CN104070254A - Substrate heating and soldering device - Google Patents
Substrate heating and soldering device Download PDFInfo
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- CN104070254A CN104070254A CN201410123722.6A CN201410123722A CN104070254A CN 104070254 A CN104070254 A CN 104070254A CN 201410123722 A CN201410123722 A CN 201410123722A CN 104070254 A CN104070254 A CN 104070254A
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- Prior art keywords
- substrate
- temperature
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- heating
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
The invention provides a substrate heating and a soldering device. The substrate heating device can be used for the pre-heating device and a soldering device comprising the pre-heating device. The pre-heating device (1A) comprises a heater (2) used for heating the substrate (11). The putting-in motion of the pre-heating device (1A) and the substrate (11) can be used to drive the rising of the power of the heater (2), and then the substrate (11) can be preheated. The pre-heating device (1A) comprises a temperature sensor (3) used for measuring the temperature of the substrate (11), and can be used to set the power of the heater (2)according to the temperature of the substrate (11) for the pre-heating of the substrate (11). The ending of the pre-heating of the pre-heating device (1A) can cause the power reducing of the heater (2).
Description
Technical field
The present invention relates to a kind of for the substrate preparation of pending solder being heated to the substrate heating equipment and the soft soldering apparatus that comprises substrate heating equipment of the temperature that is suitable for solder.
Background technology
Substrate being carried out to, in the soft soldering apparatus of solder, be provided with the heater for heated substrates.The device that as the technology that adopts surface to install, electronic component is installed on to the solder of substrate, is known to reflow soldering apparatus.In reflow soldering apparatus, a kind of required electric current when suppressing starting drive is proposed and the technology (for example,, with reference to patent documentation 1) of start-up time of the heater that staggers.
In addition, in reflow soldering apparatus, following a kind of technology is proposed: the electric current of the heater that can make to flow through is variable, current value while reducing heater starting, and when near temperature detection heater and near temperature heater reach the temperature of regulation, connect by the ON(that switches on) and OFF(disconnection) design temperature (for example,, with reference to patent documentation 2) maintained.
On the other hand, be known to a kind of soft soldering apparatus, this soft soldering apparatus comprises: solder flux apparatus for coating, and it is known as solder flux spreader (Off ラ Network サ), for to base plate coating solder flux; Substrate heating equipment, it is known as preheating device, for the substrate that is coated with solder flux is prepared to heating; Soft solder groove, it is for carrying out solder to the substrate after preparation heating; And cooling device, its substrate after for cooling solder.
In substrate heating equipment, preset the power that with the stipulated time, substrate is prepared the required heater of heating, when installation's power source is connected, heater is by the power drive with constant.
Patent documentation 1: Japanese kokai publication hei 7-212027 communique
Patent documentation 2: TOHKEMY 2005-125340 communique
In the past, at the substrate heating equipment for substrate being prepared to heating, carried out the power of heater to remain constant control, even because the power of heater in the time not putting into substrate is also constant, therefore can not suppress power consumption.On the other hand, in the time that the energising of heater is carried out to the control of ON-OFF, it is constant that temperature does not keep, and can not substrate preparation be heated to required temperature with the stipulated time.
Summary of the invention
the problem that invention will solve
The present invention makes in order to solve such problem, and its object is, a kind of substrate heating equipment that can suppress power consumption and can make the temperature of substrate increase reliably and the soft soldering apparatus that comprises substrate heating equipment are provided.
for the scheme of dealing with problems
In order to address the above problem, the invention provides a kind of substrate heating equipment, wherein, this substrate heating equipment comprises: handling part, substrate is put into this handling part, the substrate of putting into is discharged from this handling part; Heater block, it is for heating the substrate of putting into handling part; Temperature detection part, it is for detecting the temperature of the substrate of putting into handling part; And control assembly, it utilizes temperature detection part to measure and detect beginning substrate temperature to putting into the temperature of the substrate before the heating of handling part, and the running power of heater block is set as to the heating running power based on starting substrate temperature.
In addition, the invention provides a kind of soft soldering apparatus, wherein, this soft soldering apparatus comprises: solder flux apparatus for coating, and it is for to base plate coating solder flux; Substrate heating equipment, it has heater block for the substrate that has been coated with solder flux by solder flux apparatus for coating is heated and the temperature detection part for detection of the temperature of substrate; Soft solder groove, it is for carrying out solder to the substrate after being heated by substrate heating equipment; Cooling device, it is for carrying out cooling to the substrate being implemented after solder at soft solder groove place; And control assembly, it utilizes temperature detection part measure and detect beginning substrate temperature the temperature of putting into the substrate before the heating of substrate heating equipment, and the running power of heater block is set as to the heating running power based on starting substrate temperature, the action of after the end of the heating of this control assembly and substrate, substrate being discharged to soft solder groove from substrate heating equipment switches to the standby running power of power lower than heating running power by the running power of heater block from heating running power linkedly.
