CN104064507B - For pallet and method, the testing, sorting machine and method to positive semiconductor package part - Google Patents
For pallet and method, the testing, sorting machine and method to positive semiconductor package part Download PDFInfo
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- CN104064507B CN104064507B CN201410100812.3A CN201410100812A CN104064507B CN 104064507 B CN104064507 B CN 104064507B CN 201410100812 A CN201410100812 A CN 201410100812A CN 104064507 B CN104064507 B CN 104064507B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses for the pallet to positive semiconductor package part, the testing, sorting machine using the pallet, the method to positive semiconductor package part and use the test method to correction method.Conceive according to the present invention, include: tray main body for the pallet to positive semiconductor package part, the tray main body includes multiple packaging part container parts, and multiple semiconductor package parts are individually accommodated in the multiple packaging part container part；And pneumatic position, to positive unit, the pneumatic position connect positive unit with the tray main body.Air with predetermined pressure is applied to the semiconductor package part being accommodated in packaging part container part to positive unit by pneumatic position.To positive semiconductor package part at packaging part container part.
Description
Cross reference to related applications
This application claims on March 18th, 2013 to be committed to the South Korea patent application No.10-2013- of Korean Intellectual Property Office
Content of the application, is incorporated herein by 0028588 priority by reference herein.
Technical field
Present inventive concept be related to for positive semiconductor package part pallet, using the testing, sorting machine of the pallet, to just
The method of semiconductor package part and using the test method to correction method, more specifically, present inventive concept is related to being used for
Pallet to positive semiconductor package part, the testing, sorting machine using the pallet, method and use to positive semiconductor package part
The test method to correction method, wherein semiconductor package part does not have failure pedestal.
Background technique
In semiconductor fabrication, if semiconductor package part assembled completely, each semiconductor package part meeting
It is transmitted for by process for example as described herein.Semiconductor fabrication need and meanwhile transmit many semiconductor package parts or
The many semiconductor package parts of accurate contraposition.
The semiconductor collection provided in the form of chip on semiconductor crystal wafer (a chip on a semiconductor wafer)
The form of packaging part is reprocessed at circuit, by preventing chip from being rushed while a series of encapsulation process by outside
It hits.Treated completely, and semiconductor package part will pass through packaging and testing process, carry out before consigning to user in this process
Final electric test.Test equipment on computers is installed using various measuring devices and is used for semiconductor package part is automatic
The sorting machine of the test equipment is transmitted and is connected to, these equipment are collectively referenced as testing, sorting machine.
In brief, the operation of testing, sorting machine is as follows.If storing user tray (C pallet) dress of semiconductor package part
It is loaded in the inlet of loading part, then the semiconductor package part being located on user tray is transferred into buffer pallet (B pallet) simultaneously
And it is accommodated on buffer pallet (B pallet) again by picking up head etc..Then, the semiconductor packages being accommodated in buffer pallet
Part is accommodated in the test pallet (T pallet) for being suitble to test again by picking up head etc..Hereafter, test pallet is transferred into survey
Examination hall institute, to test semiconductor package part.
Here, testing, sorting machine may need semiconductor package part being sent to buffer pallet from user tray (C pallet).
In general, used equipped with for the buffer pallet for guiding the container part of packaging part outer rim to transmit and to positive semiconductor package
Piece installing, and the inner wall for forming container part is inclined, so that semiconductor package part is when being received in container part, i.e.,
Keep semiconductor package part slightly crooked, container part can also be entered along inclined surface.
However, semiconductor package part is opposite sometimes if with High Speed Transfer and storing many semiconductor package parts
In container part skew.In this case, entire testing, sorting chance pause is taking out semiconductor package part or manually will
Semiconductor package part is received into after the correct position of container part, and testing, sorting machine just restarts, thus reduces production
Rate.
In addition, the container part of buffer pallet need to be fabricated to the size greater than semiconductor package part, to prevent half
Conductor packaging part is stuck relative to physical dimension tolerance, therefore, in semiconductor relative to pre- in buffer pallet container part
In the case that possible skew is set in positioning, it is possible that problem.
Buffer pallet is hereinbefore described by way of example.However, for the normal tray to positive semiconductor package part
The problem of be: because even semiconductor package part relative to container part skew in the case where, equipment is also without automatic school
Orthofunction, so equipment is suspended to take manual measure.Because of the essence corresponding with semiconductor package part needed for providing
True position will appear difficulty to timing, so being difficult to carry out normal load semiconductor package part with small spacing.
Summary of the invention
Inventive concept provides for the pallet to positive semiconductor package part, the testing, sorting machine of the pallet, right is used
The method of positive semiconductor package part and use the test method to correction method, wherein there may come a time when meeting when being sent alone
The semiconductor package part of skew can be relative to correct position to just, and can be further improved encapsulation compared with regular situation
Accuracy of the part on correct position.
The one aspect conceived according to the present invention provides a kind of pallet for positive semiconductor package part.The support
Disk includes: tray main body, and the tray main body includes multiple packaging part container parts, and multiple semiconductor package parts are individually stored
In the multiple packaging part container part；And pneumatic position, to positive unit, the pneumatic position is to positive unit and the support
Disc main body connection.Air with predetermined pressure is applied to positive unit and is accommodated in packaging part container part by the pneumatic position
In semiconductor package part.To the just described semiconductor package part at the packaging part container part.
In some embodiments, the pneumatic position includes: the air flue in the tray main body to positive unit, described
Air flue communicate and be arranged in the tray main body with the packaging part container part so as to the jet for injecting air
Hole connection；And air pump, the air pump supply air to the air flue.
In some embodiments, the central area of the bottom wall of the tray main body is arranged in the fumarole.
In some embodiments, the pallet further includes spreading grooves, fumarole of the spreading grooves relative to the bottom wall
Around surface indentation and communicated with the fumarole, the cross section of the spreading grooves increases with upwardly extending.
In some embodiments, each fumarole is connected to an air flue.
In some embodiments, the pneumatic position further includes controller to positive unit, and the controller controls the gas
Air to be continuously supplied to when semiconductor package part to be tested to be loaded into the tray main body in the predetermined time by pump
The air flue shakes the semiconductor package part.
