CN104078588A - Organic light-emitting device and fabrication method thereof - Google Patents
Organic light-emitting device and fabrication method thereof Download PDFInfo
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- CN104078588A CN104078588A CN201310101410.0A CN201310101410A CN104078588A CN 104078588 A CN104078588 A CN 104078588A CN 201310101410 A CN201310101410 A CN 201310101410A CN 104078588 A CN104078588 A CN 104078588A
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- H—ELECTRICITY
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- H10K50/00—Organic light-emitting devices
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Abstract
The invention provides an organic light-emitting device which comprises an anode conducting substrate, a light-emitting functional layer, a cathode layer and a package layer which are sequentially stacked, wherein the package layer is a composite structure which is formed by overlapping package layer units, and each package layer unit comprises a first organic baffle layer, a second organic baffle layer, a first inorganic baffle layer, a third organic baffle layer, a fourth organic baffle layer and a second inorganic baffle layer which are sequentially stacked. The invention also provides a fabrication method of the organic light-emitting device. By the method, erosion of moisture and oxygen to the organic light-emitting device can be effectively reduced, so that effective protection on an organic functional material and an electrode are formed, and the service life of the organic light-emitting device can be obviously prolonged. The method provided by the invention is particularly applicable for package of a flexible organic light-emitting device.
Description
Technical field
The present invention relates to electronic device association area, relate in particular to a kind of organic electroluminescence device and preparation method thereof.
Background technology
Organic electroluminescence device (OLED) is a kind of current mode light emitting semiconductor device based on organic material.Its typical structure is that the luminous organic material of preparing tens nanometer thickness on ito glass is made luminescent layer, and there is the metal electrode of low work function luminescent layer top.In the time being added with voltage on electrode, luminescent layer just produces light radiation.
OLED device have active illuminating, luminous efficiency high, low in energy consumption, light, thin, without advantages such as angle limitations, thought to be most likely at by insider the device of new generation that occupies dominance on following illumination and display device market.As a brand-new illumination and Display Technique, the ten years development in the past of OLED technology is swift and violent, has obtained huge achievement.Throw light on because the whole world is increasing and show that producer drops into research and development one after another, having promoted greatly the industrialization process of OLED, making the growth rate of OLED industry surprising, having arrived the eve of scale of mass production at present.
The current ubiquity life-span of organic electroluminescence device is short, and therefore the quality of encapsulation directly affects the life-span of device.In conventional art, adopt glass cover or crown cap to encapsulate, ultraviolet polymerization resin sealing for its edge, but the glass cover using in this method or crown cap volume are often larger, have increased the weight of device.
Summary of the invention
For overcoming the defect of above-mentioned prior art, the invention provides a kind of organic electroluminescence device and preparation method thereof.Organic electroluminescence device of the present invention can reduce steam, the erosion of oxygen to organic electroluminescence device effectively; organic functional material and the electrode of protection organic electroluminescence device exempt from destruction; meet the sealing requirements of encapsulation; can improve significantly the life-span of OLED device; preparation method of the present invention is simple; easily large area preparation, is suitable for large-scale industrialization and uses.The inventive method is applicable to the organic electroluminescence device prepared with conducting glass substrate of encapsulation, is also applicable to the flexible organic electroluminescent device that encapsulation is prepared as substrate taking plastics or metal.The inventive method is particularly useful for encapsulating flexible organic electroluminescent device.
On the one hand, the invention provides a kind of organic electroluminescence device, comprise the anode conducting substrate, light emitting functional layer, cathode layer and the encapsulated layer that stack gradually, described encapsulated layer is the composite construction being formed by encapsulated layer cells overlap; Described encapsulated layer unit comprises the first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer that stack gradually;
The material on described first organic barrier layer and the 3rd organic barrier layer is all selected from 1,1-bis-((4-N, N '-bis-(p-methylphenyl) amine) phenyl) cyclohexane, N, N'-diphenyl-N, N'-bis-(1-naphthyl)-1,1'-biphenyl-4,4'-diamines, oxine aluminium, 4,4', 4''-tri-(N-3-aminomethyl phenyl-N-phenyl amino) triphenylamine, 2,9-dimethyl-4,7-diphenyl-1, one in 10-phenanthroline and 1,3,5-tri-(1-phenyl-1H-benzimidazolyl-2 radicals-yl) benzene;
The material on described second organic barrier layer and the 4th organic barrier layer is all selected from 4,7-diphenyl Phen, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline, 1,3,5-tri-(1-phenyl-1H-benzimidazolyl-2 radicals-yl) benzene, oxine aluminium, two (2-methyl-8-quinoline)-(4-phenylphenol) aluminium and 3-(4-xenyl)-4 phenyl-5-tert-butyl benzene-1, one in 2,4-triazole;
The composite material that the oxide that described the first inorganic barrier layer material is binary metal alloy material and rhenium forms, the oxide of described rhenium is oxidation two rheniums, rheium oxide, rhenium sesquioxide, rhenium dioxide, five oxidation two rheniums or rhenium trioxides;
Described the second inorganic barrier layer material is the composite material that binary metal alloy material and metal sulfide form; Described metal sulfide is cadmium sulfide, vulcanized lead, ferrous disulfide, copper sulfide, zinc sulphide or nickel sulfide;
Described binary metal alloy material is Nitinol, silver-cadmium alloy, copper cadmium alloy, albronze, corronil or alumin(i)um zinc alloy.
Preferably, described encapsulated layer is the composite construction that 2～4 encapsulated layer cells overlaps form.
Preferably, the thickness on described first organic barrier layer, second organic barrier layer, the 3rd organic barrier layer and the 4th organic barrier layer is 200nm～300nm, and described the first inorganic barrier layer and the second inorganic barrier layer thickness are 100nm～200nm.
