CN104063081A - Touch panel and manufacturing method thereof - Google Patents
Touch panel and manufacturing method thereof Download PDFInfo
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- CN104063081A CN104063081A CN201310093863.3A CN201310093863A CN104063081A CN 104063081 A CN104063081 A CN 104063081A CN 201310093863 A CN201310093863 A CN 201310093863A CN 104063081 A CN104063081 A CN 104063081A
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Abstract
The invention provides a touch panel which comprises a base plate, a sensitive layer, a conductor layer and a ground wire, wherein the base plate is provided with a touch zone and a perimeter zone; the sensitive layer is arranged on the base plate and positioned in the touch zone and comprises a plurality of first axial electrodes and a plurality of second axial electrodes; the conductor layer is arranged on the base plate and positioned in the perimeter zone and comprises a plurality of first conductors and a plurality of second conductors; the first conductors are positioned in a first conductor zone, the second conductors are positioned in a second conductor zone, the first conductors are electrically connected with the first axial electrodes respectively, and the second conductors are electrically connected with the second axial electrodes respectively; the ground wire is arranged on the base plate and positioned in the perimeter zone and is provided with a plurality of branches, and at least one branch is positioned between the first conductor zone and the second conductor zone. The invention further provides a manufacturing method of the touch panel and aims to reduce signal crosstalk between each transmitting shaft and each receiving shaft.
Description
Technical field
The invention relates to touch technology field, relate to especially a kind of contact panel and its method for making.
Background technology
In the market of various consumption electronic products now, the interface tool that the portable electronic products such as personal digital assistant (PDA), mobile phone (mobile Phone), notebook computer (notebook) and flat computer (tablet PC) use contact panel (touch panel) to link up as its data all widely.In addition, because the design of current electronic product is all taking light, thin, short, little as direction, therefore on product, hold input equipment as traditional in keyboard, mouse etc. without sufficient space, especially under the drive of flat computer demand of stressing human oriented design, touch panel has suddenly become one of crucial spare part.
When known contact panel sends or receives signal, send axle and receiving axes sensitivity and will significantly affect the usefulness of black box, and owing to sending, axle is close with receiving axes position and material is generally identical, easily produce to each other (crosstalk) phenomenon of crosstalking when signal transmission, and then affect sensitivity and the fiduciary level of contact panel.Therefore, how to reduce signal cross-talk and the fiduciary level of promoting contact panel, become an important research topic.
Summary of the invention
From the above, crosstalk for avoiding signal to produce, the invention provides one touch panel structure providedly and preparation method thereof, the ground wire (GND trace) with branch is set sending between axle and receiving axes, to lower the signal cross-talk between each transmission axle and receiving axes.
The invention provides a kind of contact panel, include a substrate, this substrate definition has a touch area and the neighboring area around this touch area; One inductive layer, is located on this substrate and is positioned at this touch area, and this inductive layer comprises a plurality of first axial electrode and a plurality of second axial electrode; One conductor layer, be located on this substrate and be positioned at this neighboring area, and this conductor layer is divided into a plurality of first wires and a plurality of second wires, wherein each the first wire is positioned at one first conductor area, each the second wire is positioned at one second conductor area, and each the first wire is electrically connected respectively this first axial electrode, each the second wire is electrically connected respectively this second axial electrode; And a ground wire, be located on this substrate and be positioned at this neighboring area, wherein this ground wire has multiple branches, and at least one branch is between this first conductor area and this second conductor area.
Further, this contact panel more comprises that a bonding land is positioned at this neighboring area, and this bonding land comprises at least one junction piece, and wherein this ground wire is electrically connected at least one junction piece.
Further, this contact panel more comprises circuit board, and this junction piece and the electric connection of this circuit board.
Further, this contact panel more comprises a cover side layer, is positioned at this neighboring area, and between this conductor layer and this substrate.
Further, this contact panel more comprises a flatness layer, between this substrate and this inductive layer.
Further, this contact panel more comprises a protective seam, is positioned on this inductive layer.
Further, in this contact panel, respectively the material of this ground wire is metal.
Further, in this contact panel, partial earth line intersects with this first wire and this second wire.
Further, this contact panel more comprises that an insulation course is positioned at the crossover sites of this ground wire and this first wire and this second wire.