In some embodiments, the tray main body includes: body part, and the body part includes that the packaging part holds
Device part and the accommodating groove for being formed in packaging part container part lower part；And packaging part support device, the packaging part branch
Support arrangement is arranged in the accommodating groove of the body part and supports the semiconductor being accommodated in the packaging part container part
Packaging part, and the fumarole is formed in the packaging part support device.
In some embodiments, the packaging part support device includes: packaging part braced frame, the packaging part support frame
Frame is connect in a manner of relatively-movable with the body part；And impact absorbing member, the impact absorbing member are located at
Between the body part and the packaging part braced frame and absorb the impact for being applied to the packaging part braced frame.
In some embodiments, the multiple packaging part container part all includes inclined-plane, and the inclined-plane is located at the pallet
On the inner wall of the formation packaging part container part of main body, so that the cross section of each packaging part container part is with from top
Portion's opening extends to bottom surface and is become narrow gradually.
In some embodiments, the pallet further includes buffer pallet, and the buffer pallet is loaded and stored from being mounted with
The semiconductor package part of the user tray transmission of semiconductor package part to be tested.
The one aspect conceived according to the present invention, provides a kind of testing, sorting machine, and the testing, sorting machine includes being used for
To the pallet of positive semiconductor package part, the semiconductor package part is stored in the pallet.The pallet includes: pallet master
Body, the tray main body include multiple packaging part container parts, and multiple semiconductor package parts are individually accommodated in the multiple envelope
In piece installing container part；And pneumatic position, to positive unit, the pneumatic position connect positive unit with the tray main body.Institute
It states described in the air with predetermined pressure is applied to positive unit and is accommodated in the packaging part container part by pneumatic position
Semiconductor package part allows in the packaging part container part to the just described semiconductor package part.
In some embodiments, the pneumatic position includes: positioned at least one of described tray main body to positive unit
Fumarole；Air flue in the tray main body, the air flue and at least one described fumarole phase for injecting air
It is logical；And air pump, the air pump supply air to the air flue, so that described semiconductor package part to be tested to be loaded into
The semiconductor package part can shake when in tray main body.
In some embodiments, the bottom wall of the formation packaging part container part of the tray main body is arranged in the fumarole
Central area.
In some embodiments, the testing, sorting machine further includes spreading grooves, and the spreading grooves are relative to the bottom wall
Surface indentation around fumarole to be communicated with the fumarole, and the cross section of the spreading grooves with upwardly extending and
Increase.
In some embodiments, the pneumatic position further includes controller to positive unit, and the controller controls the gas
Air to be continuously supplied to when semiconductor package part to be tested to be loaded into the tray main body in the predetermined time by pump
The air flue shakes the semiconductor package part.
In some embodiments, the tray main body includes: body part, and the body part includes that the packaging part holds
Device part and the accommodating groove for being formed in packaging part container part lower part；And packaging part support device, the packaging part branch
Support arrangement is arranged in the accommodating groove of the body part and supports the semiconductor being accommodated in the packaging part container part
Packaging part, and the fumarole is formed in the packaging part support device.
In some embodiments, the packaging part support device includes: packaging part braced frame, the packaging part support frame
Frame is connect in a manner of relatively-movable with the body part；And impact absorbing member, the impact absorbing member are located at
Between the body part and the packaging part braced frame and absorb the impact for being applied to the packaging part braced frame.
In some embodiments, the multiple packaging part container part all includes inclined-plane, and the inclined-plane is located at the pallet
On the inner wall of the formation packaging part container part of main body, so that the cross section of each packaging part container part is with from top
Portion's opening extends to bottom surface and is become narrow gradually.
In some embodiments, the testing, sorting machine includes buffering support, and the buffer pallet is loaded and stored from loading
There is the semiconductor package part of the user tray transmission of semiconductor package part to be tested.
The other side conceived according to the present invention provides a kind of method to positive semiconductor package part, the method
Comprising steps of storing semiconductor package part in for the pallet to positive semiconductor package part, the pallet includes multiple encapsulation
Multiple semiconductor package parts are individually accommodated in the multiple packaging part container part by part container part；And will have pre-
The air of constant-pressure is applied to the semiconductor package part being accommodated in the packaging part container part, so as to the just described semiconductor
Packaging part.
In some embodiments, applying the step of having the air of predetermined pressure includes: by fumarole in the predetermined time
Continuously apply air, the semiconductor package part shaken, wherein the fumarole be formed in tray main body so as to
It is communicated with the packaging part container part, the tray main body is equipped with the institute for the pallet to positive semiconductor package part
State packaging part container part.
In some embodiments, the step of application has the air of predetermined pressure comprises determining that semiconductor package part is opposite
It is whether crooked in the predetermined position of the packaging part container part；And air is applied to and the packaging part container part phase
Logical fumarole shakes the semiconductor package part, wherein the packaging part container part is accommodated with relative to institute
State the semiconductor package part of predetermined position skew.
The other side conceived according to the present invention provides a kind of test method of semiconductor package part, the test
Method is comprising steps of to the just described semiconductor package part in for the pallet to positive semiconductor package part, the pallet includes
Multiple semiconductor package parts are individually accommodated in the multiple packaging part container part by multiple packaging part container parts；And
Test pallet will be sent to the semiconductor package part after just, wherein include: in the use to the step of positive semiconductor package part
The semiconductor package part is stored in the pallet to positive semiconductor package part；And the air with predetermined pressure is applied to
The semiconductor package part being accommodated in the packaging part container part, so as to the just described semiconductor package part.
In some embodiments, applying the step of having the air of predetermined pressure includes: by fumarole in the predetermined time
Continuously apply air, the semiconductor package part shaken, wherein the fumarole be formed in tray main body so as to
It is communicated with the packaging part container part, the tray main body is equipped with the institute for the pallet to positive semiconductor package part
State packaging part container part.
In some embodiments, the step of application has the air of predetermined pressure comprises determining that semiconductor package part is opposite
It is whether crooked in the predetermined position of the packaging part container part；And air is applied to and the packaging part container part phase
Logical fumarole shakes the semiconductor package part, wherein the packaging part container part is accommodated with relative to institute
State the semiconductor package part of predetermined position skew.