Preferably, in the first inorganic barrier layer, the mass fraction of the oxide of described rhenium is 10%～30%; In the second inorganic barrier layer, the mass fraction of described metal sulfide is 10%～30%.
Preferably, light emitting functional layer comprises the hole injection layer, hole transmission layer, luminescent layer, electron transfer layer and the electron injecting layer that stack gradually.
Preferably, described anode conducting substrate is conducting glass substrate or conduction organic film substrate.
More preferably, described anode conducting substrate is tin indium oxide (ITO) conducting glass substrate.
Preferably, described cathode layer can be non-transparent metals negative electrode (aluminium, silver, gold etc.) layer or transparent cathode layer (dielectric layer/metal level/dielectric layer etc., as ITO/Ag/ITO, ZnS/Ag/ZnS etc.).
More preferably, described cathode layer is aluminium.
The existence on organic barrier layer can stop outside water, the erosion of oxygen isoreactivity material to organic electroluminescence device on the one hand, can increase on the other hand the flexibility of encapsulated layer, prevent the appearance crackle of encapsulated layer, simultaneously organic barrier layer have quality light, prepare the advantages such as easy.The pliability of encapsulated layer has been strengthened in the preparation that repeats on organic barrier layer.
Inorganic barrier layer good insulating, has good water, oxygen obstructing capacity, improves packaging effect, extends the encapsulation life-span.Binary metal alloy material in described the first inorganic barrier layer material has improved the compactness on this barrier layer, and the oxide of rhenium has reduced stress in thin film, has avoided the appearance of the defect such as space, crack, improves barrier properties.The oxide of binary metal alloy material and rhenium is mixed to the water oxygen obstructing capacity that can further improve device.
The impact of the defect that encapsulated layer of the present invention can reduce single organic barrier layer, single inorganic barrier layer on packaging effect, extend water, oxygen permeation pathway, make water, oxygen enter the path of organic electroluminescence device more complicated, effectively reduce outside water, the erosion of oxygen isoreactivity material to organic electroluminescence device, the pliability that can improve encapsulated layer simultaneously, reaches encapsulation requirement.
On the other hand, the invention provides a kind of preparation method of organic electroluminescence device, comprise the following steps:
(1) anode pattern that is prepared with organic electroluminescence devices on clean electrically-conductive backing plate forms anode conducting substrate; Adopt the method for vacuum evaporation on anode conducting substrate, to prepare light emitting functional layer and cathode layer;
(2) on cathode layer, prepare encapsulated layer, preparation method is as follows:
(a) the organic barrier layer of vacuum evaporation first on cathode layer, evaporation condition is: vacuum degree is 1 × 10
-5pa～1 × 10
-3pa, evaporation rate is
(b) the organic barrier layer of vacuum evaporation second on first organic barrier layer, evaporation condition is: vacuum degree is 1 × 10
-5pa～1 × 10
-3pa, evaporation rate is
(c) on second organic barrier layer, adopt the method for magnetron sputtering to prepare the first inorganic barrier layer, when sputter, base vacuum degree is 1 × 10
-5pa～1 × 10
-3pa;
(d) vacuum evaporation the 3rd organic barrier layer on the first inorganic barrier layer, evaporation condition is: vacuum degree is 1 × 10
-5pa～1 × 10
-3pa, evaporation rate is
(e) vacuum evaporation the 4th organic barrier layer on the 3rd organic barrier layer, evaporation condition is: vacuum degree is 1 × 10
-5pa～1 × 10
-3pa, evaporation rate is
(f) on the 4th organic barrier layer, magnetron sputtering is prepared the second inorganic barrier layer, base vacuum degree 1 × 10
-5～1 × 10
-3pa;
(a)～after (f) step completes, make an encapsulated layer unit;
(g) repeating step (a)～(f), make the encapsulated layer with composite construction, finally obtains described organic electroluminescence device;
The material on described first organic barrier layer and the 3rd organic barrier layer is all selected from 1,1-bis-((4-N, N '-bis-(p-methylphenyl) amine) phenyl) cyclohexane (TAPC), N, N'-diphenyl-N, N'-bis-(1-naphthyl)-1,1'-biphenyl-4,4'-diamines (NPB), oxine aluminium (Alq3), 4,4', 4''-tri-(N-3-aminomethyl phenyl-N-phenyl amino) triphenylamine (m-MTDATA), 2,9-dimethyl-4,7-diphenyl-1, one in 10-phenanthroline (BCP) and 1,3,5-tri-(1-phenyl-1H-benzimidazolyl-2 radicals-yl) benzene (TPBi);
Described second organic barrier layer and the 4th organic barrier layer material are all selected from 4,7-diphenyl Phen (Bphen), 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline (BCP), 1,3,5-tri-(1-phenyl-1H-benzimidazolyl-2 radicals-yl) benzene (TPBi), oxine aluminium (Alq3), two (2-methyl-8-quinoline)-(4-phenylphenol) aluminium (Balq) and 3-(4-xenyl)-4 phenyl-5-tert-butyl benzene-1, one in 2,4-triazole (TAZ);
The composite material that the oxide that described the first inorganic barrier layer material is binary metal alloy material and rhenium forms, the oxide of described rhenium is oxidation two rhenium (Re
2o), rheium oxide (ReO), rhenium sesquioxide (Re
2o
3), rhenium dioxide (ReO
2), five oxidation two rhenium (Re
2o
5) or rhenium trioxide (ReO
3);
Described the second inorganic barrier layer material is the composite material that binary metal alloy material and metal sulfide form; Described metal sulfide is cadmium sulfide (CdS), vulcanized lead (PbS), ferrous disulfide (FeS
2), copper sulfide (CuS), zinc sulphide (ZnS) or nickel sulfide (NiS);
Described binary metal alloy material is Nitinol (Ni-Ti), silver-cadmium alloy (Ag-Cd), copper cadmium alloy (Cu-Cd), albronze (Cu-Al), corronil (Cu-Ni) or alumin(i)um zinc alloy (Al-Zn).