In the present invention, in when action heating, the temperature that the running power of heater block is set as the substrate based on to before heating is measured and the heating running power of the beginning substrate temperature that detects.Before and after thermally operated in adding of substrate, the running power of heater block is set as power reduces the power of heater block lower than the standby running power of heating running power.In addition, according to the temperature that adds the substrate of hankering, the heating running power setting according to the temperature of substrate is adjusted.
the effect of invention
In the present invention, by the height of putting into the power that switches heater block for substrate each time and set the power of heater block according to the temperature of measured substrate, can reduce power consumption, and, can make reliably the temperature rise of substrate to the temperature as target using official hour.
In addition, if according to the running power that adds the substrate temperature of hankering and adjust heater block, can make the temperature of substrate follow the temperature that will reach at any time.
Brief description of the drawings
Fig. 1 is the overall structure figure that represents an example of the preheating device of present embodiment.
Fig. 2 is the major part structure chart that represents an example of the preheating device of present embodiment.
Fig. 3 is the structure chart that represents an example of the soft soldering apparatus of present embodiment.
Fig. 4 is the block diagram that represents an example of the function of the preheating device of present embodiment.
Fig. 5 is the key diagram that is illustrated in an example of a reference value of setting in beginning substrate temperature-heater power table.
Fig. 6 is the chart representing through the setting example of target temperature.
Fig. 7 is the key diagram that represents an example of preheating action setting picture.
Fig. 8 is the flow chart that represents the pre-thermally operated example in present embodiment.
Fig. 9 is the chart that represents the transformation of heater power and variations in temperature.
Detailed description of the invention
Below, with reference to accompanying drawing to substrate heating equipment of the present invention being applied to preheating device and the embodiment while being applied to the soft soldering apparatus that comprises preheating device describes.
the preheating device of present embodiment and the structure example of soft soldering apparatus
Fig. 1 is the overall structure figure that represents an example of the preheating device of present embodiment, Fig. 2 is the major part structure chart that represents an example of the preheating device of present embodiment, (a) of Fig. 2 is the side view of the preheating device of present embodiment, and (b) of Fig. 2 is the front view of the preheating device of present embodiment.In addition, Fig. 3 is the structure chart that represents an example of the soft soldering apparatus of present embodiment.In Fig. 3, soft soldering apparatus is represented with top view.
First, the summary of the preheating device 1A to present embodiment describes, and preheating device 1A comprises: heater 2, and it is for heated substrates 11; And temperature sensor 3, it is for measuring the temperature of substrate 11.In preheating device 1A, will put into handling part 4 by the substrate 11 that has been coated with solder flux as the solder flux apparatus for coating 12 of pretreating device, utilize temperature sensor 3 to measure the temperature of the substrate 11 of putting into handling part 4.Set the power of heater 2 taking the temperature of this substrate 11 determining as basis, carry out the preheat temperature control of substrate 11 described later.
The end of preheating device 1A and preheating makes the power of heater 2 reduce linkedly, and the substrate 11 that completes preheating is expelled to the soft solder groove 13 as after-treatment device.
Below, the preheating device 1A of present embodiment is elaborated.Handling part 4 comprises: guiding elements 40, and it is for supporting substrates 11; And glass plate 41, it is for the protection of the structure of downside that is disposed at substrate 11, and this substrate 11 is supported by guiding elements 40.As an example, this glass plate 41 is made up of the good quartz glass of transmitance.By configuration glass plate 41, thereby even if coating the solder flux of substrate 11 drips and also can be attached to the surface of glass plate 41, therefore can prevent that solder flux is attached on heater 2 structures such as grade of the downside that is disposed at glass plate 41.In flux constituent, solvent accounts for more than half part, and configuration glass plate 41 is to consider that the solvent preventing in solder flux was directly attached in when energising can exceed such security on the heater 2 of burning-point of solvent and the structure that draws.In addition, because the near infrared ray of heater 2 is easy to see through glass plate 41, therefore glass plate 41 is difficult for accumulation of heat, and utilizes as described later the surface temperature of sensor monitoring glass plate 41, and the surface temperature of management glass plate 41 makes it below burning-point.And, be only also the surface that drops to the surface of glass plate 41 and be attached to this glass plate 41 even if solder flux drips, be therefore also easy to remove the solder flux adhering to.
Preheating device 1A comprises as the lower pre-hot heater 2A above-mentioned heater 2 for heated substrates 11, that heat for the substrate 11 to putting into handling part 4.Lower pre-hot heater 2A is an example of heater block, and its many heaters 20 by the downside setting at glass plate 41 form, for the substrate 11 of putting into handling part 4 being heated from below according to temperature control described later.The in the situation that of this example, heater 20 is made up of not shown Halogen lamp LED.
Preheating device 1A also can be configured to and comprise the horizontal pre-hot heater 5 heating for the substrate 11 to putting into handling part 4.Horizontal pre-hot heater 5 is examples for heater block, and it comprises fan 50 and heater 51, blows out hot blast and the substrate 11 of putting into handling part 4 is heated with the temperature of regulation from side for the blow-off outlet 52 from the sidepiece of being located at handling part 4.
Preheating device 1A also can be configured to and also comprise the upper pre-hot heater 6 heating for the substrate 11 to putting into handling part 4.Upper pre-hot heater 6 is examples for heater block, and it is located at the upside of handling part 4, for the substrate 11 of putting into handling part 4 being heated with the temperature of regulation from top.