Another embodiment conceived according to the present invention, provides a kind of testing, sorting machine, and the testing, sorting machine includes
Buffer pallet, the buffer pallet is to just multiple semiconductor package parts to be tested.Buffer pallet includes: tray main body, the support
Disc main body has multiple packaging part container parts, and multiple semiconductor package parts are individually accommodated in the multiple packaging part container portion
In point；And pneumatic position, to positive unit, the pneumatic position connect positive unit with the tray main body and applies air
Each of packaging part container part semiconductor package part will be accommodated in by adding to, so as in the packaging part container part
To the just described semiconductor package part.The testing, sorting machine further includes load units, and the load units are by the semiconductor package
Piece installing is sent to test pallet from the buffer pallet.
In some embodiments, the pneumatic position includes: the air flue in the tray main body to positive unit, described
Air flue communicate and be arranged in the tray main body with the packaging part container part so as to the jet for injecting air
Hole connection；And air pump, the air pump supply air to the air flue.
In some embodiments, the pneumatic position further includes controller to positive unit, and the controller controls the gas
Air to be continuously supplied to when semiconductor package part to be tested to be loaded into the tray main body in the predetermined time by pump
The air flue shakes the semiconductor package part.
In some embodiments, the tray main body includes: body part, and the body part includes that the packaging part holds
Device part and the accommodating groove for being formed in packaging part container part lower part；And packaging part support device, the packaging part branch
Support arrangement is arranged in the accommodating groove of the body part and supports the semiconductor being accommodated in the packaging part container part
Packaging part, and the fumarole is formed in the packaging part support device.
In some embodiments, the multiple packaging part container part all includes inclined-plane, and the inclined-plane is located at the pallet
On the inner wall of the formation packaging part container part of main body, so that the cross section of each packaging part container part is with from top
Portion's opening extends to bottom surface and is become narrow gradually.
Detailed description of the invention
It will be more clearly understood that the exemplary embodiment of present inventive concept through the following detailed description taken in conjunction with the accompanying drawings,
In attached drawing:
Fig. 1 is the schematic plan view of the testing, sorting machine for the embodiment conceived according to the present invention；
Fig. 2 is the local perspective view of testing, sorting machine shown in Fig. 1；
Fig. 3 be the embodiment conceived according to the present invention testing, sorting machine shown in Fig. 1 in be used as to positive semiconductor
The perspective view of the buffer pallet of the pallet of packaging part；
Fig. 4 is the enlarged perspective in the region Fig. 3 " A "；
Fig. 5 is the plan view of the air flue inside buffer pallet shown in Fig. 3 shown in concealed wire；
Fig. 6 and Fig. 7 is the view for showing the process to positive semiconductor package part, wherein by buffer pallet shown in Fig. 3
Air shake semiconductor package part；
Fig. 8 is the flow chart of the test method of the semiconductor package part for the embodiment conceived according to the present invention；And
Fig. 9 is the flow chart of the semiconductor package part test method for another embodiment conceived according to the present invention.
Specific embodiment
Merely for illustrating the purpose of embodiment conceived according to the present invention to the basis disclosed in this specification or application
The specific structure of the embodiment of present inventive concept or the description of function are illustrated.The embodiment conceived according to the present invention can
To be realized in different forms, and it is not necessarily to be construed as being limited to this specification or application the embodiment described.
The embodiment conceived according to the present invention can change in different ways and can have diversified forms, therefore this
Specification or application will be described in detail by exemplary embodiment shown in the drawings.However, it is not intended that by of the invention
The embodiment of design is limited to certain open form, it should be appreciated that in the thought and technical scope for not departing from present inventive concept
In the case where, embodiment includes all modifications form, equivalent form or alternative forms.
The terms such as " first " and/or " second " can be used when describing each element, but these elements will not
It is limited by preceding terms.It provides above-mentioned term to be only used for distinguishing an element with another element, for example, not departing from
In the case where the range of present inventive concept, first element can be named as second element, and vice versa.
If a certain element be described as with other elements " connection " or " coupling ", which can be with other elements
It is directly connected to or couples, but be also understood to can have additional element between said elements.On the other hand, if certain
One element is described as and other elements " being directly connected to " or " direct-coupling ", then should be understood as between these two elements
There is no element.For illustrating other statements of relationship between element, for example, " ... between ", " between directly existing ... ",
" close ... " and " being directly adjacent to ... " etc. should similarly explain.
The term used in the present specification is used merely to explain some embodiments rather than is used to limit present inventive concept.Only
Will be within a context without other definition, singular may include plural form.In the present specification, it should be appreciated that " packet
Include ", the terms such as " having " are only used for indicating existing characteristics, numerical value, step, operation, component, assembly unit or combinations thereof, but are not excluded for
In the presence of or a possibility that addition one or more features, numerical value, step, operation, component, assembly unit or combinations thereof.
As long as no other definition, all terms used herein including scientific term or technical term contain
Justice is identical as the normally understood meaning of present inventive concept person of an ordinary skill in the technical field.In addition, in common dictionary
The term of definition should be construed as the meaning being equal with the situational meaning of the relevant technologies, as long as and clearly fixed in the description
Justice is just not construed as preferably or excessively formal meaning.
In the following, by the embodiment of elaboration present inventive concept in conjunction with the accompanying drawings, present inventive concept is described in detail.In attached drawing
In identical appended drawing reference indicate identical element.
Present inventive concept can be applied to for positive semiconductor package part various pallets, using the test point of the pallet
Select machine, to the method for positive semiconductor package part and using the test method to correction method, but for ease of description, below
It will be described using buffer pallet (B pallet) as the pallet to positive semiconductor package part.
Fig. 1 is the schematic plan view of the testing, sorting machine for the embodiment conceived according to the present invention.Fig. 2 is surveyed shown in Fig. 1
Try the local perspective view of sorting machine.