Preferably, described encapsulated layer is the composite construction that 2～4 encapsulated layer cells overlaps form.
Preferably, the thickness on described first organic barrier layer, second organic barrier layer, the 3rd organic barrier layer and the 4th organic barrier layer is 200nm～300nm, and described the first inorganic barrier layer and the second inorganic barrier layer thickness are 100nm～200nm.
Preferably, in the first inorganic barrier layer, the mass fraction of the oxide of described rhenium is 10%～30%; In the second inorganic barrier layer, the mass fraction of described metal sulfide is 10%～30%.
Preferably, light emitting functional layer comprises the hole injection layer, hole transmission layer, luminescent layer, electron transfer layer and the electron injecting layer that stack gradually, all adopts the method preparation of vacuum evaporation.
Preferably, described anode conducting substrate is conducting glass substrate or conduction organic film substrate.
More preferably, described anode conducting substrate is tin indium oxide (ITO) conducting glass substrate.
Preferably, described cathode layer can be non-transparent metals negative electrode (aluminium, silver, gold etc.) layer or transparent cathode layer (dielectric layer/metal level/dielectric layer etc., as ITO/Ag/ITO, ZnS/Ag/ZnS etc.).
More preferably, described cathode layer is aluminium.
Described encapsulated layer is that multiple basic structure repeats to form, water, oxygen permeation pathway are extended, can reach good packaging effect, effectively reduce outside water, the erosion of oxygen isoreactivity material to organic electroluminescence device, make up the shortcoming on single oxide layer and single organic substance barrier layer, extended device lifetime.
The invention provides a kind of organic electroluminescence device and preparation method thereof and there is following beneficial effect:
(1) organic electroluminescence device of the present invention can reduce outside water, the erosion of oxygen isoreactivity material to organic electroluminescence device effectively, thereby device light emitting functional layer and electrode are formed to effective protection, improve significantly the life-span of organic electroluminescence device;
(2) water resistance of organic electroluminescence device encapsulated layer of the present invention (WVTR) reaches 10
-4g/m
2day, the life-span reaches 4,490 hours above (T701000cd/m
2);
(3) organic electroluminescence device preparation method of the present invention is simple, and easily large area preparation is suitable for large-scale industrialization and uses.
Brief description of the drawings
Fig. 1 is the structural representation of the organic electroluminescence device prepared of the embodiment of the present invention 1.
Embodiment
The following stated is the preferred embodiment of the present invention.It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvement and adjustment, these improvement and adjustment are also considered as in protection scope of the present invention.
Embodiment 1:
A preparation method for organic electroluminescence device, comprises the following steps:
(1) ito glass substrate 1 pre-treatment: ITO conducting glass substrate 1 is put into acetone, ethanol, deionized water, ethanol successively, and ultrasonic cleaning 5 minutes, then dries up with nitrogen respectively, and stove-drying is stand-by; Ito glass substrate 1 after cleaning is carried out to surface activation process, to increase the oxygen content of conductive surface layer, improve the work function of conductive layer surface; Ito glass substrate 1 thickness is 100nm;
(2) preparation of light emitting functional layer 2:
Hole injection layer 21: evaporation MoO on ito glass substrate 1
3the composite material that doping NPB obtains, MoO
3doping mass fraction be 30%, evaporation all adopts high vacuum coating equipment to carry out, when evaporation, vacuum degree is 1 × 10
-5pa, evaporation rate is
obtain hole injection layer 21, thickness is 10nm;
Hole transmission layer 22: adopt 4,4', 4''-tri-(carbazole-9-yl) triphenylamine (TCTA) is as hole mobile material, evaporation TCTA on hole injection layer 21, vacuum degree is 1 × 10
-5pa, evaporation rate is
evaporation thickness is 30nm;
Luminescent layer 23: evaporation luminescent layer 23 on hole transmission layer 22, luminescent layer 23 material of main parts adopt 1,3,5-tri-(1-phenyl-1H-benzimidazolyl-2 radicals-yl) benzene (TPBI), guest materials adopts three (2-phenylpyridines) to close iridium (Ir (ppy)
3), guest materials quality accounts for 5% of material of main part, and evaporation vacuum degree is 1 × 10
-5pa, evaporation rate is
evaporation thickness is 20nm;
The preparation of electron transfer layer 24: evaporation 4 on luminescent layer 23,7-diphenyl-1,10-phenanthroline (Bphen) is as electron transport material, and vacuum degree is 1 × 10
-5pa, evaporation rate is
evaporation thickness is 10nm;
The preparation of electron injecting layer 25: evaporation electron injection material forms electron injecting layer 25 on electron transfer layer 24, and electron injecting layer 25 materials are CsN
3the composite material that doping Bphen forms, doping mass fraction is 30%, vacuum degree is 1 × 10
-5pa, evaporation rate is
evaporation thickness is 20nm;
(3) preparation of cathode layer 3: evaporation metal negative electrode 3 on electron injecting layer 25, metallic cathode 3 adopts aluminium (Al), and thickness is 100nm, and evaporation vacuum degree is 1 × 10
-5pa, evaporation rate is
(4) preparation of encapsulated layer 4:
(a) preparation on first organic barrier layer 401: vacuum evaporation TPBi on cathode layer 3, obtaining thickness is first organic barrier layer 401 of 200nm, vacuum degree is 1 × 10
-3pa, evaporation rate is
(b) preparation on second organic barrier layer 402: vacuum evaporation TAZ on first organic barrier layer 401, obtaining thickness is second organic barrier layer 402 of 220nm, vacuum degree is 1 × 10
-3pa, evaporation rate is
(c) preparation of the first inorganic barrier layer 403: adopting magnetron sputtering to prepare thickness on second organic barrier layer 402 is that the material of the first inorganic barrier layer 403, the first inorganic barrier layers 403 of 70nm is ReO
