CN104075822A - Temperature processing device and method in satellite thermal test - Google Patents

Temperature processing device and method in satellite thermal test Download PDF

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Publication number
CN104075822A
CN104075822A CN201410258524.0A CN201410258524A CN104075822A CN 104075822 A CN104075822 A CN 104075822A CN 201410258524 A CN201410258524 A CN 201410258524A CN 104075822 A CN104075822 A CN 104075822A
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China
Prior art keywords
satellite
temperature sensor
digital temperature
digital
temperature
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Pending
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CN201410258524.0A
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Chinese (zh)
Inventor
常亮
金其海
王永
诸成
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Shanghai Engineering Center for Microsatellites
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Shanghai Engineering Center for Microsatellites
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Priority to CN201410258524.0A priority Critical patent/CN104075822A/en
Publication of CN104075822A publication Critical patent/CN104075822A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a temperature processing device and method in a satellite thermal test. The device comprises a satellite bottom plate and at least one satellite side plate. One of the satellite side plates and the satellite bottom plate is provided with a digital temperature sensor used for collecting the temperature of the satellite side plates or the satellite bottom plate and sending the temperature to a satellite-mounted computer. The satellite-mounted computer is arranged on the satellite bottom plate and used for receiving the temperature collected by the digital temperature sensor and transmitting and forwarding the temperature to a terminal for later processing. The digital temperature sensor is used for replacing a traditional thermocouple, and therefore the problem of the complex connection relation of the thermocouple is solved. Meanwhile, a digital temperature sensor interface integrated through the satellite-mounted computer is utilized, temperature collecting is achieved, the temperature is transmitted to the ground, and therefore a large number of flanges and special ground testing devices are saved, and the effects of saving labor and force are achieved.