As shown, the testing, sorting machine for semiconductor devices for the embodiment conceived according to the present invention includes: main body
100, for supplying the load units 600 of semiconductor package part to be tested, for unloading the semiconductor package part for completing to test
Unloading unit 700, for the semiconductor package part that preheats or precook at a predetermined temperature infusion chamber 200, for be loaded in survey
The test cabinet 300 tested of semiconductor package part on examination pallet 330 and for returning the semiconductor package part after test
Return to the discharge room 400 of initial room-temperature state.
In the present embodiment, testing, sorting machine is using buffer pallet 800 as to semiconductor package part just to be tested
Pallet, and herein be described in.
Main body 100 is connect with load units 600, unloading unit 700, infusion chamber 200, test cabinet 300 and discharge room 400.
Main body 100 may be used as supporting the frame or dependency structure of aforementioned each device.
Load units 600 include loading machine (not shown), load side plate 610 and load Descartes (Cartesian) certainly
Dynamic device 620.The loading machine deposit that 100 front of main body is arranged in has user tray (C pallet) 630, in the user tray 630
Semiconductor package part to be tested there are many loading.
The user tray 630 laid in loading machine is sequentially transmitted by transferring arm (not shown) to loading side plate
610.As shown in Fig. 2, loading Descartes's automatic device 620 includes that the first pickup head 621 and second pick up head 622.First
It picks up head 621 and semiconductor package part is sent to buffer pallet 800 from user tray 630.Second pickup head 622 will partly be led
Body packaging part is sent to test pallet 330 from buffer pallet 800.
Because being arranged in user tray 630 and accommodating the length of the packaging part container part 812 of semiconductor package part/wide
Spend packaging part container part of the spacing usually with setting on test pallet 330 (it is to be tested and arranged in test site)
812 length/width spacing is different, so semiconductor package part is located at buffer pallet before being transferred into test pallet 330
In 800.Therefore, if the first pickup head 621 will be received in partly leading in the packaging part container part 812 of user tray 630
Body packaging part is conveyed directly to the packaging part container part of test pallet 330, then the spacing between them be it is unmatched simultaneously
And automatic device is not easy to be controlled, to cause the loss in work.
Similar with load units, unloading unit 700 includes unloader (not shown), unloading side plate 710 and unloading flute card
That automatic device 720.The side of loading machine is arranged in unloader, in unloader, by the semiconductor package part after test according to
Test result is classified and is contained in user tray 630.In addition, unloading side plate will be located at also by transferring arm (not shown)
User tray 630 on 710 is sent to unloader.
Unloading Descartes's automatic device 720 includes that third picks up head (not shown) and the 4th pickup head (not shown).
Third picks up head and semiconductor package part is sent to unloading buffer pallet 730 from test pallet 330.4th picks up head will be partly
Conductor packaging part is sent to user tray 630 from unloading buffer pallet 730.Replacement shape as offer unloading buffer pallet 730
Formula, unloading unit can not provide unloading buffer pallet 730 in other embodiments.
In brief, loading machine and unloader are separately positioned on the front of main body 100, loading machine deposit have multiple storages to
The user tray 630 of semiconductor package part is tested, and unloader deposit has after storing test and partly leading according to grade separation
The user tray 630 of body packaging part.Loading machine and unloading are arranged in addition, loading side plate 610 and unloading side plate 710
On machine, as the holding fix for loading and unloading semiconductor package part.
Ease up in addition, loading Descartes's automatic device 620 and unloading Descartes's automatic device 720 via user tray 630
It is continuous between each test pallet 330 and repeatedly move to rush pallet 800.Therefore, Descartes's automatic device 620 is loaded via general
The semiconductor package part to be tested of buffer pallet 800 is sent to test pallet 330 from user tray 630.It is automatic to unload Descartes
Semiconductor package part after test is sent to user tray from test pallet 330 via unloading buffer pallet 730 by device 720
630。
Test pallet 330 cycles repeatedly through, and during this period, test pallet 330 sequentially moves before entering infusion chamber 200
It moves to the Accreditation Waiting Area of loading stage 640.Test pallet 330 sequentially moves between infusion chamber 200, test cabinet 300 and discharge room 400
It is dynamic.Test pallet 330 is moved to relieving platform 740, and relieving platform 740 is proximate to the region of discharge room 400, and is leaving discharge room
After 400, before being moved to loading stage 640, test pallet 330 is located at relieving platform 740.
In loading stage 640, test pallet 330, which waits, loads semiconductor package part to be tested.Relieving platform 740 includes classification
Area and buffer area, in classification area, the semiconductor package part waiting after test is classified, in the buffer, empty test pallet
330 waitings are provided to loading stage 640.
In order to recycle test pallet 330, the testing, sorting machine for the embodiment conceived according to the present invention includes holding in the palm test
The conveyer that disk 330 recycles between loading stage 640, infusion chamber 200, test cabinet 300, discharge room 400 and relieving platform 740, and
It and further include the master controller for controlling conveyer.After main body 100 is arranged in infusion chamber 200, test cabinet 300 and discharge room 400
Portion region.
Test pallet 330 with a semiconductor package is loaded to move on from infusion chamber 200 to the direction that room 400 is discharged.
Here, the effect of infusion chamber 200 is: before test pallet 330 is sent to test cabinet 300, with predetermined temperature preheating or
It precools and loads test pallet 330 with a semiconductor package.
In addition, the effect of discharge room 400 is that semiconductor package part after test from test cabinet 300 returns to initial room-temperature
State.
Under test conditions, that is, under conditions of keeping high temperature or low temperature, test cabinet 300 will be loaded using test board
Semiconductor package part on test pallet 330 is electrically connected with the test jack (not shown) of test board respectively, to be surveyed
Examination.
When semiconductor package part is transmitted from the user tray 630 of storage semiconductor package part and is accommodated in buffer pallet 800
When middle, routine test sorting machine has following known problem: because even in semiconductor package part relative to buffer pallet 800
In the case where 812 skew of packaging part container part, testing, sorting machine is also without zero offset capability, so testing, sorting machine is temporary
Stop to take manual measure.Specifically, because it is difficult to obtain required exact position pair corresponding with semiconductor package part
Just, so being difficult to carry out normal load semiconductor package part with small spacing.
In embodiment, there is following construction for the buffer pallet 800 to positive semiconductor package part, and can solve
With the above-mentioned problem related with routine test sorting machine of processing.