3with the composite material that Al-Zn forms, ReO
3mass fraction in the first inorganic barrier layer 403 is 20%, and thickness is 150nm, and base vacuum degree is 1 × 10
-3pa;
(d) preparation on the 3rd organic barrier layer 404: prepare material, thickness and the preparation method on 404, the three organic barrier layers 404, the 3rd organic barrier layer with first organic barrier layer 401 on the first inorganic barrier layer 403;
(e) preparation on the 4th organic barrier layer 405: prepare material, thickness and the preparation method on 405, the four organic barrier layers 405, the 4th organic barrier layer with second organic barrier layer 402 on the 3rd organic barrier layer 404;
(f) preparation of the second inorganic barrier layer 406: adopt the method for magnetron sputtering to prepare the second inorganic barrier layer 406 on the 4th organic barrier layer 405, material is the composite material that NiS and Al-Zn form, obtaining thickness is the second inorganic barrier layer 815 of 120nm, the mass fraction of NiS in the second inorganic barrier layer 406 is 10%, and base vacuum degree is 1 × 10
-3pa;
(g) first organic barrier layer 407, second organic barrier layer 408, the first inorganic barrier layer 409, the 3rd organic barrier layer 410, the 4th organic barrier layer 411, second inorganicly stops 412 preparation: after step (f), adopt method and the material identical with step (a) on the second inorganic barrier layer 406, to prepare first organic barrier layer 407, on first organic barrier layer 407, adopt again method and the material that step (b) is identical to prepare second organic barrier layer 408, on second organic barrier layer 408, adopt method and the material that step (c) is identical to prepare the first inorganic barrier layer 409, on the first inorganic barrier layer 409, adopt method and the material that step (d) is identical to prepare the 3rd organic barrier layer 410, on the 3rd organic barrier layer 410, adopt again method and the material identical with step (e) to prepare the 4th organic barrier layer 411, on the 4th organic barrier layer 411, adopt method that step (f) is identical and material to prepare second and inorganicly stop 412, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer form an encapsulated layer unit, finally obtain the encapsulated layer that contains 2 encapsulated layer unit.
Water oxygen permeability (WVTR, the g/m of the present embodiment organic electroluminescence device
2day) be 8.3 × 10
-4, the life-span of organic electroluminescence device is 4,490h(T701000cd/m
2).
Fig. 1 is the structural representation of the organic electroluminescence device that makes of the embodiment of the present invention 1.As shown in Figure 1, the present embodiment organic electroluminescence device, comprise the ito glass substrate 1, light emitting functional layer 2, cathode layer 3 and the encapsulated layer 4 that stack gradually, light emitting functional layer 2 comprises the hole injection layer 21, hole transmission layer 22, luminescent layer 23, electron transfer layer 24, the electron injecting layer 25 that stack gradually, encapsulated layer 4 comprises first organic barrier layer 401,407, second organic barrier layer 402,408, the first inorganic barrier layer 403,409, the 3rd organic barrier layer 405,411, organic barrier layer 404,410, the four and the second inorganic barrier layer 406,412.
Embodiment 2:
A preparation method for organic electroluminescence device, comprises the following steps:
(1), (2), (3) are with embodiment 1;
(4) preparation of encapsulated layer:
(a) preparation on first organic barrier layer: vacuum evaporation TAPC on cathode layer, obtaining thickness is first organic barrier layer of 200nm, vacuum degree is 1 × 10
-5pa, evaporation rate is
(b) preparation on second organic barrier layer: vacuum evaporation Bphen on first organic barrier layer, obtaining thickness is second organic barrier layer of 200nm, vacuum degree is 1 × 10
-5pa, evaporation rate is
(c) preparation of the first inorganic barrier layer: adopt magnetron sputtering to prepare the first inorganic barrier layer that thickness is 200nm on second organic barrier layer, the material of the first inorganic barrier layer is Ni-Ti and Re
2the composite material that O forms, Re
2the mass fraction of O in the first inorganic barrier layer is 30%, and base vacuum degree is 1 × 10
-5pa;
(d) preparation on the 3rd organic barrier layer: prepare the 3rd organic barrier layer on the first inorganic barrier layer, material, thickness and the preparation method on the 3rd organic barrier layer is with first organic barrier layer;
(e) preparation on the 4th organic barrier layer: prepare the 4th organic barrier layer on the 3rd organic barrier layer, material, thickness and the preparation method on the 4th organic barrier layer is with second organic barrier layer;
(f) preparation of the second inorganic barrier layer: adopt the method for magnetron sputtering to prepare the second inorganic barrier layer that thickness is 200nm on the 4th organic barrier layer, material is the composite material that Ni-Ti and CdS form, the mass fraction of CdS in the second inorganic barrier layer is 30%, and base vacuum degree is 1 × 10
-5pa;
(g) after step (f), adopt method and the material identical with step (a) on the second inorganic barrier layer, to prepare first organic barrier layer, on first organic barrier layer, adopt again method and the material that step (b) is identical to prepare second organic barrier layer, on second organic barrier layer, adopt method and the material that step (c) is identical to prepare the first inorganic barrier layer, on the first inorganic barrier layer, adopt method and the material that step (d) is identical to prepare the 3rd organic barrier layer, on the 3rd organic barrier layer, adopt again method and the material identical with step (e) to prepare the 4th organic barrier layer, on the 4th organic barrier layer, adopt method and the material that step (f) is identical to prepare for the second inorganic stopping, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer form an encapsulated layer unit, prepare multiple encapsulated layers unit, finally obtain the encapsulated layer that contains 4 encapsulated layer unit.