The method for making of the another kind of contact panel of the present invention, includes and provides a substrate, this substrate to be divided into a touch area and the neighboring area around this touch area; Form in an inductive layer this touch area on this substrate, wherein this inductive layer comprises a plurality of first axial electrode and a plurality of second axial electrode; Form in a conductor layer this neighboring area on this substrate, and this conductor layer is divided into a plurality of first wires and a plurality of second wires, wherein each the first wire is positioned at one first conductor area, each the second wire is positioned at one second conductor area, and each the first wire is electrically connected respectively this first axial electrode, each the second wire is electrically connected respectively this second axial electrode; And form in the neighboring area of a ground wire on this substrate, wherein this ground wire has multiple branches, and at least one branch is between this first conductor area and this second conductor area.
Further, this touch panel module method for making more comprises that a bonding land is positioned at this neighboring area, and this bonding land comprises at least one junction piece, and wherein ground wire is electrically connected at least one junction piece.
Further, this touch panel module method for making more comprises provides a circuit board, and this junction piece and the electric connection of this circuit board.
Further, this touch panel module method for making more comprises formation one cover side layer, is positioned at this neighboring area, and between this conductor layer and this substrate.
Further, this touch panel module method for making more comprises formation one flatness layer, between this substrate and this inductive layer.
Further, this touch panel module method for making more comprises formation one protective seam, is positioned on this inductive layer.
Further, in this touch panel module method for making, respectively the material of this ground wire is metal.
Further, in this touch panel module method for making, partial earth line intersects with this first wire and this second wire.
Further, this touch panel module method for making more comprises that an insulation course is positioned at the crossover sites of this ground wire and this first wire and this second wire.
Contact panel provided by the invention and its method for making, ground wire has multiple branches, has a branch at least between this first wire and this second wire, can reach the object that prevents signal cross-talk.In addition, in the present invention, also allow ground wire to cross over wire setting, therefore make the configuration of ground wire more flexible, further make the neighboring area of contact panel more effectively utilize, reduce cost of manufacture.
Brief description of the drawings
Fig. 1 illustrate the present invention's the first preferred embodiment on look schematic diagram.
Fig. 2 illustrates the cross-sectional view along profile line A-A' in Fig. 1.
Fig. 3 illustrates the touch panel structure provided diagrammatic cross-section of the present invention's the second preferred embodiment.
Fig. 4 illustrates the touch panel structure provided diagrammatic cross-section of the present invention's the 3rd preferred embodiment.
Fig. 5 illustrate the present invention's the 4th preferred embodiment on look schematic diagram.
Fig. 6 illustrate the present invention's the 5th preferred embodiment on look schematic diagram.
Fig. 7 illustrate the present invention's the 6th preferred embodiment on look schematic diagram.
Fig. 8 illustrates the process flow diagram of the method for making of the contact panel of the present invention's the first preferred embodiment.
Embodiment
Can further understand the present invention for making to have the knack of skill person as one of the technical field of the invention, below spy enumerates the present invention's preferred embodiment, and coordinates appended graphicly, describes constitution content of the present invention in detail and effect of reaching is wanted by institute.
For convenience of description, the present invention's is each graphic only for signal is to be easier to understand the present invention, and its detailed ratio can be adjusted according to the demand of design.Description is for the upper and lower relation of relative component in figure in the text, people in this area all will be understood that the relative position that it refers to object, therefore all can overturn and present identical member, this all should belong to the scope that this instructions discloses together, first chats bright in this appearance.
Please refer to Fig. 1, Fig. 1 illustrated the present invention's the first preferred embodiment on look schematic diagram.As shown in Figure 1, contact panel 1 of the present invention includes a substrate 10, and on substrate 10, definition has a touch area 12 and a neighboring area 14 around touch area 12.Substrate 10 can be various transparent or transparent materials, be not limited to hard substrate or bendable substrate, for example glass, polycarbonate (polycarbonate, PC), poly terephthalic acid second two fat (polyethylene terephthalate, PET), polymethyl methacrylate (polymethylmesacrylate, PMMA), polysulfones (Polysulfone, PES) or other cyclenes copolymers (cyclic olefin copolymer) etc.
