CN104064354A - High-power resonance capacitor manufacture method - Google Patents
High-power resonance capacitor manufacture method Download PDFInfo
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- CN104064354A CN104064354A CN201410295189.1A CN201410295189A CN104064354A CN 104064354 A CN104064354 A CN 104064354A CN 201410295189 A CN201410295189 A CN 201410295189A CN 104064354 A CN104064354 A CN 104064354A
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Abstract
The invention discloses a high-power resonance capacitor manufacture method. The method comprises the following steps: (1) a certain number of copper foils and mica papers are provided, the copper foils and the mica papers are stacked alternately to form a square layered structure, and a mica paper exists between every two adjacent copper foils; (2) evacuation and the heating process are performed on the layered structure to evacuate the air in the layered structure and remove the moisture in the layered structure; (3) a first electrode and a second electrode are provided, the first electrode covers one end of the layered structure, the second electrode covers the other end of the layered structure, and the first electrode and the second electrode are in electrical connection with the copper foils in the layered structure separately; (4) and epoxy resin is poured into the matching portions of the first electrode, the second electrode and the layered structure to make the cooled epoxy resin form a sealing layer for sealing the layered structure. The high-power resonance capacitor manufacture method of the invention has advantages of energy saving, low cost, and prolonged service life.
Description
Technical field
The present invention relates to a kind of capacitor area, relate in particular to a kind of manufacture method of high power resonant vibration capacitor.
Background technology
Along with the continuous progress of economic development and society, for all trades and professions provide abundant material consumption product, to guarantee the normal development of all trades and professions, and resonant capacitor is exactly a kind of in many material consumption product.
At present, in the resonant capacitor of large electric current (being 400-500 peace as current range), in this resonant capacitor, between adjacent two Copper Foils, fold and be provided with a mica sheet, and relating to a kind of extremely important and complicated operation, the manufacture process of mica sheet roasts exactly silver, this technique can cause the cost of existing resonant capacitor very high, meanwhile, go back the short defect of average life.
Therefore, be badly in need of wanting a kind of can reduce costs and the manufacture method of the high power resonant vibration capacitor that the life-span is long overcomes above-mentioned defect.
Summary of the invention
The object of the present invention is to provide a kind of can reducing costs and the manufacture method of the high power resonant vibration capacitor that the life-span is long.
For realizing above-mentioned object, the invention provides a kind of manufacture method of high power resonant vibration capacitor, comprise that step has: (1) provides Copper Foil and the mica paper of some, described Copper Foil and described mica paper are alternately folded and established to form square layer structure, and between Copper Foil, there is a described mica paper described in adjacent two; (2) layered structure is vacuumized and heat treated, to take the air in layered structure away, and remove the moisture in layered structure; (3) provide one first electrode and one second electrode, make described the first electrode be placed on one end of layered structure, make described the second electrode be placed on the other end of layered structure, also make described the first electrode and the second electrode respectively with layered structure in Copper Foil be electrically connected; (4), toward the cooperation place infusion epoxy resin in described the first electrode, the second electrode and layer structure three, make cooling epoxy resin form the sealant of the layered structure of sealing.
Preferably, all Copper Foils of the both sides in four sides of described the first electrode and layered structure are electrically connected.
Preferably, all Copper Foils of the remaining both sides in four sides of described the second electrode and layered structure are electrically connected.
Preferably, described Copper Foil and mica paper are square structure.
Preferably, the area of described mica paper and the area of described Copper Foil equate.
Preferably, the thickness range of described mica paper is 0.01 millimeter to 0.1 millimeter.
Preferably, the thickness of described mica paper is 0.01 millimeter, 0.05 millimeter or 0.1 millimeter.
Preferably, the thickness range of described Copper Foil is 0.1 millimeter to 0.2 millimeter.
Preferably, the thickness of described Copper Foil is 0.1 millimeter, 0.15 millimeter or 0.2 millimeter.
Compared with prior art, because mica paper of the present invention and Copper Foil are alternately folded, establish to form square layer structure, and layer structure is vacuumized and heat treated, to take the air in layer structure away, and remove the moisture in layer structure, effectively guarantee the reliability of working between Copper Foil, thereby extended the life-span by the manufacture method manufacturing of high power resonant vibration capacitor of the present invention capacitor out; Again due to the use of mica paper, saved the roasting silver process of mica sheet, therefore cost is lower, correspondingly reduced the cost by the manufacture method manufacturing of high power resonant vibration capacitor of the present invention capacitor out.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of high power resonant vibration capacitor of the present invention.
Fig. 2 is the perspective view by the prepared high power resonant vibration capacitor of manufacture method of high power resonant vibration capacitor of the present invention.
Fig. 3 is the stereo decomposing structural representation of the high power resonant vibration capacitor shown in Fig. 2.