Description

A kind of Temperature Treatment devices and methods therefor of satellite heat test
Technical field
The present invention relates to aerospace measurement and control technology field, specifically, is a kind of Temperature Treatment devices and methods therefor of satellite heat test.
Background technology
In space industry, need to usually to satellite, carry out the examination of vacuum thermal test.In vacuum thermal test process, need to build a thermal environment to testee, this thermal environment needs a large amount of temperature acquisitions.Current common way is in satellite development process, to add this procedure of thermal control star repacking (that is, required thermopair, well heater etc. while increasing vacuum thermal test on satellite), and this operation is by manually completing.Shown in Figure 1, in temperature acquisition process, the vacuum thermal test method of domsat is mainly to be undertaken by the method for thermopair 110 at present, it is general by even thermopair more than Ji Qian road 110 of hundreds of road is set, each thermopair 110(comprises thermopair 1, 2, n) all need both positive and negative polarity to access independently in ground environment, satellite needs above-mentioned thermopair 110 to be connected in the transfer panel (or being called ring flange 120) of vacuum tank in thermal control star retrofit process, and access ground checkout equipment 130(is special-purpose temperature acquisition equipment) in, temperature data is sent to PC terminal 140.But said method has following weak point: one, can cause and use a large amount of connector and cable; Two, can waste a large amount of manpower and materials; Three, the accuracy of temperature acquisition is difficult to guarantee; Four, after satellite vacuum thermal test is complete, also need to remove.
In view of this, need a kind of Temperature Treatment device or method of satellite heat test, to address the above problem.
Summary of the invention
The object of the invention is to, a kind of Temperature Treatment device of satellite heat test is provided, it utilizes digital temperature sensor to substitute traditional thermopair, and by spaceborne computer institute integrated digital formula temperature sensor interface, directly collecting temperature Data Concurrent is delivered to ground for processing, thereby can simplify the interconnecting relation of original temperature acquisition system, and save the repacking time of original thermal control star.
For achieving the above object, the present invention by the following technical solutions.
A Temperature Treatment device for satellite heat test, comprises a satellite base plate and at least one satellite side plate; In one of them of described at least one satellite side plate and described satellite base plate, at least one digital temperature sensor is set, described at least one digital temperature sensor is used for gathering the temperature of described at least one satellite side plate or described satellite base plate, and is sent to a spaceborne computer; Described spaceborne computer is arranged on described satellite base plate, the temperature gathering for receiving described at least one digital temperature sensor, and transmit and transfer to a terminal, for subsequent processes.
As optional technical scheme, a digital temperature sensor interface is set on described spaceborne computer, described digital temperature sensor interface is connected with described at least one digital temperature sensor.
As optional technical scheme, on described at least one satellite side plate, plural digital temperature sensor is set, and described plural digital temperature sensor is one another in series.
As optional technical scheme, on described satellite base plate, plural digital temperature sensor is set, and described plural digital temperature sensor is one another in series, connect with the plural digital temperature sensor on described at least one satellite side plate simultaneously.
As optional technical scheme, described plural digital temperature sensor is to be one another in series by three cables, and described three cables comprise a service cable, a telegram in reply cable and a signal cable; Wherein said service cable and telegram in reply cable, for providing electric energy to digital temperature sensor, described signal cable is for the data transmission of digital temperature sensor.
As optional technical scheme, described spaceborne computer is connected with described terminal by RS422 bus.
Another object of the present invention is to, a kind of Temperature Treatment method of satellite heat test is provided, the Temperature Treatment device that adopts above-mentioned satellite heat test, comprises the following steps: spaceborne computer sends at least one temperature acquisition instruction at least one digital temperature sensor; Described at least one digital temperature sensor receives after described at least one temperature acquisition instruction, gathers the temperature of at least one satellite side plate or satellite base plate, and is converted into digital signal and is sent to described spaceborne computer; Described spaceborne computer receives after described digital signal, is sent to a terminal.
The invention has the advantages that, utilize digital temperature sensor to substitute traditional thermopair, thereby solve the problem of the complicated annexation of thermopair.Meanwhile, utilize the integrated digital temperature sensor interface of spaceborne computer, realize the collection of temperature, and transfer to ground, to save a large amount of ring flanges and dedicated ground testing apparatus, and then reach people from province labour-saving effect.In addition, the present invention, after carrying out vacuum thermal test, does not need to remove, and still can utilize the temperature acquisition assembly (as digital temperature sensor) in vacuum thermal test process when satellite moves on the track of appointment.
Accompanying drawing explanation
Fig. 1 is the structural representation of the Temperature Treatment device of existing satellite heat test.
Fig. 2 is the structural representation of the Temperature Treatment device of the described satellite heat test in one embodiment of the invention.
Fig. 3 is the flow chart of steps of the Temperature Treatment method of the described satellite heat test in one embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing, the Temperature Treatment devices and methods therefor embodiment of satellite heat test provided by the invention is elaborated.Below in conjunction with accompanying drawing, technical scheme of the present invention is elaborated.At this, it should be noted that, in different icons, identical element numbers represents same or analogous assembly.
Referring to Fig. 2, in one embodiment of the invention, provide a kind of Temperature Treatment device of satellite heat test, comprise a satellite base plate 210 and at least one satellite side plate 220.In an embodiment of the present invention, the quantity of satellite side plate 220 is four, i.e. the first satellite side plate 220, the second satellite side plate 220, the 3rd satellite side plate 220 and the 4th satellite side plate 220.In one of them of described four satellite side plates 220 and described satellite base plate 210, at least one digital temperature sensor 240 is set.
In inventive embodiment, on described four satellite side plates 220, plural digital temperature sensor 240 is set, and described plural digital temperature sensor 240 is one another in series.Plural digital temperature sensor 240 is set on described satellite base plate 210, and described plural digital temperature sensor 240 is one another in series, connect with the plural digital temperature sensor 240 on described four satellite side plates 220 simultaneously.