Water oxygen permeability (WVTR, the g/m of the present embodiment organic electroluminescence device
2day) be 6.9 × 10
-4, the life-span of organic electroluminescence device is 4,610h(T701000cd/m
2).
The present embodiment organic electroluminescence device, comprise the ito glass substrate stacking gradually, light emitting functional layer, cathode layer and encapsulated layer, encapsulated layer comprises the first organic barrier layer stacking gradually, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer.
Embodiment 3:
A preparation method for organic electroluminescence device, comprises the following steps:
(1), (2), (3) are with embodiment 1;
(4) preparation of encapsulated layer:
(a) preparation on first organic barrier layer: vacuum evaporation NPB on cathode layer, obtaining thickness is first organic barrier layer of 300nm, vacuum degree is 1 × 10
-4pa, evaporation rate is
(b) preparation on second organic barrier layer: vacuum evaporation BCP on first organic barrier layer, obtaining thickness is second organic barrier layer of 300nm, vacuum degree is 1 × 10
-4pa, evaporation rate is
(c) preparation of the first inorganic barrier layer: adopt magnetron sputtering to prepare the first inorganic barrier layer that thickness is 100nm on second organic barrier layer, the material of the first inorganic barrier layer is the composite material that Ag-Cd and ReO form, the mass fraction of ReO in the first inorganic barrier layer is 10%, and base vacuum degree is 1 × 10
-5pa;
(d) preparation on the 3rd organic barrier layer: prepare the 3rd organic barrier layer on the first inorganic barrier layer, material, thickness and the preparation method on the 3rd organic barrier layer is with first organic barrier layer;
(e) preparation on the 4th organic barrier layer: prepare the 4th organic barrier layer on the 3rd organic barrier layer, material, thickness and the preparation method on the 4th organic barrier layer is with second organic barrier layer;
(f) preparation of the second inorganic barrier layer: adopt the method for magnetron sputtering to prepare the second inorganic barrier layer that thickness is 150nm on the 4th organic barrier layer, material is the composite material that Ag-Cd and PbS form, the mass fraction of PbS in the second inorganic barrier layer is 20%, base vacuum degree 1 × 10
-4pa;
(g) after step (f), adopt method and the material identical with step (a) on the second inorganic barrier layer, to prepare first organic barrier layer, on first organic barrier layer, adopt again method and the material that step (b) is identical to prepare second organic barrier layer, on second organic barrier layer, adopt method and the material that step (c) is identical to prepare the first inorganic barrier layer, on the first inorganic barrier layer, adopt method and the material that step (d) is identical to prepare the 3rd organic barrier layer, on the 3rd organic barrier layer, adopt again method and the material identical with step (e) to prepare the 4th organic barrier layer, on the 4th organic barrier layer, adopt method and the material that step (f) is identical to prepare the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer form an encapsulated layer unit, prepare multiple encapsulated layers unit, finally obtain the encapsulated layer that contains 3 encapsulated layer unit.
Water oxygen permeability (WVTR, the g/m of the present embodiment organic electroluminescence device
2day) be 7.2 × 10
-4, the life-span of organic electroluminescence device is 4,581h(T701000cd/m
2).
The present embodiment organic electroluminescence device, comprise the ito glass substrate stacking gradually, light emitting functional layer, cathode layer and encapsulated layer, encapsulated layer comprises the first organic barrier layer stacking gradually, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer.
Embodiment 4:
A preparation method for organic electroluminescence device, comprises the following steps:
(1), (2), (3) are with embodiment 1;
(4) preparation of encapsulated layer:
(a) preparation on first organic barrier layer: vacuum evaporation Alq3 on cathode layer, obtaining thickness is first organic barrier layer of 250nm, vacuum degree is 1 × 10
-4pa, evaporation rate is
(b) preparation on second organic barrier layer: vacuum evaporation TPBi on first organic barrier layer, obtaining thickness is second organic barrier layer of 250nm, vacuum degree is 1 × 10
-4pa, evaporation rate is
(c) preparation of the first inorganic barrier layer: adopt magnetron sputtering to prepare the first inorganic barrier layer that thickness is 160nm on second organic barrier layer, material is Cu-Cd and Re
2o
3the composite material forming, Re
2o
3mass fraction in the first inorganic barrier layer is 20%, and base vacuum degree is 1 × 10
-5pa;
(d) preparation on the 3rd organic barrier layer: prepare the 3rd organic barrier layer on the first inorganic barrier layer, material, thickness and the preparation method on the 3rd organic barrier layer is with first organic barrier layer;
(e) preparation on the 4th organic barrier layer: prepare the 4th organic barrier layer on the 3rd organic barrier layer, material, thickness and the preparation method on the 4th organic barrier layer is with second organic barrier layer;
(f) preparation of the second inorganic barrier layer: adopt the method for magnetron sputtering to prepare the second inorganic barrier layer that thickness is 140nm on the 4th organic barrier layer, material is Cu-Cd and FeS
2, FeS
2mass fraction in the second inorganic barrier layer is 10%, base vacuum degree 1 × 10
-4pa;
(g) after step (f), adopt method and the material identical with step (a) on the second inorganic barrier layer, to prepare first organic barrier layer, on first organic barrier layer, adopt again method and the material that step (b) is identical to prepare second organic barrier layer, on second organic barrier layer, adopt method and the material that step (c) is identical to prepare the first inorganic barrier layer, on the first inorganic barrier layer, adopt method and the material that step (d) is identical to prepare the 3rd organic barrier layer, on the 3rd organic barrier layer, adopt again method and the material identical with step (e) to prepare the 4th organic barrier layer, on the 4th organic barrier layer, adopt method and the material that step (f) is identical to prepare for the second inorganic stopping, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer form an encapsulated layer unit, prepare multiple encapsulated layers unit, finally obtain the encapsulated layer that contains 3 encapsulated layer unit.