Fig. 3 be the embodiment conceived according to the present invention testing, sorting machine shown in Fig. 1 in be used as to positive semiconductor
The perspective view of the buffer pallet 800 of the pallet of packaging part, Fig. 4 are the enlarged perspectives in the region Fig. 3 " A ".Fig. 5 is shown with concealed wire
The plan view of air flue inside buffer pallet 800 shown in Fig. 3 out.Fig. 6 and Fig. 7 is the process shown to positive semiconductor package part
View, wherein shaking semiconductor package part by the air in buffer pallet 800 shown in Fig. 3.
As shown, buffer pallet 800 can be used as the embodiment conceived according to the present invention for just partly leading
The pallet of body packaging part.Buffer pallet 800 includes tray main body 810, and tray main body 810 has multiple independent storage semiconductor packages
The packaging part container part 812 of piece installing.As shown in Figure 6 and Figure 7, buffer pallet 800 further includes the gas connecting with tray main body 810
Position is moved to positive unit 850, the air with predetermined or preset pressure is applied to and will be stored to positive unit 850 by pneumatic position
Semiconductor package part in packaging part container part 812, thus to positive semiconductor packages in packaging part container part 812
Part.In the present embodiment, when air is applied to semiconductor package part to positive unit 850 by pneumatic position, semiconductor package part
Vibration, to carry out in packaging part container part 812 to just.
The appearance of the formation buffer pallet 800 of tray main body 810.Tray main body 810 can have whole block as needed
Shape structure, i.e. monomer structure.In some embodiments, if tray main body 810 works as semiconductor in whole block structure
When packaging part is received into packaging part container part 812, impact may be applied to semiconductor package part.
Therefore, semiconductor package is applied to when semiconductor package part is received into packaging part container part 812 in order to absorb
The impact of piece installing, tray main body 810 include body part 820 and packaging part support device 830, and the setting of body part 820 is being sealed
The lower part of piece installing container part 812 is simultaneously formed with accommodating groove 822, and packaging part support device 830 is arranged in the receipts of body part 820
It receives in slot 822 and provides support to the semiconductor package part being accommodated in packaging part container part 812.
In addition, packaging part support device 830 includes packaging part braced frame 831 and impact absorbing member 835, packaging part branch
Support frame frame 831 is connect in a manner of relatively-movable with body part 820, impact absorbing member 835 be located at body part 820 with
Between packaging part braced frame 831.Impact absorbing member 835, which is configured and positioned to absorb, is applied to packaging part braced frame 831
Impact.
In some embodiments, spring can be used as impact absorbing member 835, packaging part braced frame 831 can be with
The spring mounting groove 832 of spring is stored including being recessed.In some embodiments, spring mounting groove 832 is formed as and air flue
860 is coaxial, but not limited to this.Alternatively, spring mounting groove 832 can be spaced apart from each other with air flue 860 and be formed in packaging part
In braced frame 831.The quantity of spring mounting groove can change without limiting.
In addition, packaging part braced frame 831 can be formed by material identical with body part 820, or can by with
The different material of body part 820 is formed.
Utilize this construction, when semiconductor package part, which is accommodated in, to be operated in packaging part container part 812, packaging part
Impact can be absorbed in place safely relative to semiconductor package part in support device 830.Specifically, in the present embodiment, such as
Air is applied to semiconductor package part to positive unit 850 by pneumatic position by fruit, then semiconductor package part can shake.Although
There is a possibility that colliding between semiconductor package part and packaging part support device 830, but this vibration can inhale
Receive impact.
In addition, each packaging part container part 812 can include inclined-plane 821, inclined-plane 821, which is located at, forms packaging part container
On the inner wall of part 812, so that the cross section of packaging part container part 812 becomes narrow gradually from top opening to bottom surface.Cause
This, when semiconductor package part is accommodated in packaging part container part 812, despite the presence of not to it is positive a possibility that, for example, half
In the case where the movement of conductor packaging part slightly skew, semiconductor package part can also enter along inclined-plane 821.
Pneumatic position may include at least one fumarole 852 to positive unit 850, and fumarole 852 is formed in tray main body
In 810, that is, be formed in the packaging part braced frame 831 of packaging part support device 830.Pneumatic position may be used also to positive unit 850
To include air flue 860, air pump (not shown) and controller (not shown), air flue 860 is arranged in tray main body 810 and and jet
Hole 852 communicates, and air pump supplies air to a plurality of air flue 860, controller for control air pump with according to the predetermined time by air
It is continuously supplied to air flue 860, so that when semiconductor package part to be tested to be loaded in tray main body 810, semiconductor packages
Part can shake.
In one embodiment, in order to which position any in packaging part container part 812 is to positive semiconductor package part, jet
Hole 852 be formed in tray main body 810 and be arranged in each packaging part container part 812 so as to each packaging part
Container part 812 communicates.
In one embodiment, as shown in figure 5, the fumarole 852 of multiple packaging part container parts 812 and an air flue
860 connections, but not limited to this.Alternatively, each region can be separated, and can be in each separation region
Middle setting air flue to supply air simultaneously.
In one embodiment, the bottom of the formation packaging part container part 812 of tray main body 810 is arranged in fumarole 852
The central area of wall.Why fumarole 852 is set in this way, is because when fumarole 852 is arranged in tray main body 810
Bottom wall central area when, can be more effectively to positive semiconductor package part, but not limited to this.Alternatively, fumarole
852 can be set in other regions other than the central area of the bottom wall of tray main body 810, as long as semiconductor package part
At least substantially by just.
Therefore, the central area of the bottom wall of tray main body 810 is set in fumarole 852 and is injected up relatively seldom
In the embodiment of the air of amount, for example, as shown in Figure 6 and Figure 7, semiconductor package part can seal while vibration (shake)
Slightly float in piece installing container part 812.At this point, if semiconductor package part skew or not to just, semiconductor packages
Part can return to appropriate location in operation.In addition, the mobile range of semiconductor package part may be limited to encapsulation
In part container part 812, thus can be than regular situation more accurately to positive semiconductor package part.