As shown in Figure 2, the quantity of the digital temperature sensor 240 on the first satellite side plate 220 is 4, the quantity of the digital temperature sensor 240 on the second satellite side plate 220 is 3, the quantity of the digital temperature sensor 240 on the 3rd satellite side plate 220 is 8, the quantity of the digital temperature sensor 240 on the 4th satellite side plate 220 is 4, the quantity of the digital temperature sensor 240 on satellite base plate 210 is 2, digital temperature sensor 240 quantity on above-mentioned satellite side plate 220 and satellite base plate 210 are only for example, but should be as limit.Equally, the quantity of satellite side plate 220 is only also for example, but with this, does not limit the scope that the present invention asks for protection.
In an embodiment of the present invention, described digital temperature sensor 240 adopts 18B20 type digital temperature sensor 240, and described digital temperature sensor 240 is supported series system.By being used in conjunction with of a spaceborne computer 230, digital temperature sensor 240 and signal cable, can instrumented satellite side plate 220 and satellite base plate 210 on the temperature of each desired location.Each digital temperature sensor 240 is corresponding one by one respectively with each desired location on satellite side plate 220 and satellite base plate 210.For example, the first desired location of the corresponding first satellite side plate 220 of first digit formula temperature sensor 240 of the first satellite side plate 220.The second desired location of the corresponding first satellite side plate 220 of second digit formula temperature sensor 240 of the first satellite side plate 220, by that analogy, the 3rd desired location of corresponding the 4th satellite side plates 220 of third digit formula temperature sensor 240 of the 4th satellite side plate 220, other digital temperature sensors 240 are no longer given an example with the relation of corresponding desired location.
By spaceborne computer 230, send a fill order, can obtain the temperature of each desired location at every turn, and by the temperature data gathering by signal cable (or be called bus, the arbitrary digital temperature sensor 240 being connected with this bus all can with the direct transceiving data of spaceborne computer 230) be directly sent to spaceborne computer 230.The second digit formula temperature sensor 240 that for example spaceborne computer 230 sends fill order to a first satellite side plate 220 is to gather the temperature of the second desired location of corresponding the first satellite side plate 220, the second digit formula temperature sensor 240 of the first satellite side plate 220, after collecting temperature, is directly sent to spaceborne computer 230 by temperature data by signal cable.In like manner, the first digit formula temperature sensor 240 that spaceborne computer 230 sends fill order to a second satellite side plate 220 is to gather the temperature of the first desired location of corresponding the second satellite side plate 220, the first digit formula temperature sensor 240 of the second satellite side plate 220, after collecting temperature, is directly sent to spaceborne computer 230 by temperature data by signal cable.The digital temperature sensor 240 arranging by series connection, can save a large amount of connector of the prior art and cable, avoids the annexation problem of prior art thermopair complexity, saves a plurality of ground checkout equipments and ring flange, to reduce costs simultaneously.
Above-mentioned plural digital temperature sensor 240 is to be one another in series by three cables, and described three cables comprise a service cable, a telegram in reply cable and a signal cable (not shown); Wherein said service cable and telegram in reply cable, for electric energy being provided to digital temperature sensor 240, described signal cable is for the data transmission of digital temperature sensor 240.
Described at least one digital temperature sensor 240 is for gathering the temperature of described at least one satellite side plate 220 or described satellite base plate 210, and is sent to spaceborne computer 230.Described spaceborne computer 230 is arranged on described satellite base plate 210, and the temperature gathering for receiving described at least one digital temperature sensor 240 after processing as calculated, and is transmitted and transferred to a terminal by RS422 bus, for subsequent processes.Described terminal can have the equipment of computing and management function for PC terminal 250, server or other.In embodiments of the present invention, adopt PC terminal 250.
Optionally, a digital temperature sensor interface (not shown) is set on described spaceborne computer 230, described digital temperature sensor interface is connected with described at least one digital temperature sensor 240.That is in embodiments of the present invention, described digital temperature sensor interface and a plurality of digital temperature sensor 240 are the relation of one-to-many, thereby be convenient to described spaceborne computer 230, concentrate and gather and control a plurality of digital temperature sensors 240.
Another object of the present invention is to, a kind of Temperature Treatment method of satellite heat test is provided, the Temperature Treatment device that adopts above-mentioned satellite heat test, referring to Fig. 3, comprises the following steps: step S310, spaceborne computer send at least one temperature acquisition instruction at least one digital temperature sensor; Step S320, described at least one digital temperature sensor receive after described at least one temperature acquisition instruction, gather the temperature of at least one satellite side plate or satellite base plate, and are converted into digital signal and are sent to described spaceborne computer; Step S330, described spaceborne computer receive after described digital signal, are sent to a terminal.
Above above-mentioned steps is elaborated.
Step S310, spaceborne computer send at least one temperature acquisition instruction at least one digital temperature sensor.
In this step, spaceborne computer 230, by the setting of its built-in application program, regularly or aperiodically sends at least one temperature acquisition instruction at least one digital temperature sensor 240.For example, described spaceborne computer 230 sends the first digit formula temperature sensor 240 of temperature acquisition instruction to the four satellite side plates 220 for the first time, to gather the temperature of the first desired location of the 4th satellite side plate 220, described spaceborne computer 230 sends the third digit formula temperature sensor 240 of temperature acquisition instruction to the four satellite side plates 220 for the second time, to gather the temperature of the 3rd desired location of the 4th satellite side plate 220, described spaceborne computer 230 sends the second digit formula temperature sensor 240 of temperature acquisition instruction to the first satellite side plate 220 for the third time, to gather the temperature of the second desired location of the first satellite side plate 220.
Step S320, described at least one digital temperature sensor receive after described temperature acquisition instruction, gather the temperature of at least one satellite side plate or satellite base plate, and are converted into digital signal and are sent to described spaceborne computer.
Each digital temperature sensor 240 receives after said temperature acquisition instructions, gather the temperature of its corresponding desired location (on satellite side plate 220 or satellite base plate 210), and utilize the characteristic of described digital temperature sensor 240, temperature signal is converted into digital signal, to be sent to described spaceborne computer 230.
Step S330, described spaceborne computer receive after described digital signal, are sent to a terminal.
Described spaceborne computer 230, after receiving a plurality of temperature datas (digital), is sent to described PC terminal 250, for subsequent processes.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims (7)

