CN104062174B - Data handling system based on split hopkinson bar dynamic mechanical test device - Google Patents
Data handling system based on split hopkinson bar dynamic mechanical test device Download PDFInfo
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- CN104062174B CN104062174B CN201410324282.0A CN201410324282A CN104062174B CN 104062174 B CN104062174 B CN 104062174B CN 201410324282 A CN201410324282 A CN 201410324282A CN 104062174 B CN104062174 B CN 104062174B
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Abstract
The invention discloses a kind of data handling system based on split hopkinson bar dynamic mechanical test device, first described data handling system reads split hopkinson bar dynamic mechanical and tests the voltage time data point obtained, and plotted volt-time curve, then given test parameters or the parameter inputted voluntarily and computing formula are used, volt-time curve test obtained by man-machine interaction is converted into engineering stress strain curve and the true stress-strain curve of needs, and checking of data can be carried out at any time, smooth, amendment, intercepting and output etc..Notebook data processing system can process dynamic compression, shearing and stretching mechanical property testing data respectively；User-centered interface based on Windows operating system, it is achieved that the intellectuality that split hopkinson bar dynamic mechanical data process so that data process the most flexible, improve arithmetic speed and ease-to-operate, have the strongest practicality.
Description
Technical field
The present invention relates to material dynamic mechanical field tests, in particular it relates to one is dynamic based on separate type Hopkinson
The data handling system of mechanics test device.
Background technology
Strain rate is a kind of tolerance of material rate of deformation, is the strain derivative to the time.When strain rate is more than 10-2s-1
Time, the mechanical behavior shown during material deformation is referred to as the dynamic mechanical behavior of material.Material is in oil drilling, Aero-Space
Especially often there is high strain-rate (10 during the application of the field such as weapons2s-1-104s-1) even Under High Strain rate (104s-1-
106s-1) deformation.Now, the failure mode of material is different from static load conditions, and the intensity of a lot of material and plasticity can be with
The change strain rate changes.Therefore, the research tool of material dynamic mechanical performance is of great significance.
At present, most popular when measuring material mechanical property under high strain-rate in material science it is exactly
Split hopkinson bar (SHPB) test device.SHPB test device is mainly made up of three parts: SHPB, deformeter and data
Acquisition system, such as Fig. 1.Wherein, the key component of SHPB includes: bullet 1, tachymeter 2, incident bar 3, transmission bar 4, absorption
Bar and foil gauge 5.Foil gauge 5 is attached on incident bar 3 and transmission bar 4, and is connected on dynamic strain indicator 6 by cable, with
Time dynamic strain indicator 6 be connected with data collecting system 7.
When carrying out SHPB test, sample to be tested is clipped between incident bar and transmission bar.Bullet clashes into incidence with certain speed
Bar, makes to produce in incident bar the stress wave of certain length.When stress wave propagation to incident bar and sample contacts end, a part should
Reeb is reflected back into Rhizoma Belamcandae, another part generation transmission, and sample is implemented Impulsive load after passing to sample by transmitted wave.Incident
Ripple, echo and transmitted wave converted by foil gauge and deformeter after by data collecting system record and save as data file.
The data file of data collecting system record is voltage-time data point.Owing to foil gauge change in resistance is the faintest,
For the ease of display or control, these voltage-time data points are the value after high dynamic strain indicator amplifies.During calculating, number
Reduce according to needs, be converted into the change in resistance of foil gauge simultaneously.When foil gauge occurs strain, its resistance value can become
Change, so its strain, computing formula and the type of foil gauge and relating to parameters can be calculated by change in resistance.
For resistance strain gage and semiconductor gauge, the computing formula of strain is respectively
Wherein, KSFor the sensitivity coefficient of resistance strain gage, π is the piezoresistance coefficient of semiconductor gauge, and E is the elastic modelling quantity of bar, and Δ R is
Foil gauge change in resistance, R is the original resistance of foil gauge.
Because foil gauge is attached on bar, so the strain of foil gauge is the strain calculating incident bar with reflective spindle.Pass through
The strain of incident bar and transmission bar can calculate displacement and the power of incident bar, transmission bar and sample contacts position particle, enters one
Step can calculate the strain stress of samplesWith stress σs。
If 0 moment sample starts to load, then t, the strain and stress of sample is respectively Wherein u1, u2, σ1, σ2It is respectively incident bar, transmission bar and sample contacts position
Put displacement and the stress of particle, lsFor the length of sample, A and AsIt is respectively bar and the cross-sectional area of test specimen, C0, E is two bars
Velocity of wave and elastic modelling quantity, εRIt is the echo strain that causes incident bar, εTIt it is the transmitted wave strain that causes reflective spindle.