Preheating device 1A utilizes said temperature sensor 3 to measure the temperature of the substrate 11 of putting into handling part 4.Temperature sensor 3 is examples for temperature detection part, by forming the radiation thermometer of putting into the surface temperature of substrate 11 of handling part 4 and measuring with cordless.
In addition, also can be configured to: be determined in advance the temperature of the handling part 4 under the state of substrate 11 not being put into handling part 4, assist with the temperature control when putting into substrate 11 at handling part 4 places.; after the solder flux coating processing that utilizes solder flux apparatus for coating 12 to be coated with solder flux to substrate 11 finishes and substrate 11 is being put into before the handling part 4 of subsequent processing; utilize the surface temperature by substrate 11 sides temperature, glass plate 41 of not shown thermocouple measurement as handling part 4; at the temperature that reaches regulation, substrate 11 is put into handling part 4.If be the temperature that is suitable for the regulation of the preheating of substrate 11 by the Temperature Setting of handling part 4 in advance before substrate 11 is put into handling part 4, the temperature control of putting into the substrate 11 of handling part 4 becomes easy.
In the following description, be called and put into front control measuring in advance the control of not putting into the temperature of the handling part 4 under the state of this substrate 11 and carry out, the temperature control of substrate 11 of putting into handling part 4 is called and puts into rear control.
In the present invention, the situation of putting into front control and putting into these two controls of rear control is described, but in the present invention, also can omits and put into front control.
The preheating device 1A of present embodiment is assembled in soft soldering apparatus 10.Next, the soft soldering apparatus 10 of present embodiment is described.Soft soldering apparatus 10 comprises the above-mentioned solder flux apparatus for coating 12 for be coated with solder flux to substrate 11 and the preheating device 1A that carries out preheating to being coated with the substrate 11 of solder flux.
In addition, in the present example, in order to carry out solder to the electronic component of different shapes, soft soldering apparatus 10 comprise as the substrate 11 for to after preheating carry out solder above-mentioned soft solder groove 13, the 1st soft solder groove 13a and the 2nd soft solder groove 13b.And soft soldering apparatus 10 comprises for the substrate 11 to having carried out solder and carries out cooling cooling device 14.
In soft soldering apparatus 10, the 1st soft solder groove 13a and the 2nd soft solder groove 13b arrange in the mode configuring side by side, and solder flux apparatus for coating 12 and preheating device 1A arrange in the mode configuring side by side with cooling device 14.
Soft soldering apparatus 10 comprises supplies with conveying mechanism 15, and this supply conveying mechanism 15, for the substrate 11 being placed on pallet 10a is delivered to solder flux apparatus for coating 12 from workbench 10b, is then delivered to preheating device 1A by it from solder flux apparatus for coating 12.In soft soldering apparatus 10, be placed on the handling part 4 that substrate 11 on pallet 10a is supplied to conveying mechanism 15 and puts into from solder flux apparatus for coating 12 preheating device 1A, in preheating device 1A, the pallet 10a of the substrate 11 of being put into some extent in the position of regulation supporting mounting by guiding elements 40.
Soft soldering apparatus 10 comprises portable transfer robot 16, this movable type transfer robot 16 is for putting into the substrate 11 of preheating device 1A to the 1st soft solder groove 13a and the 2nd soft solder groove 13b carries, and the substrate 11 that is delivered to the 1st soft solder groove 13a and the 2nd soft solder groove 13b is carried to cooling device 14.
Portable transfer robot 16 is made up of the 1st guiding elements 16b and the 2nd guiding elements 16c, and be located at the top of the 1st soft solder groove 13a and the 2nd soft solder groove 13b, the 1st guiding elements 16b is for making the maintaining part 16a that the pallet 10a to being placed with substrate 11 keeps move up arrow A 1 side along the orientation of preheating device 1A and the 1st soft solder groove 13a, the 2nd guiding elements 16c is for making maintaining part 16a move up arrow A 2 sides along the orientation of the 1st soft solder groove 13a and the 2nd soft solder groove 13b, and keep maintaining part 16a in the mode that can make maintaining part 16a rotation.
In portable transfer robot 16, the 2nd guiding elements 16c moves along arrow A 1 direction under the guiding of the 1st guiding elements 16b, makes thus the maintaining part 16a that is supported on the 2nd guiding elements 16c move along arrow A 1 direction.In addition, maintaining part 16a is in the upper lifting of arrow A 3 directions (Fig. 1).In addition, maintaining part 16a can move along arrow A 2 directions under the guiding of the 2nd guiding elements 16c.And maintaining part 16a can rotate as shown in arrow A 4.That is, utilize portable transfer robot 16, make the pallet 10a that is placed with substrate 11 to move up and to carry this pallet 10a in the mode that can make this pallet 10a rotation at above-below direction, right and left.