1. a Temperature Treatment device for satellite heat test, is characterized in that, comprises a satellite base plate and at least one satellite side plate; In one of them of described at least one satellite side plate and described satellite base plate, at least one digital temperature sensor is set, described at least one digital temperature sensor is used for gathering the temperature of described at least one satellite side plate or described satellite base plate, and is sent to a spaceborne computer; Described spaceborne computer is arranged on described satellite base plate, the temperature gathering for receiving described at least one digital temperature sensor, and transmit and transfer to a terminal, for subsequent processes.
2. the Temperature Treatment device of satellite heat test according to claim 1, it is characterized in that, one digital temperature sensor interface is set on described spaceborne computer, and described digital temperature sensor interface is connected with described at least one digital temperature sensor.
3. the Temperature Treatment device of satellite heat test according to claim 1, is characterized in that, on described at least one satellite side plate, plural digital temperature sensor is set, and described plural digital temperature sensor is one another in series.
4. the Temperature Treatment device of satellite heat test according to claim 3, it is characterized in that, on described satellite base plate, plural digital temperature sensor is set, and described plural digital temperature sensor is one another in series, connect with the plural digital temperature sensor on described at least one satellite side plate simultaneously.
5. according to the Temperature Treatment device of the satellite heat test described in claim 3 or 4, it is characterized in that, described plural digital temperature sensor is to be one another in series by three cables, and described three cables comprise a service cable, a telegram in reply cable and a signal cable; Wherein said service cable and telegram in reply cable, for providing electric energy to digital temperature sensor, described signal cable is for the data transmission of digital temperature sensor.
6. the Temperature Treatment device of satellite heat test according to claim 1, is characterized in that, described spaceborne computer is connected with described terminal by RS422 bus.
7. a Temperature Treatment method for satellite heat test, adopts the Temperature Treatment device of satellite heat test claimed in claim 1, comprises the following steps:
Spaceborne computer sends at least one temperature acquisition instruction at least one digital temperature sensor;
Described at least one digital temperature sensor receives after described at least one temperature acquisition instruction, gathers the temperature of at least one satellite side plate or satellite base plate, and is converted into digital signal and is sent to described spaceborne computer;
Described spaceborne computer receives after described digital signal, is sent to a terminal.
CN201410258524.0A 2014-06-12 2014-06-12 Temperature processing device and method in satellite thermal test Pending CN104075822A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110501083A (en) * 2019-07-03 2019-11-26 上海卫星工程研究所 The general temperature measuring equipment of satellite standard test macro
CN112527029A (en) * 2020-12-07 2021-03-19 上海卫星工程研究所 Wireless passive temperature control system applied to satellite thermal control system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0283423A (en) * 1988-09-20 1990-03-23 Nec Corp Temperature monitor apparatus to be carried on artificial satellite
CN2783289Y (en) * 2004-12-29 2006-05-24 中国科学院空间科学与应用研究中心 Multi-channel temperature sampling system for aeronatutics and astronautics system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0283423A (en) * 1988-09-20 1990-03-23 Nec Corp Temperature monitor apparatus to be carried on artificial satellite
CN2783289Y (en) * 2004-12-29 2006-05-24 中国科学院空间科学与应用研究中心 Multi-channel temperature sampling system for aeronatutics and astronautics system

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110501083A (en) * 2019-07-03 2019-11-26 上海卫星工程研究所 The general temperature measuring equipment of satellite standard test macro
CN110501083B (en) * 2019-07-03 2021-07-30 上海卫星工程研究所 Universal temperature measuring device for satellite standardized test system
CN112527029A (en) * 2020-12-07 2021-03-19 上海卫星工程研究所 Wireless passive temperature control system applied to satellite thermal control system
CN112527029B (en) * 2020-12-07 2022-03-18 上海卫星工程研究所 Wireless passive temperature control system applied to satellite thermal control system

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Application publication date: 20141001