Then, one inductive layer 16 is formed in the touch area 12 on substrate 10, wherein, inductive layer 16 comprises a plurality of first axial electrode 20 that are arranged in parallel along a first direction (being Y-axis in the present embodiment) and a plurality of the second axial electrode 30 being arranged in parallel along a second direction (being X-axis in the present embodiment).In addition, because each the first axial electrode 20 is crossing with each the second axial electrode 30, for avoiding it to be mutually electrically connected, inductive layer 16 more includes a plurality of bridging structures 32 and a plurality of insulation course 36, in the present embodiment, each the first axial electrode 20 is all continuous structure, each the second axial electrode 30 is to be connected in series with a plurality of bridging structures 32 by a plurality of the second axial electrode pieces 31, and the intersection area of the first axial electrode 20 and the second axial electrode 30 has insulation course 36 to exist, with by the first axial electrode 20 and the second axial electrode 30 electrical isolation, avoid it to be mutually electrically connected.In addition, in the present embodiment, bridging structure 32 is crossed over by the first axial electrode 20 tops, namely first complete after the first axial electrode 30, just complete bridging structure, but the invention is not restricted to this, bridging structure 32 also can be passed through by the first axial electrode 30 belows, namely first form after bridging structure 32 and insulation course 36, then form the first axial electrode 20 and a plurality of the second axial electrode piece 31, the second axial electrode 30 has been connected in series.
In the present embodiment, each the first axial electrode 20 can comprise various transparent conductive materials with the material of each the second axial electrode piece 31, for example, tin indium oxide (indium tin oxide, ITO), indium zinc oxide (indiumzinc oxide, IZO), cadmium tin (cadmium tin oxide, CTO), aluminum zinc oxide (aluminumzinc oxide, AZO), indium oxide zinc-tin (indium tin zinc oxide, ITZO), zinc paste (zincoxide), cadmium oxide (cadmium oxide), hafnia (hafnium oxide, HfO), indium oxide gallium zinc (indium gallium zinc oxide, InGaZnO), indium oxide gallium zinc-magnesium (indium gallium zincmagnesium oxide, InGaZnMgO), indium oxide gallium magnesium (indium gallium magnesium oxide, or indium oxide gallium aluminium (indium gallium aluminum oxide InGaMgO), InGaAlO) etc.Insulation course 36 materials can comprise insulation material, for example, and pi (Polyimide, PI), monox (SiO2), silicon nitride (SiN), silicon oxynitride (SiCN), silit (SiC) etc.Bridging structure 32 materials can comprise above-mentioned transparent conductive material, or metal is as silver, aluminium, gold, copper etc.About the detailed method for making of other inductive layers 16, know technician by this area and known, do not repeat them here.
Then, form a plurality of first wires 42 and a plurality of the second wires 44, one end of each the first wire 42, is all electrically connected with first axial electrode 20, and the other end is connected with the pin position 53 of a join domain 51.And one end of each the second wire 44 is all electrically connected with second axial electrode 30, the other end is also connected with the pin position 53 of join domain 51.Taking the present embodiment as example, the first wire 42 and the second wire 44 transmit respectively from the first axial electrode 20(Y axle) and the second axial electrode 30(X axle) signal, processor receives respectively after signal, can, by the crossover location of two signal representatives, judge the position that the contact panel 1 in touch area 12 is touched.In the present embodiment, the material of the first wire 42 and the second wire 44 can comprise metal for example silver, aluminium, gold, copper etc., and in order to save processing procedure part, each the first wire 42 and each the second wire 44 are preferably simultaneously and make, therefore both materials are identical, but are not limited to this.In addition, in the present embodiment, each the first wire 42 is positioned at least one the first conductor area 42a, and 44, each the second wire is positioned at least one the second conductor area 44a.That is to say, in the first conductor area 42a, include in a plurality of first wires 42, the second conductor area 44a and include a plurality of the second wires 44.