Strain is strain rate when sample deforms for time derivation.
Stress time curve, strain-time graph can be drawn respectively by stress the most in the same time, strain and strain rate
With strain rate-time graph.Engineering stress-strain curve can be calculated by strain-time and stress time curve simultaneous.
In some cases, engineering stress-strain curve needs to be further converted to true stress-true strain curve.Compressive Mechanical Properties is tested
Middle trus stress σc, true strain εcTrus stress σ in testing with tensile mechanical propertiest, true strain εtComputing formula as follows Wherein ε0For engineering strain, σ0For engineering stress.
To sum up, the data file at data collecting system record is mainly deposited during being converted into load-deformation curve etc.
Problem in terms of three below:
The calculating process of load-deformation curve needs to confirm substantial amounts of parameter, often changes a parameter, needs again to count
Calculate.These parameters include the diameter of sample, highly (shape beyond cylinder can be converted into according to area of section equal principle
Effect cylinder sample), incident bar, longitudinal velocity of wave of transmission bar, elastic modelling quantity, diameter, the original resistance of resistance strain gage, strain quick
Sense coefficient or the original resistance of semiconductor gauge, piezoresistance coefficient etc.；
After test parameters determines, the amount of calculation of load-deformation curve is big and complicated.Concrete computational engineering includes: from
Voltage-time curve be changed into successively the resistivity-time curve of foil gauge, the strain-time graph of foil gauge, bar strain-
Time graph, the stress time curve of sample, the strain-time graph of sample, the strain rate-time graph of sample, final
Engineering stress-strain curve and true stress-true strain curve etc. to sample；
Single curve is made up of numerical point the most in the same time, and in general SHPB test, effective data point is at 80
Above, the acquisition of each curve is required for calculating.Meanwhile, the curve in the voltage-time curve of collection and processing procedure
Abnormity point the most easily occur, the undulatory property of integrated curved is the biggest, needs to modify curve and the smoothing processing of entirety.
Due to data processing complex, specialty requires the highest, at present, there is no the data that can be fully solved the problems referred to above
Processing system.
Summary of the invention
The present invention proposes a kind of data handling system based on SHPB dynamic mechanical test device, has a following functions:
Read SHPB and test the voltage-time data point obtained, and be translated into voltage-time curve, it is possible to enter
The checking of row data, smooth, revise and intercepting etc.；
The test parameters that given three sets are conventional calculates, it is also possible to inputted parameter and computing formula voluntarily by user, from
And make notebook data processing system meet deformeter and the sensor of different model, it is suitable for different scaling methods and gathers frequency
Rate；
When after parameter determination, can by man-machine interaction the voltage-time curve of gained is converted into required stress-time
Half interval contour, strain-time graph, engineering stress-strain curve and true stress-true strain curve, and looking into of data can be carried out at any time
See, smooth, revise, intercept and output etc.；
Dynamic compression, shearing and stretching mechanical property testing data can be processed；
User-centered interface based on Windows operating system, it is achieved that data process intellectuality so that data process more
Flexibly, improve arithmetic speed and ease-to-operate, there is the strongest practicality.
It is characterized in that: this system includes data read module 10, waveform selection module 20, computing module 30 and data
Smooth and repair module 40.
Main read voltage-the time data of data read module 10.
Waveform selection module 20 carries out waveform separation to the data read.
Computing module 30 is mainly edited various parameter and carries out the calculating of data.
In data smoothing and repair module 40 user can according to the needs of oneself, to the curve in first three module and
Data check immediately, revise, intercept and preservation etc. processes.
Accompanying drawing explanation
The present invention is further illustrated with detailed description of the invention below in conjunction with the accompanying drawings.