Thus, the maintaining part 16a of portable transfer robot 16 between preheating device 1A and the 1st soft solder groove 13a, move between the robot drain position 17 between the 1st soft solder groove 13a and the 2nd soft solder groove 13b and at the upstream side of the 2nd soft solder groove 13b and cooling device 14.Thereby, utilize the movement between the portion of reason throughout of the handling at maintaining part 16a place and the lifting of maintaining part 16a and maintaining part 16a of substrate 11, the pallet 10a that is placed with substrate 11 is delivered to the 1st soft solder groove 13a from preheating device 1A.In addition, the pallet 10a that is placed with substrate 11 is delivered to the 2nd soft solder groove 13b from the 1st soft solder groove 13a.And, the pallet 10a that is placed with substrate 11 is delivered to robot drain position 17 from the 2nd soft solder groove 13b.In addition, need to not be in the situation that the 2nd soft solder groove 13b carries out solder operation, can be not yet via the 2nd soft solder groove 13b ground, utilize the movement in A1 direction and the movement that side by side movement in A2 direction combines, make the pallet 10a that is placed with substrate 11 move to obliquely robot drain position 17 from the 1st soft solder groove 13a.
Soft soldering apparatus 10 comprises discharges conveying mechanism 18, this discharge conveying mechanism 18 is for pallet 10a guiding elements 17a, that be placed with substrate 11 that is moved formula transfer robot 16 and is delivered to robot drain position 17 is delivered to cooling device 14, and this pallet 10a is delivered to workbench 10b from cooling device 14.
Preheating device 1A forms in the present example the transport path that utilizes portable transfer robot 16 to make substrate 11 rise to the top of handling part 4 and this substrate 11 is exported to the 1st soft solder groove 13a.And, preheating device 1A comprises temperature sensor mobile device 30, this temperature sensor mobile device 30 is for making temperature sensor 3 put into the locating and avoid moving between the retreating position of transport path of portable transfer robot 16 of temperature of the substrate 11 of handling part 4 in mensuration, and makes temperature sensor 3 and the size of substrate 11 move accordingly at the place of locating.
In addition, preheating device 1A comprises upper heater lowering or hoisting gear 60, this upper heater lowering or hoisting gear 60 for make upper pre-hot heater 6 put in heating handling part 4 substrate 11 heating location and avoid lifting between the retreating position of transport path of portable transfer robot 16.
the control function example of the preheating device of present embodiment and soft soldering apparatus
Fig. 4 is the block diagram that represents an example of the function of the preheating device of present embodiment, next, the control function of preheating device 1A and the soft soldering apparatus 10 of present embodiment is described with reference to each figure.
The soft soldering apparatus 10 of present embodiment comprises the control part 100 being made up of microcomputer etc., and solder flux apparatus for coating 12, preheating device 1A, soft solder groove 13, cooling device 14 and each conveying device are controlled by control part 100.
Control part 100 is examples for control assembly, and its execution is stored in program in storage part 101 and according to a series of processing of carrying out solder in the operation at operating portion 102 places.Control part 100 carries out will being placed on that substrate 11 on the pallet 10a of workbench 10b is put into solder flux apparatus for coating 12 and action from solder flux to substrate 11 that be coated with.In addition, carry out the substrate 11 that is coated with solder flux to put into preheating device 1A and the action of pre-hot substrate 11 and carry out completing substrate 11 after preheating to put into soft solder groove 13 and the action of carrying out solder.And, carry out the substrate after solder 11 to put into cooling device 14 and the action of cooling base 11, action that cooled substrate 11 is discharged to workbench 10b.In addition, in this series of control, the in the situation that of this example, the pallet 10a that is placed with substrate 11 moves with following step.First, (1) this series of movement of workbench 10b～solder flux apparatus for coating 12～preheating device 1A is undertaken by supplying with conveying mechanism 15, (2) 17 these a series of movements of preheating device 1A～soft solder groove 13～robot drain position are undertaken by portable transfer robot 16, and this series of movement of the drain position 17～cooling device 14～workbench 10b of (3) robot is undertaken by discharging conveying mechanism 18.
In preheating device 1A is controlled, control part 100 utilizes heater drive circuit 22 to switch the power of lower pre-hot heater 2A.In addition, the power of lower pre-hot heater 2A is switched in the action that control part 100 and the substrate 11 that completes preheating are discharged to soft solder groove 13 linkedly.The power of the horizontal pre-hot heater 5 being driven by heater drive circuit 53 and the upper pre-hot heater 6 being driven by heater drive circuit 62 is set as constant in the situation that of this example.
Substrate 11 is being put into before preheating device 1A, control part 100 is standby running power Pwa by the power setting of lower pre-hot heater 2A.In the time of the preheating action of putting into after substrate 11, control part 100 carries out such control: be set as the power of lower pre-hot heater 2A from standby running power Pwa as the warming up power P wc of heating running power, and maintain the running power Pwc after setting.After the preheating of completing substrate 11, the power of lower pre-hot heater 2A is set as to standby running power Pwa and the power of pre-hot heater 2A is reduced from warming up power P wc.
Control part 100 also can be configured to: substrate 11 being carried out continuously in the automatic running of a series of processing of solder, be coated with solder flux to substrate 11, before putting into substrate 11 to preheating device 1A, utilize not shown thermocouple to measure the surface temperature by substrate 11 sides of glass plate 41, carry out following substrate according to the glass sheet temperatures by thermocouple measurement and put into front control: the power of lower pre-hot heater 2A is switched to the heating installation running power Pwb or the warming up power P wc that are set between standby running power and warming up power.Put into front control by this, can avoid being accompanied by substrate 11 in long-time preheating heated and produce, carry part from substrate 11 come off, the heat breakage of part itself.But, according to number of packages of the size of substrate 11, the electronic component that carries etc., not necessarily need this to put into front operation.