Near join domain 51, add ground wire 50, ground wire 50 is located at and on substrate 10, is positioned at neighboring area 14.Ground wire 50 has branch, and a part of branch is positioned at the outside of the first conductor area 42a and the second conductor area 44a, another space between the first conductor area 42a and the second conductor area 44a in neighboring area 14 of part branch.Thus, due to ground wire 50 integral grounds, therefore can prevent the signal cross-talk between the first wire 42 and the second wire 44 in ground wire 50 branches between the first conductor area 42a and the second conductor area 44a, ground wire 50 branches that are positioned at the first conductor area 42a and the second conductor area 44a outside can reduce the signal interference from outside other assemblies.Certainly, the ground wire configuration in the 1st figure is only a wherein preferred embodiment, but the invention is not restricted to this, and length, width, shape and the position etc. of ground wire 50 can be adjusted according to actual demand.In the present embodiment, the material of ground wire 50 be metal as silver, aluminium, gold, copper or electrically conducting transparent material, the material of for example above-mentioned making the first axial electrode 20 and each the second axial electrode piece 31.
Ground wire 50 is connected to the junction piece 52 of join domain 51.Junction piece 52 is connected in a circuit board (not shown) of substrate 10 outsides, to reach the object of ground connection.In the present embodiment, join domain 51 comprises junction piece 52, and junction piece 52 is the ground connection pin position of known techniques.But according to actual design demand, join domain 51 can comprise multiple junction pieces 52, and the present invention is not as limit.
Fig. 2 illustrates the cross-sectional view along profile line A-A' in Fig. 1; as shown in Figure 2; contact panel 1 includes a substrate 10; on substrate 10, definition has a viewing area 12 and a neighboring area 14; then according to above-described step; sequentially form after inductive layer 16, the first wire (not shown), the second wire 44, ground wire 50 and join domain (not shown), comprehensive covering one protective seam 60 is positioned on viewing area 12 and neighboring area 14 again.Protective seam 60 is generally an insulation film, cover and protect inductive layer 16, and then make inductive layer 16 not because of extraneous physics or chemical change destroyed.The material of protective seam 60 is selected from polyimide (Polyimide, PI), ink, silicon nitride (S3N4) or silicon dioxide (SiO2) etc., but the material ranges of implementing is not limited with previous materials.It should be noted that protective seam 60 is according to practical application selection enforcement.
In addition, the contact panel 1 of the present embodiment more optionally adds other assemblies, and there is different embodiment, below will describe for different embodiments of the invention, wherein for highlighting not existing together between each embodiment, identical assembly represents with identical label, and its method for making is with identical described in material and the first preferred embodiment, and do not repeat in addition.
Fig. 3 illustrates the touch panel structure provided diagrammatic cross-section of the present invention's the second preferred embodiment, as shown in Figure 3, contact panel 2 includes a substrate 10, on substrate 10, definition has a viewing area 12 and a neighboring area 14, one inductive layer 16 is positioned at viewing area 12, and a plurality of the first wire (not shown), the second wire 44 and a plurality of ground wires 50 are positioned at neighboring area 14.Be with the present invention's the first preferred embodiment difference, the present embodiment, between inductive layer 16 and substrate 10, more comprises a flatness layer 18.Flatness layer 18 is better to be formed by non-conductive material, is covered in the surface of substrate 10, to solve the out-of-flatness problem on substrate 10 surfaces, inductive layer 16 can be formed on a flat surfaces.Flatness layer 18 can be for example the smooth layer forming with polymkeric substance, for example pi (polyimide, PI), also can make with inorganic material form, for example silicon nitride (Si3N4) or silicon dioxide (SiO2), the present invention does not limit the material of flatness layer 18.Remaining component is identical with the first preferred embodiment, does not repeat them here.
Fig. 4 illustrates the touch panel structure provided diagrammatic cross-section of the present invention's the 3rd preferred embodiment, as shown in Figure 4, contact panel 3 includes a substrate 10, on substrate 10, definition has a viewing area 12 and a neighboring area 14, one inductive layer 16 is positioned at viewing area 12, and a plurality of the first wire (not shown), the second wire 44 and a plurality of ground wires 50 are positioned at neighboring area 14.Be with the present invention's the first preferred embodiment difference, in the present embodiment, position, between inductive layer 16 and substrate 10, more comprises a light shield layer 19, light shield layer 19, conventionally formed such as dark-coloured photoresistance, dark-coloured ink etc., and the neighboring area 14 of covered substrate 10 by transparent materials, can cover other electronic packages that are positioned on light shield layer 19, as the first wire 42, the second wire 44 or ground wire 50 etc., make it not to be exposed in user interface, reach aesthetic.