In one embodiment, there is phase by the air that the fumarole 852 of each packaging part container part 812 injects
Same pressure.Therefore, the spray being formed according to air flue 860 in the bottom wall of the formation packaging part container part 812 of tray main body 810
Stomata 852 can have identical size or relative configurations, or according to the distance between with air inlet 861, packaging part container
The size or relative configurations of the fumarole 852 of part 812 can be different.In this manner it is achieved that even if air and air flue 860 into
Port 861 is apart from each other, can also inject air with identical pressure.
In addition, spreading grooves 834 can be formed around the fumarole 852 on the bottom wall for being located at tray main body 810.Spreading grooves
834 can be relative to surface indentation to communicate with fumarole 852, and the cross section of spreading grooves 834 is in upward direction
It is upper extension and increase.Air can be diffused into presumptive area from fumarole 852 by this, partly be led so that air concentration be prevented to be applied to
Body packaging part.
In the present embodiment, controller controls air pump so that air is continuously supplied to air flue in the relatively short time
860, so that semiconductor package part can shake when semiconductor package part to be tested to be loaded in tray main body 810.As this
Sample, semiconductor package part can shake, thus the automatic alignment in packaging part container part 812.
In the present embodiment, it is whether correct right in packaging part container part 812 not know semiconductor package part for controller
Just, and air pump is controlled so that air is continuously supplied to fumarole 852 in the relatively short time.This is because supply air
Time it is very short so that air is provided at once when semiconductor package part to be loaded into buffer pallet 800, thus not only to just
The semiconductor package part of skew, even and if compared with the not crooked regular situation of semiconductor package part, more accurately to just
Semiconductor package part.
In the present embodiment, controller controls air pump so that air is continuously supplied to fumarole in the relatively short time
852, but not limited to this.Alternatively, it is possible to which controlling air pump discontinuously supplies air, as long as effectively to positive semiconductor packages
Part.
In addition to Fig. 1 to Fig. 7, reference will also be made to Fig. 8 description conceive according to the present invention embodiment to positive semiconductor packages
The method of part and use the semiconductor package part test method to correction method.
In step S100, to positive semiconductor package part in buffer pallet 800, buffer pallet 800 has multiple independent receipts
The packaging part container part 812 of nano semiconductor packaging part, and step S200 is related to transmitting and test to positive semiconductor packages
Part.
It include one group of step to the step S100 of positive semiconductor package part in buffer pallet 800.Specifically, step
S100 includes the steps that storing semiconductor package part S110 in buffer pallet 800 and applies the air with predetermined pressure
To the semiconductor package part being accommodated in packaging part container part 812 so as to the step S130 to positive semiconductor package part.
More specifically, the user tray 630 laid on loading machine is sent to by loading side pressure by transferring arm
Plate.Multiple semiconductor package parts on user tray 630 are loaded into buffer pallet 800 by loading Descartes's automatic device
In each packaging part container part 812 (S110).
When multiple semiconductor package parts are loaded onto each packaging part container part 812 of buffer pallet 800, partly lead
Body packaging part may be relative to 800 skew of buffer pallet.Can determine whether semiconductor package part is crooked.However, in this reality
It applies in example, when multiple semiconductor package parts are loaded onto each packaging part container part 812 of buffer pallet 800, will have
There is the air of predetermined pressure to be injected into whole packaging part container parts 812 according to the scheduled time via fumarole 852, without
It is whether crooked with determining semiconductor package part.
It is injected into the air of fumarole 852 and the semiconductor package part being loaded into each packaging part container part 812
Collision, so that semiconductor package part shakes, thus to positive semiconductor package part (S130).
Then, it in step S200, transmits and tests to the semiconductor package part after just.More specifically, when in buffering support
When in disk 800 to positive semiconductor package part, semiconductor package part is loaded into test support from buffer pallet 800 by the second pickup head
Disk 330.
The test pallet 330 for being mounted with multiple semiconductor package parts is sent to infusion chamber, and in the temperature of test condition
It is heated or cooled under degree, is then resent to test cabinet.
In test cabinet, multiple semiconductor package parts on test pallet 330 are connect with test jack, to be surveyed
Examination.Then, the test pallet 330 after test is sent to discharge room 400.
Test pallet 330 returns to room temperature when by room 400 is discharged, and unloads Descartes's automatic device 720 according to survey
Test result is classified according to grade.Then, test pallet 330 is moved to the user tray being located in unloading side plate 710
630。
If the empty user tray 630 being located in unloading side plate 710 is completely filled up semiconductor package part, transferring arm
User tray 630 is transmitted according to different grades and is laid in unloader.Then, transferring arm is by new empty user tray
630 are sent to unloading side plate 710.
Fig. 9 is the flow chart of the semiconductor package part test method for another embodiment conceived according to the present invention.Here,
By the present embodiment for conceiving according to the present invention only about different from Fig. 8 part descriptions to the method for positive semiconductor package part and
Use the test method of the semiconductor package part to correction method.
In the present embodiment, in step S100a, to positive semiconductor package part in buffer pallet 800.Step S100a packet
It includes: it is whether crooked (S120a) relative to the predeterminated position of packaging part container part 812 to determine semiconductor package part, and passes through
Air is set to be only applied to 852 pairs of fumarole that its crooked packaging part container part 812 opposite with semiconductor package part communicates
Positive semiconductor package part.Therefore, unlike previous embodiment, there is the step of shaking semiconductor package part (S130a).
However, storing the step S110a of semiconductor package part in buffer pallet 800 and transmitting and test to the semiconductor packages after just
The step S200a of part is identical as previous embodiment.
Meanwhile previous embodiment shows and uses buffer pallet 800 as the pallet to positive semiconductor package part, still
It is without being limited thereto.Alternatively, it can be applied to test pallet 330 for the pallet to positive semiconductor package part.
The embodiment conceived according to the present invention there may come a time when that the semiconductor package part of meeting skew can be right when being sent alone
Positive correct position, and can be further improved accuracy of the packaging part on correct position compared with regular situation.
Although reference example embodiment specifically illustrates and describes present inventive concept, but it is to be understood that do not departing from
The variation on various forms and details can be carried out in the case where spirit and scope of the appended claims.