Substrate 11 is being put into after preheating device 1A, and control part 100 is set the warming up power P wc of lower pre-hot heater 2A according to the temperature of the substrate 11 being detected by temperature sensor 3.That is, by substrate 11 from solder flux apparatus for coating 12 is put into preheating device 1A, control part 100 utilizes temperature sensor 3 to measure the surface temperature of substrate 11, detects the beginning substrate temperature ta as the surface temperature of the substrate 11 before preheating.
Control part 100, according to the beginning substrate temperature ta being detected by temperature sensor 3, utilizes the beginning substrate temperature-heater power table (TB1) being stored in storage part 101 to set the warming up power P wc of lower pre-hot heater 2A.
Fig. 5 is the key diagram that is illustrated in an example of a reference value of setting in beginning substrate temperature-heater power table (TB1).Starting in substrate temperature-heater power table (TB1), start substrate temperature ta and be set with multiple a reference values, be set with the warming up power P wc of lower pre-hot heater 2A for each a reference value.In addition, as the thermometer final goal temperature t b of the final goal temperature of the substrate 11 that will reach in preheating action, set for starting each a reference value of substrate temperature.
In preheating device 1A, utilize temperature sensor 3 to detect the surperficial temperature of substrate 11.On the other hand, the face that device 10 implements solder that is soldered is the back side of substrate 11.Therefore, for the temperature at the back side that makes substrate 11 reaches a certain constant target temperature T and carries out preheating action.But heating, due to the beginning substrate temperature ta difference before preheating, the surface temperature of the substrate 11 being detected by temperature sensor 3 is also different in the case of the temperature at the back side in order to make substrate 11 reaches target temperature T.Therefore,, in beginning substrate temperature-heater power table (TB1), the thermometer final goal temperature t b that will reach in preheating action sets for starting each a reference value of substrate temperature.
Control part 100 is according to the beginning substrate temperature a reference value ta setting in beginning substrate temperature-heater power table (TB1)
1～ta
nthe corresponding warming up power P w of beginning substrate temperature ta calculating and detected by temperature sensor 3
1～Pw
nthermometer final goal temperature t b with substrate 11
1～tb
n.
Control part 100 utilizes temperature sensor 3 detected temperatures meters through substrate temperature tc, to carry out the power correction of lower pre-hot heater 2A in preheating action.
Control part 100 so that the mode that the thermometer of the substrate 11 being detected by temperature sensor 3 becomes the temperature of the substrate that will reach at any time through substrate temperature tc the power of lower pre-hot heater 2A is switched.
The substrate temperature that will reach at any time can be obtained as follows.Time till reaching thermometer final goal temperature t b in the temperature that starts the substrate 11 being detected by temperature sensor 3 after preheating action is called to Tm preheating time.In addition, by for reach in the temperature that makes substrate 11 through preheating time when Tm thermometer final goal temperature t b, the temperature of the substrate that will reach is called through target temperature td at any time.
For process target temperature td, according to start substrate temperature ta, thermometer final goal temperature t b and preheating time Tm, can utilize following formula (1) to obtain temperature in order to make substrate 11 at the ascending temperature te that rises to the required time per unit of thermometer final goal temperature t b through preheating time when Tm.Then, be added by starting substrate temperature ta and ascending temperature te, can obtain every process target temperature td through the stipulated time.
The ascending temperature te=(thermometer final goal temperature t b-of time per unit starts substrate temperature ta)/preheating time Tm(1)
Fig. 6 is the chart representing through the setting example of target temperature.Herein, consider the temperature at the back side of substrate 11 to be heated to the preheating action of 120 DEG C with Tm preheating time of regulation.Starting substrate temperature ta while being 30 DEG C, with by preheating time Tm be set as 20 seconds and the mode that makes the temperature at the back side of substrate 11 reach 120 DEG C while controlling, the surperficial temperature of result substrate 11 is 92 DEG C.
While calculating through target temperature td under above condition, through type (1) is known, when start substrate temperature ta be 30 DEG C, thermometer final goal temperature t b be 92 DEG C, preheating time Tm be that the ascending temperature te of 20 seconds time per units (1 second) under such setting is 3.1 DEG C, be often set as the value shown in the chart of (a) of Fig. 6 and the chart of Fig. 6 (b) through the stipulated time (1 second) through target temperature td.
Move in order to set with preheating the above-mentioned each setting value being associated, control part 100 is configured to: preheating action is set to picture 110 and be presented on display part 103, can utilize the operation of carrying out at operating portion 102 places to change setting value.
Fig. 7 is the key diagram that represents an example of preheating action setting picture.Set in picture 110 in preheating action, utilize setting item 110a setting preheating time Tm preheating time.In addition, utilize standby running power setting item 110b to set the standby running power Pwa of lower pre-hot heater 2A.