It should be noted that, the present embodiment also can interosculate with the present invention's the second preferred embodiment, therefore, contact panel 3 described in the present embodiment also can include a flatness layer between inductive layer 16 and substrate 10, wherein flatness layer can be covered on substrate 10 and light shield layer 19, or covered substrate 10 middle sections only, and do not extend on light shield layer 19, the top of light shield layer 19 and the top of flatness layer are flushed.Remaining component is identical with the first preferred embodiment, does not repeat them here.
Fig. 5 illustrate the present invention's the 4th preferred embodiment on look schematic diagram, as shown in Figure 5, contact panel 4 includes a substrate 10, on substrate 10, definition has a viewing area 12 and a neighboring area 14, one inductive layer 16 is positioned at viewing area 12, a plurality of first wires 42, the second wire 44 and a plurality of ground wires 50 are positioned at neighboring area 14, and wherein each the first wire 42 is positioned at least one the first conductor area 42a, each the second wire 44 is positioned at least one the second conductor area 44a, in addition the present embodiment is between inductive layer 16 and substrate 10, more comprise a flatness layer (not shown) and/or a light shield layer (not shown).Flatness layer is better to be formed by non-conductive material, is covered in the surface of substrate 10, to solve the out-of-flatness problem on substrate 10 surfaces, inductive layer 16 can be formed on a flat surfaces.The neighboring area 14 of light shield layer covered substrate 10, can cover other electronic packages that are positioned on light shield layer as the first wire 42, the second wire 44 or ground wire 50 etc., makes it not to be exposed in user interface, reaches aesthetic.Different from the present invention's the first preferred embodiment be in, in the present embodiment, there is more than one junction piece 52, and each junction piece 52 represents a pin position, be connected on outside circuit board and ground connection, the present embodiment, by multiple junction piece 52 ground connection, can increase the fiduciary level of contact panel 4, when one of them pin bit loss bad time, the function of ground connection still can be brought into play in remaining pin position, and is unlikely to make the ground wire 50 of contact panel 4 to lose function.The present invention optionally increases the quantity of junction piece 52, can further improve the reliability of contact panel.Remaining component is identical with the first preferred embodiment, does not repeat them here.
Fig. 6 illustrate the present invention's the 5th preferred embodiment on look schematic diagram, roughly the same in the contact panel 5 of the present embodiment and the present invention's the first preferred embodiment structure, and difference is, in the present embodiment, the part branch of ground wire 50 separately has part branch to be positioned at the outside of the first conductor area 42a and the second conductor area 44a between the first conductor area 42a and the second conductor area 44a, in addition, ground wire 50 in the present embodiment, around the touch area 12 of contact panel 5, is surrounded the inductive layer 16 in all wires and viewing area 12.So not only can reduce crosstalking between the first wire 42 and the second wire 44, also can further shield the interference of extraneous static, increase the degree of stability of contact panel.It should be noted that the present embodiment can be combined with above-mentioned the 4th preferred embodiment, that is to say and can there are multiple junction pieces 52, to increase the fiduciary level of contact panel.Certainly, the present embodiment also can be combined with the second preferred embodiment or the 3rd preferred embodiment, namely, between inductive layer 16 and substrate 10, more comprises a flatness layer (not shown) and a light shield layer (not shown).Flatness layer is better to be formed by non-conductive material, is covered in the surface of substrate 10, to solve the out-of-flatness problem on substrate 10 surfaces.The neighboring area 14 of light shield layer covered substrate 10, can cover other electronic packages that are positioned on light shield layer, reaches aesthetic.Remaining component is identical with the first preferred embodiment, does not repeat them here.