Fig. 1 is SHPB dynamic mechanical test structure drawing of device；
Fig. 2 is the structured flowchart of present invention data handling system based on separate type SHPB dynamic mechanical test device；
Fig. 3 is the flow chart of present invention data handling system based on separate type SHPB dynamic mechanical test device
Fig. 4 A is the voltage-time data figure of the incident bar obtained after certain material carries out SHPB dynamic mechanical test；
Fig. 4 B is the voltage-time data figure of the transmission bar obtained after certain material carries out SHPB dynamic mechanical test；
Fig. 4 C is the nominal data figure that certain material carries out incident bar during SHPB dynamic mechanical test；
Fig. 4 D is the nominal data figure that certain material carries out transmission bar during SHPB dynamic mechanical test；
Fig. 5 A is to the voltage-time data figure after 4A smoothing processing；
Fig. 5 B is to the voltage-time data figure after 4B smoothing processing；
Fig. 6 A is first the incidence wave oscillogram automatically identified；
Fig. 6 B is first the reflection wave figure automatically identified；
Fig. 6 C is first the transmitted wave oscillogram automatically identified；
Fig. 7 A is required load-deformation curve；
Fig. 7 B is required true stress-true strain curve；
Fig. 7 C is required stress time curve；
Fig. 7 D is required strain-time graph；
Fig. 7 E is required strain rate-time graph.
Specific implementation method
The present invention is described in further detail below in conjunction with the accompanying drawings.
Process owing to there presently does not exist a kind of data that can conveniently calculate SHPB dynamic mechanical test data
System, the present invention proposes a kind of data handling system based on SHPB dynamic mechanical test device.Described data handling system bag
Include: data read module 10, waveform selection module 20, computing module 30 and data smoothing and repair module 40.
(1) data read module 10
Read the data file of data collecting system record, can be with the amplification of input voltage or add during reading
Enter to demarcate file.Need to be calculated the amplification of high dynamic strain indicator for this, method is as follows:
Bullet institute band energy is calculated, with incident bar and transmission bar institute band energy after measuring bullet velocity by laser velocimeter
Amount contrasts, and calculates amplification；
The resistance of external certain resistance and apply pulse signal obtain demarcate file after automatically calculated amplification by system.
(2) waveform selection module 20
In SHPB process of the test, the data point collected is the process that stress wave is repeatedly propagated.Therefore, when calculating, need
Suitable data point is selected to process.This module use three kinds of methods automatic, semi-automatic, manual choose incidence wave, echo,
Transmitted wave waveform: under automatic mode, system utilization mathematical algorithm intelligence computation separation waveform, with 1/3h, 2/3h, (h is shaking of ripple
Width) matching tangent line, and obtain intercept to determine waveform；Under semiautomatic-mode, user may determine that a scope, and system is at this
In the range of automatically choose waveform；In a manual mode, user is completely manual chooses waveform.Major part waveform can use automatic mold
Formula selects, but some complicated wave form, when automatic mode can not carry out selecting or selecting mistake, then need to use half certainly
Dynamic model formula or automatic mode select.
(3) computing module 30, mainly select or input various parameter and carry out the calculating of data, and step is:
Step 31: Selection experiment type.Different owing to compressing, stretching, shearing the computing formula of three kinds of tests, need to carry out
The selection of test type；
Step 32: the parameters in editor's test.The parameter being directed to include sample diameter, highly (cylinder with
Outer shape can be converted into the cylinder sample of equivalence according to area of section equal principle), incident bar, the longitudinal wave of transmission bar
Speed, elastic modelling quantity, diameter, the original resistance of resistance strain gage, resistance strain gage strain sensitive coefficient, demarcate resistance etc.；
Step 33: select computation model.Compared to bar, the length of sample is the shortest, when therefore stress wave is propagated in the sample
Between the shortest, and the stress in sample was tended to balance within the extremely short time, constant can be regarded as.Before then for sample
The strain increment sum that the incidence wave of end incident bar and echo cause is equal to the strain of the transmitted wave in sample right-hand member take-off lever
Increment.So, it is known that in incidence wave, echo and transmitted wave, any two can calculate the 3rd waveform.System can make
Calculate with incident-reflection, incidence-transmission and three kinds of computation models of reflective-transmissive, be also convenient for carrying out data accurate simultaneously
The checking of property；
Step 34: automatically calculated stress-strain diagram, true stress-true stain curve, stress time curve by system, answer
Become time graph and strain rate time graph.
(4) data smoothing and repair module 40
User can according to the needs of oneself, to above-mentioned in steps in curve and data immediately check, revise,
Intercept and preservation etc. processes.Native system provides two kinds of smooth manners (sliding average method and median scanning method) to song simultaneously
Line is smoothed.Use sliding average method can obtain more smooth waveform, and use median scanning method main
It is to remove some abnormity point occurred in dynamic mechanical test.