And, in a reference value setting item 110c, set and start substrate temperature a reference value ta
1～ta
n, warming up power P w
1～Pw
nand thermometer final goal temperature t b
1～tb
n.In addition, utilize power correction setting item 110d to set the correction value of the power of lower pre-hot heater 2A.
the preheating device of present embodiment and the action case of soft soldering apparatus
Fig. 8 is the flow chart that represents the pre-thermally operated example in present embodiment, and Fig. 9 is the chart that represents the transformation of heater power and variations in temperature, below, with reference to each figure, the preheating device of present embodiment and the preheating of soft soldering apparatus action are described.In the present example, in Fig. 8, become and comprised aforesaid substrate and put into the flow chart of front control.In addition, in Fig. 9, the running power of the diagrammatic representation that solid line represents in the situation that carrying out controlling before substrate is put into changes, and the running power of the diagrammatic representation being represented by single-point line in the situation that not carrying out controlling before substrate is put into changes.
After the power connection of soft soldering apparatus 10, when then pre-heater becomes ON state, control part 100 becomes automatic operation mode in the step SA1 of Fig. 8.In preheating device 1A, in the time starting running automatically, control part 100 is standby running power Pwa by the power setting of lower pre-hot heater 2A in the step SA2 of Fig. 8, and utilizes heater drive circuit 22 to drive lower pre-hot heater 2A.In the present example, the standby running power Pwa of lower pre-hot heater 2A is set as 5%.
In addition, control part 100 utilizes heater drive circuit 53 to drive horizontal pre-hot heater 5.In the present example, the power of horizontal pre-hot heater 5 is fixed.For example, the power of horizontal pre-hot heater 5 is fixed on to 16%.
Control part 100 is delivered to substrate 11 the solder flux apparatus for coating 12 of the prime of preheating device 1A in the step SA3 of Fig. 8, substrate 11 based on having completed in step SA4 to being delivered to solder flux apparatus for coating 12 is coated with solder flux, in step SA5, more than whether the temperature of utilizing not shown thermocouple to measure glass plate 41 under the state of substrate 11 not being put into handling part 4 reaches the temperature (being 140 DEG C this example) of regulation.
In the time that the temperature of detected glass plate 41 is less than substrate and puts into temperature, while being less than in the present example 140 DEG C, in step SA6, do not start to put into substrate 11 to preheating device 1A, but with heating installation running power Pwb, lower pre-hot heater 2A is driven, this heating installation running power Pwb is set between standby running power and warming up power.
Being that substrate is put into temperature when above in the temperature of glass plate 41, is when more than 140 DEG C in the present example, and control part 100 drives in the step SA7 of Fig. 8 to be supplied with conveying mechanism 15 and start to put into substrate 11 to preheating device 1A.In addition, drive upper heater lowering or hoisting gear 60 and make pre-hot heater 6 drop to heating location.
In step SA8 at control part 100 at Fig. 8, detect when substrate 11 has been transported to the position of regulation of the handling part 4 of preheating device 1A, in step SA9, in order to obtain the temperature information that starts the substrate 11 before preheating, utilize temperature sensor 3 to measure the temperature of substrate 11, measure in the present example the temperature of the upper surface of substrate 11, start substrate temperature ta thereby detect.
The control part 100 warming up power P wc of pre-hot heater 2A according to the beginning substrate temperature ta being detected by temperature sensor 3 and under setting in the step SA10 of Fig. 8.As mentioned above, preset and made to start substrate temperature a reference value ta
1～ta
n, warming up power P w
1～Pw
nand thermometer final goal temperature t b
1～tb
nmutually corresponding and beginning substrate temperature-heater power table (TB1) of obtaining.
Judge at control part 100 the beginning substrate temperature ta being detected by temperature sensor 3 and be contained in the 1st beginning substrate temperature a reference value ta setting in beginning substrate temperature-heater power table TB1
1scope in time, the warming up power P wc of lower pre-hot heater 2A is set as and the 1st starts substrate temperature a reference value ta
1the 1st corresponding warming up power P w
1.
Similarly, judge beginning substrate temperature ta at control part 100 and be included in the 2nd beginning substrate temperature a reference value ta
2scope in time, the warming up power P wc of lower pre-hot heater 2A is set as and the 2nd starts substrate temperature a reference value ta
2the 2nd corresponding warming up power P w
2.In addition, judge beginning substrate temperature ta at control part 100 and be included in the 3rd beginning substrate temperature a reference value ta
3scope in time, the warming up power P wc of lower pre-hot heater 2A is set as and the 3rd starts substrate temperature a reference value ta
3the 3rd corresponding warming up power P w
3.(with reference to Fig. 7)
Control part 100 drives lower pre-hot heater 2A with the warming up power P wc setting in the step SA11 of Fig. 8.
In the time starting the preheating of substrate 11, control part 100 carries out power correction in the step SA12 of Fig. 8.In power correction, in the time starting the preheating of substrate 11, in step SA12a, in order to obtain the temperature information of the substrate 11 of hankering in advance, control part 100 utilizes temperature sensor 3 to measure the temperature of the upper surface of substrate 11, thereby detected temperatures meter is through substrate temperature tc.
As mentioned above, the thermometer final goal temperature t b of the substrate 11 that setting will reach by preheating and reach thermometer final goal temperature t b Tm preheating time used, set for Tm makes substrate 11 with preheating time temperature rise to needed, the every unit interval through regulation of thermometer final goal temperature t b through target temperature td.