Claims (28)
1. a kind of pallet for positive semiconductor package part, the pallet include:
Tray main body, the tray main body include multiple packaging part container parts, and multiple semiconductor package parts are individually accommodated in
In the multiple packaging part container part；And
To positive unit, the pneumatic position connect positive unit with the tray main body and will have predetermined pressure pneumatic position
Air be applied to be accommodated in the multiple packaging part container part one encapsulation in the multiple semiconductor package part
A semiconductor package part in part container part is so that one semiconductor package part shakes, to partly lead one
Body packaging part at one packaging part container part to just,
Wherein, the tray main body includes:
Body part, the body part include the packaging part container part and are formed in packaging part container part lower part
Accommodating groove；And
Packaging part support device, the packaging part support device are arranged in the accommodating groove of the body part and support storage
Semiconductor package part in the packaging part container part, the packaging part support device include:
Packaging part braced frame, the packaging part braced frame are connect in a manner of relatively-movable with the body part；With
And
Impact absorbing member, the impact absorbing member between the body part and the packaging part braced frame and
Absorb the impact for being applied to the packaging part braced frame.
2. pallet according to claim 1, wherein the pneumatic position includes: to positive unit
Air flue in the tray main body, the air flue communicate with the packaging part container part and the support are arranged in
To be connect with the fumarole for injecting air in disc main body；And
Air pump, the air pump supply air to the air flue.
3. pallet according to claim 2, wherein the center of the bottom wall of the tray main body is arranged in the fumarole
Domain.
4. pallet according to claim 3 further includes spreading grooves, fumarole week of the spreading grooves relative to the bottom wall
It the surface indentation that encloses and is communicated with the fumarole, the cross section of the spreading grooves increases with upwardly extending.
5. pallet according to claim 2, wherein each fumarole is connected to an air flue.
6. pallet according to claim 2, wherein the pneumatic position further includes controller to positive unit, the control
Device controls the air pump so as to will be empty in the predetermined time when semiconductor package part to be tested to be loaded into the tray main body
Gas is continuously supplied to the air flue, so that the semiconductor package part shakes.
7. pallet according to claim 2, wherein the fumarole is formed in the packaging part support device.
8. pallet according to claim 1, wherein the multiple packaging part container part all includes inclined-plane, the inclined-plane
On the inner wall of the formation packaging part container part of the tray main body, so that the cross of each packaging part container part
Section becomes narrow gradually with extending from top opening to bottom surface.
9. pallet according to claim 1 further includes buffer pallet, the buffer pallet load and store from be mounted with to
Test the semiconductor package part of the user tray transmission of semiconductor package part.
10. a kind of testing, sorting machine, comprising:
For the pallet to positive semiconductor package part, the semiconductor package part, and the pallet are stored in the pallet
Include:
Tray main body, the tray main body have multiple packaging part container parts, multiple semiconductor package parts are individually accommodated in
In the multiple packaging part container part；And
To positive unit, the pneumatic position connect positive unit with the tray main body and will have predetermined pressure pneumatic position
Air be applied to the semiconductor package part being accommodated in the packaging part container part so that the semiconductor package part
Vibration, so as to the just described semiconductor package part in the packaging part container part,
Wherein, the tray main body includes:
Body part, the body part include the packaging part container part and are formed in packaging part container part lower part
Accommodating groove；And
Packaging part support device, the packaging part support device are arranged in the accommodating groove of the body part and support storage
Semiconductor package part in the packaging part container part, the packaging part support device include:
Packaging part braced frame, the packaging part braced frame are connect in a manner of relatively-movable with the body part；With
And
Impact absorbing member, the impact absorbing member between the body part and the packaging part braced frame and
Absorb the impact for being applied to the packaging part braced frame.
11. testing, sorting machine according to claim 10, wherein the pneumatic position includes: to positive unit
At least one fumarole in the tray main body；
Air flue in the tray main body, the air flue are communicated at least one described fumarole for injecting air；
And
Air pump, the air pump supply air to the air flue, so that semiconductor package part to be tested is loaded into the support
Semiconductor package part vibration when in disc main body.
12. testing, sorting machine according to claim 11, wherein the formation of the tray main body is arranged in the fumarole
The central area of the bottom wall of packaging part container part.
13. testing, sorting machine according to claim 12, further includes spreading grooves, the spreading grooves are relative to the bottom wall
Surface indentation around fumarole to be communicated with the fumarole, and the cross section of the spreading grooves with upwardly extending and
Increase.
14. testing, sorting machine according to claim 11, wherein the pneumatic position further includes controller to positive unit,
The controller controls the air pump to make a reservation for when semiconductor package part to be tested to be loaded into the tray main body
Air is continuously supplied to the air flue by the time, so that the semiconductor package part shakes.
15. testing, sorting machine according to claim 11, wherein
The fumarole is formed in the packaging part support device.
16. testing, sorting machine according to claim 10, wherein the multiple packaging part container part all includes inclined-plane,
The inclined-plane is located on the inner wall of the formation packaging part container part of the tray main body, so that each packaging part container
Partial cross section becomes narrow gradually with extending from top opening to bottom surface.
17. testing, sorting machine according to claim 10, including buffer pallet, the buffer pallet is loaded and is stored from dress
It is loaded with the semiconductor package part of the user tray transmission of semiconductor package part to be tested.
18. a kind of method to positive semiconductor package part, the method includes the steps:
Semiconductor package part is stored in for the pallet to positive semiconductor package part, the pallet includes having multiple packaging parts
The body part and packaging part support device of container part and the accommodating groove for being formed in packaging part container part lower part,
Multiple semiconductor package parts are individually accommodated in the multiple packaging part container part, the packaging part support device is arranged in
In the accommodating groove of the body part and support the semiconductor package part being accommodated in the packaging part container part；And
Air with predetermined pressure is applied to the semiconductor package part being accommodated in the packaging part container part so that institute
Semiconductor package part vibration is stated, so as to the just described semiconductor package part,
Wherein, during to the just semiconductor package part, by be located at the body part with relatively-movable
Impact absorbing member absorption between mode and the packaging part braced frame of body part connection is applied to the packaging part
The impact of braced frame, the impact absorbing member and the packaging part braced frame are included in the packaging part support device
In.