Water oxygen permeability (WVTR, the g/m of the present embodiment organic electroluminescence device
2day) be 7.3 × 10
-4, the life-span of organic electroluminescence device is 4,547h(T701000cd/m
2).
The present embodiment organic electroluminescence device, comprise the ito glass substrate stacking gradually, light emitting functional layer, cathode layer and encapsulated layer, encapsulated layer comprises the first organic barrier layer stacking gradually, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer.
Embodiment 5:
A preparation method for organic electroluminescence device, comprises the following steps:
(1), (2), (3) are with embodiment 1;
(4) preparation of encapsulated layer:
(a) preparation on first organic barrier layer: vacuum evaporation m-MTDATA on cathode layer, obtaining thickness is first organic barrier layer of 220nm, vacuum degree is 1 × 10
-4pa, evaporation rate is
(b) preparation on second organic barrier layer: vacuum evaporation Alq3 on first organic barrier layer, obtaining thickness is second organic barrier layer of 240nm, vacuum degree is 1 × 10
-4pa, evaporation rate is
(c) preparation of the first inorganic barrier layer: adopt magnetron sputtering to prepare the first inorganic barrier layer that thickness is 150nm on second organic barrier layer, the material of the first inorganic barrier layer is Cu-Al and ReO
2the composite material forming, ReO
2mass fraction in the first inorganic barrier layer is 20%, and base vacuum degree is 5 × 10
-5pa;
(d) preparation on the 3rd organic barrier layer: prepare the 3rd organic barrier layer on the first inorganic barrier layer, material, thickness and the preparation method on the 3rd organic barrier layer is with first organic barrier layer;
(e) preparation on the 4th organic barrier layer: prepare the 4th organic barrier layer on the 3rd organic barrier layer, material, thickness and the preparation method on the 4th organic barrier layer is with second organic barrier layer;
(f) preparation of the second inorganic barrier layer: adopt the method for magnetron sputtering to prepare the second inorganic barrier layer that thickness is 120nm on the 4th organic barrier layer, material is the composite material that Cu-Al and CuS form, obtain, the mass fraction of CuS in the second inorganic barrier layer is 10%, base vacuum degree 1 × 10
-4pa;
(g) after step (f), adopt method and the material identical with step (a) on the second inorganic barrier layer, to prepare first organic barrier layer, on first organic barrier layer, adopt again method and the material that step (b) is identical to prepare second organic barrier layer, on second organic barrier layer, adopt method and the material that step (c) is identical to prepare the first inorganic barrier layer, on the first inorganic barrier layer, adopt method and the material that step (d) is identical to prepare the 3rd organic barrier layer, on the 3rd organic barrier layer, adopt again method and the material identical with step (e) to prepare the 4th organic barrier layer, on the 4th organic barrier layer, adopt method and the material that step (f) is identical to prepare the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer form an encapsulated layer unit, prepare multiple encapsulated layers unit, finally obtain the encapsulated layer that contains 2 encapsulated layer unit,
Water oxygen permeability (WVTR, the g/m of the present embodiment organic electroluminescence device
2day) be 7.6 × 10
-4, the life-span of organic electroluminescence device is 4,525h(T701000cd/m
2).
The present embodiment organic electroluminescence device, comprise the ito glass substrate, light emitting functional layer, cathode layer and the encapsulated layer that stack gradually, encapsulated layer comprises first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer that stack gradually.
Embodiment 6:
A preparation method for organic electroluminescence device, comprises the following steps:
(1), (2), (3) are with embodiment 1;
(4) preparation of encapsulated layer:
(a) preparation on first organic barrier layer: vacuum evaporation BCP on cathode layer, obtaining thickness is first organic barrier layer of 260nm, vacuum degree is 1 × 10
-4pa, evaporation rate is
(b) preparation on second organic barrier layer: vacuum evaporation Balq on first organic barrier layer, obtaining thickness is second organic barrier layer of 200nm, vacuum degree is 1 × 10
-4pa, evaporation rate is
(c) preparation of the first inorganic barrier layer: adopt magnetron sputtering to prepare the first inorganic barrier layer that thickness is 150nm on second organic barrier layer, the material of the first inorganic barrier layer is Cu-Ni and Re
2o
5the composite material forming, Re
2o
5mass fraction in the first inorganic barrier layer is 20%, and base vacuum degree is 5 × 10
-5pa;
(d) preparation on the 3rd organic barrier layer: prepare the 3rd organic barrier layer on the first inorganic barrier layer, material, thickness and the preparation method on the 3rd organic barrier layer is with first organic barrier layer;
(e) preparation on the 4th organic barrier layer: prepare the 4th organic barrier layer on the 3rd organic barrier layer, material, thickness and the preparation method on the 4th organic barrier layer is with second organic barrier layer;
(f) preparation of the second inorganic barrier layer: adopt the method for magnetron sputtering to prepare the second inorganic barrier layer that thickness is 100nm on the 4th organic barrier layer, material is the composite material that ZnS and Cu-Ni form, the mass fraction of ZnS in the second inorganic barrier layer is 15%, evaporation rate
vacuum degree 1 × 10
-4pa;
(g) after step (f), adopt method and the material identical with step (a) on the second inorganic barrier layer, to prepare first organic barrier layer, on first organic barrier layer, adopt again method and the material that step (b) is identical to prepare second organic barrier layer, on second organic barrier layer, adopt method and the material that step (c) is identical to prepare the first inorganic barrier layer, on the first inorganic barrier layer, adopt method and the material that step (d) is identical to prepare the 3rd organic barrier layer, on the 3rd organic barrier layer, adopt again method and the material identical with step (e) to prepare the 4th organic barrier layer, on the 4th organic barrier layer, adopt method and the material that step (f) is identical to prepare the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer form an encapsulated layer unit, prepare multiple encapsulated layers unit, finally obtain the encapsulated layer that contains 2 encapsulated layer unit.