The thermometer that control part 100 detects time per unit in the step SA12b of Fig. 8 compares through substrate temperature tc and process target temperature td, and adjusts the warming up power P wc of lower pre-hot heater 2A with respect to the height of process target temperature td through substrate temperature tc according to thermometer.
In the time that thermometer passes through substrate temperature tc lower than process target temperature td, control part 100 rises the warming up power P wc of lower pre-hot heater 2A according to predefined correction value.In addition, in the time that thermometer passes through substrate temperature tc higher than process target temperature td, control part 100 reduces the warming up power P wc of lower pre-hot heater 2A according to predefined correction value.
In the present example, the correction value of the power of the lower pre-hot heater 2A in setting power correction in the power correction setting item 110d of preheating action setting picture 110 illustrated in fig. 7.Control part 100 is according to the correction value of setting in by power correction setting item 110d, set correction value through substrate temperature tc with respect to the difference of the height through target temperature td according to thermometer, thereby adjust the warming up power P wc of lower pre-hot heater 2A.
Control part 100 judges whether through Tm preheating time in the step SA13 of Fig. 8, judging through preheating time when Tm, in step SA14, judges whether thermometer has reached thermometer final goal temperature t b through substrate temperature tc.
In the time that thermometer reaches thermometer final goal temperature t b through substrate temperature tc, in step SA15, making after temperature sensor 3 moves to retreating position, substrate 11 is discharged and substrate 11 is delivered to the soft solder groove 13 of rear class, and the power of lower pre-hot heater 2A is switched to standby running power Pwa.At this, after process Tm preheating time, even thermometer does not reach thermometer final goal temperature t b through substrate temperature tc yet in the case of having passed through the allowing stand-by time of regulation, be made as time-out error.As long as in enforcement common use of the present invention, substantially all can reach the temperature that will reach with the preheating time setting, thereby can not produce time-out error, but for example, in the time of such abnormal state such as reduction of the heater power being caused by the life-span, also can produce time-out error.
Carry out the processing of solder putting into continuously multiple substrates 11, detect ensuing substrate 11 be transported to solder flux apparatus for coating 12 in time, turn back to the processing of above-mentioned steps SA4, automatically set the warming up power P wc of lower pre-hot heater 2A according to the beginning substrate temperature ta of put into substrate 11.
In power correction, adjust the warming up power P wc of lower pre-hot heater 2A through substrate temperature tc according to the thermometer of substrate 11 as described above.Then, make continuously linkedly the power of lower pre-hot heater 2A drop to the preheating action of standby running power Pwa with the tenth skill of preheating.
the action effect example of the preheating device of present embodiment and soft soldering apparatus
In the preheating device 1A of present embodiment, in the time that moving, preheating make the power of lower pre-hot heater 2A increase.In addition, pre-before and after thermally operated and complete preheating and be discharged to soft solder groove 13 and ensuing substrate 11 was put into from solder flux apparatus for coating 12 to this period of pre-thermally operated interim till preheating device 1A at previous substrate 11 in processing continuously, the power of lower pre-hot heater 2A is reduced.
Like this, switch the power of pre-hot heater for putting into of each substrate, thereby compared with the running of the pre-hot heater of power drive with constant, can reduce power consumption.
In addition, because being sets warming up power P wc according to starting preheating beginning substrate temperature ta before, therefore, can with for Tm makes substrate with predefined preheating time temperature rise to best power drive pre-heater for thermometer final goal temperature t b, can reduce power consumption, and, can make reliably the temperature rise of substrate to thermometer final goal temperature t b with predefined preheating time of Tm.
And, if adjust warming up power P wc according to the thermometer in preheating action through substrate temperature tc, can make the temperature of substrate follow the temperature that will reach at any time, can make reliably the temperature rise of substrate to thermometer final goal temperature t b with predefined preheating time of Tm.
utilizability in industry
The present invention is applicable to automatically carry out the automatic soft soldering apparatus of preparation heating, solder and the cooling a series of action of coating, the substrate of conveying, the solder flux of substrate.
description of reference numerals
1A, preheating device; 2A, lower pre-hot heater; 3, temperature sensor; 4, handling part; 5, horizontal pre-hot heater; 6, upper pre-hot heater; 10, soft soldering apparatus; 11, substrate; 12, solder flux apparatus for coating; 13, soft solder groove; 14, cooling device; 100, control part.
Claims (7)
1. a substrate heating equipment, is characterized in that, comprising:
Handling part, puts into this handling part by substrate, and the substrate of putting into is discharged from this handling part;
Heater block, it is for heating the substrate of putting into above-mentioned handling part;
Temperature detection part, it is for detecting the temperature of the substrate of putting into above-mentioned handling part; And
Control assembly, it utilizes said temperature detection part to measure and detect beginning substrate temperature to putting into the temperature of the substrate before the heating of above-mentioned handling part, and the running power of above-mentioned heater block is set as to the heating running power based on starting substrate temperature.
2. substrate heating equipment according to claim 1, is characterized in that,
In above-mentioned control assembly, preset the running power that starts a reference value of substrate temperature and the above-mentioned heater block corresponding with starting a reference value of substrate temperature, above-mentioned control assembly is set the running power of above-mentioned heater block according to a reference value of the beginning substrate temperature being detected by said temperature detection part and predefined beginning substrate temperature.