19. according to the method for claim 18, wherein the step of application has the air of predetermined pressure includes: to pass through spray
Stomata continuously applies air in the predetermined time, so that the semiconductor package part shakes, wherein the fumarole is formed in pallet
To communicate with the packaging part container part in main body, the tray main body is equipped with described for positive semiconductor package part
Pallet the packaging part container part.
20. according to the method for claim 18, wherein application the step of having the air of predetermined pressure includes:
Determine whether semiconductor package part is crooked relative to the predetermined position of the packaging part container part；And
Air is applied to the fumarole communicated with the packaging part container part, so that the semiconductor package part shakes,
Described in packaging part container part be accommodated with the semiconductor package part relative to the predetermined position skew.
21. a kind of test method of semiconductor package part, the test method comprising steps of
To the just described semiconductor package part in for the pallet to positive semiconductor package part, the pallet includes having multiple envelopes
Body part and packaging part the support dress of piece installing container part and the accommodating groove for being formed in packaging part container part lower part
It sets, multiple semiconductor package parts is individually accommodated in the multiple packaging part container part, the packaging part support device cloth
It sets in the accommodating groove of the body part and supports the semiconductor package part being accommodated in the packaging part container part；With
And
Test pallet will be sent to the semiconductor package part after just,
Wherein, include: to the step of positive semiconductor package part
The semiconductor package part is stored in the pallet for positive semiconductor package part；And
Air with predetermined pressure is applied to the semiconductor package part being accommodated in the packaging part container part so that institute
Semiconductor package part vibration is stated, so as to the just described semiconductor package part,
Wherein, during to the just semiconductor package part, by be located at the body part with relatively-movable
Impact absorbing member absorption between mode and the packaging part braced frame of body part connection is applied to the packaging part
The impact of braced frame, the impact absorbing member and the packaging part braced frame are included in the packaging part support device
In.
22. test method according to claim 21, wherein the step of application has the air of predetermined pressure includes: logical
It crosses fumarole and continuously applies air in the predetermined time, so that the semiconductor package part shakes, wherein the fumarole is formed in
To communicate with the packaging part container part in tray main body, the tray main body is equipped with described for positive semiconductor package
The packaging part container part of the pallet of piece installing.
23. test method according to claim 21, wherein application the step of having the air of predetermined pressure includes:
Determine whether semiconductor package part is crooked relative to the predetermined position of the packaging part container part；And
Air is applied to the fumarole communicated with the packaging part container part, so that the semiconductor package part shakes,
Described in packaging part container part be accommodated with the semiconductor package part relative to the predetermined position skew.
24. a kind of testing, sorting machine, comprising:
Buffer pallet, the buffer pallet is to just multiple semiconductor package parts to be tested and includes:
Tray main body, the tray main body have multiple packaging part container parts, multiple semiconductor package parts are individually accommodated in
In the multiple packaging part container part；And
Pneumatic position to positive unit, the pneumatic position positive unit is connect with the tray main body and by air be applied to by
Being accommodated in each of packaging part container part semiconductor package part shakes the semiconductor package part, so as in the envelope
To the just described semiconductor package part in piece installing container part；And
The semiconductor package part is sent to test pallet from the buffer pallet by load units, the load units,
Wherein, the tray main body includes:
Body part, the body part include the packaging part container part and are formed in packaging part container part lower part
Accommodating groove；And
Packaging part support device, the packaging part support device are arranged in the accommodating groove of the body part and support storage
Semiconductor package part in the packaging part container part, the packaging part support device include:
Packaging part braced frame, the packaging part braced frame are connect in a manner of relatively-movable with the body part；With
And
Impact absorbing member, the impact absorbing member between the body part and the packaging part braced frame and
Absorb the impact for being applied to the packaging part braced frame.
25. testing, sorting machine according to claim 24, wherein the pneumatic position includes: to positive unit
Air flue in the tray main body, the air flue communicate with the packaging part container part and the support are arranged in
To be connect with the fumarole for injecting air in disc main body；And
Air pump, the air pump supply air to the air flue.
26. testing, sorting machine according to claim 25, wherein the pneumatic position further includes controller to positive unit,
The controller controls the air pump to make a reservation for when semiconductor package part to be tested to be loaded into the tray main body
Air is continuously supplied to the air flue by the time, so that the semiconductor package part shakes.
27. testing, sorting machine according to claim 25, wherein
The fumarole is formed in the packaging part support device.
28. testing, sorting machine according to claim 24, wherein the multiple packaging part container part all includes inclined-plane,
The inclined-plane is located on the inner wall of the formation packaging part container part of the tray main body, so that each packaging part container
Partial cross section becomes narrow gradually with extending from top opening to bottom surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0028588 | 2013-03-18 | ||
| KR1020130028588A KR102138794B1 (en) | 2013-03-18 | 2013-03-18 | A Tray for Aligning the Positions of Semiconductor Package, Test Handler Using the Same, A Method for Aligning the Positions of Semiconductor Package and the Test Method Using the Same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104064507A CN104064507A (en) | 2014-09-24 |
| CN104064507B true CN104064507B (en) | 2019-06-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410100812.3A Active CN104064507B (en) | 2013-03-18 | 2014-03-18 | For pallet and method, the testing, sorting machine and method to positive semiconductor package part |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9459315B2 (en) |
| KR (1) | KR102138794B1 (en) |
| CN (1) | CN104064507B (en) |
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| KR20230055985A (en) * | 2021-10-19 | 2023-04-26 | (주)테크윙 | Test handler and method for controlling same |
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2014
- 2014-03-18 US US14/217,911 patent/US9459315B2/en active Active
- 2014-03-18 CN CN201410100812.3A patent/CN104064507B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102565656A (en) * | 2010-11-24 | 2012-07-11 | 泰克元有限公司 | Testing handler |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20140114534A (en) | 2014-09-29 |
| CN104064507A (en) | 2014-09-24 |
| US20140262928A1 (en) | 2014-09-18 |
| KR102138794B1 (en) | 2020-07-28 |
| US9459315B2 (en) | 2016-10-04 |
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