Fig. 7 illustrate the present invention's the 6th preferred embodiment on look schematic diagram, roughly the same in the contact panel 6 of the present embodiment and the present invention's the first preferred embodiment structure, and difference is, the ground wire 50 in the present embodiment can be crossed over each wire setting, and ground wire 50 is enclosed wires.Cross over the second wire 44 although only illustrate ground wire 50 in Fig. 7, in fact also can be according to user demand, freely cross over the first wire 42 or the second wire 44.And ground wire 50 and the first wire 42 or the second wire 44 crossover sites have an insulation course 38 to exist are crosstalked mutually to completely cut off between the two.The ground wire design pattern of the present embodiment, another kind of wire and ground wire configuration mode are provided, and because ground wire 50 allows to cross over wire setting, therefore partial earth line 50 can, between inductive layer 16 and the first conductor area 42a or the second conductor area 44a, more can effectively shield the electrical crosstalk between the first wire 42 and the second wire 44.In addition, in the present embodiment, ground wire 50 is crossed over by the second wire 44 tops, but in fact also can be passed through by below according to user demand, and the present invention is not as limit.In addition, the present embodiment, between inductive layer 16 and substrate 10, more comprises a flatness layer (not shown) and a light shield layer (not shown).Flatness layer is better to be formed by non-conductive material, is covered in the surface of substrate 10, to solve the out-of-flatness problem on substrate 10 surfaces.The neighboring area 14 of light shield layer covered substrate 10, can cover other electronic packages that are positioned on light shield layer, reaches aesthetic.Remaining component is identical with the first preferred embodiment, does not repeat them here.
It should be noted that, contact panel 4～6 described in above-mentioned the four～six preferred embodiment, all can with the flatness layer described in aforementioned the second preferred embodiment, and light shield layer combination described in the 3rd preferred embodiment, that is to say, between substrate 10 and inductive layer 16, can, according to actual fabrication flow process, more may include a flatness layer, to solve the problem of surface irregularity, and comprise a masking frame, reach and cover unnecessary light and beauty function.Its various combinations all belong in the scope that the present invention contains., do not repeat them here in previous paragraphs explanation about its material selection.
Above-mentioned the first～six preferred embodiment, can be according to user's request, the technical characterictic that the each embodiment of independent assortment is mentioned, and all be combined into by the technical characterictic of the various embodiments described above touch panel structure provided, all belong in the scope that the present invention contains.
Of the present invention touch panel structure provided, can realize by following method for making, please refer to Fig. 8, Fig. 8 illustrates the process flow diagram of the method for making of the contact panel of the present invention's the first preferred embodiment, and please also refer to Fig. 1～Fig. 2, this method for making mainly comprises step S01: a substrate 10 is provided, substrate 10 is divided into a touch area 12 and the neighboring area 14 around touch area 12, step S03: form in the touch area 12 of an inductive layer 16 on substrate 10, wherein inductive layer 16 comprises a plurality of first axial electrode 20 and a plurality of second axial electrode 30 are positioned at touch area 12, wherein each the first axial electrode 20 is arranged in parallel with each other along a first direction, each the second axial electrode 30 is arranged in parallel with each other along a second direction.Step S05: form in the neighboring area 14 of a conductor layer on substrate 10, this conductor layer comprises a plurality of first wires 42 and a plurality of the second wires 44, wherein each the first wire 42 is electrically connected each the first axial electrode 20, and each the second wire 44 is electrically connected each the second axial electrode 30.Step S07: form a plurality of ground wires 50 in the neighboring area 14 of substrate 10, wherein each ground wire 50 is electrically connected to each other, and at least one ground wire 50 is between the first wire 42 and the second wire 44.Step S09: form at least one bonding land, wherein bonding land comprises at least one junction piece 52 and is electrically connected with ground wire 50, and in addition, ground wire 50 is connected also ground connection with an outside circuit board (not shown) by junction piece 52.Finally carry out step S11: form a protective seam 60, comprehensive being covered on touch area 12 and neighboring area 14, to protect each assembly not to be damaged.
