a kind of.
- 8. double (2,6- dioxy -4- morpholinyls) ethane of curing agent 1,2- according to one of claim 2-4 are in epoxy resin The application process of system, it is characterised in that described epoxy resin is E-54, E-51, E-44, in E-42, CYD127, CYD128 One or more mixtures in any proportion.
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CN201410362564.XA CN104086750B (en) | 2014-07-28 | 2014-07-28 | Application of curing agent 1,2-bi(2,6-dioxo-4-morpholinyl) ethane in epoxy resin system |
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CN201410362564.XA CN104086750B (en) | 2014-07-28 | 2014-07-28 | Application of curing agent 1,2-bi(2,6-dioxo-4-morpholinyl) ethane in epoxy resin system |
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CN104086750A CN104086750A (en) | 2014-10-08 |
CN104086750B true CN104086750B (en) | 2017-05-03 |
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KR101023843B1 (en) * | 2008-01-11 | 2011-03-22 | 주식회사 엘지화학 | Pressure-sensitive adhesive compositions, polarizers and liquid crystal displays comprising the same |
JP5387428B2 (en) * | 2010-01-26 | 2014-01-15 | Jnc株式会社 | Liquid crystal alignment agent, liquid crystal alignment film, and liquid crystal display element |
BR112012026853A2 (en) * | 2010-06-08 | 2016-07-12 | Dow Global Technologies Llc | method for preparing a particulate reversible crosslinked polymeric material and particulate reversible crosslinked particulate material |
GB201211309D0 (en) * | 2012-06-26 | 2012-08-08 | Fujifilm Mfg Europe Bv | Process for preparing membranes |
CN103333322B (en) * | 2013-08-09 | 2016-02-24 | 武汉工程大学 | A kind of spirocyclic compound is at the application method of epoxy-resin systems |
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Inventor after: Xu Ye Inventor before: Peng Yongli Inventor before: Wu Shengang Inventor before: Sun Yong Inventor before: Xiong Lijun |
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Effective date of registration: 20180404 Address after: No. 99, No. fourth, Tianyuan Road, economic and Technological Development Zone, Guangzhou, Guangdong Province Patentee after: Guangzhou present environmental protection materials Co., Ltd. Address before: 430074 Wuhan, Hongshan Province District, hung Chu street, No. 693 Patentee before: Wuhan Institute of Technology |
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