3. substrate heating equipment according to claim 1 and 2, is characterized in that,
Above-mentioned control assembly utilizes said temperature detection part that the temperature of putting into the substrate that adding of above-mentioned handling part hanker is measured and detected through substrate temperature, and according to the running power of setting above-mentioned heater block through substrate temperature.
4. substrate heating equipment according to claim 3, is characterized in that,
In above-mentioned control assembly, preset that substrate that the correction value and adding of the running power of above-mentioned heater block hankers will reach through target temperature, above-mentioned control assembly utilization is adjusted the running power of above-mentioned heater block based on what detected by said temperature detection part through substrate temperature and predefined correction value through target temperature.
5. according to the substrate heating equipment described in any one in claim 1 to 4, it is characterized in that,
Above-mentioned control assembly utilizes said temperature detection part to detect the temperature of the above-mentioned handling part under the state of substrate not being put into above-mentioned handling part, in the time that the temperature rise of above-mentioned handling part is above to the temperature of regulation, substrate is put into above-mentioned handling part.
6. according to the substrate heating equipment described in any one in claim 1 to 5, it is characterized in that,
The action that substrate is discharged in the end of the heating of above-mentioned control assembly and substrate afterwards switches to the standby running power of power lower than heating running power by the running power of above-mentioned heater block from heating running power linkedly.
7. a soft soldering apparatus, is characterized in that, comprising:
Solder flux apparatus for coating, it is for to base plate coating solder flux;
Substrate heating equipment, it has heater block for the substrate that has been coated with solder flux by above-mentioned solder flux apparatus for coating is heated and the temperature detection part for detection of the temperature of substrate;
Soft solder groove, it is for carrying out solder to the substrate after being heated by aforesaid substrate heater;
Cooling device, it is for carrying out cooling to the substrate being implemented after solder at above-mentioned soft solder groove place; And
Control assembly, it utilizes said temperature detection part measure and detect beginning substrate temperature the temperature of putting into the substrate before the heating of aforesaid substrate heater, and the running power of above-mentioned heater block is set as to the heating running power based on starting substrate temperature, the action of after the end of the heating of this control assembly and substrate, substrate being discharged to above-mentioned soft solder groove from aforesaid substrate heater switches to the standby running power of power lower than heating running power by the running power of above-mentioned heater block from heating running power linkedly.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013072981A JP6209842B2 (en) | 2013-03-29 | 2013-03-29 | Substrate heating device and soldering device |
| JP2013-072981 | 2013-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104070254A true CN104070254A (en) | 2014-10-01 |
| CN104070254B CN104070254B (en) | 2018-01-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410123722.6A Active CN104070254B (en) | 2013-03-29 | 2014-03-28 | Substrate heating equipment and soft soldering apparatus |
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| Country | Link |
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| JP (1) | JP6209842B2 (en) |
| CN (1) | CN104070254B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240082941A1 (en) * | 2021-07-20 | 2024-03-14 | Shinkawa Ltd. | Flux transfer apparatus |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10688578B2 (en) | 2014-08-04 | 2020-06-23 | OK International, Inc | Variable temperature controlled soldering iron |
| US10716220B2 (en) | 2014-08-04 | 2020-07-14 | Ok International, Inc. | Variable temperature controlled soldering iron |
| CN107283016A (en) * | 2016-04-11 | 2017-10-24 | Ok国际公司 | The controlled flatiron of variable temperature |
| CN111725100B (en) * | 2020-06-16 | 2023-02-10 | 北京北方华创微电子装备有限公司 | Preheating device and preheating method |
| CN116056825A (en) * | 2020-08-17 | 2023-05-02 | 三菱电机株式会社 | Welding system and welding method |
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| JPS595494Y2 (en) * | 1979-10-04 | 1984-02-18 | 権士 近藤 | Printed circuit board preheating device |
| JPS5994572A (en) * | 1982-11-22 | 1984-05-31 | Nec Corp | Solder reflow device |
| JP2501334B2 (en) * | 1987-06-19 | 1996-05-29 | 松下電工株式会社 | Reflow furnace |
| JPH0296394A (en) * | 1988-09-30 | 1990-04-09 | Matsushita Electric Ind Co Ltd | Soldering reflow method |
| DE4016366C2 (en) * | 1990-05-21 | 1994-04-28 | Siemens Nixdorf Inf Syst | Method and device for reflow soldering of electronic components on a printed circuit board |
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| JPH04288967A (en) * | 1991-03-12 | 1992-10-14 | Matsushita Electric Ind Co Ltd | Reflow soldering apparatus |
| JPH04371365A (en) * | 1991-06-18 | 1992-12-24 | Matsushita Electric Ind Co Ltd | Method for controlling temperature in reflow apparatus |
| JPH0621643A (en) * | 1992-07-01 | 1994-01-28 | Matsushita Electric Works Ltd | Reflow furnace |
| CN102566625A (en) * | 2010-12-09 | 2012-07-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for reflux welder |
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| US20240082941A1 (en) * | 2021-07-20 | 2024-03-14 | Shinkawa Ltd. | Flux transfer apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104070254B (en) | 2018-01-02 |
| JP2014197631A (en) | 2014-10-16 |
| JP6209842B2 (en) | 2017-10-11 |
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