Above-mentioned method for making flow process is only a preferred embodiment, and the present invention is not limited to this, and can be according to different embodiment, changed by above-mentioned making flow process, all belong in covering scope of the present invention, for instance, the step S03～step S09 in above-mentioned making flow process, its production order is not limited to this, and can change arbitrarily according to the actual requirements.In addition, more alternative formation one flatness layer 18 of above-mentioned method for making is between substrate 10 and inductive layer 16 (as shown in Figure 3), to solve the irregular problem of substrate surface.And optionally form in the neighboring area 14 of a masking frame 19 on substrate 10 (as shown in Figure 4), and the neighboring area of masking frame covered substrate, can reach and cover unnecessary light and beauty function.And it should be noted that in this case, masking frame 19 can form respectively with flatness layer 18 and do not need the while and deposit.Other change kenel and include: the quantity (as shown in Figure 5) that changes junction piece, change ground wire 50 around region (as shown in Figure 6), even be after step S05, further form a plurality of insulation courses 38 and be covered on part the first wire 42 or part the second wire 44, make each ground wire 50 allow to cross over the first wire 42 or the second wire 44 (as shown in Figure 7).Certainly, above-mentioned various variation kenels, for example whether the formation of masking frame, flatness layer and insulation course to be, and the present invention, not as limit, can, according to actual fabrication flow process, freely optionally add in touch panel module of the present invention.Its material selection discloses in aforementioned paragraphs, does not repeat them here.In brief, according to provided by the present invention touch panel structure provided, its relative production step, all belongs in the method for making scope of contact panel of the present invention.
In sum, contact panel provided by the invention and preparation method thereof, the ground wire of contact panel is all electrically connected, and minimum can be being only connected on outside circuit board to reach the object of ground connection by a pin position, reduces in a large number the use amount of contact panel pin position.In addition, in the present invention, also allow ground wire to cross over wire setting, therefore make the configuration of ground wire more flexible, further make the neighboring area of contact panel more effectively utilize, reduce cost of manufacture.In addition, the present invention also allows to make multiple pins position, and by complete ground wire encirclement touch area, to shield the interference of extraneous static, all can further increase the fiduciary level of contact panel.
The foregoing is only the present invention's preferred embodiment, all equalizations of being done according to the present patent application the scope of the claims change and modify, and all should belong to the present invention's covering scope.
Claims (18)
1. a contact panel, is characterized in that, includes:
One substrate, this substrate definition has a touch area and the neighboring area around this touch area;
One inductive layer, is located on this substrate and is positioned at this touch area, and this inductive layer comprises a plurality of first axial electrode and a plurality of second axial electrode;
One conductor layer, be located on this substrate and be positioned at this neighboring area, and this conductor layer is divided into a plurality of first wires and a plurality of second wires, wherein each the first wire is positioned at one first conductor area, each the second wire is positioned at one second conductor area, and each the first wire is electrically connected respectively this first axial electrode, each the second wire is electrically connected respectively this second axial electrode; And
One ground wire, is located on this substrate and is positioned at this neighboring area, and wherein this ground wire has multiple branches, and at least one branch is between this first conductor area and this second conductor area.
2. contact panel according to claim 1, is characterized in that, more comprises that a bonding land is positioned at this neighboring area, and this bonding land comprises at least one junction piece, and wherein a plurality of ground wires are electrically connected at least one junction piece.
3. contact panel according to claim 2, is characterized in that, more comprises a circuit board, and this junction piece and the electric connection of this circuit board.
4. contact panel according to claim 1, is characterized in that, more comprises a cover side layer, is positioned at this neighboring area, and between this conductor layer and this substrate.
5. contact panel according to claim 1, is characterized in that, more comprises a flatness layer, between this substrate and this inductive layer.
6. contact panel according to claim 1, is characterized in that, more comprises a protective seam, is positioned on this inductive layer.
7. contact panel according to claim 1, is characterized in that, respectively the material of this ground wire is metal.
8. contact panel according to claim 1, is characterized in that, this ground wire intersects with this first wire or this second wire.
9. contact panel according to claim 8, is characterized in that, more comprises an insulation course and be positioned at the crossover sites of this ground wire and this first wire or this second wire.
10. a method for making for contact panel, includes:
One substrate is provided, and this substrate is divided into a touch area and the neighboring area around this touch area;
Form in an inductive layer this touch area on this substrate, wherein this inductive layer comprises a plurality of first axial electrode and a plurality of second axial electrode;
Form in a conductor layer this neighboring area on this substrate, and this conductor layer is divided into a plurality of first wires and a plurality of second wires, wherein each the first wire is positioned at one first wire block, each the second wire is positioned at one second wire block, and each the first wire is electrically connected respectively this first axial electrode, each the second wire is electrically connected respectively this second axial electrode; And
Form in the neighboring area of a ground wire on this substrate, wherein this ground wire has multiple branches, and at least one branch is between this first wire block and this second wire block.