Fig. 4 is the perspective view of the layer structure in the high power resonant vibration capacitor shown in Fig. 2.
Fig. 5 is the planar structure schematic diagram of the layer structure shown in Fig. 4.
Fig. 6 is the enlarged drawing of A part in Fig. 5.
Embodiment
In order to describe technology contents of the present invention, structural feature in detail, below in conjunction with execution mode and coordinate accompanying drawing to be described further.
Refer to Fig. 1, the manufacture method of high power resonant vibration capacitor of the present invention comprises that step has: S001, the Copper Foil 41 that some is provided and mica paper 42 (seeing Fig. 3), the quantity of this Copper Foil 41 and mica paper 42 is known according to actual needs by those of ordinary skills, therefore do not repeat them here; Copper Foil 41 and mica paper 42 are alternately folded and established to form square layer structure 40 (seeing Fig. 3), and there is a mica paper 42 between adjacent two Copper Foils 41.S002, layer structure 40 is vacuumized and heat treated, to take the air in layer structure 40 away, and remove the moisture in layer structure 40.S003, provide one first electrode 10 and one second electrode 20 (seeing Fig. 3), make the first electrode 10 be placed on one end of layer structure 40, make the second electrode 20 be placed on the other end of layer structure 40, also make the first electrode 10 and the second electrode 20 respectively with layer structure 40 in Copper Foil 41 be electrically connected; Particularly, all Copper Foils 41 of the both sides in four sides of the first electrode 10 and layer structure 40 are electrically connected, all Copper Foils 41 of the remaining both sides in four sides of the second electrode 20 and layer structure 40 are electrically connected, so that prepared high power resonant vibration capacitor 100 can be exported the electric current of double texts, therefore can volume be done littlely with respect to the existing resonant capacitor of the equal electric current of output, correspondingly reduce costs; Preferably, all Copper Foils 41 of the left and right sides in four sides of the first electrode 10 and layer structure 40 are electrically connected, and all Copper Foils 41 of the both sides, front and back in four sides of the second electrode 20 and layer structure 40 are electrically connected, so that connect, but not as limit.S004, toward the cooperation place infusion epoxy resin in the first electrode 10, the second electrode 20 and layer structure 40 threes, make cooling epoxy resin form the sealant 30 of sealing layer structure 40, so that sealant 30 is placed on the first electrode 10, the second electrode 20 and layer structure 40, to form the space of sealing layer structure 40.More specifically, as follows:
Incorporated by reference to Fig. 2 to Fig. 6, Copper Foil 41 and mica paper 42 are square structure, the first electrode 10 electric currents of Copper Foil 41 outputs are equated with the second electrode 20 size of current of output, thereby make the first electrode 10 electric currents and the second electrode 20 electric currents very even, with prevent because of the inhomogeneous Copper Foil 41 that makes between the first electrode 10 electric currents and the second electrode 20 electric currents breakdown, therefore, correspondingly extend the life-span of high power resonant vibration capacitor 100, thereby reduced the use cost of high power resonant vibration capacitor 100; Particularly, the area of mica paper 42 equates with the area of Copper Foil 41, therefore, makes insulation and insulation effect between adjacent two Copper Foils 41 better.It should be noted that so-called square refers to the thickness of ignoring Copper Foil 41 or mica paper 42, by length and wide the surrounded profile of Copper Foil 41 or mica paper 42.
Meanwhile, the thickness range of mica paper 42 is 0.01 millimeter to 0.1 millimeter, and preferably, the thickness of mica paper 42 is 0.01 millimeter, 0.05 millimeter or 0.1 millimeter, to reach better insulation and insulation effect.
Moreover the thickness range of Copper Foil 41 is 0.1 millimeter to 0.2 millimeter, preferably, the thickness of Copper Foil 41 is 0.1 millimeter, 0.15 millimeter or 0.2 millimeter, to increase further the capacity of high power resonant vibration capacitor 100 of the present invention.
Compared with prior art, because mica paper 42 of the present invention and Copper Foil 41 are alternately folded and established to form square layer structure 40, and layer structure 40 is vacuumized and heat treated, to take the air in layer structure 40 away, and remove the moisture in layer structure 40, effectively guarantee the reliability of working between Copper Foil 41, thereby extended the life-span by the manufacture method manufacturing of high power resonant vibration capacitor of the present invention high power resonant vibration capacitor 100 out; Again due to the use of mica paper 42, saved the roasting silver process of mica sheet, therefore cost is lower, correspondingly reduced the cost by the manufacture method manufacturing of high power resonant vibration capacitor of the present invention capacitor 100 out.
Above disclosed is only preferred embodiments of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the claims in the present invention, still belongs to the scope that the present invention is contained.