Water oxygen permeability (WVTR, the g/m of the present embodiment organic electroluminescence device
2day) be 7.9 × 10
-4, the life-span of organic electroluminescence device is 4,510h(T701000cd/m
2).
The present embodiment organic electroluminescence device, comprise the ito glass substrate, light emitting functional layer, cathode layer and the encapsulated layer that stack gradually, encapsulated layer comprises first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer, first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer that stack gradually.
Effect embodiment
For the beneficial effect of valid certificates organic electroluminescence device of the present invention and preparation method thereof, provide related experiment data as follows.
Table 1. embodiment 1～6 organic electroluminescence device water oxygen permeability
| ? | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 |
| WVTR(g/m 2/day) | 8.3×10 -4 | 6.9×10 -4 | 7.2×10 -4 | 7.3×10 -4 | 7.6×10 -4 | 7.9×10 -4 |
Table 2. embodiment 1～6 organic electro-luminescence device lifetime situation
As can be seen from Table 1, the water oxygen permeability of organic electroluminescence device of the present invention (WVTR) reaches 6.9 × 10
-4g/m
2day, as can be seen from Table 2, the life-span of organic electroluminescence device of the present invention reaches 4,490 hours above (T701000cd/m
2).
To sum up; organic electroluminescence device provided by the invention can reduce outside water, the erosion of oxygen isoreactivity material to organic electroluminescence device effectively; thereby device organic functional material and electrode are formed to effective protection; meet the requirement of the sealing of encapsulation, the life-span that can improve significantly OLED device.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. an organic electroluminescence device, comprises the anode conducting substrate, light emitting functional layer, cathode layer and the encapsulated layer that stack gradually, it is characterized in that, described encapsulated layer is the composite construction being formed by encapsulated layer cells overlap; Described encapsulated layer unit comprises the first organic barrier layer, second organic barrier layer, the first inorganic barrier layer, the 3rd organic barrier layer, the 4th organic barrier layer and the second inorganic barrier layer that stack gradually;
The material on described first organic barrier layer and the 3rd organic barrier layer is all selected from 1,1-bis-((4-N, N '-bis-(p-methylphenyl) amine) phenyl) cyclohexane, N, N'-diphenyl-N, N'-bis-(1-naphthyl)-1,1'-biphenyl-4,4'-diamines, oxine aluminium, 4,4', 4''-tri-(N-3-aminomethyl phenyl-N-phenyl amino) triphenylamine, 2,9-dimethyl-4,7-diphenyl-1, one in 10-phenanthroline and 1,3,5-tri-(1-phenyl-1H-benzimidazolyl-2 radicals-yl) benzene;
The material on described second organic barrier layer and the 4th organic barrier layer is all selected from 4,7-diphenyl Phen, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline, 1,3,5-tri-(1-phenyl-1H-benzimidazolyl-2 radicals-yl) benzene, oxine aluminium, two (2-methyl-8-quinoline)-(4-phenylphenol) aluminium and 3-(4-xenyl)-4 phenyl-5-tert-butyl benzene-1, one in 2,4-triazole;
The composite material that the oxide that described the first inorganic barrier layer material is binary metal alloy material and rhenium forms, the oxide of described rhenium is oxidation two rheniums, rheium oxide, rhenium sesquioxide, rhenium dioxide, five oxidation two rheniums or rhenium trioxides;
Described the second inorganic barrier layer material is the composite material that binary metal alloy material and metal sulfide form; Described metal sulfide is cadmium sulfide, vulcanized lead, ferrous disulfide, copper sulfide, zinc sulphide or nickel sulfide;
Described binary metal alloy material is Nitinol, silver-cadmium alloy, copper cadmium alloy, albronze, corronil or alumin(i)um zinc alloy.
2. organic electroluminescence device as claimed in claim 1, is characterized in that, described encapsulated layer is the composite construction that 2～4 encapsulated layer cells overlaps form.
3. organic electroluminescence device as claimed in claim 1, is characterized in that, in the first inorganic barrier layer, the mass fraction of the oxide of described rhenium is 10%～30%; In the second inorganic barrier layer, the mass fraction of described metal sulfide is 10%～30%.
4. organic electroluminescence device as claimed in claim 1, it is characterized in that, the thickness on described first organic barrier layer, second organic barrier layer, the 3rd organic barrier layer and the 4th organic barrier layer is 200nm～300nm, and described the first inorganic barrier layer and the second inorganic barrier layer thickness are 100nm～200nm.
5. organic electroluminescence device as claimed in claim 1, is characterized in that, described light emitting functional layer comprises the hole injection layer, hole transmission layer, luminescent layer, electron transfer layer and the electron injecting layer that stack gradually.