11. method for makings according to claim 10, is characterized in that, more comprise that a bonding land is positioned at this neighboring area, and this bonding land comprises at least one junction piece, and wherein a plurality of ground wires are electrically connected at least one junction piece.
12. method for makings according to claim 11, is characterized in that, more comprise a circuit board are provided, and this junction piece and the electric connection of this circuit board.
13. method for makings according to claim 10, is characterized in that, more comprise and form a cover side layer, are positioned at this neighboring area, and between this conductor layer and this substrate.
14. method for makings according to claim 10, is characterized in that, more comprise and form a flatness layer, between this substrate and this inductive layer.
15. method for makings according to claim 10, is characterized in that, more comprise and form a protective seam, are positioned on this inductive layer.
16. method for makings according to claim 10, is characterized in that, wherein respectively the material of this ground wire is metal.
17. method for makings according to claim 10, is characterized in that, wherein partial earth line intersects with this first wire and this second wire.
18. method for makings according to claim 17, is characterized in that, more comprise an insulation course and be positioned at the crossover sites of this ground wire and this first wire and this second wire.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310093863.3A CN104063081B (en) | 2013-03-22 | 2013-03-22 | Contact panel and preparation method thereof |
| TW103202807U TWM485450U (en) | 2013-03-22 | 2014-02-18 | Touch panel |
| TW103105364A TWI528237B (en) | 2013-03-22 | 2014-02-18 | Touch panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310093863.3A CN104063081B (en) | 2013-03-22 | 2013-03-22 | Contact panel and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104063081A true CN104063081A (en) | 2014-09-24 |
| CN104063081B CN104063081B (en) | 2017-07-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310093863.3A Active CN104063081B (en) | 2013-03-22 | 2013-03-22 | Contact panel and preparation method thereof |
Country Status (2)
| Country | Link |
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| CN (1) | CN104063081B (en) |
| TW (2) | TWM485450U (en) |
Cited By (5)
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| CN106201084A (en) * | 2016-07-11 | 2016-12-07 | 京东方科技集团股份有限公司 | Contact panel and preparation method thereof, touch control display apparatus |
| CN106325585A (en) * | 2015-07-10 | 2017-01-11 | 南京瀚宇彩欣科技有限责任公司 | ESD protection touch control structure |
| CN106980399A (en) * | 2016-01-15 | 2017-07-25 | 宸鸿科技(厦门)有限公司 | Contact panel |
| CN107340933A (en) * | 2017-08-14 | 2017-11-10 | 业成科技（成都）有限公司 | Contact panel and its manufacture method |
| US11144168B1 (en) * | 2020-06-19 | 2021-10-12 | Hannstouch Solution Incorporated | Touch panel and manufacturing method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10037952B2 (en) | 2015-02-10 | 2018-07-31 | Mediatek Inc. | Integrated circuit, electronic device and method for transmitting data in electronic device |
| US9978692B2 (en) | 2015-02-10 | 2018-05-22 | Mediatek Inc. | Integrated circuit, electronic device and method for transmitting data in electronic device |
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| CN106980399B (en) * | 2016-01-15 | 2023-10-24 | 宸鸿科技(厦门)有限公司 | Touch panel |
| CN106201084A (en) * | 2016-07-11 | 2016-12-07 | 京东方科技集团股份有限公司 | Contact panel and preparation method thereof, touch control display apparatus |
| CN107340933A (en) * | 2017-08-14 | 2017-11-10 | 业成科技（成都）有限公司 | Contact panel and its manufacture method |
| CN107340933B (en) * | 2017-08-14 | 2020-07-14 | 业成科技（成都）有限公司 | Touch panel and manufacturing method thereof |
| US11144168B1 (en) * | 2020-06-19 | 2021-10-12 | Hannstouch Solution Incorporated | Touch panel and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM485450U (en) | 2014-09-01 |
| TWI528237B (en) | 2016-04-01 |
| CN104063081B (en) | 2017-07-11 |
| TW201437877A (en) | 2014-10-01 |
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