Claims (9)
1. a manufacture method for high power resonant vibration capacitor, is characterized in that, comprises the steps:
(1) provide Copper Foil and the mica paper of some, described Copper Foil and described mica paper are alternately folded and established to form square layer structure, and between Copper Foil, there is a described mica paper described in adjacent two;
(2) layered structure is vacuumized and heat treated, to take the air in layered structure away, and remove the moisture in layered structure;
(3) provide one first electrode and one second electrode, make described the first electrode be placed on one end of layered structure, make described the second electrode be placed on the other end of layered structure, also make described the first electrode and the second electrode respectively with layered structure in Copper Foil be electrically connected; And
(4), toward the cooperation place infusion epoxy resin in described the first electrode, the second electrode and layer structure three, make cooling epoxy resin form the sealant of the layered structure of sealing.
2. the manufacture method of high power resonant vibration capacitor as claimed in claim 1, is characterized in that, all Copper Foils of the both sides in four sides of described the first electrode and layered structure are electrically connected.
3. the manufacture method of high power resonant vibration capacitor as claimed in claim 2, is characterized in that, all Copper Foils of the remaining both sides in four sides of described the second electrode and layered structure are electrically connected.
4. the manufacture method of high power resonant vibration capacitor as claimed in claim 1, is characterized in that, described Copper Foil and mica paper are square structure.
5. the manufacture method of high power resonant vibration capacitor as claimed in claim 4, is characterized in that, the area of described mica paper equates with the area of described Copper Foil.
6. the manufacture method of high power resonant vibration capacitor as claimed in claim 1, is characterized in that, the thickness range of described mica paper is 0.01 millimeter to 0.1 millimeter.
7. the manufacture method of high power resonant vibration capacitor as claimed in claim 6, is characterized in that, the thickness of described mica paper is 0.01 millimeter, 0.05 millimeter or 0.1 millimeter.
8. the manufacture method of high power resonant vibration capacitor as claimed in claim 1, is characterized in that, the thickness range of described Copper Foil is 0.1 millimeter to 0.2 millimeter.
9. the manufacture method of high power resonant vibration capacitor as claimed in claim 8, is characterized in that, the thickness of described Copper Foil is 0.1 millimeter, 0.15 millimeter or 0.2 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410295189.1A CN104064354A (en) | 2014-06-26 | 2014-06-26 | High-power resonance capacitor manufacture method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410295189.1A CN104064354A (en) | 2014-06-26 | 2014-06-26 | High-power resonance capacitor manufacture method |
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| CN104064354A true CN104064354A (en) | 2014-09-24 |
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| CN201410295189.1A Pending CN104064354A (en) | 2014-06-26 | 2014-06-26 | High-power resonance capacitor manufacture method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216511A (en) * | 2019-07-10 | 2021-01-12 | 上海绿态电子科技有限公司 | Mica paper capacitor and manufacturing process thereof |
| CN115366498A (en) * | 2022-08-16 | 2022-11-22 | 上海交通大学 | High-strength structure capacitor, preparation method, new energy automobile and unmanned aerial vehicle |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3398326A (en) * | 1965-08-25 | 1968-08-20 | Vitramon Inc | Solid-state electrical component combining multiple capacitors with other kinds of impedance |
| US4379182A (en) * | 1979-03-05 | 1983-04-05 | Siemens Aktiengesellschaft | Method of making a regenerable electric layer capacitor |
| CN2237884Y (en) * | 1995-01-25 | 1996-10-16 | 陈国荣 | Mica paper capacitor for industrial high-frequency resonance |
| CN203673970U (en) * | 2014-01-24 | 2014-06-25 | 四川美丰云母工业有限责任公司 | Dry type mica paper resonant capacitor |
-
2014
- 2014-06-26 CN CN201410295189.1A patent/CN104064354A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3398326A (en) * | 1965-08-25 | 1968-08-20 | Vitramon Inc | Solid-state electrical component combining multiple capacitors with other kinds of impedance |
| US4379182A (en) * | 1979-03-05 | 1983-04-05 | Siemens Aktiengesellschaft | Method of making a regenerable electric layer capacitor |
| CN2237884Y (en) * | 1995-01-25 | 1996-10-16 | 陈国荣 | Mica paper capacitor for industrial high-frequency resonance |
| CN203673970U (en) * | 2014-01-24 | 2014-06-25 | 四川美丰云母工业有限责任公司 | Dry type mica paper resonant capacitor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216511A (en) * | 2019-07-10 | 2021-01-12 | 上海绿态电子科技有限公司 | Mica paper capacitor and manufacturing process thereof |
| CN115366498A (en) * | 2022-08-16 | 2022-11-22 | 上海交通大学 | High-strength structure capacitor, preparation method, new energy automobile and unmanned aerial vehicle |
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