6. a preparation method for organic electroluminescence device, is characterized in that, comprises the following steps:
(1) anode pattern that is prepared with organic electroluminescence devices on clean electrically-conductive backing plate forms anode conducting substrate; Adopt the method for vacuum evaporation on substrate, to prepare light emitting functional layer and cathode layer;
(2) on cathode layer, prepare encapsulated layer, encapsulated layer preparation method is as follows:
(a) the organic barrier layer of vacuum evaporation first on cathode layer, evaporation condition is: vacuum degree is 1 × 10
-5pa～1 × 10
-3pa, evaporation rate is
(b) the organic barrier layer of vacuum evaporation second on first organic barrier layer, evaporation condition is: vacuum degree is 1 × 10
-5pa～1 × 10
-3pa, evaporation rate is
(c) on second organic barrier layer, adopt the method for magnetron sputtering to prepare the first inorganic barrier layer, when sputter, base vacuum degree is 1 × 10
-5pa～1 × 10
-3pa;
(d) vacuum evaporation the 3rd organic barrier layer on the first inorganic barrier layer, evaporation condition is: vacuum degree is 1 × 10
-5pa～1 × 10
-3pa, evaporation rate is
(e) vacuum evaporation the 4th organic barrier layer on the 3rd organic barrier layer, evaporation condition is: vacuum degree is 1 × 10
-5pa～1 × 10
-3pa, evaporation rate is
(f) on the 4th organic barrier layer, adopt the method for magnetron sputtering to prepare the second inorganic barrier layer, base vacuum degree is 1 × 10
-5～1 × 10
-3pa;
(a)～after (f) step completes, make an encapsulated layer unit;
(g) repeating step (a)～(f), make the encapsulated layer with composite construction, finally obtains described organic electroluminescence device;
The material on described first organic barrier layer and the 3rd organic barrier layer is all selected from 1,1-bis-((4-N, N '-bis-(p-methylphenyl) amine) phenyl) cyclohexane, N, N'-diphenyl-N, N'-bis-(1-naphthyl)-1,1'-biphenyl-4,4'-diamines, oxine aluminium, 4,4', 4''-tri-(N-3-aminomethyl phenyl-N-phenyl amino) triphenylamine, 2,9-dimethyl-4,7-diphenyl-1, one in 10-phenanthroline and 1,3,5-tri-(1-phenyl-1H-benzimidazolyl-2 radicals-yl) benzene;
The material on described second organic barrier layer and the 4th organic barrier layer is all selected from 4,7-diphenyl Phen, 2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline, 1,3,5-tri-(1-phenyl-1H-benzimidazolyl-2 radicals-yl) benzene, oxine aluminium, two (2-methyl-8-quinoline)-(4-phenylphenol) aluminium and 3-(4-xenyl)-4 phenyl-5-tert-butyl benzene-1, one in 2,4-triazole;
The composite material that the oxide that described the first inorganic barrier layer material is binary metal alloy material and rhenium forms, the oxide of described rhenium is oxidation two rheniums, rheium oxide, rhenium sesquioxide, rhenium dioxide, five oxidation two rheniums or rhenium trioxides;
Described the second inorganic barrier layer material is the composite material that binary metal alloy material and metal sulfide form; Described metal sulfide is cadmium sulfide, vulcanized lead, ferrous disulfide, copper sulfide, zinc sulphide or nickel sulfide;
Described binary metal alloy material is Nitinol, silver-cadmium alloy, copper cadmium alloy, albronze, corronil or alumin(i)um zinc alloy.
7. the preparation method of organic electroluminescence device as claimed in claim 6, is characterized in that, described encapsulated layer is the composite construction that 2～4 encapsulated layer cells overlaps form.
8. the preparation method of organic electroluminescence device as claimed in claim 6, is characterized in that, in the first inorganic barrier layer, the mass fraction of the oxide of described rhenium is 10%～30%; In the second inorganic barrier layer, the mass fraction of described metal sulfide is 10%～30%.
9. the preparation method of organic electroluminescence device as claimed in claim 6, it is characterized in that, the thickness on described first organic barrier layer, second organic barrier layer, the 3rd organic barrier layer and the 4th organic barrier layer is 200nm～300nm, and described the first inorganic barrier layer and the second inorganic barrier layer thickness are 100nm～200nm.
10. the preparation method of organic electroluminescence device as claimed in claim 6, it is characterized in that, described light emitting functional layer comprises the hole injection layer, hole transmission layer, luminescent layer, electron transfer layer and the electron injecting layer that stack gradually, all adopts the method preparation of vacuum evaporation.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101027798A (en) * | 2004-09-23 | 2007-08-29 | 3M创新有限公司 | Protected polymeric film |
| US20070228382A1 (en) * | 2002-06-11 | 2007-10-04 | Shunpei Yamazaki | Light emitting device and manufacturing method thereof |
| CN101359722A (en) * | 2008-09-23 | 2009-02-04 | 吉林大学 | Encapsulation method for top radiation organic EL part |
| CN101412300A (en) * | 2007-10-16 | 2009-04-22 | 富士胶片株式会社 | Barrier laminate, barrier film substrate, device, and method for producing barrier laminate |
| CN102909911A (en) * | 2011-08-05 | 2013-02-06 | 林宽锯 | Transparent conductive glass with high visible light transmittance and manufacture method thereof |
-
2013
- 2013-03-27 CN CN201310101410.0A patent/CN104078588A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070228382A1 (en) * | 2002-06-11 | 2007-10-04 | Shunpei Yamazaki | Light emitting device and manufacturing method thereof |
| CN101027798A (en) * | 2004-09-23 | 2007-08-29 | 3M创新有限公司 | Protected polymeric film |
| CN101412300A (en) * | 2007-10-16 | 2009-04-22 | 富士胶片株式会社 | Barrier laminate, barrier film substrate, device, and method for producing barrier laminate |
| CN101359722A (en) * | 2008-09-23 | 2009-02-04 | 吉林大学 | Encapsulation method for top radiation organic EL part |
| CN102909911A (en) * | 2011-08-05 | 2013-02-06 | 林宽锯 | Transparent conductive glass with high visible light transmittance and manufacture method thereof |
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