Below, illustrate that notebook data processing system is real by the data of the SHPB mechanical dynamic compression property performance test of certain material
Existing technique effect.Obviously, described embodiment is only a part of embodiment of the present invention rather than whole enforcement
Example.Based on the embodiment in the present invention, the every other reality that those skilled in the art are obtained on the premise of not having creative work
Execute example, broadly fall into the scope of protection of the invention.
The embodiment of the present invention provides a kind of data handling system based on SHPB dynamic checkout unit, and step is as follows:
Step 301, reads incident bar and the data file of transmission bar respectively, and is made curve chart, such as Fig. 4 A, 4B；
Step 302, reads incident bar and the demarcation file of transmission bar, respectively such as Fig. 4 C, 4D；
Step 303, Selection experiment type is mechanical dynamic compression property test；
Step 304, the various parameters that editor's test is relevant；
Step 305, is smoothed incident bar and transmission bar data and curves, respectively such as Fig. 5 A, 5B；
Step 306, use automated manner choose first incidence wave, echo and transmitted wave waveform respectively, as Fig. 6 A,
6B、6C；
Step 307, selects incidence-transmission computation model；
Step 308, is automatically calculated stress-strain diagram (Fig. 7 A), true stress-true stain curve (figure by internal system
7B), stress time curve (Fig. 7 C), strain time graph (Fig. 7 D) and strain rate time graph (Fig. 7 E)；
Step 309, above-mentioned all curves are modified, smoothed, preservation etc. processes.
Particular embodiments described above, has been carried out the purpose of the present invention, technical scheme and beneficial outcomes the most in detail
Describe in detail bright, be it should be understood that the specific embodiment that the foregoing is only the present invention, the guarantor being not intended to limit the present invention
Protect scope, all within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. done, should be included in this
Within the protection domain of invention.
Claims (2)
1. a data handling system based on split hopkinson bar dynamic mechanical test device, it is characterised in that
Including: data read module 10, waveform selection module 20, computing module 30 and data smoothing and repair module 40；
Data read module 10, reads the data file of data collecting system record, obtains by adding the method demarcating file
Voltage-time data after amplification；
Waveform selection module 20, uses three kinds of methods automatic, semi-automatic, manual to choose incidence wave, echo, transmission wave-wave
Shape, under automatic mode, system uses mathematical algorithm intelligence computation separation waveform, and with 1/3h, 2/3h matching tangent line, h is shaking of ripple
Width, and obtain intercept to determine waveform；Under semiautomatic-mode, user may determine that a scope, system in the range of this from
Move and choose waveform；In a manual mode, user is completely manual chooses waveform；
Computing module 30, carries out the calculating of data for selecting or input various parameter, the steps include: step 31: select compression,
Stretching, shearing test type, owing to the computing formula of three kinds of tests is different, need to carry out the selection of test type；Step 32: compile
Parameters in volume test, the parameter being directed to includes the diameter, highly of sample, and the shape beyond cylinder can be according to cutting
Face area equation principle is converted into the cylinder sample of equivalence, incident bar, longitudinal velocity of wave of transmission bar, elastic modelling quantity, diameter, resistance
The original resistance of foil gauge, resistance strain gage strain sensitive coefficient, demarcate resistance；Step 33: selecting computation model, system can make
Calculate with incident-reflection, incidence-transmission and three kinds of computation models of reflective-transmissive；Step 34: automatically calculated by system
Go out stress-strain diagram, true stress-true stain curve, stress time curve, strain time graph and strain rate time graph；
Data smoothing and repair module 40, user can be according to the needs of oneself, to each curve in data handling procedure
And data immediately check, revise, intercept and preservation process.
Data handling system the most according to claim 1, it is characterised in that: in described data smoothing and repair module 40,
The method that the smoothing processing of curve uses is sliding average method and median scanning method.
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| CN110967246B (en) * | 2018-09-29 | 2022-09-30 | 中国航发商用航空发动机有限责任公司 | Data processing method and data processing system for split Hopkinson bar experiment |
| CN111678639B (en) * | 2020-06-18 | 2021-04-06 | 中国人民解放军国防科技大学 | Free field pressure sensor dynamic sensitivity coefficient calibration device |
| CN113484167B (en) * | 2021-07-09 | 2023-01-31 | 北京理工大学 | Dynamic mechanical property testing device and method for amorphous alloy |
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